Ear hanging type earphone

Abstract

The utility model provides an earphone, which is characterized in that a double-layer circuit board structure is arranged in a circuit board bin, so that a longitudinal space, perpendicular to a first circuit board surface, in the circuit board bin is fully utilized, and more circuit expansion requirements can be met under the condition that the circuit board bin is not expanded. For example, the requirements for storage and playing of audio data are met. Furthermore, the earphone provided by the specification can use earphone shells of other models, and redesign and mold opening are not needed, so that the development and production cost can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of acoustic equipment, and in particular to an ear-hook headphone. Background Art

[0002] As people's requirements for the comfort of wearable devices increase, wearable devices are increasingly developing in the direction of miniaturization and lightness. At the same time, people's functional requirements for electronic devices are also continuously increasing, and it is inevitable to expand the functions through hardware circuits, which means an increase in circuit area.

[0003] As a wearable electronic device, ear-hook headphones also face the contradiction between controlling the size and mass of the body and achieving circuit expansion.

[0004] Therefore, it is necessary to provide a headset that can integrate more circuits in a limited body space.

[0005] The content of the background technology section is only the information known to the applicant personally, and does not mean that the above information has entered the public domain before the application date of this disclosure, nor does it mean that it can become the prior art of the present disclosure. Utility Model Content

[0006] This specification provides an ear-hook headset that can expand the circuit area within a limited circuit board compartment.

[0007] The present specification provides an ear-hook headset, comprising a speaker unit for converting input into sound; and a circuit board bin, comprising a accommodating space; and a first circuit board, a second circuit board and a connector, wherein the first circuit board and the second circuit board are connected in the accommodating space through the connector to form a double-layer circuit board structure to utilize the longitudinal space in the circuit board bin perpendicular to the surface of the first circuit board.

[0008] In some implementations, the connector is a board-to-board connector, and the first circuit board and the second circuit board are arranged in parallel on both sides of the board-to-board connector to form the double-layer circuit board structure; or the connector includes a flexible circuit board, and the first circuit board and the second circuit board are foldably connected through the flexible circuit board and arranged in parallel to form the double-layer circuit board structure.

[0009] In some implementations, in the board surface direction of the first circuit board, a ratio of an overlapping area of ​​the first circuit board and the second circuit board to a union area of ​​the two circuit boards is greater than or equal to 0.2.

[0010] In some implementations, a ratio of a maximum cross-sectional area of ​​the accommodating space to a combined area of ​​the first circuit board and the second circuit board along a surface direction of the first circuit board is less than or equal to 1.5.

[0011] In some implementations, the ratio of the thickness of the circuit board compartment to the thickness of the double-layer circuit board structure is less than or equal to 1.5, wherein the thickness of the double-layer circuit board structure is the maximum distance between the first circuit board and its components and the second circuit board and its components in a direction perpendicular to the surface of the first circuit board.

[0012] In some implementations, the circuit board bin has a thickness in a range of 0.6 cm to 1 cm.

[0013] In some implementations, the length of the circuit board bin is in the range of 3 cm to 4 cm.

[0014] In some embodiments, the shell of the circuit board warehouse includes at least one positioning column; and at least one positioning hole and / or at least one positioning notch are provided on the first circuit board and the second circuit board, wherein the at least one positioning column is passed through the at least one positioning hole or the at least one positioning notch to fix the first circuit board and the second circuit board in the respective board surface directions.

[0015] In some implementations, the headset also includes at least one button, and the at least one button is at least partially disposed between the first circuit board and the second circuit board, and the button is electrically connected to the first circuit board or the second circuit board. The shell also includes at least one button hole, and the at least one button is inserted into the at least one button hole.

[0016] In some implementations, a thickness of the key is less than or equal to a distance between the first circuit board and the second circuit board.

[0017] As can be seen from the above technical solutions, the earphones provided in this specification are provided with a double-layer circuit board structure in the circuit board compartment, so that the longitudinal space in the circuit board compartment perpendicular to the first circuit board surface is fully utilized, thereby meeting more circuit expansion requirements without expanding the circuit board compartment, such as the requirements for the storage and playback of audio data. Furthermore, the earphones provided in this specification can use other types of earphone shells without redesigning the mold, thereby reducing development and production costs.

[0018] Other features of the headset provided in this specification are partially listed in the following description. Based on the description, the content introduced by the following figures and examples will be obvious to those of ordinary skill in the art. The creative aspects of the headset provided in this specification can be fully explained by practicing or using the methods, devices and combinations provided in the following detailed examples. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions in the embodiments of this specification, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this specification. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0020] Figure 1 A schematic diagram of the structure of headphones provided according to some embodiments of this specification is shown;

[0021] Figure 2 A partial exploded view of a circuit board bin provided according to some embodiments of this specification is shown;

[0022] Figure 3 A schematic diagram of a double-layer circuit board structure provided according to some embodiments of this specification is shown;

[0023] Figure 4 A schematic diagram of the internal structure of a circuit board bin provided according to some embodiments of this specification is shown; and

[0024] Figure 5 A schematic diagram of a double-layer circuit board structure provided according to some embodiments of the present specification is shown. DETAILED DESCRIPTION

[0025] The following description provides specific application scenarios and requirements of this specification, with the purpose of enabling those skilled in the art to make and use the contents of this specification. Various local modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of this specification. Therefore, this specification is not limited to the embodiments shown, but to the widest scope consistent with the claims.

[0026] The terms used herein are only used for the purpose of describing specific example embodiments and are not restrictive. For example, unless the context clearly indicates otherwise, as used herein, the singular forms "a", "an" and "the" may also include plural forms. When used in this specification, the terms "include", "comprise" and / or "contain" mean that the associated integers, steps, operations, elements and / or components exist, but do not exclude the existence of one or more other features, integers, steps, operations, elements, components and / or groups or that other features, integers, steps, operations, elements, components and / or groups may be added in the system / method.

[0027] In view of the following description, these and other features of the present specification, as well as the operation and function of the related elements of the structure, and the economy of the combination and manufacture of the parts can be significantly improved. Reference is made to the accompanying drawings, all of which form a part of this specification. However, it should be clearly understood that the drawings are for illustration and description purposes only and are not intended to limit the scope of this specification. It should also be understood that the drawings are not drawn to scale.

[0028] The flowcharts used in this specification illustrate the operations implemented by the system according to some embodiments in this specification. It should be clearly understood that the operations of the flowcharts may not be implemented in sequence. On the contrary, the operations may be implemented in reverse order or simultaneously. In addition, one or more other operations may be added to the flowchart. One or more operations may be removed from the flowchart.

[0029] In this specification, "X includes at least one of A, B or C" means that X includes at least A, or X includes at least B, or X includes at least C. That is, X may include only any one of A, B, and C, or may include any combination of A, B, and C and other possible contents / elements at the same time. The any combination of A, B, and C may be A, B, C, AB, AC, BC, or ABC.

[0030] In this specification, unless explicitly stated otherwise, the association relationship between structures can be a direct association relationship or an indirect association relationship. For example, when describing "A is connected to B", unless it is explicitly stated that A is directly connected to B, it should be understood that A can be directly connected to B or indirectly connected to B; for another example, when describing "A is above B", unless it is explicitly stated that A is directly above B (AB is adjacent and A is above B), it should be understood that A can be directly above B or indirectly above B (AB is separated by other elements and A is above B). And so on.

[0031] This specification provides an ear-hook headset. The type of headset is not limited in this specification. For example, the headset can be a bone conduction headset, an air conduction headset, or a combination of an air conduction headset and a bone conduction headset. For another example, the headset can be a wired headset or a wireless headset.

[0032] In some usage scenarios, in order to meet the user's functional requirements for headphones, it is sometimes necessary to expand new circuit modules. For example, if the user has the need to play local music, an MP3 module can be designed in the circuit. Or, if the user has the need to listen to the radio or intercom, a radio module or an intercom module can be designed in the circuit. However, the wearing comfort and stability of the headphones cannot be reduced due to the expansion of circuit board functions, that is, the volume of the circuit board compartment cannot be increased in order to expand the circuit area, thereby increasing the weight of the circuit board compartment. Therefore, this specification provides a headset that can set a larger area of ​​circuit within a limited circuit board compartment space.

[0033] Figure 1 The schematic diagram of the structure of the earphone 001 provided according to some embodiments of the present specification is shown. The earphone 001 provided in the present specification may include a speaker unit 030 and a circuit board compartment 010. In some embodiments, the earphone 001 may also include a power compartment 040. The power compartment 040 may include a battery, and the battery is used to power active devices in the earphone.

[0034] The speaker unit 030 can convert the received audio electrical signal into sound waves. The number of speaker units 030 can be one or two. In some embodiments, for use scenarios that do not require high stereo sound, such as hearing aids for hearing-impaired patients, host prompts, etc., the number of speaker units 030 can be one. When in use, the user can wear the headset on the left ear or the right ear. In some embodiments, such as Figure 1 As shown, the number of speaker units 030 can be two. Headphones with dual speaker units can be applied to usage scenarios that require stereo effects to improve the listening experience. This specification will take headphones with two speaker units as an example for introduction.

[0035] In some embodiments, the speaker unit 030 can be directly or indirectly connected to the circuit board compartment 010. Figure 1 In the earphones shown, one speaker unit 031 is directly connected to the circuit board compartment 010 through the ear hook 021 on one side, and the other speaker unit 032 is connected to the power compartment 040 through the ear hook 022 on the other side, and then connected to the rear hanging part 050 through the adapter in the power compartment 040, and then indirectly connected to the circuit board compartment 010 through the rear hanging part 050.

[0036] Figure 2A partial exploded view is shown according to some embodiments of the present specification. Figure 2 As shown in the exploded view of area A, the circuit board compartment 010 may include a housing 100 and a receiving space surrounded by the housing 100. The receiving space may be used to load the circuit board of the earphone 001. The housing 100 may include a first housing 110 and a second housing 120, and the first housing 110 and the second housing 120 together form the receiving space.

[0037] To meet the wearing comfort requirements of the headset 001, the shape of the circuit board compartment 010 can be a flat long strip. When worn, the side of the circuit board compartment 010 close to the user's skin and the side of the ear hook 020 and the back hook 050 close to the user's skin are roughly on a smooth curved surface, so that the headset 001 conforms to the ergonomic design, thereby avoiding or reducing the protrusion of the side of the circuit board compartment 010 close to the user's skin to cause a sense of oppression to the user or avoid the feeling of unevenness when wearing. To meet the wearing stability requirements of the headset 001, the volume or mass of the circuit board compartment 010 and the power supply compartment 040 should be as close as possible, so as to avoid the headset 001 from tilting to one side during wearing. To meet the aesthetic requirements of the headset 001, the appearance of the headset 001 can adopt a roughly symmetrical design, that is, the shape of the circuit board compartment 010 and the power supply compartment 040 can be roughly the same. Under the premise that the headset 001 design needs to be miniaturized and lightweight, the shape and size of the circuit board compartment 010 and the power supply compartment 040 should be controlled as much as possible. Therefore, it is necessary to provide an earphone 001 that can expand the circuit board area within the circuit board bin 010 space with limited shape and volume.

[0038] In some embodiments, the thickness of the circuit board bin 010 is in the range of 0.4 cm to 1.6 cm. Further, in order to provide a better wearing experience and reduce or avoid the pressure of the circuit board bin 010 on the user's skin, in some embodiments, the thickness of the circuit board bin 010 is in the range of 0.5 cm to 1.3 cm. In some embodiments, the thickness of the circuit board bin 010 is in the range of 0.6 cm to 1 cm. In some embodiments, the length of the circuit board bin 010 is in the range of 2 cm to 5 cm. Further, in order to improve the wearing stability of the headset 001 and prevent the length of the circuit board bin 010 from being too long, causing the overall center of gravity of the headset 001 to be biased backward, in some embodiments, the length of the circuit board bin 010 is in the range of 3 cm to 4.5 cm. In some embodiments, the length of the circuit board bin 010 is in the range of 3 cm to 4 cm. Among them, the maximum distance between the side of the circuit board bin 010 away from the user's skin and the side close to the user's skin is the thickness of the circuit board bin 010, and the distance between the connection part of the circuit board bin 010 and the ear hook 020 and the connection part between the circuit board bin 010 and the rear hook 050 is the length of the circuit board bin 010.

[0039] The earphone 001 provided in this specification expands the area of ​​the circuit boards by designing the circuit boards on the first circuit board 210 and the second circuit board 220, and fully utilizes the accommodation space of the circuit board compartment 010 by arranging the two circuit boards in double layers.

[0040] Due to the limited space of the circuit board bin 010, it is necessary to consider improving the utilization rate of the accommodation space in the direction perpendicular to the surface of the first circuit board 210. The thickness of the double-layer circuit board structure 200 is the longitudinal space actually required. Since there are components of different heights on the circuit board, the thickness is the maximum distance between the first circuit board 210 and its components and the second circuit board 220 and its components in the direction perpendicular to the surface of the first circuit board 210. As mentioned above, the thickness of the circuit board bin 010 is the maximum distance between the side of the circuit board bin 010 away from the user's skin and the side close to the user's skin. The ratio of the thickness of the circuit board bin 010 to the thickness of the double-layer circuit board structure 200 is greater than 1.0. The closer this ratio is to 1.0, the higher the utilization rate of the double-layer circuit board structure 200 for the accommodation space in the direction perpendicular to the surface of the first circuit board 210. In some embodiments, the ratio of the thickness of the circuit board bin 010 to the thickness of the double-layer circuit board structure 200 is less than or equal to 1.5.

[0041] Furthermore, it is also necessary to consider improving the utilization rate of the accommodation space in the direction parallel to the surface of the first circuit board 210. The combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface is the minimum area actually required by the double-layer circuit board structure 200. The combined area should be smaller than the cross-sectional area of ​​the accommodation space in this direction, that is, the ratio of the maximum cross-sectional area of ​​the accommodation space to the combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface is greater than 1.0. The closer the ratio is to 1.0, the higher the utilization rate of the accommodation space in the direction of the first circuit board 210 by the double-layer circuit board structure 200. In some embodiments, the ratio of the maximum cross-sectional area of ​​the accommodation space to the combined area of ​​the first circuit board 210 and the second circuit board 220 in the direction of the first circuit board 210 along the surface is less than or equal to 1.5.

[0042] In addition to considering the overall space utilization of the double-layer circuit board structure 200 in the board direction, the relative position between the two circuit boards inside the double-layer circuit board structure 200 should also be considered. The first circuit board 210 and the second circuit board 220 are arranged in double layers, and the overlapping area of ​​the two in the board direction of the first circuit board 210 is greater than 0. In some technical fields, IoU (intersection over union) is used to measure the similarity between two indicators to be compared. For the double-layer circuit board structure 200 of the earphone 001 provided in this specification, IoU can be used to measure the overlap between the two circuit boards. In the board direction of the first circuit board 210, the ratio of the overlapping area of ​​the first circuit board 210 and the second circuit board 220 to the union area of ​​the two, that is, IoU, is less than or equal to 1.0. Only when the areas of the first circuit board 210 and the second circuit board 220 are the same and completely overlapped, can IoU be 1.0. The closer IoU is to 1.0, the greater the overlap between the two circuit boards of the double-layer circuit board structure 200. In some embodiments, in the board direction of the first circuit board 210 , the ratio of the overlapping area of ​​the first circuit board 210 and the second circuit board 220 to the union area of ​​the two is greater than or equal to 0.2.

[0043] In summary, the earphone 001 provided in this specification forms a double-layer circuit board structure 200 by combining the first circuit board 210 and the second circuit board 220 to utilize the longitudinal space in the circuit board compartment 010 that is perpendicular to the surface of the first circuit board 210. Furthermore, through the overlapping arrangement of the double-layer circuit board structure 200, the transverse space in the circuit board compartment 010 that is parallel to the surface of the first circuit board 210 can be utilized.

[0044] Figure 3 1 shows a schematic diagram of a double-layer circuit board structure 200 provided according to some embodiments of the present specification. The double-layer circuit board structure 200 may include a first circuit board 210, a second circuit board 220, and a connector 230. The connector 230 may be used to connect the first circuit board 210 and the second circuit board 220 so that the first circuit board 210 and the second circuit board 220 are electrically connected. For example, the connector 230 may be as follows: Figure 3In the board-to-board connector shown, the first circuit board 210 and the second circuit board 220 are arranged in parallel on both sides of the board-to-board connector to form a double-layer circuit board structure 200. For example, the connector 230 may include a flexible circuit board, and the first circuit board 210 and the second circuit board 220 are foldably connected and arranged in parallel through the flexible circuit board to form a double-layer circuit board structure 200. In some embodiments, the connector 230 also includes a terminal connector used in conjunction with the flexible circuit board. For another example, the connector 230 may also be a wire, and the first circuit board 210 and the second circuit board 220 are foldably connected and arranged in parallel through the wire to form a double-layer circuit board structure 200.

[0045] In some embodiments, the first circuit board 210 may include a control element, which may be an MCU (Microcontroller Unit). The control element may send a control signal or instruction to a connected element, or perform one-way or two-way transmission of a data signal therewith. In some embodiments, the control element may be connected to a radio frequency device to receive and transmit a wireless signal, such as by at least one of Bluetooth, NFC, or Wifi to achieve communication with an external media player or a main-end device. In some embodiments, the control element may achieve communication with the main-end device in a wired manner through an interface for wired transmission. In some embodiments, the control element may perform audio data decoding or digital-to-analog conversion, and convert the digital signal into an analog signal and then transmit it to the speaker unit.

[0046] In some embodiments, the first circuit board 210 may include a power amplifier element. The power amplifier element is used to amplify the power of the received analog signal and then transmit it to the speaker so that the sound can be heard by people. The control element and the power amplifier element are electrically connected to receive the control signal or sound electrical signal sent by the control element.

[0047] In some embodiments, the first circuit board 210 may further include a Bluetooth antenna 211, and the control element may establish a connection with an external device via the Bluetooth antenna 211 to receive and play audio data sent by an external media player, that is, to play music via a Bluetooth connection.

[0048] The earphone 001 provided in this specification can perform local audio playback. In some embodiments, the local audio playback function can be implemented by an MP3 module. The functions of the MP3 module may include at least one of importing and storing audio files, decoding and playing audio files, volume adjustment, or song switching. The MP3 module may include at least part of the components and corresponding circuits on the second circuit board 220. Specifically, the MP3 module can be completely arranged on the second circuit board 220, and the MP3 module can also be partially arranged on the second circuit board 220 and partially arranged on the first circuit board 210. For example, the audio storage unit can be arranged on the second circuit board 220, and the volume button can be arranged on the first circuit board 210.

[0049] The MP3 module may include a data unit. The data unit may import audio data from an external device and store it. The data unit may read the stored audio data and play it through a speaker during audio playback. In some embodiments, the second circuit board 220 may include a data unit, and the data unit and the first circuit board 210 may transmit signals to each other through a connector 230 when working. When importing data, the control unit on the first circuit board 210 may synchronize the clock signal with the data unit, and the connector 230 may communicate the clock signal. When reading data, the control unit on the first circuit board 210 may receive audio data from the data unit. In some embodiments, the data unit may include a data input and output circuit and a memory 221. The memory 221 is used to store audio data, and the memory is electrically connected to the data input and output circuit to realize the import and export of data.

[0050] In some embodiments, the data input and output circuit can be arranged on the side of the second circuit board 220 facing the first circuit board 210. The data input and output circuit will be accompanied by a high-frequency clock signal and a high-speed changing data signal when performing data transmission. In different technical fields, the definition of high frequency is different. In the definition of high-speed circuit, if the clock frequency in the electronic system reaches or exceeds 50MHz, the circuit system is a high-speed circuit, and the clock frequency can be considered as high frequency. The high frequency mentioned in this specification can refer to this definition. High-frequency signals can bring many problems to the circuit system. For example, the electromagnetic radiation generated by the high-frequency signal may cause crosstalk inside the circuit system, causing timing errors or affecting the sensitivity of components. For example, the electromagnetic waves generated by the high-frequency signal may radiate externally through the surface or interface of the component, thereby generating electromagnetic disturbance to other electronic devices. For another example, a circuit with a high-frequency signal is more likely to couple with external electromagnetic radiation, thereby forming electromagnetic interference to the data input and output circuit. In order to solve the above problems, the earphone 001 provided in this specification can perform signal shielding on the data input and output circuit.

[0051] In some embodiments, a signal shielding component 300 may be provided above the entire data input / output circuit, or above part of the data input / output circuit, to at least partially block the electromagnetic radiation generated during audio data transmission. At the same time, it also reduces the interference that external electromagnetic radiation may cause to the data input / output circuit. In some embodiments, the signal shielding component 300 may be a semi-enclosed metal cover with an opening on one side, which is provided above the data input / output circuit with the opening side facing the data input / output circuit, and abuts against the second circuit board 220. In some embodiments, the signal shielding component 300 is made of a metal material with low resistivity, and utilizes the eddy current generated in the metal to form a counteracting effect on external electromagnetic waves, thereby achieving a shielding effect. The signal shielding component 300 is grounded.

[0052] In some embodiments, a conductive buffer pad may be provided between the first circuit board 210 and the signal shielding component 300. The conductive buffer pad abuts against the first circuit board 210 and the signal shielding component 300 to increase the electrical connection between the ground wires of the first circuit board 210 and the second circuit board 220, thereby reducing the signal loop area between the two boards. Since the outer surface of the conductive buffer pad is a conductive layer, the signal shielding component can be electrically connected to the first circuit board 210, and the second circuit board 220 is also grounded to the first circuit board 210. The signal loop area is reduced and the electromagnetic radiation in the circuit is suppressed. On the other hand, since the conductive buffer pad is made of a buffer material, it can be provided between the first circuit board 210 and the second circuit board 220 to play a supporting and buffering role. In some embodiments, the conductive buffer pad is bonded to the surface of the signal shielding component 300. In some embodiments, the conductive buffer pad may be a conductive foam.

[0053] In some embodiments, the memory 221 can be arranged on a side of the second circuit board 220 away from the first circuit board 210. The data input-output circuit is arranged between the first circuit board 210 and the second circuit board 220, and is also covered with a signal shielding component 300 and a conductive buffer pad, which has occupied a large area, so the memory 221 can be installed on the other side of the second circuit board 220 to control the area of ​​the second circuit board 220. On the other hand, by arranging the data input-output circuit and the memory 221 on opposite sides of the corresponding position on the second circuit board 220, the wiring between the two can be shortened, thereby reducing signal delay.

[0054] The earphone 001 provided in this specification has a reasonable layout for the data unit. On the one hand, the layout space on both sides of the second circuit board 220 can be fully utilized to reduce the area of ​​the second circuit board 220 itself; on the other hand, the structure of the double-layer circuit board allows the signal shielding component 300 and the conductive buffer pad to be used in combination between the two circuit boards to increase the grounding area of ​​the two boards and reduce the signal loop area, thereby reducing external electromagnetic radiation; on the other hand, the conductive buffer pad can form a physical support and buffering effect on the first circuit board 210, maintaining the relative parallelism and relative stability between the two circuit boards.

[0055] like Figure 3 As shown, the circuit board compartment 010 may also include a button 400. For example, the circuit board compartment 010 includes a play button, a pause button, and the like of an MP3 player. The number of buttons 400 may be one or more. In some embodiments, the button 400 may be a volume adjustment button. The button 400 may include a button cap, an elastic member, and a switch circuit, and the switch circuit is electrically connected to the first circuit board 210 or the second circuit board 220. The button cap includes a cap portion and a rod portion, and the cap portion is at least partially exposed outside the housing 100 to receive a user's pressing operation. The rod portion passes through the button hole, and there is no elastic force between the rod portion and the elastic member when it is not pressed. When pressed, the pressure is transmitted to the elastic member through the rod portion, so that the elastic member moves toward the switch circuit. The switch circuit converts the received user button operation into an electrical signal and transmits it to the control element on the first circuit board 210. In some embodiments, when viewed along the gap between the first circuit board 210 and the second circuit board 220, the one or more buttons 400 are completely or partially disposed between the first circuit board 210 and the second circuit board 220, wherein at least the switch circuit portion is located between the two circuit boards. Accordingly, the housing 100 further includes a corresponding number of button holes at corresponding positions. In this way, on the assembled earphones, each button 400 is inserted into the corresponding button hole. Figure 3 As shown, the thickness of the key should be less than or equal to the distance between the first circuit board 210 and the second circuit board 220, so that the key 400 can move freely in the gap left between the first circuit board 210 and the second circuit board 220 when pressed without being stuck, wherein the thickness is the maximum distance of the switch circuit along the direction perpendicular to the surface of the first circuit board.

[0056] The earphone 001 provided in this specification has a reasonable layout of buttons. At least one button is completely or partially arranged between two circuit boards, making full use of the gap between the two boards without occupying additional longitudinal space.

[0057] Next, it will be described how the double-layer circuit board structure 200 of the earphone 001 provided in this specification maintains a stable position in the circuit board compartment 010.

[0058] Figure 4 The schematic diagram of the internal structure of the circuit board bin 010 provided according to some embodiments of the present specification is shown. The housing 100 of the circuit board bin 010 may include at least one positioning post 111. In the present specification, the at least one positioning post is located on the first housing 110 for example, but it should be understood that the one or more positioning posts may be located on the first housing 110 or on the second housing 120. One or more positioning holes and / or one or more positioning notches may be provided on the first circuit board 210 and the second circuit board 220. These positioning holes or positioning notches may be provided in whole or in part on one of the first circuit board 210 and the second circuit board 220. For example, in some embodiments, at least one positioning hole and / or at least one positioning notch is provided on the first circuit board 210, and no positioning hole or positioning notch is provided on the second circuit board 220. In some embodiments, at least one positioning hole and / or at least one positioning notch is provided on the second circuit board 220, and no positioning hole or positioning notch is provided on the first circuit board 210. In some embodiments, at least one positioning hole and / or at least one positioning notch is provided on the first circuit board 210, and at least one positioning hole and / or at least one positioning notch is also provided on the second circuit board 220. Furthermore, one or more positioning posts 111 are provided on the first housing 110. These positioning posts 111 are inserted into the above-mentioned one or more positioning holes or positioning notches to limit the first circuit board 210 and the second circuit board 220 from moving relative to the circuit board compartment 010 along their respective board surface directions, thereby fixing the first circuit board 210 and the second circuit board 220 in their respective board surface directions.

[0059] In some embodiments, at least one of the positioning columns 11 has the structure of a target positioning column. The target positioning column includes a column body and an enlarged column head, wherein the column body is fixedly connected to the first housing 110 and passes through the first circuit board 210 and the second circuit board 220, and the column head abuts against the first circuit board 210 or the second circuit board 220 away from the first housing 110 to fix the first circuit board 210 and the second circuit board 220 along the axis of the column body. In other words, the enlarged column head of the target positioning column can limit the first circuit board 210 and the second circuit board 220 from moving relative to the circuit board bin 010 in a direction perpendicular to the first circuit board 210 or the second circuit board 220. In some embodiments, the target positioning column can be a hot melt column, and the column head is deformed after being hot melted to fix the double-layer circuit board structure 200. The target positioning column can also be a screw, wherein the screw portion corresponds to the main body, and the nut portion corresponds to the column head. Of course, the target positioning column can also be a structure of other forms.

[0060] like Figure 4As shown, three positioning posts 111-1, 111-2 and 111-3 can be arranged on the first housing 110, and the three positioning posts are all target positioning posts and are evenly arranged around the accommodation space. On the one hand, the even arrangement of the three positioning posts can stably limit the movement of the first circuit board 210 and the second circuit board 220 relative to the circuit board bin 010 along the direction of the first circuit board 210 or the second circuit board 220. On the other hand, the even arrangement can also make the force on the circuit board more even when the column head limits the circuit board along the axial direction of the column body, which helps the double-layer circuit board to stably maintain parallelism.

[0061] In some embodiments, glue may be applied to the position where at least one positioning column on the side of the first circuit board 210 or the second circuit board 220 close to the first shell 110 contacts at least one positioning hole / positioning notch to fix the side of the first circuit board 210 or the second circuit board 220 close to the first shell 110 along the axial direction of the positioning column.

[0062] Furthermore, a receiving cavity may be provided in the circuit board compartment 010 of the earphone 001 provided in this specification. The receiving cavity is used to accommodate and limit the movement of components on the circuit board along the direction of the circuit board, thereby limiting the movement of the circuit board where the components are located along the board surface direction. In some embodiments, a receiving cavity may be provided in the first shell 110 of the circuit board compartment 010 to accommodate the corresponding target components and limit the movement of the circuit board where the target components are located along the board surface direction. The target component is the component with the highest height along the direction perpendicular to the board surface of the circuit board where it is located. For example, the memory on the second circuit board 220 is higher than other electronic components on the same board, and can be used as an "anchor point" to further fix the second circuit board 220 when it is assembled into the circuit board compartment. Accordingly, a shape-matching receiving cavity can be provided at the corresponding position of the inner wall of the circuit board compartment 100, so that the second circuit board 220 is just embedded in the receiving cavity when it is assembled into the circuit board compartment 110, and the second circuit board 220 is further fixed.

[0063] In order to allow the target component to be smoothly stuck in the accommodating cavity without affecting other components such as the circuit board itself, the depth of the accommodating cavity is designed to be less than or equal to the height of the target component relative to the surface of the circuit board on which it is located. On the one hand, such a design can make the target component abut against the first shell 110, thereby limiting the movement of the target component toward the first shell 110 in a direction perpendicular to the surface of the board. On the other hand, it can prevent the top of the accommodating cavity wall from abutting against the circuit board, thereby avoiding possible damage to the circuit board. It can be imagined that the number of the accommodating cavities can be one or more, and the number of the target components can also be one or more.

[0064] In the above application scenario, the target component is the memory 221, which is disposed on a side of the second circuit board 220 away from the first circuit board 210. The memory 221 has a larger area and a regular shape relative to the side of the double-layer circuit board structure 200 facing outward, so placing it in the accommodating cavity can form a better stabilizing effect on the double-layer circuit board structure 200.

[0065] In order to further increase the structural stability of each component in the product after assembly and improve product quality, the earphone 001 provided in this specification may also include a buffer. In some embodiments, the buffer may be located in the gap formed between the shorter of the two circuit boards and the longer one and the housing 100 of the circuit board bin 010. In some embodiments, the buffer is located between the first circuit board 210 and the housing 100 of the circuit board bin 010, and abuts against the first circuit board 210 and the housing 100, forming support for the first circuit board 210 in a direction perpendicular to its board surface. Figure 5 FIG. 1 shows a schematic diagram of a double-layer circuit board structure provided according to some embodiments of this specification. Figure 5 As shown, the buffer 500 is bonded to the side of the first circuit board 210 facing the second circuit board 220 and protruding relative to the second circuit board 220. The buffer 500 is located in the gap formed between the first circuit board 210 and the housing 100 of the circuit board compartment 010, and forms a support between the first circuit board 210 and the housing 100. The shape and size of the buffer 500 can be adjusted according to the relative position difference between the first circuit board 210 and the second circuit board 220. The thickness of the buffer 500 is not less than the distance between the first circuit board 210 and the housing 100, so as to form a support between the first circuit board 210 and the housing 100.

[0066] The double-layer circuit board structure 200 of the earphone 001 provided in the present specification can be stably assembled in the circuit board bin 010 thanks to: on the one hand, positioning columns and / or accommodating cavities can be set on the shell 100 of the circuit board bin 010 to limit the movement of the double-layer circuit board structure 200 along the board surface direction; on the other hand, target positioning columns and / or buffer parts can be set on the shell 100 of the circuit board bin 010 to limit the movement of the double-layer circuit board structure 200 in the direction perpendicular to the board surface.

[0067] In actual production, the iteration and update speed of products is very fast, especially for electronic devices. If the shell is redesigned every time an update is made, and then the mold is opened for production, the cost is very huge. The earphone 001 provided in this specification can use the shell of the original model earphone without replacing the shell. Through the double-layer design of the circuit board, a larger area of ​​the circuit board is placed in the circuit board bin 010 of the earphone 001, thereby reducing the cost of mold opening. For the convenience of description, the earphone 001 provided in this specification is a first model earphone, and the original model earphone is a second model earphone. In some embodiments, the circuit board bin 010 of the first model earphone is at least the same as the second model earphone in the shape and size of the circuit board bin 010. Further, the first model earphone can be directly expanded and upgraded on the basis of the first circuit board of the second model earphone, and the functional modules that need to be updated or added are set on the second circuit board 220, further reducing the cost of circuit design. In some embodiments, the circuit board bin 010 of the second model earphone may not include the second circuit board, that is, it only contains one circuit board, or contains a replaceable second circuit board. In some embodiments, specific functional modules can be set on the second circuit board, such as modules that are easily damaged or iterate quickly. In this way, the coupling degree between the functional module on the second circuit board and the first circuit board module can be reduced as much as possible during circuit design, thereby reducing the difficulty and cost of repairing and updating the headset, and improving the maintainability and scalability of the headset.

[0068] In summary, the earphone 001 provided in the present specification can be provided with a double-layer circuit board structure 200 in a circuit board bin 010 with limited space, so as to expand the area of ​​the circuit board. The double-layer circuit board structure 200 improves the utilization rate of the longitudinal space of the accommodating space while making full use of the lateral space of the accommodating space. At the same time, by utilizing the structural characteristics of the double-layer circuit board, a conductive buffer structure is provided between the two circuit boards to increase the grounding point, thereby reducing the signal loop area and reducing the external electromagnetic radiation. Furthermore, the earphone 001 provided in the present specification can maintain the stability of the double-layer circuit board structure 200 in the circuit board bin 010. Furthermore, the earphone 001 provided in the present specification can use the shell of an existing model of earphones to assemble the double-layer circuit board structure 200, which can reduce the production cost.

[0069] The above describes specific embodiments of the present application. Other embodiments are within the scope of the appended claims. In some cases, the actions or steps recorded in the claims can be performed in an order different from that in the embodiments and still achieve the desired results. In addition, the processes depicted in the accompanying drawings do not necessarily require a specific order or a continuous order to achieve the desired results. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.

[0070] In summary, after reading this detailed disclosure, those skilled in the art will appreciate that the foregoing detailed disclosure may be presented only by way of example and may not be restrictive. Although not explicitly stated herein, those skilled in the art will appreciate that the requirements of this application encompass various reasonable changes, improvements and modifications to the embodiments. These changes, improvements and modifications are intended to be proposed by the present application and are within the spirit and scope of the exemplary embodiments of the present application.

[0071] In addition, certain terms in this application have been used to describe embodiments of the present application. For example, "one embodiment", "embodiment" and / or "some embodiments" mean that a particular feature, structure or characteristic described in conjunction with the embodiment may be included in at least one embodiment of the present application. Therefore, it can be emphasized and should be understood that two or more references to "embodiment" or "one embodiment" or "alternative embodiment" in various parts of the present application do not necessarily refer to the same embodiment. In addition, specific features, structures or characteristics can be appropriately combined in one or more embodiments of the present application.

[0072] It should be understood that in the foregoing description of the embodiments of the present application, in order to help understand a feature and for the purpose of simplifying the present application, the present application combines various features in a single embodiment, drawing or its description. However, this does not mean that the combination of these features is necessary. When reading the present application, it is entirely possible for a person skilled in the art to mark out a part of the devices as a separate embodiment. In other words, the embodiments in the present application can also be understood as the integration of multiple secondary embodiments. This is also true when the content of each secondary embodiment is less than all the features of a single aforementioned disclosed embodiment.

[0073] Each patent, patent application, patent application publication, and other material, such as articles, books, specifications, publications, documents, articles, etc., cited herein, except any historical prosecution documents to which it is relevant, any equivalent that may be inconsistent or conflicting with this document, or any equivalent historical prosecution documents that may have a limiting effect on the broadest scope of the claims, may be incorporated herein by reference and used for all purposes now or hereafter associated with this document. In addition, in the event of any inconsistency or conflict between the descriptions, definitions, and / or use of terms associated with any of the incorporated materials and the terminology, descriptions, definitions, and / or use associated with this document, the terminology in this document shall control.

[0074] Finally, it should be understood that the embodiments of the application disclosed herein are explanations of the principles of the embodiments of the present application. Other modified embodiments are also within the scope of the present application. Therefore, the embodiments disclosed in the present application are merely examples and not limitations. Those skilled in the art can adopt alternative configurations according to the embodiments in the present application to implement the application in the present application. Therefore, the embodiments of the present application are not limited to the embodiments accurately described in the application.

Claims

1. An earhook headset, characterized in that: include: A speaker unit, which converts the input into sound; as well as A circuit board compartment, including a storage space; The speaker unit is connected to the circuit board compartment via an ear hook; as well as A first circuit board, a second circuit board and a connector, wherein the first circuit board and the second circuit board are connected in the accommodating space through the connector to form a double-layer circuit board structure to utilize the longitudinal space in the circuit board compartment perpendicular to the surface of the first circuit board; At least one button is at least partially disposed between the first circuit board and the second circuit board and is electrically connected to the first circuit board or the second circuit board.

2. The headset according to claim 1, characterized in that The connector is a board-to-board connector, and the first circuit board and the second circuit board are arranged in parallel on two sides of the board-to-board connector to form the double-layer circuit board structure; or The connector includes a flexible circuit board, and the first circuit board and the second circuit board are foldably connected and arranged in parallel through the flexible circuit board to form the double-layer circuit board structure.

3. The earphone according to claim 1, characterized in that In the board surface direction of the first circuit board, the ratio of the overlapping area of ​​the first circuit board and the second circuit board to the union area of ​​the two is greater than or equal to 0.

2.

4. The earphone according to claim 3, characterized in that The ratio of the maximum cross-sectional area of ​​the accommodating space to the combined area of ​​the first circuit board and the second circuit board along the board surface direction of the first circuit board is less than or equal to 1.

5.

5. The earphone according to claim 1, wherein: The ratio of the thickness of the circuit board bin to the thickness of the double-layer circuit board structure is less than or equal to 1.5, wherein: The thickness of the double-layer circuit board structure is the maximum distance between the first circuit board and its components and the second circuit board and its components in a direction perpendicular to the surface of the first circuit board.

6. The earphone according to claim 1, wherein: The thickness of the circuit board bin is in the range of 0.6 cm to 1 cm.

7. The earphone according to claim 1, wherein: The length of the circuit board bin is in the range of 3 cm to 4 cm.

8. The earphone according to claim 1, wherein: The housing of the circuit board bin includes at least one positioning post; and At least one positioning hole and / or at least one positioning notch are provided on the first circuit board and the second circuit board. Wherein, the at least one positioning column is penetrated through the at least one positioning hole or the at least one positioning notch to fix the first circuit board and the second circuit board in respective board surface directions.

9. The earphone according to claim 1, wherein: The shell of the circuit board bin also includes at least one button hole, and the at least one button is inserted into the at least one button hole.

10. The earphone according to claim 9, characterized in that The thickness of the button is less than or equal to the distance between the first circuit board and the second circuit board.

11. The earphone according to any one of claims 1 to 10, characterized in that: The circuit board compartment is identical to a circuit board compartment of another model of headphones at least in terms of appearance and size.

12. The headset according to claim 11, characterized in that The other model of earphones includes the first circuit board but does not include the second circuit board.

Images