Millimeter-level radar control system circuit board and electronic equipment

Abstract

The utility model provides a millimeter-scale radar control system circuit board and electronic equipment. The millimeter-level radar control system circuit board comprises a board body, a circuit layer and a plurality of shielding structures, the circuit layer is formed on the board body, each shielding structure comprises a first metal layer and a second metal layer, a plurality of shielding cavities arranged at intervals are formed in the side, close to the circuit layer, of the board body, and the shielding cavities are arranged in the first metal layer and the second metal layer. The plurality of shielding cavities and the plurality of shielding structures are arranged in a one-to-one correspondence manner, each shielding cavity comprises a grounding via hole and a blind slot, the grounding via hole is communicated with the blind slot, the width of the blind slot is greater than the diameter of the grounding via hole, the first metal layer is attached to the inner wall of the grounding via hole, and the second metal layer is attached to the inner wall of the first metal layer. The second metal layer is attached to the inner wall of the blind groove. The width of the blind groove is larger than the diameter of the grounding via hole, and the distance between one ends of two adjacent shielding cavities is small, so that the electromagnetic shielding effect and the anti-interference effect of the plurality of shielding cavities are better.

Description

Technical Field

[0001] The present disclosure relates to the technical field of millimeter-level radar control system circuit boards, and in particular to a millimeter-level radar control system circuit board and electronic equipment. Background Art

[0002] As the high-end printed circuit board market accelerates its transition to high frequency and high speed, especially for the circuit boards of millimeter-level radar control systems, the requirements for the shielding effect of high-frequency and high-speed signal layers and the prevention of interference are becoming increasingly higher. In traditional technology, the circuit board has a grounding via on one side of the circuit layer, and a copper layer is plated in the hole to enhance the shielding effect.

[0003] For example, the Chinese patent application number CN201621433126.9 discloses a high-frequency microwave circuit board, including a substrate, and an aluminum oxide heat dissipation layer, a copper-tin layer, a photo-oxidation catalytic layer and a circuit layer sequentially plated on the surface thereof, wherein the circuit layer is provided with a plurality of connection holes, and a metal foil layer is coated inside or at the edge of the connection holes. The high-frequency microwave circuit board is provided with a plurality of connection holes on the circuit layer, and the inner walls and surfaces of the connection holes are coated with a metal foil layer, thereby well shielding the high-frequency microwaves in the circuit board and improving the anti-interference performance of the circuit board.

[0004] However, for microwave circuit boards with smaller wavelengths, such as those with a wavelength of 0.1mm-0.5m, the volume of the circuit boards themselves is small, so the apertures of several holes on one side of the circuit layer are also small, and there is a certain distance between the holes. However, due to the influence of the materials and production process of the circuit boards, the distance between the holes cannot be very small, so the shielding effect of electromagnetic waves when passing through the metal layer in the hole is poor, that is, the anti-interference effect is poor.

[0005] Therefore, for millimeter-level radar control system circuit boards with smaller wavelengths, it is urgent to enhance their shielding and anti-interference effects. Utility Model Content

[0006] The purpose of the present invention is to overcome the deficiencies in the prior art and provide a millimeter-level radar control system circuit board and electronic equipment with better electromagnetic wave shielding effect and better anti-interference effect.

[0007] The purpose of this disclosure is achieved through the following technical solutions:

[0008] A millimeter-level radar control system circuit board, comprising:

[0009] A board body and a circuit layer, wherein the circuit layer is formed on the board body;

[0010] The millimeter-level radar control system circuit board also includes multiple shielding structures, each of which includes a first metal layer and a second metal layer. A plurality of shielding cavities are arranged at intervals on one side of the board body adjacent to the circuit layer. The plurality of shielding cavities are arranged one-to-one corresponding to the plurality of shielding structures. Each of the shielding cavities includes a grounding via and a blind groove. The grounding via is connected to the blind groove, and the width of the blind groove is greater than the diameter of the grounding via. The first metal layer is attached to the inner wall of the grounding via, and the second metal layer is attached to the inner wall of the blind groove. The first metal layer is connected to the second metal layer.

[0011] In one of the embodiments, the diameter of the ground via is 0.2 mm-0.4 mm.

[0012] In one embodiment, the width of the blind groove is 0.4 mm-0.6 mm.

[0013] In one embodiment, the first metal layer is a copper layer.

[0014] In one embodiment, the second metal layer is a copper layer.

[0015] In one embodiment, each of the shielding cavities penetrates the plate body.

[0016] In one embodiment, the depth of the blind slot is greater than or equal to the depth of the ground via.

[0017] In one of the embodiments, the millimeter-level radar control system circuit board also includes a solder resist layer, and the solder resist layer is attached to the surface of the board.

[0018] In one embodiment, the solder resist layer is an ink layer.

[0019] An electronic device comprises the millimeter-level radar control system circuit board described in any one of the above embodiments.

[0020] Compared with the prior art, the present invention has at least the following advantages:

[0021] In the above-mentioned millimeter-level radar control system circuit board, each shielding structure includes a first metal layer and a second metal layer, and a plurality of shielding cavities are opened on one side of the board body adjacent to the circuit layer. The plurality of shielding cavities are arranged one-to-one corresponding to the plurality of shielding structures, and each shielding cavity includes a connected blind groove and a grounding via. The first metal layer is attached to the inner wall of the grounding via, and the second metal layer is attached to the inner wall of the blind groove. The first metal layer and the second metal layer are used to reflect electromagnetic waves, and the width of the blind groove is greater than the diameter of the grounding via, so that when the spacing between two adjacent grounding vias is fixed, the spacing between two adjacent blind grooves is small, thereby achieving a smaller spacing at one end between two adjacent shielding cavities, thereby making the electromagnetic shielding effect and anti-interference effect of the multiple shielding cavities better. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions of the embodiments of the present disclosure, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present disclosure and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0023] Figure 1 This is a schematic diagram of the structure of a millimeter-level radar control system circuit board according to an embodiment;

[0024] Figure 2 for Figure 1 The structural cross-sectional view of the millimeter-level radar control system circuit board shown;

[0025] Figure 3 for Figure 1 Another structural cross-sectional view of the millimeter-level radar control system circuit board is shown. DETAILED DESCRIPTION

[0026] In order to facilitate the understanding of the present disclosure, the present disclosure will be described more fully below with reference to the relevant drawings. The preferred embodiments of the present disclosure are given in the drawings. However, the present disclosure can be implemented in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present disclosure more thoroughly and comprehensively understood.

[0027] It should be noted that when an element is referred to as being "fixed to" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only and do not represent the only implementation method.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art of the present disclosure. The terms used herein in the specification of the present disclosure are only for the purpose of describing specific embodiments and are not intended to limit the present disclosure. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0029] The present disclosure provides a millimeter-level radar control system circuit board, including a board body, a circuit layer and multiple shielding structures, the circuit layer is formed on the board body, each of the shielding structures includes a first metal layer and a second metal layer, a side of the board body adjacent to the circuit layer is provided with multiple shielding cavities arranged at intervals, the multiple shielding cavities are arranged in a one-to-one correspondence with the multiple shielding structures, each of the shielding cavities includes a grounding via and a blind groove, the grounding via is connected to the blind groove, the width of the blind groove is greater than the diameter of the grounding via, the first metal layer is attached to the inner wall of the grounding via, the second metal layer is attached to the inner wall of the blind groove, and the first metal layer is connected to the second metal layer.

[0030] In the above-mentioned millimeter-level radar control system circuit board, each shielding structure includes a first metal layer and a second metal layer, and a plurality of shielding cavities are opened on one side of the board body adjacent to the circuit layer. The plurality of shielding cavities are arranged one-to-one corresponding to the plurality of shielding structures, and each shielding cavity includes a connected blind groove and a grounding via. The first metal layer is attached to the inner wall of the grounding via, and the second metal layer is attached to the inner wall of the blind groove. The first metal layer and the second metal layer are used to reflect electromagnetic waves, and the width of the blind groove is greater than the diameter of the grounding via, so that when the spacing between two adjacent grounding vias is fixed, the spacing between two adjacent blind grooves is small, thereby achieving a smaller spacing at one end between two adjacent shielding cavities, thereby making the electromagnetic shielding effect and anti-interference effect of the multiple shielding cavities better.

[0031] In order to better understand the technical solutions and beneficial effects of the present invention, the present invention is further described in detail below in conjunction with specific embodiments:

[0032] like Figures 1 to 3As shown, a millimeter-level radar control system circuit board 10 of an embodiment includes a board body 100, a circuit layer 200 and a plurality of shielding structures 300, wherein the circuit layer 200 is formed on the board body 100, and each of the shielding structures 300 includes a first metal layer 310 and a second metal layer 320. A plurality of shielding cavities 110 arranged at intervals are opened on one side of the board body 100 adjacent to the circuit layer 200, and the plurality of shielding cavities 110 are arranged in a one-to-one correspondence with the plurality of shielding structures 300, and each of the shielding cavities 110 includes a grounding via 111 and a blind groove 112, wherein the grounding via 111 is connected to the blind groove 112, and the width of the blind groove 112 is greater than the diameter of the grounding via 111, and the first metal layer 310 is attached to the inner wall of the grounding via 111, and the second metal layer 320 is attached to the inner wall of the blind groove 112, and the first metal layer 310 is connected to the second metal layer 320.

[0033] In this embodiment, the circuit layer 200 generates electromagnetic radiation when working, and a plurality of shielding cavities 110 are provided at intervals on one side of the circuit layer 200, and a plurality of shielding structures 300 are provided in one-to-one correspondence with the shielding cavities 110. Further, each shielding cavity 110 includes a blind slot 112 and a grounding via 111 that are connected, and the first metal layer 310 is attached to the inner wall of the grounding via 111, and the second metal layer 320 is attached to the inner wall of the blind slot 112, and the first metal layer 310 and the second metal layer 320 are used to reflect electromagnetic radiation, and because the width of the blind slot 112 is greater than the diameter of the grounding via 111, that is, when the distance between two adjacent grounding vias 111 is the smallest due to the process and the material of the board 100, the distance between two adjacent blind slots 112 is smaller, so that the distance between one end of the two adjacent shielding cavities 110 is smaller, that is, the multiple shielding cavities 110 are more dense, and thus the multiple shielding cavities 110 have better electromagnetic shielding effect and anti-interference effect.

[0034] In the above-mentioned millimeter-level radar control system circuit board 10, each shielding structure 300 includes a first metal layer 310 and a second metal layer 320. A plurality of shielding cavities 110 are opened on one side of the board body 100 adjacent to the circuit layer 200. The plurality of shielding cavities 110 are arranged one-to-one corresponding to the plurality of shielding structures 300. Each shielding cavity 110 includes a connected blind groove 112 and a grounding via 111. The first metal layer 310 is attached to the inner wall of the grounding via 111, and the second metal layer 320 is attached to the inner wall of the blind groove 112. The first metal layer 310 and the second metal layer 320 are used to reflect electromagnetic waves, and the width of the blind groove 112 is greater than the diameter of the grounding via 111, so that when the spacing between two adjacent grounding vias 111 is fixed, the spacing between two adjacent blind grooves 112 is small, thereby achieving a small spacing at one end between two adjacent shielding cavities 110, thereby making the electromagnetic shielding effect and anti-interference effect of the plurality of shielding cavities 110 better.

[0035] In one embodiment, the diameter of the grounding via 111 is 0.2 mm-0.4 mm. In this embodiment, the diameter of the grounding via 111 is 0.2 mm.

[0036] In one embodiment, the width of the blind groove 112 is 0.4 mm-0.6 mm. In this embodiment, the width of the blind groove 112 is 0.4 mm.

[0037] In one embodiment, the first metal layer 310 is a copper layer. It is understood that after drilling the board 100 to form the grounding via 111, the board 100 is grooved to form a blind groove 112 connected to the grounding via 111, and then the grounding via 111 is copper plated to form a copper layer on the hole wall of the grounding via 111, so that the copper layer reflects electromagnetic waves. Of course, in other embodiments, the first metal layer 310 can also be other metals such as gold and silver.

[0038] In one embodiment, the second metal layer 320 is a copper layer. It is understood that the blind groove 112 is subjected to copper deposition operation, and a copper layer is formed on the inner wall of the blind groove 112, so that the copper layer is resistant to electromagnetic radiation. Of course, in other embodiments, the second metal layer 320 can also be other metals such as gold and silver.

[0039] like Figure 2 and Figure 3 As shown, in one embodiment, each of the shielding cavities 110 penetrates the board body 100. It can be understood that each of the shielding cavities 110 includes a grounding via 111 and a blind slot 112, and the grounding via 111 is connected to the blind slot 112, that is, one end of the grounding via 111 penetrates the upper surface of the board body 100, and one end of the blind slot 112 penetrates the lower surface of the board body 100.

[0040] In one embodiment, the depth of the blind groove 112 is greater than or equal to the depth of the ground via 111. In this embodiment, the depth of the blind groove 112 is equal to the depth of the ground via 111, that is, the depth of the blind groove 112 is equivalent to half the thickness of the board 100, so that the blind groove 112 and the ground via 111 have a better effect on electromagnetic reflection.

[0041] like Figure 2 As shown, in one embodiment, the millimeter-level radar control system circuit board 10 further includes a solder resist layer 400, and the solder resist layer 400 is attached to the surface of the board body 100. It can be understood that the solder resist layer 400 is attached to the circuits and copper surfaces on the surface of the board body 100 that do not need to be soldered, so as to protect the circuits and insulate.

[0042] In one embodiment, the solder resist layer 400 is an ink layer. In this embodiment, the ink undergoes polymerization after exposure to solidify and adheres to the circuits and copper surfaces on the surface of the board 100 that do not need to be soldered.

[0043] The present application also provides an electronic device, comprising the millimeter-level radar control system circuit board 10 described in any of the above embodiments.

[0044] Compared with the prior art, the present invention has at least the following advantages:

[0045] In the above-mentioned millimeter-level radar control system circuit board 10, each shielding structure 300 includes a first metal layer 310 and a second metal layer 320. A plurality of shielding cavities 110 are opened on one side of the board body 100 adjacent to the circuit layer 200. The plurality of shielding cavities 110 are arranged one-to-one corresponding to the plurality of shielding structures 300. Each shielding cavity 110 includes a connected blind groove 112 and a grounding via 111. The first metal layer 310 is attached to the inner wall of the grounding via 111, and the second metal layer 320 is attached to the inner wall of the blind groove 112. The first metal layer 310 and the second metal layer 320 are used to reflect electromagnetic waves, and the width of the blind groove 112 is greater than the diameter of the grounding via 111, so that when the spacing between two adjacent grounding vias 111 is fixed, the spacing between two adjacent blind grooves 112 is small, thereby achieving a small spacing at one end between two adjacent shielding cavities 110, thereby making the electromagnetic shielding effect and anti-interference effect of the plurality of shielding cavities 110 better.

[0046] The above-mentioned embodiments only express several implementation methods of the present disclosure, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the utility model patent. It should be pointed out that, for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the present disclosure, and these all belong to the protection scope of the present disclosure. Therefore, the protection scope of the patent of the present disclosure shall be based on the attached claims.

Claims

1. A millimeter-level radar control system circuit board, comprising a board body and a circuit layer, wherein the circuit layer is formed on the board body, characterized in that: The millimeter-level radar control system circuit board also includes multiple shielding structures, each of which includes a first metal layer and a second metal layer. A plurality of shielding cavities are arranged at intervals on one side of the board body adjacent to the circuit layer. The plurality of shielding cavities are arranged one-to-one corresponding to the plurality of shielding structures. Each of the shielding cavities includes a grounding via and a blind groove. The grounding via is connected to the blind groove, and the width of the blind groove is greater than the diameter of the grounding via. The first metal layer is attached to the inner wall of the grounding via, and the second metal layer is attached to the inner wall of the blind groove. The first metal layer is connected to the second metal layer.

2. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The diameter of the ground via hole is 0.2 mm-0.4 mm.

3. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The width of the blind groove is 0.4mm-0.6mm.

4. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The first metal layer is a copper layer.

5. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The second metal layer is a copper layer.

6. The millimeter-level radar control system circuit board according to claim 1, characterized in that: Each of the shielding cavities penetrates the plate body.

7. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The depth of the blind groove is greater than or equal to the depth of the ground via.

8. The millimeter-level radar control system circuit board according to claim 1, characterized in that: The millimeter-level radar control system circuit board also includes a solder resist layer, and the solder resist layer is attached to the surface of the board body.

9. The millimeter-level radar control system circuit board according to claim 8, characterized in that: The solder resist layer is an ink layer.

10. An electronic device, characterized in that: A millimeter-level radar control system circuit board comprising any one of claims 1 to 9.

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