Packaging structure of ultrathin PCB substrate

Abstract

The utility model discloses a packaging structure of an ultrathin PCB (Printed Circuit Board) substrate, which relates to the technical field of PCBs and comprises a main body, the body comprises an upper supporting layer, a top layer, a middle layer, a bottom layer and a lower supporting layer. The top layer adheres to one side of the middle layer, the bottom layer adheres to the side, away from the top layer, of the middle layer, the upper supporting layer adheres to the side, away from the middle layer, of the top layer, the lower supporting layer adheres to the side, away from the middle layer, of the bottom layer, a plurality of through holes are formed in the body at equal intervals, and bonding pad assemblies are arranged in the through holes. According to the utility model, by arranging the bonding pad assembly capable of self-riveting, the bonding pad assembly can be riveted on the main body by utilizing the structure of the bonding pad assembly, and each plate layer of the main body can be connected together by virtue of the riveting effect, so that the main body and the bonding pad assembly can be packaged in a riveting manner, and the stability of the bonding pad assembly cannot be influenced by long-term high temperature; and the service life of the PCB substrate in a long-term high-temperature or high-pressure environment is greatly prolonged.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB boards, and in particular to a packaging structure of an ultra-thin PCB substrate. Background Art

[0002] Ultra-thin PCB substrate refers to a PCB substrate with a thinner thickness compared to standard types of PCBs. It is not only more compact and lighter, but also suitable for any PCB application where high reliability and miniaturization play a major role. Through high-density PCB design, ultra-thin PCB substrate can help achieve the miniaturization of equipment and provide better performance.

[0003] In the prior art, during the manufacturing process, the pads on the PCB are usually precisely fixed to the through-hole positions of the substrate by welding to achieve a stable connection with the electronic components. However, this welding process is not without risks. In actual operation, the high temperature environment when welding components often causes the metal material at the connection part of the pad to melt, which may not only destroy the structural integrity of the pad, but also cause the serious problem of the pad falling off from the substrate. Once the pad falls off, it will directly cause the circuit to be disconnected, thereby affecting the normal operation of the entire electronic device; in addition, the multi-layer structure of the PCB board is also a major challenge in its design and manufacturing process. In order to achieve a close combination between the layers, adhesives such as glue are usually used for interlayer bonding. However, this bonding method is in an environment where electronic equipment works for a long time. As the equipment continues to operate, the internal temperature continues to rise, and the bonding performance of the glue will gradually decrease, resulting in debonding, which will lead to loosening between the board layers, affecting the stability and reliability of the entire PCB board. Utility Model Content

[0004] The purpose of the utility model is to provide a packaging structure of an ultra-thin PCB substrate to solve the problems raised in the above background technology.

[0005] In order to solve the above technical problems, the technical solution adopted by the utility model is:

[0006] A packaging structure of an ultra-thin PCB substrate comprises a main body; the main body comprises an upper supporting layer, a top layer, a middle layer, a bottom layer and a lower supporting layer; the top layer is bonded to one side of the middle layer, the bottom layer is bonded to a side of the middle layer away from the top layer, the upper supporting layer is bonded to a side of the top layer away from the middle layer, and the lower supporting layer is bonded to a side of the bottom layer away from the middle layer; a plurality of through holes are equidistantly provided on the main body, pad assemblies are provided inside the through holes, the pad assemblies are used for structurally fastening the main body and providing welding support at the same time, a reinforcing assembly is provided on the side wall of the main body, the reinforcing assembly is used for structurally reinforcing the frame position of the main body.

[0007] By adopting the above technical solution, a self-riveting pad assembly is provided, which can be riveted to the main body by utilizing its own structure, and at the same time, the various board layers of the main body can be connected together by means of the riveting action, so that the main body and the pad assembly can be packaged in a riveted manner, and their stability will not be affected by long-term high temperature.

[0008] A further improvement of the technical solution of the utility model is that the pad assembly includes a connecting tube, one end of the connecting tube is fixedly connected to a fixed pad, the inner wall of the connecting tube is equidistantly fixedly connected to a plurality of rivet plates, an end of the connecting tube away from the fixed pad is provided with a movable pad, and the movable pad is riveted to the end of the connecting tube through the rivet plates.

[0009] By adopting the above technical solution, the movable pad can be fixed by extending each rivet sheet outward, and then pressed to deform the rivet sheet and fit tightly against the bottom of the inner wall of the recess, so that the pad can be riveted and fixed as a whole, and after the riveting is completed, soldering operation is performed in the recess to fix the rivet sheet and the recess.

[0010] A further improvement of the technical solution of the utility model is that: fitting openings are provided at both ends of the through hole on the main body, the fixed pad and the movable pad are located inside the fitting openings, and a notch is provided on one side of the movable pad.

[0011] By adopting the above technical solution, the riveting sheets can be extended to the side away from each other through the movable welding pads for simple connection and fixation, so that the movable welding pads and the connecting tube are connected and fixed, while avoiding the presence of protrusions at the riveting positions that affect use.

[0012] A further improvement of the technical solution of the utility model is that the reinforcing component includes two first ribs and two second ribs, the first ribs are symmetrically arranged between the upper supporting layer and the lower supporting layer, the first ribs are in contact with the middle layer, the bottom layer and the top layer on opposite sides, the two second ribs are respectively arranged between the ends of the two first ribs, and the second ribs are connected to the first ribs by screws.

[0013] By adopting the above technical solution, ribs (first ribs and second ribs) are arranged around the main body to structurally strengthen the frame position of the main body, thereby ensuring the compression resistance of the main body.

[0014] A further improvement of the technical solution of the utility model is that: a T-shaped groove is provided on one side of the upper supporting layer and the lower supporting layer, and T-shaped blocks are provided on both sides of the second rib and the first rib, and the T-shaped blocks are used in conjunction with the T-shaped groove.

[0015] The above technical solution is adopted so that the ribs can be riveted to the upper supporting layer and the lower supporting layer at the same time, so as to improve the stability of the whole structure.

[0016] A further improvement of the technical solution of the utility model is that the upper supporting layer and the lower supporting layer are both set as FR-epoxy resin, the top layer and the bottom layer are both set as copper foil, and the middle layer is set as FR-epoxy resin.

[0017] Using the above technical solution, FR-epoxy resin is used as an insulating material with excellent electrical properties, mechanical properties and thermal stability, which can meet the stability and pressure resistance requirements of the PCB substrate, while copper foil is used as a conductive layer (top and bottom layers) to realize signal transmission and power distribution, ensuring the normal operation of the circuit board.

[0018] A further improvement of the technical solution of the utility model is that a plurality of positioning holes are provided on the main body.

[0019] By adopting the above technical solution, holes are reserved on the main body to facilitate installation of the main body in the usage scenario.

[0020] Due to the adoption of the above technical solution, the utility model has achieved the following technical progress compared with the prior art:

[0021] 1. The utility model provides a packaging structure of an ultra-thin PCB substrate. By arranging a self-riveting pad assembly, it can be riveted on the main body by utilizing its own structure, and at the same time, the various board layers of the main body can be connected together by means of the riveting action, so that the main body and the pad assembly can be packaged in a riveted manner, and thus its stability will not be affected by long-term high temperature, which greatly improves the service life of the PCB substrate in long-term high temperature or high pressure environment.

[0022] 2. The utility model provides a packaging structure of an ultra-thin PCB substrate, by respectively arranging a first rib and a second rib around the main body to structurally strengthen the frame position of the main body, thereby ensuring the compression resistance of the main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The utility model will be further described below in conjunction with the accompanying drawings.

[0024] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0025] Figure 2 This is a schematic diagram of the split structure of the utility model;

[0026] Figure 3 It is a schematic diagram of the structure of the main body of the utility model;

[0027] Figure 4 It is a partial cross-sectional structural schematic diagram of the utility model;

[0028] Figure 5 This is a schematic diagram of the structure of the first rib and the second rib of the utility model;

[0029] Figure 6 For this utility model Figure 4 Enlarged view of point A in the middle.

[0030] In the figure: 1. main body; 11. upper supporting layer; 12. top layer; 13. middle layer; 14. bottom layer; 15. lower supporting layer; 21. connecting tube; 22. fixed pad; 23. riveting sheet; 24. movable pad; 25. notch; 31. first rib; 32. T-shaped block; 33. T-shaped slot; 34. second rib; 4. through hole; 5. fitting opening; 6. positioning hole. DETAILED DESCRIPTION

[0031] The present invention is further described in detail below in conjunction with the embodiments:

[0032] Example 1

[0033] like Figure 1-Figure 6 As shown, the utility model provides a packaging structure of an ultra-thin PCB substrate, including a main body 1; the main body 1 includes an upper supporting layer 11, a top layer 12, a middle layer 13, a bottom layer 14 and a lower supporting layer 15; the top layer 12 is bonded to one side of the middle layer 13, the bottom layer 14 is bonded to the side of the middle layer 13 away from the top layer 12, the upper supporting layer 11 is bonded to the side of the top layer 12 away from the middle layer 13, and the lower supporting layer 15 is bonded to the side of the bottom layer 14 away from the middle layer 13, a plurality of through holes 4 are equidistantly provided on the main body 1, a pad assembly is provided inside the through hole 4, the pad assembly is used for structurally fastening the main body 1 and providing welding support, a reinforcing assembly is provided on the side wall of the main body 1, and the reinforcing assembly is used for structurally reinforcing the frame position of the main body 1.

[0034] In this embodiment, a self-riveting pad assembly is provided, which can be riveted to the main body 1 by utilizing its own structure, and the various board layers of the main body 1 can be connected together by means of the riveting action, so that the main body 1 and the pad assembly can be packaged in a riveted manner, and thus will not be affected by long-term high temperature and its stability, which greatly improves the service life of the PCB substrate in long-term high temperature or high pressure environment.

[0035] like Figure 4 and Figure 6 As shown, preferably, the pad assembly includes a connecting tube 21, one end of the connecting tube 21 is fixedly connected to a fixed pad 22, the inner wall of the connecting tube 21 is equidistantly fixedly connected to a plurality of rivet plates 23, and an end of the connecting tube 21 away from the fixed pad 22 is provided with a movable pad 24, and the movable pad 24 is riveted to the end of the connecting tube 21 through the rivet plates 23.

[0036] In this embodiment, the movable pad 24 can be fixed by extending each rivet sheet 23 outward, and then pressed to deform the rivet sheet 23 and fit tightly against the bottom of the inner wall of the recess 25, so that the pad can be riveted and fixed as a whole. After the riveting is completed, soldering operation is performed in the recess 25, so that the rivet sheet 23 and the recess 25 are fixedly connected.

[0037] like Figure 4 and Figure 6 As shown, preferably, fitting openings 5 ​​are provided at both ends of the through hole 4 on the main body 1 , the fixed pad 22 and the movable pad 24 are located inside the fitting openings 5 ​​, and a notch 25 is provided on one side of the movable pad 24 .

[0038] In this embodiment, the riveting pieces 23 can be extended to the side away from each other through the movable pads 24 for simple connection and fixation, so that the movable pads 24 and the connecting tube 21 are connected and fixed, while avoiding the presence of protrusions at the riveting position to affect the use.

[0039] Example 2

[0040] like Figure 3 and Figure 5 As shown, based on Example 1, the utility model provides a technical solution: preferably, the reinforcement component includes two first ribs 31 and two second ribs 34, the first ribs 31 are symmetrically arranged between the upper supporting layer 11 and the lower supporting layer 15, the first ribs 31 are in contact with the middle layer 13, the bottom layer 14 and the top layer 12 on opposite sides, the two second ribs 34 are respectively arranged between the ends of the two first ribs 31, and the second ribs 34 are connected to the first ribs 31 by screws.

[0041] In this embodiment, ribs (first ribs 31 and second ribs 34 ) are provided around the main body 1 to structurally strengthen the frame of the main body 1 , thereby ensuring the compression resistance of the main body 1 .

[0042] like Figure 5 and Figure 6 As shown, preferably, a T-shaped groove 33 is provided on one side of the upper supporting layer 11 and the lower supporting layer 15 close to each other, and a T-shaped block 32 is provided on both sides of the second rib 34 and the first rib 31 , and the T-shaped block 32 is used in conjunction with the T-shaped groove 33 .

[0043] In this embodiment, the ribs are capable of riveting the upper supporting layer 11 and the lower supporting layer 15 at the same time, so as to improve the stability of the entire structure.

[0044] Example 3

[0045] Based on Example 2, the utility model provides a technical solution: preferably, the upper support layer 11 and the lower support layer 15 are both set to FR-4 epoxy resin, the top layer 12 and the bottom layer 14 are both set to copper foil, and the middle layer 13 is set to FR-4 epoxy resin.

[0046] In this embodiment, FR-4 epoxy resin is used as an insulating material, and has excellent electrical properties, mechanical properties and thermal stability, and can meet the stability and pressure resistance requirements of the PCB substrate, while copper foil is used as a conductive layer (top layer 12 and bottom layer 14), which can realize signal transmission and power distribution, and ensure the normal operation of the circuit board.

[0047] like Figure 1 and Figure 2 As shown, preferably, a plurality of positioning holes 6 are provided on the main body 1 .

[0048] In this embodiment, holes are reserved on the main body 1 to facilitate installation of the main body 1 in the usage scenario.

[0049] The working principle of the packaging structure of the ultra-thin PCB substrate is described in detail below.

[0050] like Figure 1-Figure 6 As shown, in the production process of the equipment, the layers are arranged from bottom to top in the order of lower support layer 15, bottom layer 14, middle layer 13, top layer 12 and upper support layer 11, and glued together. Before bonding, at least three positioning rods need to be used to pass through the through holes 4 located at the corners of each layer to ensure that the layers are aligned during mounting. After mounting, the first ribs 31 are placed from both sides of the mounted main body 1, so that each T-shaped block 32 is inserted into the corresponding T-shaped groove 33, and then the second ribs 34 are placed from both ends of the first rib 31, and then the second ribs 34 are connected to the first ribs 31 with screws.

[0051] For the pad assembly, insert the connecting tube 21 through the through hole 4 from one side of the lower support layer 15 (before insertion, it is necessary to use external force to slightly deform the rivet sheet 23 so that it can pass through the through hole 4 smoothly, and the subsequent connection process of the movable pad 24 also requires the same operation), so that the top of the connecting tube 21 is flush with the bottom of the fitting opening 5 located in the upper support layer 11, and then press the movable pad 24 so that each rivet sheet 23 fixes the movable pad 24, and then press it to deform the rivet sheet 23 and fit tightly to the bottom of the inner wall of the recess 25, so that the pad can be riveted and fixed as a whole, and after the riveting is completed, soldering operation is performed in the recess 25, so that the rivet sheet 23 is fixedly connected to the recess 25, and the packaging operation of the PCB substrate is completed.

[0052] After the encapsulation is completed, the main body 1 is provided with ribs on all sides to ensure the compression resistance of the main body 1; the board layers are restricted by the T-shaped blocks 32 and the T-shaped slots 33 on the one hand, and are constrained by the pad components on the other hand, so that debonding and loosening will not easily occur even when working in a high-temperature environment for a long time. At the same time, it can avoid the pad from falling off due to high temperature during welding, thereby improving the service life of the PCB board.

[0053] The above generally describes the present invention in detail, but it is obvious to a person skilled in the art that some modifications or improvements can be made to the present invention. Therefore, modifications or improvements that do not deviate from the spirit of the present invention are within the scope of protection of the present invention.

Claims

1. A packaging structure of an ultra-thin PCB substrate, comprising a main body (1); characterized in that: The main body (1) comprises an upper supporting layer (11), a top layer (12), a middle layer (13), a bottom layer (14) and a lower supporting layer (15); the top layer (12) is bonded to one side of the middle layer (13), the bottom layer (14) is bonded to the side of the middle layer (13) away from the top layer (12), the upper supporting layer (11) is bonded to the side of the top layer (12) away from the middle layer (13), and the lower supporting layer (15) is bonded to the side of the bottom layer (14) away from the middle layer (13); a plurality of through holes (4) are equidistantly provided on the main body (1); a pad assembly is provided inside the through hole (4); the pad assembly is used for structurally fastening the main body (1) and providing welding support; a reinforcing assembly is provided on the side wall of the main body (1); the reinforcing assembly is used for structurally reinforcing the frame position of the main body (1).

2. The packaging structure of an ultra-thin PCB substrate according to claim 1, characterized in that: The pad assembly comprises a connecting tube (21), one end of the connecting tube (21) is fixedly connected to a fixed pad (22), the inner wall of the connecting tube (21) is fixedly connected to a plurality of rivet plates (23) at equal intervals, and an end of the connecting tube (21) away from the fixed pad (22) is provided with a movable pad (24), and the movable pad (24) is riveted to the end of the connecting tube (21) via the rivet plates (23).

3. The packaging structure of an ultra-thin PCB substrate according to claim 2, characterized in that: The main body (1) is provided with fitting openings (5) at both ends of the through hole (4); the fixed pad (22) and the movable pad (24) are located inside the fitting openings (5); and a notch (25) is provided on one side of the movable pad (24).

4. The packaging structure of an ultra-thin PCB substrate according to claim 3, characterized in that: The reinforcing component comprises two first ribs (31) and two second ribs (34); the first ribs (31) are symmetrically arranged between the upper supporting layer (11) and the lower supporting layer (15); the first ribs (31) are in contact with the middle layer (13), the bottom layer (14) and the top layer (12) on opposite sides; the two second ribs (34) are respectively arranged between the ends of the two first ribs (31); and the second ribs (34) are connected to the first ribs (31) by screws.

5. The packaging structure of an ultra-thin PCB substrate according to claim 4, characterized in that: A T-shaped groove (33) is provided on the side where the upper supporting layer (11) and the lower supporting layer (15) are close to each other, and T-shaped blocks (32) are provided on both sides of the second rib (34) and the first rib (31), and the T-shaped blocks (32) are used in conjunction with the T-shaped groove (33).

6. The packaging structure of an ultra-thin PCB substrate according to claim 5, characterized in that: The upper supporting layer (11) and the lower supporting layer (15) are both configured as FR-4 epoxy resin, the top layer (12) and the bottom layer (14) are both configured as copper foil, and the middle layer (13) is configured as FR-4 epoxy resin.

7. The packaging structure of an ultra-thin PCB substrate according to claim 6, characterized in that: The main body (1) is provided with a plurality of positioning holes (6).

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