Circuit board processing dispensing machine

Abstract

The utility model belongs to the technical field of circuit board processing, and particularly relates to a circuit board processing glue dispenser which comprises a base, an X-axis moving platform and a Y-axis moving platform, the X-axis moving platform and the Y-axis moving platform are fixedly connected to one side of the base, a Z-axis moving platform is fixedly connected to the moving end of the X-axis moving platform, and a supporting seat is fixedly connected to the moving end of the Y-axis moving platform. A clamping mechanism is connected to one side of the supporting seat, a mounting frame is fixedly connected to the moving end of the Z-axis moving platform, and a dispensing module and a heating assembly are fixedly connected to the mounting frame; according to the glue dispensing device, the heating assembly is arranged, the glue solution and the glue dispensing area of the circuit board can be heated through the heating assembly, so that the flowability and the curing effect of the glue solution are ensured, glue dispensing in a low-temperature environment and glue with poor flowability are particularly important, the flowability of the glue solution on the circuit board can be better, and the glue dispensing effect is better. And meanwhile, the reject ratio can also be reduced.

Description

Technical Field

[0001] The present application relates to the technical field of circuit board processing, and in particular to a circuit board processing glue dispensing machine. Background Art

[0002] Gluing is to apply, fill and drip electronic glue, oil or other liquids onto the circuit board to make the circuit board stick, fill, insulate, fix and smooth the surface;

[0003] The circuit board glue dispensing machine in the prior art can only dispense glue on one side of the circuit board, and the production efficiency is low;

[0004] The existing patent (Announcement No.: CN219836736U) discloses a circuit board processing glue dispensing machine, including a workbench, a bracket, a glue dispensing assembly, a C-shaped plate A, an electric push rod A, a C-shaped plate B, an electric push rod B, a glue dispensing device, a placement box, a flip mechanism, a motor and other structures, which can perform double-sided glue dispensing on the circuit board, thereby improving the glue dispensing efficiency of the circuit board;

[0005] However, when dispensing glue under low ambient temperature, the glue discharged from the dispensing module has poor fluidity on the circuit board, resulting in the glue being unable to flow quickly and seal the devices on the circuit board, resulting in an increase in the defective rate. Utility Model Content

[0006] The purpose of the present application is to provide a circuit board processing glue dispensing machine to solve the problem in the above-mentioned background technology that the glue cannot flow quickly and seal the components on the circuit board.

[0007] To achieve the above-mentioned purpose, the present application provides the following technical solutions: a circuit board processing glue dispensing machine, comprising a base and an X-axis movable platform and a Y-axis movable platform fixedly connected to one side of the base, and a Z-axis movable platform is fixedly connected to the movable end of the X-axis movable platform, a support seat is fixedly connected to the movable end of the Y-axis movable platform, and a clamping mechanism is connected to one side of the support seat, a mounting frame is fixedly connected to the movable end of the Z-axis movable platform, and a glue dispensing module and a heating component are fixedly connected to the mounting frame;

[0008] The heating assembly includes an outer shell body 2 fixedly connected to the lower end of the mounting frame, a cavity opened inside the outer shell body 2, a fan 2 fixedly connected to one side of the outer shell body 2 and with the air outlet end extending into the cavity, and an electric heating element fixedly connected to the inner wall of the cavity. The opening of the cavity faces the end facing away from the dispensing module and the mounting frame.

[0009] In one embodiment, a drainage hood is fixedly connected to the lower end of the mounting frame, a purification component is fixedly connected to the outer surface of the Z-axis movable platform, and the purification component includes an outer shell, a fan fixedly connected to the outer shell, an exhaust port and an inner cavity opened in the outer shell, a through groove connecting the exhaust port with the inner cavity, and a filter plate fixedly connected to the exhaust port; an opening connected to the inner cavity is opened at the bottom of the outer shell, and the suction end of the fan faces the opening, and the opening is connected to the drainage hood through a pipe.

[0010] In one embodiment, the clamping mechanism includes a fixing seat fixed on the supporting seat, a screw threaded inside the fixing seat, a clamping block rotatably connected to one end of the screw, and a stepped clamping opening on the side of the clamping block away from the screw.

[0011] In one embodiment, the inner wall of the stepped clamp is connected to an anti-overflow glue plate, and a plurality of glue dispensing avoidance grooves are provided inside the anti-overflow glue plate.

[0012] In one embodiment, an inner flow channel 1 is further provided inside the anti-overflow rubber plate, and two flow channel interfaces 1 both connected to the inner flow channel 1 are symmetrically provided on an outer surface of one side of the anti-overflow rubber plate.

[0013] In one embodiment, the support seat is provided with an internal flow channel 2, and two flow channel interfaces 2 which are both connected to the internal flow channel 2 are symmetrically provided on the outer surface of one side of the support seat. The support seat is also provided with a guide groove for guiding the movement of the clamping block.

[0014] Compared with the prior art, the beneficial effects of this application are:

[0015] The present application is provided with a heating component, which can heat the glue and the glue dispensing area of ​​the circuit board, thereby ensuring the fluidity and curing effect of the glue. This is especially important for dispensing in a low-temperature environment and for some glues with poor fluidity. It can not only make the glue more fluid on the circuit board and achieve rapid potting, but also reduce the defective rate. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 This is a schematic diagram of the structure of this application;

[0017] Figure 2 This is a schematic diagram of the heating component structure of this application;

[0018] Figure 3 This is a schematic diagram of the clamping mechanism and guide groove structure of this application;

[0019] Figure 4 A cross-sectional view of the heating component for this application;

[0020] Figure 5A cross-sectional view of the purification assembly for this application;

[0021] Figure 6 This is a cross-sectional view of the anti-overflow rubber plate for this application;

[0022] Figure 7 This is a cross-sectional view of the support seat of this application.

[0023] In the figure: 1. base; 2. X-axis movable platform; 3. Z-axis movable platform; 4. mounting frame; 5. dispensing module; 6. Y-axis movable platform; 7. support seat; 71. flow channel interface 1; 72. inner flow channel 1; 73. guide groove; 8. clamping mechanism; 81. fixed seat; 82. screw rod; 83. clamping block; 84. stepped clamp; 9. anti-overflow glue plate; 91. dispensing avoidance groove; 92. flow channel interface 2; 93. inner flow channel 2; 10. drainage hood; 11. purification component; 111. outer shell 1; 112. fan 1; 113. exhaust port; 114. through groove; 115. filter plate; 12. heating component; 121. outer shell 2; 122. fan 2; 123. cavity; 124. electric heating element. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0025] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0026] Example:

[0027] See also Figure 1-7The present application provides a technical solution: a circuit board processing glue dispensing machine, comprising a base 1 and an X-axis movable platform 2 and a Y-axis movable platform 6 fixedly connected to one side of the base 1, and a Z-axis movable platform 3 is fixedly connected to the movable end of the X-axis movable platform 2, and the X-axis movable platform 2 can drive the Z-axis movable platform 3 to translate when it works, so as to adjust the position of the glue dispensing module 5, and a support seat 7 is fixedly connected to the movable end of the Y-axis movable platform 6, and the Y-axis movable platform 6 can drive the support seat 7 to move when it works, so as to adjust the position of the circuit board The position can be adjusted, and the dispensing of glue at multiple positions on the circuit board can be achieved through three-axis movement, and a clamping mechanism 8 is connected to one side of the support seat 7, and the clamping mechanism 8 is used to fix the circuit board on the support seat 7. The mobile end of the Z-axis moving platform 3 is fixedly connected with a mounting frame 4, and the mounting frame 4 is fixedly connected with a dispensing module 5 and a heating component 12. The dispensing module 5 belongs to a mature existing technology, and its function is the same as the dispensing module in the existing patent (Announcement No.: CN117019545A), and both are used to discharge glue liquid onto the circuit board;

[0028] The heating assembly 12 includes an outer shell 121 fixedly connected to the lower end of the mounting frame 4, a cavity 123 opened inside the outer shell 121, a fan 122 fixedly connected to one side of the outer shell 121 and with the air outlet end extending into the cavity 123, and an electric heating element 124 fixedly connected to the inner wall of the cavity 123. The opening of the cavity 123 faces the end of the dispensing module 5 that is away from the mounting frame 4. The fan 122 can send external air into the cavity 123 when it is working. The air is heated by the electric heating element 124 in the cavity 123. The heated air is discharged from the opening of the cavity 123 and blown to the dispensing point, which can heat the glue and the dispensing area on the circuit board, ensure the fluidity and curing effect of the glue, and achieve rapid potting.

[0029] See also Figure 1 and Figure 5In this embodiment, a drainage cover 10 is also fixedly connected to the lower end of the mounting frame 4, and a purification component 11 is fixedly connected to the outer surface of the Z-axis movable platform 3, and the purification component 11 includes an outer shell 111, a fan 112 fixedly connected to the outer shell 111, an exhaust port 113 and an inner cavity provided in the outer shell 111, a through groove 114 connecting the exhaust port 113 with the inner cavity, and a filter plate 115 fixedly connected to the exhaust port 113. The bottom of the outer shell 111 is provided with an opening connected to the inner cavity, and the suction of the fan 112 The wind end faces the opening, and the opening is connected with the drainage hood 10 through a pipe. Since the glue liquid will produce a certain odor during volatilization during the heating process, in order to reduce the impact of the odor on the environment and human body, the air in the pipe and the drainage hood 10 is drawn into the outer shell 111 through a fan 112. Therefore, the air around the glue dispensing area is sucked into the drainage hood 10, and the gas enters the exhaust port 113 through the through groove 114, and is discharged after being filtered by the filter plate 115 (using an activated carbon filter plate), thereby achieving purification and filtration of the gas.

[0030] See also Figure 2 and Figure 3 In this embodiment, the clamping mechanism 8 includes a fixed seat 81 fixed on the support seat 7, a screw rod 82 screwed inside the fixed seat 81, a clamping block 83 rotatably connected to one end of the screw rod 82, and a stepped clamping opening 84 provided on the side away from the clamping block 83 and the screw rod 82. The inner wall of the stepped clamping opening 84 is connected with an anti-overflow glue plate 9, and a plurality of dispensing avoidance grooves 91 are provided inside the anti-overflow glue plate 9. The clamping block 83 can be driven to move by rotating the screw rod 82, and the circuit board can be clamped by the lower side of the clamping block 83 and the screw rod 82. The anti-overflow glue plate 9 can be clamped by the stepped clamping opening 84 above the clamping block 83, so that the anti-overflow glue plate 9 can be located above the circuit board, and the anti-overflow glue plate 9 fits the circuit board. At the same time, the dispensing avoidance grooves 91 provided can be used to perform dispensing on the area to be dispensed on the circuit board, and the glue overflow to the remaining areas on the circuit board can be limited.

[0031] The anti-overflow rubber plate 9 is also provided with an inner flow channel 1 72, and two flow channel interfaces 1 71 are symmetrically provided on the outer surface of one side of the anti-overflow rubber plate 9, both of which are connected to the inner flow channel 1 72. The support seat 7 is provided with an inner flow channel 2 93, and two flow channel interfaces 2 92 are symmetrically provided on the outer surface of one side of the support seat 7, both of which are connected to the inner flow channel 2. The support seat 7 is also provided with a guide groove 73 for guiding the movement of the clamping block 83. By designing the inner flow channel 1 72 and the inner flow channel 2 93, circulating cooling water can be fed into the inner flow channel. After the heating and dispensing process of the circuit board and the glue liquid is completed, the circuit board is cooled by circulating cooling.

[0032] The above shows and describes the basic principles and main features of the present application and the advantages of the present application. For those skilled in the art, it is obvious that the present application is not limited to the details of the above exemplary embodiments, and the present application can be implemented in other specific forms without departing from the spirit or basic features of the present application; therefore, no matter from which point of view, the embodiments should be regarded as exemplary and non-restrictive. The scope of the present application is limited by the attached claims rather than the above description, and it is intended to include all changes within the meaning and scope of the equivalent elements of the claims in the present application, and any figure marks in the claims should not be regarded as limiting the claims involved.

[0033] Although the embodiments of the present application have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A circuit board processing glue dispensing machine, comprising a base (1) and an X-axis movable platform (2) and a Y-axis movable platform (6) fixedly connected to one side of the base (1), and a Z-axis movable platform (3) fixedly connected to the movable end of the X-axis movable platform (2), characterized in that: A support seat (7) is fixedly connected to the moving end of the Y-axis moving platform (6), and a clamping mechanism (8) is connected to one side of the support seat (7); a mounting frame (4) is fixedly connected to the moving end of the Z-axis moving platform (3), and a dispensing module (5) and a heating component (12) are fixedly connected to the mounting frame (4); The heating component (12) comprises an outer shell body (121) fixedly connected to the lower end of the mounting frame (4), a cavity (123) opened inside the outer shell body (121), a fan (122) fixedly connected to one side of the outer shell body (121) and with an air outlet extending into the cavity (123), and an electric heating element (124) fixedly connected to the inner wall of the cavity (123), wherein the opening of the cavity (123) faces the end of the dispensing module (5) away from the mounting frame (4).

2. A circuit board processing glue dispensing machine according to claim 1, characterized in that: The lower end of the mounting frame (4) is also fixedly connected to a drainage hood (10), and the outer surface of the Z-axis movable platform (3) is fixedly connected to a purification component (11), and the purification component (11) comprises an outer shell (111), a fan (112) fixedly connected to the outer shell (111), an exhaust port (113) and an inner cavity provided in the outer shell (111), a through groove (114) connecting the exhaust port (113) with the inner cavity, and a filter plate (115) fixedly connected to the exhaust port (113), wherein an opening communicating with the inner cavity is provided at the bottom of the outer shell (111), and an air suction end of the fan (112) faces the opening, and the opening is connected to the drainage hood (10) through a pipe.

3. A circuit board processing glue dispensing machine according to claim 2, characterized in that: The clamping mechanism (8) comprises a fixing seat (81) fixedly connected to the supporting seat (7), a screw rod (82) screwed inside the fixing seat (81), a clamping block (83) rotatably connected to one end of the screw rod (82), and a stepped clamping opening (84) formed on a side of the clamping block (83) facing away from the screw rod (82).

4. A circuit board processing glue dispensing machine according to claim 3, characterized in that: The inner wall of the stepped clamping opening (84) is connected to a glue overflow prevention plate (9), and a plurality of glue dispensing avoidance grooves (91) are provided inside the glue overflow prevention plate (9).

5. A circuit board processing glue dispensing machine according to claim 4, characterized in that: The anti-overflow rubber plate (9) is also provided with an inner flow channel (72) therein, and two flow channel interfaces (71) are symmetrically provided on the outer surface of one side of the anti-overflow rubber plate (9), both of which are connected to the inner flow channel (72).

6. A circuit board processing glue dispensing machine according to any one of claims 3 or 5, characterized in that: The support seat (7) is provided with an inner flow channel 2 (93) inside, and two flow channel interfaces 2 (92) both connected to the inner flow channel 2 are symmetrically provided on the outer surface of one side of the support seat (7). The support seat (7) is also provided with a guide groove (73) inside for guiding the movement of the clamping block (83).

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