Device for improving alignment precision of via hole machining

Abstract

The utility model belongs to the technical field of flexible circuit board processing, and particularly relates to a device for improving via hole processing alignment precision, which comprises a bottom plate, a laser drilling assembly and an FPC (flexible printed circuit) product, the top of the bottom plate is detachably connected with a bearing plate through a connecting assembly, the bearing plate is provided with an FPC alignment groove, and the FPC alignment groove is connected with the laser drilling assembly. An FPC alignment groove is formed in the bearing plate, a plurality of white identification marks are arranged on the FPC alignment groove, a plurality of via hole blanking holes are formed in the bearing plate among the white identification marks, and an FPC product is arranged in an inner cavity of the FPC alignment groove through an adsorption assembly. Compared with the prior art, automatic identification and detection are achieved, the reliability and stability of the UV laser processing technology are greatly improved, the problem of poor copper plating caused by FPC positioning processing deviation is effectively solved, the yield of the FPC is greatly improved, and the production technology is optimized and improved.

Description

Technical Field

[0001] The utility model relates to the technical field of flexible circuit board processing, in particular to a device for improving the alignment accuracy of via hole processing. Background Art

[0002] The production process of flexible circuit boards (FPC) is complicated, and the manufacturing conditions and requirements vary with the styles and processes of the products. In the FPC production process, the function of TH vias is to enable the circuits between different layers to be mutually conductive. The main processing methods of TH holes are mechanical drilling and UV laser. Mechanical drilling has poor processing accuracy and can no longer meet the development trend of higher and higher processing accuracy of FPC. In order to meet the requirements of processing accuracy, UV lasers with high processing accuracy are currently generally used to process TH holes. During UV laser processing, the equipment places the product on the processing jig plate and aligns the edge of the product with the designed jig slot for positioning. This alignment method requires the operator to visually judge whether the product and the blanking slot in the jig are offset. During processing, it is impossible to ensure 100% that the product and the blanking slot in the jig are fully aligned. In the case where the product and the blanking slot are not aligned, the carbon powder generated by laser processing cannot be removed normally by the equipment, thereby contaminating the product and causing the TH hole to be unable to be normally copper-plated, resulting in a hole break and the product being scrapped, which poses a serious quality risk. Therefore, a device for improving the alignment accuracy of via processing is invented. Utility Model Content

[0003] In view of the above and / or existing problems in a device for improving the alignment accuracy of via hole processing, the present utility model is proposed.

[0004] Therefore, the purpose of the present invention is to provide a device for improving the alignment accuracy of via hole processing, which can solve the above-mentioned existing problems.

[0005] In order to solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0006] A device for improving the alignment accuracy of via hole processing, comprising a base plate, a laser drilling component and an FPC product, the top of the base plate being detachably connected to a carrier plate via a connecting component, an FPC alignment groove being provided on the carrier plate, a plurality of white identification marks being provided on the FPC alignment groove, a plurality of via hole blanking holes being provided on the carrier plate between the plurality of white identification marks, an FPC product being provided in the inner cavity of the FPC alignment groove via an adsorption component, a plurality of through holes being provided on the FPC product, and the through holes corresponding to the white identification marks, and an image recognition camera being provided on the laser drilling component to detect whether the white identification mark is located in the through hole.

[0007] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, the connecting component includes:

[0008] Support columns, a plurality of support columns are fixedly installed on the top of the bottom plate, and the support columns are in contact with the bearing plate;

[0009] Positioning holes: a plurality of positioning holes are provided in the bearing plate;

[0010] A first stud, wherein the first stud is fixedly mounted on the top of the support column and passes through the positioning hole;

[0011] The second stud is fixedly mounted on the top of the first stud, and the thread directions of the first stud and the second stud are arranged to be opposite.

[0012] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, the connection component further includes:

[0013] a first nut, the first nut being threadedly connected to the first stud;

[0014] A second nut is threadedly connected to the second stud.

[0015] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, the diameter of the first stud is greater than the diameter of the second stud, and one end of the first stud is located in the first nut.

[0016] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, the adsorption component includes:

[0017] A circulation slot is provided on the carrier plate directly below the FPC alignment slot;

[0018] Adsorption holes: a plurality of adsorption holes are provided on the carrier plate between the FPC alignment groove and the flow groove.

[0019] As a preferred solution of the device for improving the alignment accuracy of through-hole processing described in the utility model, a vacuum pump is fixedly installed on the top of the base plate, a pipeline is fixedly installed on the air inlet end of the vacuum pump, and one end of the pipeline is located in the circulation groove.

[0020] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, the laser drilling component includes:

[0021] A mechanical arm, wherein the mechanical arm is fixedly mounted on the top of the base plate;

[0022] A fixing plate, one end of the robotic arm is fixedly mounted with the fixing plate, and the bottom of the fixing plate is fixedly mounted with a portrait recognition camera;

[0023] A laser is fixedly mounted on the bottom of the fixing plate.

[0024] As a preferred solution of the device for improving the alignment accuracy of via hole processing described in the utility model, a collection box is placed on the top of the base plate, and the collection box is located directly below the carrier plate.

[0025] Compared with existing technologies:

[0026] The utility model can fundamentally solve the problem of positioning deviation of FPC during UV laser processing, realizes automatic identification and detection, greatly improves the reliability and stability of UV laser processing technology, effectively solves the poor copper plating caused by FPC positioning processing deviation, greatly improves the yield of FPC, and optimizes and improves the production process. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 This is a schematic diagram of the front view of the structure of the utility model;

[0028] Figure 2 For this utility model Figure 1 A schematic diagram of the structure enlargement in the middle;

[0029] Figure 3 This is a top view schematic diagram of the load-bearing plate of the utility model;

[0030] Figure 4 This is a schematic diagram of the bottom plate structure of the utility model;

[0031] Figure 5 This is a schematic diagram of the structure of the FPC product of the utility model.

[0032] In the figure: base plate 10, carrier plate 20, FPC alignment groove 21, through hole blanking hole 22, white identification mark 23, FPC product 30, through hole 31, support column 40, first stud 41, second stud 42, first nut 43, second nut 44, positioning hole 45, flow groove 50, adsorption hole 51, vacuum pump 52, pipeline 53, collection box 60, robot arm 70, fixing plate 71, laser 72, image recognition camera 73. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solution and advantages of the present invention more clear, the implementation mode of the present invention will be further described in detail below with reference to the accompanying drawings.

[0034] The utility model provides a device for improving the alignment accuracy of via hole processing. Figure 1-Figure 5, including a base plate 10, a laser punching component and an FPC product 30. The top of the base plate 10 is detachably connected to the carrier plate 20 through a connecting component. The carrier plate 20 is provided with an FPC alignment groove 21. The FPC alignment groove 21 is provided with a plurality of white identification marks 23. The carrier plate 20 located between the plurality of white identification marks 23 is provided with a plurality of through-hole blanking holes 22. The inner cavity of the FPC alignment groove 21 is provided with an FPC product 30 through an adsorption component, and the FPC product 30 is provided with a plurality of through holes 31, and the through holes 31 correspond to the white identification marks 23. The laser punching component is provided with a portrait recognition camera 73 to detect whether the white identification mark 23 is located in the through hole 31.

[0035] The connection assembly includes: a support column 40, a first stud 41, a second stud 42, a first nut 43, a second nut 44, and a positioning hole 45;

[0036] A plurality of support columns 40 are fixedly installed on the top of the base plate 10, and the support columns 40 are in contact with the bearing plate 20. A plurality of positioning holes 45 are opened in the bearing plate 20. A first stud 41 is fixedly installed on the top of the support column 40, and the first stud 41 passes through the positioning hole 45. A second stud 42 is fixedly installed on the top of the first stud 41, and the thread directions of the first stud 41 and the second stud 42 are set to be opposite, so that the tightening directions of the first nut 43 and the second nut 44 are opposite. The first nut 43 is threadedly connected to the first stud 41, and the second nut 44 is threadedly connected to the second stud 42. The diameter of the first stud 41 is larger than the diameter of the second stud 42, and one end of the first stud 41 is located in the first nut 43. The diameter of the support column 40 is larger than the diameter of the first stud 41. The first nut 43 is in contact with the bearing plate 20, and the first nut 43 and the second nut 44 are in contact. When the bearing plate 20 needs to be installed, the first stud 41 is first passed through the positioning hole 45 , and then the first nut 43 and the second nut 44 are threadedly connected to the first stud 41 and the second stud 42 in sequence.

[0037] The adsorption assembly includes: a circulation slot 50, an adsorption hole 51, a vacuum pump 52, and a pipeline 53;

[0038] A flow groove 50 is provided on the carrier plate 20 directly below the FPC alignment groove 21, and the size of the flow groove 50 matches the size of the FPC alignment groove 21. No flow groove 50 is provided on the carrier plate 20 located around the through hole blanking hole 22. A plurality of adsorption holes 51 are provided on the carrier plate 20 located between the FPC alignment groove 21 and the flow groove 50. A vacuum pump 52 is fixedly installed on the top of the base plate 10, and a pipe 53 is fixedly installed on the air inlet end of the vacuum pump 52, and one end of the pipe 53 is located in the flow groove 50.

[0039] The laser drilling assembly includes: a mechanical arm 70, a fixing plate 71, and a laser 72;

[0040] The robot arm 70 is fixedly mounted on the top of the base plate 10, a fixed plate 71 is fixedly mounted on one end of the robot arm 70, and an image recognition camera 73 is fixedly mounted on the bottom of the fixed plate 71. The laser 72 is fixedly mounted on the bottom of the fixed plate 71. In addition, the laser emitted by the laser 72 will be focused into a high-power density laser beam through the optical path system.

[0041] A collection box 60 is placed on the top of the bottom plate 10 , and the collection box 60 is located directly below the carrying plate 20 so as to collect the debris generated during the punching.

[0042] Working principle: First, the carrier plate 20 is fixed on the base plate 10 through the connecting component, and then the FPC product 30 is placed on the FPC alignment groove 21. After placement, the image recognition camera 73 can be moved to the top of the through hole 31 by the robot arm 70. At this time, the white recognition mark 23 can be grabbed through the through hole 31 by the image recognition camera 73. If the white recognition mark 23 can be grabbed normally, it means that the FPC product 30 is not offset. At this time, the adsorption hole 51 will be completely blocked by the FPC product 30, and there is no air leakage. After that, the image recognition camera 73 will be used to identify the alignment image point on the FPC product 30. After successful recognition, the air in the adsorption hole 51 will be extracted by the vacuum pump 52 to fix the FPC product 30. After fixation, the laser 72 can be moved to the top of the through hole blanking hole 22 by the robot arm 70 to achieve punching of the FPC product 30 to obtain the TH through hole. During this process, two steps of image recognition are performed. The first step is to recognize the white recognition mark 23 to ensure the positioning of the FPC product 30. The second step is to recognize the image recognition point on the FPC product 30 to ensure the positioning of the TH through hole, thereby effectively preventing the FPC product 30 from being offset.

[0043] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced with equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A device for improving the alignment accuracy of via hole processing, comprising a base plate (10), a laser drilling component and an FPC product (30), characterized in that: The top of the bottom plate (10) is detachably connected to a carrier plate (20) via a connecting assembly; an FPC alignment groove (21) is provided on the carrier plate (20); a plurality of white identification marks (23) are provided on the FPC alignment groove (21); a plurality of through holes (22) are provided on the carrier plate (20) between the plurality of white identification marks (23); an FPC product (30) is provided in the inner cavity of the FPC alignment groove (21) via an adsorption assembly; a plurality of through holes (31) are provided on the FPC product (30); and the through holes (31) correspond to the white identification marks (23); and an image recognition camera (73) is provided on the laser drilling assembly to detect whether the white identification mark (23) is located in the through hole (31).

2. The device for improving the alignment accuracy of via hole processing according to claim 1, characterized in that: The connection component comprises: Support columns (40), a plurality of support columns (40) are fixedly mounted on the top of the base plate (10), and the support columns (40) are in contact with the bearing plate (20); Positioning holes (45), a plurality of positioning holes (45) are provided in the carrying plate (20); A first stud (41), wherein the first stud (41) is fixedly mounted on the top of the support column (40), and the first stud (41) passes through the positioning hole (45); A second stud (42), wherein the second stud (42) is fixedly mounted on the top of the first stud (41), and the thread directions of the first stud (41) and the second stud (42) are arranged to be opposite.

3. The device for improving the alignment accuracy of via hole processing according to claim 2, characterized in that: The connection component also includes: A first nut (43), wherein the first nut (43) is threadedly connected to the first stud (41); A second nut (44) is threadedly connected to the second stud (42).

4. The device for improving the alignment accuracy of via hole processing according to claim 3, characterized in that: The diameter of the first stud (41) is greater than the diameter of the second stud (42), and one end of the first stud (41) is located in the first nut (43).

5. The device for improving the alignment accuracy of via hole processing according to claim 1, characterized in that: The adsorption assembly comprises: A circulation groove (50), wherein the circulation groove (50) is provided on the carrier plate (20) directly below the FPC alignment groove (21); Adsorption holes (51), a plurality of adsorption holes (51) are provided on the carrier plate (20) between the FPC alignment groove (21) and the circulation groove (50).

6. The device for improving the alignment accuracy of via hole processing according to claim 5, characterized in that: A vacuum pump (52) is fixedly mounted on the top of the bottom plate (10), a pipeline (53) is fixedly mounted on the air inlet end of the vacuum pump (52), and one end of the pipeline (53) is located in the circulation groove (50).

7. The device for improving the alignment accuracy of via hole processing according to claim 1, characterized in that: The laser drilling assembly comprises: A mechanical arm (70), the mechanical arm (70) being fixedly mounted on the top of the base plate (10); A fixing plate (71), one end of the mechanical arm (70) is fixedly mounted on the fixing plate (71), and a portrait recognition camera (73) is fixedly mounted on the bottom of the fixing plate (71); A laser (72), wherein the laser (72) is fixedly mounted on the bottom of the fixing plate (71).

8. The device for improving the alignment accuracy of via hole processing according to claim 1, characterized in that: A collection box (60) is placed on the top of the bottom plate (10), and the collection box (60) is located directly below the carrying plate (20).

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