Package carrier with hollow structure and its manufacturing process

Abstract

The present application relates to a packaging carrier with a hollow structure and a manufacturing process thereof, wherein the manufacturing process comprises the following steps: cutting a first core board, making circuits, and printing a first resin layer on the inner circuit of the first core board to obtain a first substrate; preparing a second core board and etching off the copper foil on both sides, pasting pure film on both sides of the insulating layer of the second core board, and making a cavity by UV laser process to obtain a second substrate; cutting a third core board, making circuits, and printing a second resin layer on the inner circuit of the third core board to obtain a third substrate; overlapping and pressing the first, second and third substrates in sequence to form a semi-finished board; drilling and electroplating the semi-finished board, making outer circuits, solder masking, and surface treatment, and then laser opening the cover to form a sound hole to obtain a packaging carrier. In this manufacturing process, a layer of resin layer is printed when making the inner circuit, thereby solving the problem of short circuit of dense circuits.

Description

Technical Field

[0001] The present application relates to carrier board manufacturing, and in particular to a packaging carrier board with a hollow structure and a manufacturing process thereof. Background Art

[0002] With the development of electronic technology and people's demand for miniaturization and high integration of electronic products, the package substrate needs to be hollow inside, and dense circuits are required above and below the hollow structure. At present, when making hollow structures, the toner of UV laser can easily cause short circuits between the upper and lower layers, resulting in defective products. Summary of the invention

[0003] In order to overcome the above-mentioned defects, the present application provides a manufacturing process for a packaging carrier with a hollow structure, in which a layer of resin is printed when manufacturing the inner layer circuit, thereby solving the problem of short circuit of dense circuits.

[0004] The technical solution adopted by this application to solve its technical problems is:

[0005] A process for manufacturing a packaging carrier with a hollow structure comprises the following steps:

[0006] S1: making a first substrate: preparing a first core board, cutting the first core board, making circuits on the first core board, and printing a first resin layer on the inner circuit of the first core board to obtain a first substrate;

[0007] S2: Production of the second substrate: prepare the second core board and etch off the copper foil on both sides, paste pure film on both sides of the insulation layer of the second core board, and make the cavity through UV laser process to obtain the second substrate;

[0008] S3: making the third substrate: preparing the third core board, cutting the third core board, making circuits on the third core board, and printing the second resin layer on the inner circuit of the third core board to obtain the third substrate;

[0009] S4: stacking the first substrate, the second substrate and the third substrate in sequence and pressing them together into a semi-finished plate using a press, wherein two sides of the second substrate are respectively attached to the first resin layer and the second resin layer;

[0010] S5: After drilling and electroplating, outer layer circuit production, solder masking and surface treatment of the semi-finished board, laser decapping is performed on the third substrate to form an acoustic hole to obtain a packaging carrier board, and the acoustic hole is interconnected with the cavity.

[0011] Optionally, the drilling and electroplating in S5 includes the following steps: using a drilling machine to drill through holes for interlayer connection on the board, and performing degumming, chemical copper and electroplating copper treatment on the through holes, so that a copper layer is formed in the inner layer of the through holes to form a through hole for interlayer circuit conduction; the specific process parameters are: feed speed of 1.2±0.1m / min, retract speed of 15±1m / min, rotation speed of 160±10krpm / min, depth compensation of 0.3-0.4mm; degumming rate of 0.1-0.4mg / cm 2 , the micro-etching rate is 20-60μm / min, and the deposition rate is 17-32μm / min.

[0012] Optionally, the circuit making in S1, S3 and S5 includes the following steps:

[0013] (1) Pretreatment: Use a cleaning solution containing hydrogen peroxide to clean the board surface, and then use sulfuric acid solution to roughen the surface of the copper foil layer;

[0014] (2) Pressing dry film: The photosensitive dry film is attached to the surface of the copper foil layer by heat pressing;

[0015] (3) Exposure: Use an LDI exposure machine to polymerize the photosensitive material in the photosensitive dry film, so that the designed pattern is transferred to the photosensitive dry film;

[0016] (4) Development: Use the saponification reaction between the developer and the unexposed dry film to remove it;

[0017] (5) Etching: Spray copper chloride solution on the copper surface through an etching machine, and use the chemical reaction between the solution and copper to etch the copper surface not protected by the dry film to form a circuit;

[0018] (6) Film stripping: Spray NaOH or KOH solution on the board surface through the film stripping machine, and use the chemical reaction between the solution and the dry film to remove the dry film to complete the circuit production;

[0019] (7) AOI: The AOI system inspects the circuits on the copper surface by comparing the differences between the etched circuits and the original design circuits;

[0020] The specific process parameters of the squeeze-dry film are: temperature 110±2°C, line speed 1.8±0.2m / min, pressure 6±0.2kg / cm 2 The energy grid during exposure is 6±1; the specific process parameters during development are: line speed is 3.0±0.1m / min, pressure is 1.3±0.3kg / cm 2 , temperature is 30±2℃.

[0021] Optionally, the resin layer preparation in S1 and S3 includes the following steps:

[0022] (1) Pretreatment: remove the oxide on the copper surface, pickle it after micro-etching and then dry it;

[0023] (2) Screen printing and pre-baking: The ink is evenly coated on the surface of the inner layer circuit by screen printing, and partially cured by pre-baking. The mesh number of the printing screen is 120 mesh, the wet film thickness is 30±2μm, and the ink is a thermosetting solvent-free epoxy resin;

[0024] (3) Grinding: The ink surface is smoothed by eight-axis grinding to meet the thickness tolerance of ±5μm.

[0025] The thickness of the first resin layer and the second resin layer is 15±5 μm.

[0026] Optionally, the pre-laminated pure film in S2 is laminated using a vacuum laminating machine, with a laminating temperature of 70±5°C, a laminating pressure of 0.6-0.7Mpa, and a vacuum reaching time of <20S; the process parameters for UV laser cavity production are: laser ultraviolet picosecond power of 10W, frequency of 1000KHZ, processing speed of 1500mm / s, and processing times of 3 times; after UV laser irradiation, the second substrate is placed in an environment with a temperature of 120±10°C and baked for 30±5min to achieve a glue overflow of <0.05mm.

[0027] Optionally, the pressing in S4 includes the following steps:

[0028] (1) Pretreatment: Pickling: Use sulfuric acid to remove the oxide on the surface of the copper foil layer; Cleaning: Use a detergent to hydrolyze the grease into small molecules that are easily soluble in water; Pre-impregnation: Use browning liquid to pre-impregnate the inner layer board;

[0029] (2) Browning: The surface of the copper foil layer is browned using a browning liquid, so that the copper surface forms an uneven surface shape, thereby increasing the contact area between the copper surface and the resin;

[0030] (3) Stacking: stack the plates to be pressed together in sequence;

[0031] (4) Lamination: The panels to be laminated are fused and bonded to form a multilayer panel under high temperature and high pressure in a press;

[0032] (5) Post-processing: Drilling target: Use X-ray to image the plate target, and use a drill bit to drill the positioning holes and anti-fool holes required for subsequent processes on the target; Milling edge: Use a milling machine to cut and remove excess edge material.

[0033] Optionally, the specific process parameters of the browning are as follows: the micro-etching rate is 1.2-1.6μm, the mass percentage concentration of the medicine in the prepreg tank is 1.2-2.8%, and the mass percentage concentration of H2O2 in the browning tank is 4.2-4.8%; the specific process parameters of the pressing are as follows: the ice water pressure is 0.2±0.1MPa, the vacuum degree is ≤40mPa, the oil outlet pressure is 0.2±0.1MPa and the oil inlet pressure is 0.5±0.1MPa.

[0034] Optionally, in S5, the process parameters of laser opening are: laser ultraviolet picosecond power is 10W, frequency is 1000KHZ, processing speed is 1500mm / s, and processing times is 2-3 times.

[0035] A packaging carrier plate with a hollow structure is manufactured according to the manufacturing process of the packaging carrier plate with a hollow structure.

[0036] The beneficial effects of this application are:

[0037] 1) When making the inner circuits of the first substrate and the third substrate in this manufacturing process, a layer of resin layer is printed by solder mask to protect the internal circuits, which can solve the short circuit problem caused by the sealed circuit crossing the cavity;

[0038] 2) When making the cavity structure on the second substrate, UV laser processing is used to achieve a cavity of sufficient size. The size of the hollow back cavity can be controlled within ±0.02mm, and the amount of glue overflow is less than 0.05mm. The alignment between the film and the cavity is improved by pre-laminating pure film combined with laser technology;

[0039] 3) Through the laser opening process, the hollow cavity and the outside are connected. The packaging carrier obtained by this manufacturing process not only increases the volume of the cavity and improves the signal-to-noise ratio and other performance of the product, but also solves the problem of short circuits in dense circuits. BRIEF DESCRIPTION OF THE DRAWINGS

[0040] Figure 1 This is a schematic diagram of the structure of the packaging carrier in this application;

[0041] Figure 2 This is a schematic diagram of the structure of the first core board in this application;

[0042] Figure 3 This is a schematic diagram of the structure of the first substrate in this application;

[0043] Figure 4 This is a schematic diagram of the structure of the second core board in this application;

[0044] Figure 5 This is a schematic diagram of the structure of the second core board after the pure film is attached in this application;

[0045] Figure 6 is a schematic structural diagram of the second substrate in this application;

[0046] Figure 7 This is a schematic diagram of the structure of the third core board in this application;

[0047] Figure 8 This is a schematic structural diagram of the third substrate in this application;

[0048] In the figure: 10-first substrate, 11-first insulating layer, 12-first copper foil layer, 13-second copper foil layer, 14-first resin layer, 20-second substrate, 21-second insulating layer, 22-third copper foil layer, 23-fourth copper foil layer, 24-pure film, 25-cavity, 30-third substrate, 31-third insulating layer, 32-fifth copper foil layer, 33-sixth copper foil layer, 34-second resin layer, 40-package carrier, 41-sound hole, 42-solder mask. DETAILED DESCRIPTION

[0049] The following will be combined with the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0050] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the following drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the objects used in this way can be interchanged where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein, for example. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device that includes a series of steps or units is not necessarily limited to those steps or units that are clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0051] For ease of description, spatially relative terms such as "above", "above", "on the upper surface of", "above", etc. may be used here to describe the spatial positional relationship between a device or feature and other devices or features as shown in the figure. It should be understood that spatially relative terms are intended to include different orientations of the device in use or operation in addition to the orientation described in the figure. For example, if the device in the accompanying drawings is inverted, the device described as "above other devices or structures" or "above other devices or structures" will be positioned as "below other devices or structures" or "below other devices or structures". Thus, the exemplary term "above" can include both "above" and "below". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatially relative descriptions used here are interpreted accordingly.

[0052] Embodiment: A process for manufacturing a packaging carrier with a hollow structure comprises the following steps:

[0053] S1: Preparation of the first substrate 10: Figure 2 As shown, prepare a first core board, cut the first core board, make circuits on the first core board, and print a first resin layer 14 on the inner circuit of the first core board, as shown in FIG. Figure 3 As shown, a first substrate 10 is obtained; the first core board includes a first insulating layer 11 and a first copper foil layer 12 and a second copper foil layer 13 respectively arranged on the front and back sides of the first insulating layer, a circuit pattern is made on the second copper foil layer 13, and the circuit position to be retained is covered with a dry film, and the exposed copper surface is etched off. After removing the film, a dense circuit pattern of the inner layer is obtained, and then a first resin layer 14, i.e., an ink resin layer, is printed on the circuit pattern. The first resin layer is used to protect the circuit on the second copper foil layer from being damaged by the post-process; the first substrate 10 in this embodiment is a double-layer board, and in other embodiments, the first substrate 10 can be an N-layer board, wherein N is a 3-10-layer board, and the required N-layer board is obtained by adding layers to the first core board;

[0054] S2: Preparation of the second substrate 20: Figure 4 and Figure 5 As shown, prepare the second core board and etch off the copper foil on both sides, paste the pure film 24 on both sides of the insulating layer of the second core board, and make the cavity 25 by UV laser process, as shown in FIG. Figure 6 As shown, a second substrate 20 is obtained; the second core board includes a second insulating layer 21 and a third copper foil layer 22 and a fourth copper foil layer 23 respectively arranged on the front and back sides of the second insulating layer, after the third copper foil layer 22 and the fourth copper foil layer 23 are etched away, a pure film 24 is attached to both the front and back sides of the second insulating layer 21, and a cavity 25 is made on the second core board and the pure film 24 by UV laser process, thereby obtaining the second substrate 20;

[0055] S3: Preparation of the third substrate 30: Figure 7 As shown, prepare the third core board, cut the third core board, make the circuit, and print the second resin layer 34 on the inner layer circuit of the third core board, as shown in FIG. Figure 8 As shown, a third substrate 30 is obtained; the third core board includes a third insulating layer 31 and a fifth copper foil layer 32 and a sixth copper foil layer 33 respectively arranged on the front and back sides of the third insulating layer, and a circuit pattern is made on the sixth copper foil layer 33, and the circuit position that needs to be retained is covered with a dry film, and the exposed copper surface is etched off. After removing the film, a dense circuit pattern of the inner layer is obtained, and then a second resin layer 34 is printed on the circuit pattern, and the circuit on the sixth copper foil layer is protected by the resin layer to prevent damage in subsequent processes; the third substrate 30 in this embodiment is a double-layer board, and in other embodiments, the third substrate 30 can be an N-layer board, wherein N is a 3-10-layer board, and the required N-layer board is obtained by adding layers to the third core board;

[0056] S4: The first substrate 10, the second substrate 20 and the third substrate 30 are stacked in sequence and pressed by a press machine to form a semi-finished board, and the two sides of the second substrate 20 are respectively attached to the first resin layer 14 and the second resin layer 34; the pure film 24 and the resin layer are attached to each other, and the semi-finished board is: the fifth copper foil layer 32, the third insulating layer 31, the sixth copper foil layer 33, the second resin layer 34, the pure film 24, the second insulating layer 21, the pure film 24, the first resin layer 14, the second copper foil layer 13, the first insulating layer 11 and the first copper foil layer 12;

[0057] S5: Figure 1As shown, after drilling and electroplating, outer layer circuit production, solder mask, and surface treatment, the semi-finished board is subjected to laser decapping to form a sound hole 41 on the third substrate 30 to obtain a package carrier 40, and the sound hole 41 is interconnected with the cavity 25. The semi-finished board is drilled and copper plated to form a conductive hole that is mutually conductive between layers, and the outer copper foil layer is subjected to outer layer circuit treatment, and solder mask treatment is performed to form a solder mask layer 42. After surface treatment, a layer of gold is plated on the exposed copper foil, and then the sound hole 41 is processed by laser to achieve connection between the outside and the hollow cavity, and a finished package carrier 50 is obtained. When etching the inner circuits of the first substrate 10 and the third substrate 30, this manufacturing process forms a resin layer through solder mask printing to protect the inner circuits to prevent damage in subsequent processes and prevent the problem of carbon powder generated by UV laser causing short circuits between the upper and lower circuits; when manufacturing the cavity structure on the second substrate 20, UV laser processing is used to achieve cavities of different sizes and shapes. The alignment of the film and the hollow substrate is improved by pre-attaching pure film and then lasering. The laser accuracy is controlled at ±0.02mm, thereby improving the alignment of the chip and the cavity; the hollow cavity is connected to the outside through the laser opening process, thereby realizing the production of dense circuits with a hollow structure packaging carrier, where the minimum line width*line spacing is 40μm*40μm.

[0058] The drilling and electroplating in S5 includes the following steps: using a drilling machine to drill through holes for interlayer connection on the board, and removing glue residue, chemical copper and electroplating copper in the through holes, so that a copper layer is formed in the inner layer of the through holes to form a through hole for interlayer circuit conduction; the specific process parameters are: feed speed is 1.2±0.1m / min, retract speed is 15±1m / min, rotation speed is 160±10krpm / min, depth compensation is 0.3-0.4mm; degumming rate is 0.1-0.4mg / cm 2 , the micro-etching rate is 20-60μm / min, and the deposition rate is 17-32μm / min.

[0059] The circuit production in S1, S3 and S5 includes the following steps:

[0060] (1) Pretreatment: Use a cleaning solution containing hydrogen peroxide to clean the board surface, and then use sulfuric acid solution to roughen the surface of the copper foil layer;

[0061] (2) Pressing dry film: The photosensitive dry film is attached to the surface of the copper foil layer by heat pressing;

[0062] (3) Exposure: Use an LDI exposure machine to polymerize the photosensitive material in the photosensitive dry film, so that the designed pattern is transferred to the photosensitive dry film;

[0063] (4) Development: Use the saponification reaction between the developer and the unexposed dry film to remove it;

[0064] (5) Etching: Spray copper chloride solution on the copper surface through an etching machine, and use the chemical reaction between the solution and copper to etch the copper surface not protected by the dry film to form a circuit;

[0065] (6) Film stripping: Spray NaOH or KOH solution on the board surface through the film stripping machine, and use the chemical reaction between the solution and the dry film to remove the dry film to complete the circuit production;

[0066] (7) AOI: The AOI system inspects the circuits on the copper surface by comparing the differences between the etched circuits and the original design circuits;

[0067] The specific process parameters of the squeeze-dry film are: temperature 110±2°C, line speed 1.8±0.2m / min, pressure 6±0.2kg / cm 2 The energy grid during exposure is 6±1; the specific process parameters during development are: line speed is 3.0±0.1m / min, pressure is 1.3±0.3kg / cm 2 , temperature is 30±2℃.

[0068] The production of the resin layer in S1 and S3 includes the following steps:

[0069] (1) Pretreatment: remove the oxide on the copper surface, pickle it after micro-etching and then dry it;

[0070] (2) Screen printing and pre-baking: The ink is evenly coated on the surface of the inner circuit by screen printing, and partially cured by pre-baking. The mesh number of the printing screen is 120 mesh, the wet film thickness is 30±2μm, and the ink uses thermosetting solvent-free epoxy resin. The characteristics of this ink are that the viscosity drops sharply when the temperature rises to discharge bubbles and it has high fluidity, so the flatness of the ink can achieve ±7μm;

[0071] (3) Grinding: The ink surface is smoothed by eight-axis grinding to meet the thickness tolerance of ±5μm.

[0072] The thickness of the ink resin layer 14 is 15±5 μm, and the ink resin layer is used to protect the pattern at the bottom of the cavity from being damaged.

[0073] In S2, the pre-laminated pure film 24 is laminated using a vacuum laminating machine, with a laminating temperature of 70±5°C, a laminating pressure of 0.6-0.7Mpa, and a vacuum reaching time of <20S; the process parameters for UV laser production of the cavity 25 are: the laser ultraviolet picosecond power is 10W, the frequency is 1000KHZ, the processing speed is 1500mm / s, and the number of processing times is 3 times; after UV laser, the second substrate 20 is placed in an environment with a temperature of 120±10°C and baked for 30±5min to achieve a glue overflow of <0.05mm. The laminated film is lasered to the required image, which can realize the design of cavities of different sizes and shapes. The laser accuracy is controlled at ±0.02mm, which can improve the alignment of the chip and the cavity.

[0074] Pressing in S4 includes the following steps:

[0075] (1) Pretreatment: Pickling: Use sulfuric acid to remove the oxide on the surface of the copper foil layer; Cleaning: Use a detergent to hydrolyze the grease into small molecules that are easily soluble in water; Pre-impregnation: Use browning liquid to pre-impregnate the inner layer board;

[0076] (2) Browning: The surface of the copper foil layer is browned using a browning liquid, so that the copper surface forms an uneven surface shape, thereby increasing the contact area between the copper surface and the resin;

[0077] (3) Stacking: stack the plates to be pressed together in sequence;

[0078] (4) Lamination: The panels to be laminated are fused and bonded to form a multilayer panel under high temperature and high pressure in a press;

[0079] (5) Post-processing: Drilling target: Use X-ray to image the plate target, and use a drill bit to drill the positioning holes and anti-fool holes required for subsequent processes on the target; Milling edge: Use a milling machine to cut and remove excess edge material.

[0080] The specific process parameters of the browning are as follows: microetching rate is 1.2-1.6μm, the mass percentage concentration of the medicine in the prepreg tank is 1.2-2.8%, and the mass percentage concentration of H2O2 in the browning tank is 4.2-4.8%; the specific process parameters of the pressing are as follows: ice water pressure is 0.2±0.1MPa, vacuum degree ≤40mPa, oil outlet pressure is 0.2±0.1MPa and oil inlet pressure is 0.5±0.1MPa. The medicine in the prepreg tank is BR616.

[0081] The process parameters of laser opening in S5 are: laser UV picosecond power is 10W, frequency is 1000KHZ, processing speed is 1500mm / s, and processing times is 2-3 times.

[0082] A packaging carrier with a hollow structure is manufactured according to the manufacturing process of the packaging carrier with a hollow structure. Figure 1 As shown, the package carrier 40 has a cavity 25 therein, and the cavity 25 is used for customers to mount chips.

[0083] It should be noted that, for those skilled in the art, several modifications and improvements can be made without departing from the concept of the present application, and these modifications and improvements are all within the scope of protection of the present application. Therefore, the scope of protection of the patent of the present application shall be subject to the attached claims.

Claims

1. A process for manufacturing a packaging carrier with a hollow structure, characterized in that: The steps include: S1: manufacturing the first substrate (10): preparing a first core board, cutting the first core board, manufacturing circuits on the first core board, and printing a first resin layer (14) on the inner layer circuit of the first core board to obtain the first substrate (10); S2: Manufacturing of the second substrate (20): preparing a second core board and etching away the copper foil on both sides, pasting a pure film (24) on both sides of the insulating layer of the second core board, manufacturing a cavity (25) by UV laser process, and obtaining the second substrate (20); S3: manufacturing the third substrate (30): preparing a third core board, cutting the third core board, manufacturing circuits on the third core board, and printing a second resin layer (34) on the inner circuit of the third core board to obtain the third substrate (30); S4: stacking the first substrate (10), the second substrate (20) and the third substrate (30) in sequence and pressing them together using a press to form a semi-finished plate, wherein two sides of the second substrate (20) are respectively attached to the first resin layer (14) and the second resin layer (34); S5: After drilling and electroplating, outer layer circuit production, solder masking, and surface treatment of the semi-finished board, laser decapping is performed on the third substrate (30) to form a sound hole (41) to obtain a packaging carrier (40), wherein the sound hole (41) is communicated with the cavity (25); The drilling and electroplating in S5 includes the following steps: using a drilling machine to drill through holes for interlayer connection on the board, and removing glue residue, chemical copper and electroplating copper in the through holes, so that a copper layer is formed in the inner layer of the through holes to form a through hole for interlayer circuit conduction; the specific process parameters are: feed speed is 1.2±0.1m / min, retract speed is 15±1m / min, rotation speed is 160±10krpm / min, depth compensation is 0.3-0.4mm; degumming rate is 0.1-0.4mg / cm 2 , micro-etching rate is 20-60μm / min, deposition rate is 17-32μm / min; The production of the resin layer in S1 and S3 includes the following steps: (1) Pretreatment: remove the oxide on the copper surface, pickle it after micro-etching and then dry it; (2) Screen printing and pre-baking: The ink is evenly coated on the surface of the inner layer circuit by screen printing, and partially cured by pre-baking. The mesh number of the printing screen is 120 mesh, the wet film thickness is 30±2μm, and the ink is a thermosetting solvent-free epoxy resin; (3) Grinding: The ink surface is smoothed by eight-axis grinding to meet the thickness tolerance of ±5μm. Wherein, the thickness of the first resin layer (14) and the second resin layer (34) is 15±5 μm.

2. The process for manufacturing a packaging carrier with a hollow structure according to claim 1, characterized in that: The circuit production in S1, S3 and S5 includes the following steps: (1) Pretreatment: Use a cleaning solution containing hydrogen peroxide to clean the board surface, and then use sulfuric acid solution to roughen the surface of the copper foil layer; (2) Pressing dry film: The photosensitive dry film is attached to the surface of the copper foil layer by heat pressing; (3) Exposure: Use an LDI exposure machine to polymerize the photosensitive material in the photosensitive dry film, so that the designed pattern is transferred to the photosensitive dry film; (4) Development: Use the saponification reaction between the developer and the unexposed dry film to remove it; (5) Etching: Spray copper chloride solution on the copper surface through an etching machine, and use the chemical reaction between the solution and copper to etch the copper surface not protected by the dry film to form a circuit; (6) Film stripping: Spray NaOH or KOH solution on the board surface through the film stripping machine, and use the chemical reaction between the solution and the dry film to remove the dry film to complete the circuit production; (7) AOI: The AOI system inspects the circuits on the copper surface by comparing the differences between the etched circuits and the original design circuits; The specific process parameters of the squeeze-dry film are: temperature 110±2°C, line speed 1.8±0.2m / min, pressure 6±0.2kg / cm 2 The energy grid during exposure is 6±1; the specific process parameters during development are: line speed is 3.0±0.1m / min, pressure is 1.3±0.3kg / cm 2 , temperature is 30±2℃.

3. The process for manufacturing a packaging carrier with a hollow structure according to claim 1, characterized in that: In S2, the pre-laminated pure film (24) is laminated using a vacuum laminating machine, with a laminating temperature of 70±5°C, a laminating pressure of 0.6-0.7Mpa, and a vacuum reaching time of <20S; the process parameters for UV laser production of the cavity (25) are: laser ultraviolet picosecond power of 10W, frequency of 1000kHz, processing speed of 1500mm / s, and processing times of 3 times; after UV laser irradiation, the second substrate (20) is placed in an environment with a temperature of 120±10°C and baked for 30±5min to achieve a glue overflow of <0.05mm.

4. The process for manufacturing a packaging carrier with a hollow structure according to claim 1, characterized in that: Pressing in S4 includes the following steps: (1) Pretreatment: Pickling: Use sulfuric acid to remove the oxide on the surface of the copper foil layer; Cleaning: Use a detergent to hydrolyze the grease into small molecules that are easily soluble in water; Pre-impregnation: Use browning liquid to pre-impregnate the inner layer board; (2) Browning: The surface of the copper foil layer is browned using a browning liquid, so that the copper surface forms an uneven surface shape, thereby increasing the contact area between the copper surface and the resin; (3) Stacking: stack the plates to be pressed together in sequence; (4) Lamination: The panels to be laminated are fused and bonded to form a multilayer panel under high temperature and high pressure in a press; (5) Post-processing: Drilling target: Use X-ray to image the plate target, and use a drill bit to drill the positioning holes and anti-fool holes required for subsequent processes on the target; Milling edge: Use a milling machine to cut and remove excess edge material.

5. The process for manufacturing a packaging carrier with a hollow structure according to claim 4, characterized in that: The specific process parameters of the browning are as follows: the micro-etching rate is 1.2-1.6μm, the mass percentage concentration of the medicine in the prepreg tank is 1.2-2.8%, and the mass percentage concentration of H2O2 in the browning tank is 4.2-4.8%; the specific process parameters of the pressing are as follows: the ice water pressure is 0.2±0.1MPa, the vacuum degree is ≤40mPa, the oil outlet pressure is 0.2±0.1MPa and the oil inlet pressure is 0.5±0.1MPa.

6. The process for manufacturing a packaging carrier with a hollow structure according to claim 1, characterized in that: The process parameters of laser opening in S5 are: laser UV picosecond power is 10W, frequency is 1000kHz, processing speed is 1500mm / s, and processing times is 2-3 times.

7. A packaging carrier with a hollow structure, characterized in that: It is manufactured according to the manufacturing process of the packaging carrier with a hollow structure according to any one of claims 1-6.

Images