Flexible printed circuit (FPC) softening structure

Abstract

The utility model relates to an FPC softening structure. The FPC softening structure comprises an FPC board, a clearance part and an opening part, the clearance part is arranged on the FPC board, the opening part is arranged on the FPC board, and the opening part is parallel to the clearance part. According to the scheme provided by the invention, the clearance part and the opening part are formed by hollowing out the area, without the wiring part, of the FPC board, so that the area of the FPC board can be reduced, the whole FPC board becomes softer, a traditional mode of brushing thermocuring green oil for softening is replaced, and the softening step is simpler.

Description

Technical Field

[0001] The utility model relates to the technical field of display screens, in particular to an FPC softening structure. Background Art

[0002] The FPC board is a circuit board that can provide excellent electrical performance and meet the design needs of smaller and higher density installation.

[0003] In the related art, conventional FPC is usually made by removing the surface PI material and then brushing heat-cured green oil to soften the FPC board. However, this method has complicated steps and high cost. Utility Model Content

[0004] The purpose of the utility model is to overcome the shortcomings of the prior art and provide an FPC softening structure that can replace the traditional softening process steps, simplify the operating procedures, and reduce production costs.

[0005] The purpose of this utility model is achieved through the following technical solutions:

[0006] In a first aspect, the present application provides an FPC softening structure, comprising: an FPC board; a gap avoidance portion, the gap avoidance portion being arranged on the FPC board; an opening portion, the opening portion being arranged on the FPC board, the opening portion and the gap avoidance portion being parallel to each other.

[0007] The air-avoiding portion includes a first cutting sub-portion, and the first cutting sub-portion is arranged on the FPC board.

[0008] It also includes a first routing portion, which is arranged on the FPC board and is located on one side of the first cutting sub-portion.

[0009] The air-avoiding portion further includes a second cutting sub-portion, and the second cutting sub-portion is arranged on the FPC board.

[0010] It also includes a second wiring portion, which is arranged on the FPC board and located at one side of the second cutting sub-portion.

[0011] It also includes a third wiring portion, and the third wiring portion is located on one side of the opening portion.

[0012] It also includes a port, which is arranged on the FPC board, and the first routing portion, the second routing portion and the third routing portion are electrically connected to the port respectively.

[0013] It also includes a binding gold finger, and the binding gold finger is electrically connected to the FPC board.

[0014] It also includes a driver IC, and the driver IC is electrically connected to the binding gold finger.

[0015] It also includes a positioning mark, which is arranged on the binding gold finger.

[0016] Compared with the prior art, the utility model has at least the following advantages:

[0017] The avoidance portion and the opening portion are formed by hollowing out the area of ​​the FPC board without wiring. This method can not only reduce the area of ​​the FPC board, making the FPC board softer as a whole, but also replaces the traditional method of softening by brushing heat-curing green oil, making the softening step simpler. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for use in the embodiments are briefly introduced below.

[0019] Figure 1 It is a structural schematic diagram of the FPC softening structure in one embodiment of the utility model. DETAILED DESCRIPTION

[0020] The embodiments of the present application will be described in more detail below with reference to the accompanying drawings. Although the embodiments of the present application are shown in the accompanying drawings, it should be understood that the present application can be implemented in various forms and should not be limited by the embodiments described herein. On the contrary, these embodiments are provided to make the present application more thorough and complete, and to fully convey the scope of the present application to those skilled in the art.

[0021] It should be understood that although the terms "first", "second", "third", etc. may be used in this application to describe various information, this information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of this application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Thus, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of this application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0022] Unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, or a detachable connection or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0023] Traditional FPC is usually made by removing the surface PI material and then brushing heat-cured green oil to soften the FPC board. However, this method has complicated steps and high cost.

[0024] In view of the above problems, an embodiment of the present application provides an FPC softening structure, which can replace the traditional softening process steps, simplify the operation procedures, and reduce production costs.

[0025] The technical solution of the embodiments of the present application is described in detail below with reference to the accompanying drawings.

[0026] See also Figure 1 A FPC softening structure includes: an FPC board 100, a gap avoiding portion 200 and an opening portion 300, wherein the gap avoiding portion 200 is arranged on the FPC board 100, the opening portion 300 is arranged on the FPC board 100, and the opening portion 300 and the gap avoiding portion 200 are parallel to each other.

[0027] It should be noted that the air-avoiding portion 200 and the opening portion are formed by hollowing out the area of ​​the FPC board 100 without wiring. This method can not only reduce the area of ​​the FPC board 100, making the FPC board 100 softer as a whole, but also replace the traditional method of softening by brushing hot curing green oil, making the softening step simpler. Among them, the design of the opening portion reduces the area of ​​the side of the FPC board 100, and the softening degree is greatly improved.

[0028] See also Figure 1 Specifically, the air avoidance portion 200 includes a first cutting sub-portion 210 , which is disposed on the FPC board 100 . More specifically, the air avoidance portion 200 also includes a first wiring portion 400 , which is disposed on the FPC board 100 and is located on one side of the first cutting sub-portion 210 .

[0029] It should be noted that the first cutting sub-portion 210 is located at one side of the first routing portion 400 , and a certain distance is set between the first cutting sub-portion 210 and the first routing portion 400 to avoid affecting signal transmission.

[0030] See also Figure 1 Specifically, the air avoidance portion 200 further includes a second cutting sub-portion 220, which is disposed on the FPC board 100. More specifically, the air avoidance portion 200 further includes a second wiring portion 500, which is disposed on the FPC board 100 and is located on one side of the second cutting sub-portion 220.

[0031] It should be noted that the second routing portion 500 is located between the first cutting sub-portion 210 and the second cutting sub-portion 220 , and a certain distance is set between the second cutting sub-portion 220 and the second routing portion 500 to avoid affecting signal transmission.

[0032] See also Figure 1 Specifically, it also includes a third wiring portion 600 , and the third wiring portion 600 is located on one side of the opening portion 300 .

[0033] It should be noted that the third routing portion 600 is located between the second cutting sub-portion 220 and the opening portion 300 .

[0034] See also Figure 1 In one embodiment, it further includes a port 700 , which is disposed on the FPC board 100 , and the first wiring portion 400 , the second wiring portion 500 , and the third wiring portion 600 are electrically connected to the port 700 , respectively.

[0035] It should be noted that the port 700 is used to plug in an external circuit or device for signal transmission.

[0036] See also Figure 1 In one embodiment, it further includes a binding gold finger 800, which is electrically connected to the FPC board 100. Specifically, it further includes a driver IC 900, which is electrically connected to the binding gold finger 800.

[0037] It should be noted that the driver IC 900 is used to output signals, and the binding gold finger 800 is used to conduct between the driver IC 900 and the FPC board 100 .

[0038] See also Figure 1 In one embodiment, it also includes a positioning mark 1000, which is set on the binding gold finger 800.

[0039] It should be noted that the alignment mark 1000 plays a fool-proof role when the FPC board 100 is bound to the binding gold finger 800 .

[0040] The scheme of the present application has been described in detail above with reference to the accompanying drawings. In the above embodiments, the descriptions of the various embodiments have their own emphasis. For parts that are not described in detail in a certain embodiment, reference can be made to the relevant descriptions of other embodiments. Those skilled in the art should also be aware that the actions and modules involved in the specification are not necessarily required for the present application. In addition, it can be understood that the steps in the method of the embodiment of the present application can be adjusted in order, merged and deleted according to actual needs, and the modules in the device of the embodiment of the present application can be merged, divided and deleted according to actual needs.

[0041] The embodiments of the present application have been described above, and the above description is exemplary, not exhaustive, and is not limited to the disclosed embodiments. Many modifications and changes will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the described embodiments. The selection of terms used herein is intended to best explain the principles of the embodiments, practical applications, or improvements to the technology in the market, or to enable other persons of ordinary skill in the art to understand the embodiments disclosed herein.

Claims

1. A FPC softening structure, characterized in that: include: FPC board; A space-avoiding portion, wherein the space-avoiding portion is arranged on the FPC board; An opening portion is provided on the FPC board, and the opening portion and the air-avoiding portion are parallel to each other.

2. The FPC softening structure according to claim 1, characterized in that: The air-avoiding portion includes a first cutting sub-portion, and the first cutting sub-portion is arranged on the FPC board.

3. The FPC softening structure according to claim 2, characterized in that: It also includes a first routing portion, which is arranged on the FPC board and is located on one side of the first cutting sub-portion.

4. The FPC softening structure according to claim 3, characterized in that: The air-avoiding portion further includes a second cutting sub-portion, and the second cutting sub-portion is arranged on the FPC board.

5. The FPC softening structure according to claim 4, characterized in that: It also includes a second wiring portion, which is arranged on the FPC board and located at one side of the second cutting sub-portion.

6. The FPC softening structure according to claim 5, characterized in that: It also includes a third wiring portion, and the third wiring portion is located on one side of the opening portion.

7. The FPC softening structure according to claim 6, characterized in that: It also includes a port, which is arranged on the FPC board, and the first routing portion, the second routing portion and the third routing portion are electrically connected to the port respectively.

8. The FPC softening structure according to claim 1, characterized in that: It also includes a binding gold finger, and the binding gold finger is electrically connected to the FPC board.

9. The FPC softening structure according to claim 8, characterized in that: It also includes a driver IC, and the driver IC is electrically connected to the binding gold finger.

10. The FPC softening structure according to claim 8, characterized in that: It also includes a positioning mark, which is arranged on the binding gold finger.

Images