Display device

Abstract

The embodiment of the utility model belongs to the technical field of display, and provides display equipment which comprises a mainboard, a radiator and a connecting assembly. The mainboard is provided with a heating element. The radiator is arranged on the heating element. The connection assembly is configured to connect the heat sink and the mainboard. The connecting assembly comprises a first connecting piece and a second connecting piece. The first connecting piece and the second connecting piece are arranged on the radiator and the main board respectively so as to be connected with the radiator and the main board, and the first connecting piece and the second connecting piece are located between the radiator and the main board. Wherein at least one of the first connecting piece and the second connecting piece is magnetic, and the first connecting piece and the second connecting piece are magnetically attracted. The problems that the connection mode of the radiator and the mainboard occupies the space in the thickness direction of the display equipment, and the display equipment is difficult to meet the ultra-thin requirement can be solved.

Description

Technical Field

[0001] The embodiments of the present application relate to display technology, and more particularly to a display device. Background Art

[0002] Display devices such as flat panel displays and televisions are equipped with motherboards. During the operation of the display device, the heat generating components (such as chips) on the motherboard tend to generate a lot of heat. If the heat is not promptly dissipated, the heat accumulated in the display device can easily affect the working performance of the display device and cause the display device to malfunction. Therefore, a heat sink is usually provided at the position corresponding to the heat generating component on the motherboard to dissipate the heat of the heat generating component on the motherboard.

[0003] In the related art, the heat sink can be fixed to the mainboard by spring clips or screws. In the spring clip fixing method, the thickness of the spring and the clip cap head needs to be reserved between the heat sink and the rear shell, and the thickness of the mushroom head needs to be reserved between the mainboard and the back plate. In the screw fixing method, the height of the spring and the nut needs to be reserved between the heat sink and the rear shell, and the height of the fixed rivet column needs to be reserved between the mainboard and the back plate.

[0004] However, both of the above-mentioned two fixing methods in the related art require to reserve thickness space in the thickness direction of the display device, which easily makes it difficult to reduce the thickness of the display device, thereby making it difficult to meet the development trend of ultra-thin display products. Utility Model Content

[0005] The embodiment of the present application provides a display device, which can solve the problem that the connection method between the heat sink and the mainboard causes the space in the thickness direction of the display device to be occupied, and the display device is difficult to meet the ultra-thin demand.

[0006] In a first aspect, an embodiment of the present application provides a display device, comprising:

[0007] A main board, provided with a heating element;

[0008] A radiator, disposed on the heating element;

[0009] A connection component configured to connect the heat sink and the mainboard, the connection component comprising a first connection member and a second connection member, the first connection member and the second connection member are respectively disposed on the heat sink and the mainboard to connect the heat sink and the mainboard, and the first connection member and the second connection member are located between the heat sink and the mainboard;

[0010] At least one of the first connecting member and the second connecting member is magnetic, and the first connecting member and the second connecting member are magnetically attracted to each other.

[0011] By arranging the first connecting member and the second connecting member between the mainboard and the radiator, when the radiator and the mainboard are connected, the first connecting member and the second connecting member are not easy to occupy the external space of the mainboard and the radiator, which is beneficial to reducing the thickness of the display device, improving the ultra-thinness of the display device, and meeting market demand.

[0012] In some embodiments of the present application, the first connecting member and the second connecting member are arranged opposite to each other; the first connecting member is provided with a first limiting portion, and the second connecting member is provided with a second limiting portion;

[0013] The first limiting portion may be inserted through the second limiting portion to be connected to the mainboard, or the second limiting portion may be inserted through the first limiting portion to be connected to the heat sink.

[0014] In this arrangement, the first limiting portion can be inserted into the second limiting portion, or the second limiting portion can be inserted into the first limiting portion, so that the first connecting member and the second connecting member are not easily misaligned in the plane where the two are in contact with each other, thereby improving the connection reliability between the radiator and the motherboard.

[0015] In some embodiments of the present application, the first connecting member includes a first body, the first body is disposed on the heat sink, and the first limiting portion protrudes from a surface of the first body facing the mainboard;

[0016] The second limiting portion passes through the second connecting member, the main board is provided with an avoidance portion, the second limiting portion is arranged corresponding to the avoidance portion, and the first limiting portion is passed through the second limiting portion to be connected with the avoidance portion.

[0017] In this way, the first limiting portion is located inside the second limiting portion, and the movement of the first limiting portion can be constrained by the inner wall of the second limiting portion, thereby reducing the possibility of the first connector and the second connector being offset between their opposite surfaces. The first limiting portion can pass through the second limiting portion of the second connector, and part of the first limiting portion can be located in the avoidance portion on the mainboard, so that the inner wall of the avoidance portion cooperates with the first limiting portion to increase the contact area between the first connector and the mainboard, which is conducive to improving the connection stability between the heat sink and the mainboard.

[0018] In some embodiments of the present application, a first mounting portion is provided on a surface of the heat sink facing the mainboard, and the first connecting member is provided on the first mounting portion;

[0019] And / or, a second mounting portion is provided on a surface of the mainboard facing the heat sink, and the second connecting member is provided on the second mounting portion.

[0020] At least one of the first connector and the second connector may have a relatively large thickness to improve the magnetic connection stability of the first connector and the second connector. When the thickness of the first connector and the second connector is greater than the thickness of the heating element, the first mounting portion may form a first recess. Part of the first connector may be located in the first recess so that the first connector and the second connector are still located in the interval between the heat sink and the mainboard, thereby reducing the possibility that the first connector and the second connector occupy the space outside the heat sink and the mainboard, thereby affecting the ultra-thinness of the display device.

[0021] In some embodiments of the present application, the heat sink includes a substrate and a heat sink. The heat sink is disposed on a side of the substrate facing away from the heating element. The heat sink and the substrate form a heat dissipation channel.

[0022] With such arrangement, the heat generated during operation of the heating element can be transferred to the heat dissipation channel through the substrate, and the heat generated by the heating element can be moved out to the outside of the mainboard through the airflow in the heat dissipation channel.

[0023] In some embodiments of the present application, the heat sink includes a first fin extending along a first direction of the substrate, a plurality of the first fins are spaced apart along a second direction of the substrate, and the heat dissipation channel is formed between two adjacent first fins.

[0024] By providing a plurality of first fins, the heat dissipation area of ​​the radiator can be increased. The heat generated by the heating element can be transferred to the plurality of first fins through the substrate. The heat on the plurality of first fins can be dissipated into the heat dissipation channel between two adjacent first fins. Since the heat dissipation channel is connected to the ventilation holes on the rear housing, the internal airflow of the display device and the external airflow can be circulated, so the hot air flow in the heat dissipation channel can flow to the outside of the display device through the ventilation holes.

[0025] In some embodiments of the present application, the heat sink includes a plurality of second fins, the second fins and the substrate are arranged to form a flow channel flowing along a first direction of the substrate, the plurality of second fins are sequentially connected along the first direction, and two intervals of the second fins are correspondingly arranged;

[0026] Two second fins adjacent to each other along the second direction of the substrate are staggered, and an overlapping area is provided between the two staggered second fins.

[0027] With such arrangement, along the first direction, one second fin can be separated from two adjacent second fins, so that the flow boundary layer of the flow channel can be interrupted, thereby reducing the influence of the flow boundary layer on the heat dissipation effect.

[0028] In some embodiments of the present application, the second fin has an opening facing the substrate, and the open end of the second fin is connected to the substrate.

[0029] When the open end of the second fin is connected to the base plate, the second fin and the base plate can be surrounded to form a closed annular structure to increase the contact area between the hot air flow and the second fin and improve the heat dissipation efficiency.

[0030] In some embodiments of the present application, a heat-conducting layer is provided on the surface of the heating element facing the heat sink, one side surface of the heat-conducting layer is connected to the heating element, and the other side surface is connected to the heat sink.

[0031] Since the heat-conducting layer is connected to the heating element and the heat sink, the heat generated by the heating element can be transferred to the heat sink through the heat-conducting layer and then dissipated by the heat sink. The heat-conducting layer can be configured to improve the heat conduction efficiency between the heating element and the heat sink.

[0032] In a second aspect, an embodiment of the present application provides a display device, comprising a mainboard, a heat sink and a connecting component, wherein the heat sink is arranged on the mainboard through the connecting component, and the connecting component comprises a first connecting member and a second connecting member, wherein the first connecting member is arranged on the mainboard, and the second connecting member is arranged on the heat sink, and at least one of the first connecting member and the second connecting member is magnetic, and the first connecting member and the second connecting member are both located between the mainboard and the heat sink and are magnetically attracted to each other. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the implementation methods in the embodiments of the present application or the related technologies, the following is a brief introduction to the drawings required for use in the embodiments or the related technology descriptions. Obviously, the drawings described below are some embodiments of the present application, and a person skilled in the art can also obtain other drawings based on these drawings.

[0034] Figure 1 It is a structural schematic diagram of a fixing method of a heat sink and a mainboard in an embodiment of the related art;

[0035] Figure 2 It is a structural schematic diagram of a fixing method of a heat sink and a mainboard in another embodiment of the related art;

[0036] Figure 3 A schematic diagram of a partial structure of a display device according to an embodiment of the present application;

[0037] Figure 4 It is a cross-sectional structural schematic diagram of a display device according to an embodiment of the present application in which a heat sink is arranged on a mainboard;

[0038] Figure 5 for Figure 4A schematic diagram of the enlarged structure at A in the middle;

[0039] Figure 6 for Figure 4 A schematic diagram of the enlarged structure at B in the middle;

[0040] Figure 7 A schematic diagram of a partial exploded structure of a display device according to an embodiment of the present application;

[0041] Figure 8 This is a schematic diagram of a three-dimensional structure in which a first connecting member is disposed on a heat sink in a display device according to an embodiment of the present application;

[0042] Fig. 9 This is a schematic diagram of a three-dimensional structure in which a second connecting member is arranged on a mainboard in a display device according to an embodiment of the present application;

[0043] Fig.10 It is a schematic cross-sectional structural diagram of a connection component in a display device according to another embodiment of the present application;

[0044] Fig.11 A schematic diagram of the three-dimensional structure of a heat sink according to an embodiment of the present application;

[0045] Fig.12 A schematic diagram of the three-dimensional structure of a heat sink according to another embodiment of the present application;

[0046] Fig.13 for Fig.12 Enlarged schematic diagram of point C in the middle.

[0047] Description of reference numerals:

[0048] 10-spring buckle; 11-buckle cap; 12-mushroom head;

[0049] 20-screw; 21-nut; 22-fixing rivet column; 30-spring;

[0050] 100-main board; 110-heating element; 100a-avoidance part;

[0051] 200-heat sink; 200a-first mounting portion; 200b-second mounting portion; 210-substrate; 220-heat sink; 220a-heat dissipation channel; 221-first fin; 222-second fin; 201-fin body 1; 202-fin body 2; 203-fin body 3; 204-fin body 4; 222a-first flow channel; 222b-second flow channel; 222c-third flow channel;

[0052] 300-connection assembly; 310-first connection member; 311-first position limiting portion; 312-first body; 320-second connection member; 321-second position limiting portion; 322-second body;

[0053] 400-thermal conductive layer;

[0054] 500-back panel;

[0055] X-first direction; Y-second direction; Z-thickness direction. DETAILED DESCRIPTION

[0056] In order to make the purpose, implementation mode and advantages of the present application clearer, the exemplary implementation mode of the present application will be clearly and completely described below in conjunction with the drawings in the exemplary embodiments of the present application. Obviously, the described exemplary embodiments are only part of the embodiments of the present application, not all of the embodiments.

[0057] It should be noted that the brief description of terms in this application is only for the convenience of understanding the embodiments described below, and is not intended to limit the embodiments of this application. Unless otherwise specified, these terms should be understood according to their common and usual meanings.

[0058] In addition, the terms "include" and "have" and any variations thereof are intended to cover but not exclude inclusion, for example, a product or device comprising a list of components is not necessarily limited to those components explicitly listed but may include other components not explicitly listed or inherent to such products or devices.

[0059] In the description of the present application, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0060] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of the features. In the description of this application, unless otherwise specified, "plurality" means two or more.

[0061] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0062] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0063] Display devices such as flat panel displays and televisions can be used to display images. Taking the Liquid Crystal Display (LCD) device as an example, the LCD device is mainly composed of a backlight module, a liquid crystal panel and a drive circuit. As a display panel, the liquid crystal panel does not emit light by itself, and needs to rely on the light source provided by the optical components in the backlight module to achieve brightness display. The display principle of the liquid crystal display is to place the liquid crystal between two pieces of conductive glass, and rely on the electric field between the two electrodes to drive the electric field effect of the liquid crystal molecules to twist the nematics, so as to control the transmission or shielding function of the backlight source, thereby displaying the image. If a color filter is added, a color image can be displayed.

[0064] The display device also includes a motherboard. The motherboard is arranged on the backboard. During the operation of the display device, the heating element on the motherboard tends to generate a large amount of heat. If the heat is not promptly dissipated, the heat accumulated in the display device tends to affect the working performance of the display device and cause the display device to malfunction. Therefore, a radiator is usually provided at the position corresponding to the heating element on the motherboard, and the radiator is configured to dissipate heat for the heating element on the motherboard.

[0065] Figure 1 A structural diagram of a method for fixing a heat sink to a mainboard is provided in the related art. The heat sink is fixed to the mainboard by a spring buckle.

[0066] In the related art, reference Figure 1 In the direction shown, the heat sink 200 can be fixed to the mainboard 100 by the spring buckle 10. In the fixing method of the spring buckle 10, the thickness of the spring 30 and the buckle cap 11 needs to be reserved above the heat sink 200, and the thickness of the mushroom head 12 needs to be reserved below the mainboard 100. The overall height of the spring buckle 10 cannot be reduced to less than 10 mm.

[0067] Figure 2 The structural diagram of another fixing method of a heat sink and a mainboard provided in the related art. The heat sink is fixed to the mainboard by screws.

[0068] refer to Figure 2 In the direction shown, the heat sink 200 can be fixed to the mainboard 100 by screws 20. In the fixing method of the screws 20, it is necessary to reserve the height of the spring 30 and the nut 21 above the heat sink 200, and reserve the height of the fixing rivet column 22 below the mainboard 100. The overall height of the screws 20 cannot be reduced to less than 5 mm.

[0069] Among them, reference Figure 1 and Figure 2 In the direction shown, the upper part of the heat sink 200 may refer to the space between the heat sink 200 and the rear housing, and the lower part of the heat sink 200 may refer to the space between the mainboard 100 and the back plate 500.

[0070] Therefore, both of the above two fixing methods require space to be reserved in the thickness direction Z of the display device, which easily leads to difficulty in reducing the thickness of the display device, and thus it is difficult to meet the development trend of ultra-thin display products.

[0071] If the radiator 200 is bonded to the opposite surface of the mainboard 100, the space in the thickness direction of the display device can be saved. However, the heat generated by the heating element is transferred to the radiator 200, which easily causes the connection glue between the radiator 200 and the mainboard 100 to melt and fail, thereby causing the radiator 200 to separate from the mainboard 100. In addition, the bonding method of the radiator 200 and the mainboard 100 also easily makes it difficult to maintain the mainboard 100. When the staff performs maintenance on the mainboard 100, they need to peel off the connection glue between the radiator 200 and the mainboard 100, and the maintenance process is relatively cumbersome.

[0072] Based on the above technical problems, the applicant has improved the structure of the existing display device. In the embodiment of the present application, at least one of the first connector and the second connector used to connect the heat sink and the mainboard can be magnetic, so the first connector and the second connector can be connected by magnetic attraction, so that the heat sink is fixed to the mainboard. Among them, the first connector and the second connector can be located between the mainboard and the heat sink, so the first connector and the second connector are not easy to occupy the external space of the mainboard and the heat sink, which is conducive to reducing the thickness of the display device, improving the ultra-thinness of the display device, and meeting market demand.

[0073] The external space refers to the space on the side of the mainboard facing away from the radiator and the space on the side of the radiator facing away from the mainboard along the thickness direction of the mainboard.

[0074] The display device provided in the present application is described below with reference to the accompanying drawings and in combination with specific embodiments.

[0075] Figure 3 A partial structural diagram of a display device provided by the present application, wherein the main board can be fixed on the back board.

[0076] Figure 4 This is a schematic cross-sectional structural diagram of a display device provided in the present application in which a heat sink is disposed on a mainboard. Figure 5 for Figure 4 Schematic diagram of the enlarged structure at point A in the middle. Figure 6 for Figure 4 Schematic diagram of the enlarged structure at point B in the middle.

[0077] See also Figures 3 to 6 As shown, the display device may include a mainboard 100. The mainboard 100 is disposed on a back plate 500. The mainboard 100 and the display panel are respectively located on both sides of the back plate 500. A heating element 110 may be provided on the mainboard 100. During normal operation of the display device, the heating element 110 of the mainboard 100 is prone to generate heat. The heating element 110 may be a central processing unit (CPU), a graphics processing unit (GPU), etc.

[0078] The display device may include a heat sink 200. The heat sink 200 may be disposed on the heating element 110. The heat sink 200 may fit the heating element 110. The heat sink 200 may cover a portion of the surface of the heating element 110, or may cover the entire surface of the heating element 110. The heat sink 200 may dissipate the heat generated by the heating element 110 to the outside of the mainboard 100 by having a large heat dissipation area.

[0079] The display device may include a connection assembly 300. The connection assembly 300 may be configured to connect the heat sink 200 and the main board 100. The connection assembly 300 may include a first connection member 310. The first connection member 310 may be provided on the heat sink 200. The heat sink 200 may be connected to the main board 100 through a first connection portion.

[0080] The display device may further include a second connection member 320. The second connection member 320 may be disposed on the main board 100. The main board 100 may be connected to the heat sink 200 through the second connection member 320.

[0081] In some examples, the heat sink 200 may be connected to the second connector 320 on the mainboard 100 via the first connector. The first connector 310 and the second connector 320 may be located between the mainboard 100 and the heat sink 200.

[0082] In some examples, at least one of the first connector 310 and the second connector 320 may have magnetism. The first connector 310 and the second connector 320 are magnetically attracted to each other.

[0083] In the embodiment of the present application, the heating element 110 protrudes from one side surface of the mainboard 100. The heat sink 200 is disposed on the heating element 110. Therefore, there may be a gap between the heat sink 200 and the surface opposite to the mainboard 100. The first connector 310 and the second connector 320 may be located within the above-mentioned gap between the heat sink 200 and the mainboard 100. Therefore, the first connector 310 and the second connector 320 may reasonably utilize the space between the heat sink 200 and the mainboard 100 to reduce the possibility that the first connector 310 and the second connector 320 occupy the external space of the heat sink 200 and the mainboard 100, thereby facilitating the reduction of the thickness of the display device and improving the thinness of the display device.

[0084] It is easy to understand that the external space refers to the space on the side where the main board 100 and the heat sink 200 are away from each other. Specifically, the external space on the side of the main board 100 away from the heat sink 200 may refer to the space between the main board 100 and the back plate 500. The external space on the side of the heat sink 200 away from the main board 100 may refer to the space between the heat sink 200 and the rear housing.

[0085] In addition, in the example of the present application, the first connecting member 310 and the second connecting member 320 can be connected to each other by magnetic attraction to achieve tool-free disassembly and assembly between the heat sink 200 and the motherboard 100, which is beneficial to reduce the difficulty of disassembly and assembly between the heat sink 200 and the motherboard 100 and improve installation and maintenance efficiency.

[0086] Among them, the first connecting member 310 can be made of magnetic material. The second connecting member 320 can be a metal material such as an iron sheet that can be attracted to the magnetic material. Alternatively, the second connecting member 320 can be made of magnetic material. The first connecting member 310 can be a metal material such as an iron sheet that can be attracted to the magnetic material. Furthermore, both the first connecting member 310 and the second connecting member 320 can be made of magnetic material. This is not limited in the embodiments of the present application.

[0087] In some examples, the number of the connection components 300 in the embodiment of the present application can be multiple. Multiple connection components 300 can be used to improve the connection stability between the heat sink 200 and the mainboard 100.

[0088] Exemplarily, the number of connection components 300 can be designed according to the size and mass of the heat sink 200. For example, when the heat sink 200 is larger in size or mass, a larger number of connection components 300 can be provided. A plurality of connection components 300 can be arranged at intervals along the edge of the heat sink 200.

[0089] Figure 7 A schematic diagram of the exploded structure of a heat sink and a mainboard in a display device provided in the present application.

[0090] In some possible implementations, see Figure 6 and Figure 7 As shown, the first connecting member 310 and the second connecting member 320 may be disposed opposite to each other.

[0091] Specifically, the first connecting member 310 and the second connecting member 320 can be relatively arranged along the thickness direction Z of the display device, so that when the heat sink 200 is close to the mainboard 100, when the distance between the first connecting member 310 and the second connecting member 320 reaches the magnetic attraction distance, the heat sink 200 can fit the chip.

[0092] In some examples, the first connector 310 may be provided with a first stopper 311. The second connector 320 may be provided with a second stopper 321. The first stopper 311 may be inserted through the second stopper 321 to connect with the mainboard 100. Alternatively, the second stopper 321 may be inserted through the first stopper 311 to connect with the heat sink 200.

[0093] It should be noted that the display device is usually inclined at a certain angle to the horizontal plane when in use. The present application takes the display device being perpendicular to the horizontal plane as an example for description. The thickness direction Z of the display device may be the same direction as the horizontal direction.

[0094] In the embodiment of the present application, the heat sink 200 is fixed to the mainboard 100 by means of magnetic attraction of the first connector 310 and the second connector 320. The heat sink 200 is easily offset under the action of external force or its own gravity, resulting in the misalignment of the first connector 310 and the second connector 320, so that the contact area between the first connector 310 and the second connector 320 is reduced, which affects the magnetic attraction effect, resulting in the connection reliability between the heat sink 200 and the mainboard 100. Therefore, by setting the first limiting portion 311 to be inserted into the second limiting portion 321, or the second limiting portion 321 to be inserted into the first limiting portion 311, it is not easy for the first connecting member 310 and the second connecting member 320 to be misaligned in the plane where the two are attached to each other, so as to improve the connection reliability between the heat sink 200 and the mainboard 100.

[0095] Specifically, when the first limiting portion 311 penetrates into the second limiting portion 321, the first limiting portion 311 of the first connector 310 can be inserted into the second limiting portion 321 of the second connector 320, so the portion of the first connector 310 located at the second connector 320 can be mutually constrained with the second connector 320. Alternatively, when the second limiting portion 321 penetrates into the first limiting portion 311, the second limiting portion 321 of the second connector 320 can be inserted into the first limiting portion 311 of the first connector 310, so the portion of the second connector 320 located at the first connector 310 can be mutually constrained with the first connector 310. In summary, the first limiting portion 311 and the second limiting portion 321 can constrain each other, so that the first connector 310 and the second connector 320 are not easily misaligned.

[0096] Figure 8 This is a schematic diagram of a three-dimensional structure in which a first connecting member is arranged on a heat sink in a display device provided in the present application. Fig. 9 This is a schematic diagram of a three-dimensional structure in which a second connecting member is arranged on a mainboard in a display device provided in the present application.

[0097] In some possible implementations, see Figure 6 and Figure 8 As shown, the first connector 310 may include a first body 312. The first body 312 may be disposed on the heat sink 200. The first limiting portion 311 may protrude from a surface of the first body 312 facing the mainboard 100. The second limiting portion 321 may pass through the second connector 320.

[0098] In the present application examples, see Figure 6 and Fig. 9 As shown, the first limiting portion 311 may protrude from the first body 312. The second limiting portion 321 may penetrate the second connector 320 to form a hole structure. The first limiting portion 311 is located inside the second limiting portion 321, and the movement of the first limiting portion 311 may be constrained by the inner wall of the second limiting portion 321, thereby reducing the possibility of the first connector 310 and the second connector 320 being offset between their opposing surfaces.

[0099] For some examples, see Figure 6 and Figure 7 As shown, the mainboard 100 may be provided with an avoidance portion 100a. The avoidance portion 100a and the second limiting portion 321 may be arranged correspondingly and communicated with each other. The first limiting portion 311 may pass through the second limiting portion 321 of the second connector 320, and part of the first limiting portion 311 may be located in the avoidance portion 100a on the mainboard 100, so that the inner wall of the avoidance portion 100a cooperates with the first limiting portion 311 to increase the contact area between the first connector 310 and the mainboard 100, which is beneficial to improve the connection stability between the heat sink 200 and the mainboard 100.

[0100] In some examples, when the first limiting portion 311 may protrude from the first body 312 and pass through the second limiting portion 321 to be connected to the mainboard 100 , the surfaces of the first body 312 and the second connector 320 facing each other may fit together.

[0101] In some examples, the first connector 310 may be magnetic. The second connector 320 itself may not be magnetic. The thickness of the first body 312 may be greater than the thickness of the second connector 320 to improve the connection stability of the first connector 310 and the second connector 320.

[0102] Fig.10 A schematic diagram of a partial cross-sectional structure of another display device provided in the present application in which heat sinks are connected via a connecting assembly.

[0103] For other examples, see Fig.10 As shown, the second connector 320 may include a second body 322. The second body 322 may be disposed on the mainboard 100. The second limiting portion 321 may protrude from the surface of the second body 322 facing the radiator 200. The first limiting portion 311 may penetrate the first connector 310 to form a hole structure. The radiator 200 may be provided with an avoidance portion 100a. The avoidance portion 100a and the first limiting portion 311 may correspond to each other and be connected to each other.

[0104] Among them, the second limiting portion 321 of the second connecting member 320 can pass through the first limiting portion 311 of the first connecting member 310, and part of the second limiting portion 321 can be located in the avoidance portion 100a of the radiator 200, so as to increase the contact area between the second connecting member 320 and the radiator 200 through the inner wall of the avoidance portion 100a and the second limiting portion 321, thereby facilitating improving the connection stability between the radiator 200 and the mainboard 100.

[0105] In some examples, when the second limiting portion 321 may protrude from the second body 322 and pass through the first limiting portion 311 to be connected to the heat sink 200 , the surfaces of the second body 322 and the first connector 310 facing each other may fit together.

[0106] In some examples, the first connector 310 may not be magnetic, and the second connector 320 may be magnetic. The thickness of the second body 322 may be greater than the thickness of the first connector 310. Alternatively, both the first connector 310 and the second connector 320 may be magnetic. In this case, the thickness of the second body 322 may be the same as the thickness of the first connector 310.

[0107] In some possible implementations, see Fig.10As shown, a first mounting portion 200a may be provided on a surface of the heat sink 200 facing the mainboard 100. The first connector 310 may be provided on the first mounting portion 200a.

[0108] In the implementation of the present application, the first connector 310 can be fixed to the heat sink 200 through the first mounting portion 200a. The first connector 310 can be bonded, welded or crimped to the heat sink 200, which is not limited in the present embodiment.

[0109] In some examples, the first mounting portion 200a may be a first recessed portion. The first recessed portion may be recessed in a direction away from the mainboard 100 and have an opening facing the mainboard 100. A portion of the first connector 310 may be located in the first recessed portion.

[0110] At least one of the first connector 310 and the second connector 320 may have a relatively large thickness to improve the magnetic connection stability of the first connector 310 and the second connector 320. When the thickness of the first connector 310 and the second connector 320 is greater than the thickness of the heating element 110, the first mounting portion 200a may form a first recess. Part of the first connector 310 may be located in the first recess so that the first connector 310 and the second connector 320 are still located in the interval between the heat sink 200 and the mainboard 100, thereby reducing the possibility that the first connector 310 and the second connector 320 occupy the space outside the heat sink 200 and the mainboard 100, which may affect the ultra-thinness of the display device.

[0111] Similarly, in other examples, see Fig.10 As shown, the surface of the mainboard 100 facing the radiator 200 may be provided with a second mounting portion 200b. The second connector 320 may be provided at the second mounting portion 200b. The second mounting portion 200b may be a second recess. The second recess may be recessed in a direction away from the radiator 200 and have an opening facing the radiator 200. Part of the second connector 320 may be located in the second recess so that the first connector 310 and the second connector 320 may be maintained in the interval between the radiator 200 and the mainboard 100, thereby reducing the possibility that the first connector 310 and the second connector 320 occupy the space outside the radiator 200 and the mainboard 100, resulting in the possibility of affecting the ultra-thinness of the display device.

[0112] In some examples, the second connector 320 may be fixed to the mainboard 100 via the second mounting portion 200b. The second connector 320 may be bonded, welded, or pressed onto the mainboard 100, which is not limited in this embodiment.

[0113] Fig.11 A schematic diagram of the three-dimensional structure of a radiator provided in this application. Fig.12A schematic diagram of the three-dimensional structure of another radiator provided in this application. Fig.13 for Fig.12 Enlarged schematic diagram of point C in the middle.

[0114] In some achievable embodiments, the heat sink 200 may include a substrate 210 and a heat sink 220. The heat sink 220 may be disposed on a side of the substrate 210 that faces away from the heating element 110. The heat sink 220 and the substrate 210 may form a heat dissipation channel 220a.

[0115] In the embodiment of the present application, the heat generated by the heating element 110 during operation can be transferred to the heat dissipation channel 220a through the substrate 210, and the heat generated by the heating element 110 can be moved out to the outside of the mainboard 100 through the airflow in the heat dissipation channel 220a.

[0116] In some examples, the rear housing may be provided with ventilation holes, which may communicate with the heat dissipation channel 220a, so that the heat in the heat dissipation channel 220a may be removed to the outside of the display device through the ventilation holes.

[0117] Exemplarily, when the display device is perpendicular to a horizontal plane, ventilation holes may be provided on two side panels on the rear housing that are opposite to each other in the vertical direction. The vertical direction may be the X direction in the figure. The radiator 200 is located between the two side panels so that the two ends of the heat dissipation channel 220a may correspond to the ventilation holes on the two side panels respectively, so that airflow may be formed between the outside air and the heat dissipation channel 220a. The hot airflow in the heat dissipation channel 220a may flow to the outside of the display device through the ventilation holes. For example, the airflow direction in the heat dissipation channel 220a may be upward in the vertical direction.

[0118] In some possible implementations, see Fig.11 As shown, the heat sink 220 may include first fins 221 extending along a first direction X of the substrate 210. A plurality of first fins 221 may be arranged at intervals along a second direction Y of the substrate 210. A heat dissipation channel 220a may be formed between two adjacent first fins 221.

[0119] In the embodiment of the present application, by providing a plurality of first fins 221, the heat dissipation area of ​​the heat sink 200 can be increased. The heat generated by the heating element 110 can be transferred to the plurality of first fins 221 through the substrate 210. The heat on the plurality of first fins 221 can be dissipated into the heat dissipation channel 220a between two adjacent first fins 221. Since the heat dissipation channel 220a is connected to the ventilation holes on the rear housing, the internal airflow of the display device and the external airflow can be circulated, so the hot air flow in the heat dissipation channel 220a can flow to the outside of the display device through the ventilation holes.

[0120] In some examples, the first fin 221 may be a flat plate structure. The extension direction of the first fin 221 may be a vertical direction. That is, the first direction X of the substrate 210 may be a vertical direction. The first fin 221 may be perpendicular to the substrate 210 .

[0121] It is easy to understand that the first fin 221 of the flat plate structure has a simple structure and is easy to process. The first fin 221 and the base plate 210 can be an integral structure.

[0122] In some possible implementations, see Fig.12 and Fig.13 As shown, the heat sink 220 may include a plurality of second fins 222. The second fins 222 and the substrate 210 may be arranged to form a flow channel flowing along the first direction X of the substrate 210. The plurality of second fins 222 may be sequentially connected along the first direction X, and the flow channels formed by the two spaced second fins 222 correspond to each other. Two second fins 222 adjacent to each other along the second direction Y of the substrate 210 may be staggered, and there is an overlap area between the two staggered second fins 222.

[0123] In the embodiment of the present application, the first direction X of the substrate 210 may be a vertical direction. The second direction Y may be perpendicular to the first direction X and the thickness direction Z of the display device. Along the first direction X, one second fin 222 may be separated from two adjacent second fins 222, so that the flow boundary layer of the flow channel may be interrupted, thereby reducing the influence of the flow boundary layer on the heat dissipation effect.

[0124] It should be noted that the thin layer where the flow velocity of the hot air flow changes dramatically near the inner wall of the second fin 222 is called the flow boundary layer. When the hot air flow flows through the solid surface continuously, the thickness of the formed flow boundary layer gradually accumulates and increases, which is easy to affect the heat dissipation effect.

[0125] Specifically, when the flow channel continues to extend along the first direction X, during the hot air flow flowing in the flow channel of the second fin 222 along the first direction X, a flow boundary layer is easily formed in the flow channel along the direction of the hot air flow, and the accumulation thickness of the flow boundary layer gradually increases in the area near the end of the flow channel. The hot air flow is easily obstructed by the accumulation of the flow boundary layer, resulting in a decrease in the flow velocity, thereby affecting the heat dissipation effect.

[0126] Therefore, in the embodiment of the present application, two second fins 222 are staggered so that two of the second fins 222 along the first direction X are spaced apart to cut off the flow boundary layer, thereby reducing the possibility of the flow boundary layer continuously accumulating and affecting the heat dissipation effect.

[0127] Specifically, refer to Fig.13As shown, along the first direction X, the plurality of second fins 222 can be sequentially divided into fin body 1 201, fin body 202, fin body 3 203 and fin body 4 204, and so on. Among them, fin body 1 201 and fin body 2 202 are staggered along the second direction Y, fin body 2 202 and fin body 3 203 are staggered, and fin body 3 203 and fin body 4 204 are staggered. Among them, the flow channel of fin body 1 201 corresponds to the flow channel of fin body 3 203, that is, forming a first flow channel 222a with a middle discontinuity; the flow channel of fin body 202 corresponds to the flow channel of fin body 4 204, that is, forming a second flow channel 222b with a middle discontinuity; the flow channel formed by the overlapping area of ​​fin body 1 201 and fin body 2 202, the flow channel formed by the overlapping area of ​​fin body 2 202 and fin body 3 203, and the flow channel formed by the overlapping area of ​​fin body 3 203 and fin body 4 204 correspond to form a third flow channel 222c with a middle discontinuity. A plurality of second fins 222 can be distributed on the substrate 210 in the same manner as described above.

[0128] Taking the first flow channel 222a as an example, when the hot air flow flows from the fin body 1 201 to the fin body 4 204 in the first flow channel 222a, the flow boundary layer can be formed on the inner wall of the fin body 1 201. However, since the fin body 202 disconnects the fin body 1 201 and the fin body 3 203, the amount of the flow boundary layer formed in the fin body 1 201 is small. When the hot air flow continues to move to the fin body 3 203, the flow boundary layer is re-formed on the inner wall of the fin body 3 203, and it is not easy to continue to deposit. Therefore, the gradual accumulation of the flow boundary layer formed in the fin body 1 201 and the fin body 3 203 can be blocked by the fin body 202, so that it is not easy to accumulate a thick flow boundary layer on the inner wall of the fin body 1 201 and the fin body 3 203, reducing the possibility of the flow boundary layer affecting the heat dissipation of the hot air flow, which is conducive to increasing the flow rate of the hot air flow and improving the heat dissipation efficiency.

[0129] In some possible implementations, see Fig.13 As shown, the second fin 222 may have an opening facing the base plate 210. The open end of the second fin 222 may be connected to the base plate 210.

[0130] In the embodiment of the present application, the second fin 222 can be formed by three plates connected in sequence. When the open end of the second fin 222 is connected to the base plate 210, the second fin 222 and the base plate 210 can be surrounded to form a closed annular structure to increase the contact area between the hot air flow and the second fin 222 and improve the heat dissipation efficiency.

[0131] In some possible implementations, see Figure 5 and Fig. 9As shown, the surface of the heating element 110 facing the heat sink 200 may be provided with a heat conducting layer 400. One side surface of the heat conducting layer 400 may be connected to the heating element 110, and the other side surface may be connected to the heat sink 200.

[0132] In the embodiment of the present application, since the heat-conducting layer 400 is connected to the heating element 110 and the heat sink 200, the heat generated by the heating element 110 can be transferred to the heat sink 200 through the heat-conducting layer 400, and heat dissipated by the heat sink 200. The heat-conducting layer 400 can be configured to improve the heat conduction efficiency of the heating element 110 and the heat sink 200.

[0133] In some examples, the heat-conducting layer 400 may be, but is not limited to, thermally conductive silicone grease. The heat-conducting layer 400 may be applied to the surface of the heating element 110. Alternatively, the heat-conducting layer 400 may also be a thermally conductive pad. The thermally conductive pad may be adsorbed on the surface of the heating element 110, and the heat sink 200 may press the thermally conductive pad between the heat sink 200 and the heating element 110.

[0134] In some practicable ways, the back plate 500 may be provided with a first locking piece for fixing the main board 100. The main board 100 may be locked with the first locking piece on the back plate 500 by the second locking piece, so that the main board 100 and the back plate 500 are locked and connected.

[0135] For example, the first fastening member may be a rivet stud riveted to the back plate 500. The second fastening member may be a locking screw.

[0136] In the embodiment of the present application, the heat sink 200 and the mainboard 100 are connected by the first connecting member 310 and the second connecting member 320 located therebetween, and the magnetic attraction between the first connecting member 310 and the second connecting member 320 can save the external space of the heat sink 200 and the mainboard 100. The applicant has measured through experiments that the gap between the heat sink 200 and the rear shell can be less than 1mm, and the gap between the mainboard 100 and the back plate 500 can be less than 0.5mm, so that the heat sink 200 can be fixed while meeting the heat dissipation performance, and the ultra-thin structure of the display device can be achieved.

[0137] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.

[0138] For the convenience of explanation, the above description has been made in conjunction with specific embodiments. However, the above exemplary discussion is not intended to be exhaustive or limit the embodiments to the specific forms disclosed above. Based on the above teachings, various modifications and variations can be obtained. The selection and description of the above embodiments are to better explain the principles and practical applications, so that those skilled in the art can better use the embodiments and various different variations of the embodiments suitable for specific use considerations.

Claims

1. A display device, characterized in that: The display device comprises: A main board, provided with a heating element; A radiator, disposed on the heating element; A connection assembly, comprising a first connection member and a second connection member, wherein the first connection member and the second connection member are respectively disposed on the heat sink and the mainboard to be configured to connect the heat sink and the mainboard, and the first connection member and the second connection member are located between the heat sink and the mainboard; At least one of the first connecting member and the second connecting member is magnetic, and the first connecting member and the second connecting member are magnetically attracted to each other.

2. The display device according to claim 1, characterized in that The first connecting member and the second connecting member are arranged opposite to each other; the first connecting member is provided with a first limiting portion, and the second connecting member is provided with a second limiting portion; The first limiting portion may be inserted through the second limiting portion to be connected to the mainboard, or the second limiting portion may be inserted through the first limiting portion to be connected to the heat sink.

3. The display device according to claim 2, characterized in that The first connecting member includes a first body, the first body is disposed on the heat sink, and the first limiting portion protrudes from a surface of the first body facing the mainboard; The second limiting portion passes through the second connecting member, the main board is provided with an avoidance portion, the second limiting portion is arranged corresponding to the avoidance portion, and the first limiting portion is passed through the second limiting portion to be connected with the avoidance portion.

4. The display device according to claim 2, characterized in that A first mounting portion is provided on a surface of the heat sink facing the mainboard, and the first connecting member is provided on the first mounting portion; And / or, a second mounting portion is provided on a surface of the mainboard facing the heat sink, and the second connecting member is provided on the second mounting portion.

5. The display device according to any one of claims 1 to 4, characterized in that: The heat sink comprises a substrate and a heat sink. The heat sink is arranged on a side of the substrate facing away from the heating element. The heat sink and the substrate form a heat dissipation channel.

6. The display device according to claim 5, characterized in that The heat sink includes first fins extending along a first direction of the substrate, a plurality of first fins are arranged at intervals along a second direction of the substrate, and a heat dissipation channel is formed between two adjacent first fins.

7. The display device according to claim 5, characterized in that The heat sink comprises a plurality of second fins, the second fins and the substrate are arranged to form a flow channel flowing along a first direction of the substrate, the plurality of second fins are sequentially connected along the first direction, and two spaced second fins are arranged correspondingly; Two second fins adjacent to each other along the second direction of the substrate are staggered, and an overlapping area is provided between the two staggered second fins.

8. The display device according to claim 7, characterized in that The second fin has an opening facing the substrate, and an open end of the second fin is connected to the substrate.

9. The display device according to any one of claims 1 to 4, characterized in that: A heat-conducting layer is provided on the surface of the heating element facing the radiator, one side surface of the heat-conducting layer is connected to the heating element, and the other side surface of the heat-conducting layer is connected to the radiator.

10. A display device, characterized in that: It includes a mainboard, a heat sink and a connecting component, the heat sink is arranged on the mainboard through the connecting component, the connecting component includes a first connecting member and a second connecting member, the first connecting member is arranged on the mainboard, the second connecting member is arranged on the heat sink, at least one of the first connecting member and the second connecting member is magnetic, and the first connecting member and the second connecting member are both located between the mainboard and the heat sink and are magnetically attracted to each other.

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