Solder forming equipment

Abstract

The utility model discloses solder forming equipment which comprises a support assembly, a push rod assembly, a heating cavity and an extrusion forming assembly, the extrusion forming assembly is located in the heating cavity, the heating cavity can heat solder, and the extrusion forming assembly is provided with a forming runner. The output end of the push rod assembly moves in the horizontal direction and is used for pushing the welding flux heated by the heating cavity into the forming runner. During use, firstly, welding flux is heated to be in a semi-solid state through the heating cavity, then under the action of the push rod assembly, the semi-solid welding flux is extruded into the extrusion forming assembly and enters the forming runner, and the shape of the finally formed welding flux depends on the shape of the forming runner. According to the solder forming equipment, the shape of the solder can be controlled, for example, the solder is continuously formed into the hollow thin-wall cylindrical solder, and then the finished solder can be formed through segmented cutting of the cutting machine, so that the production efficiency is greatly improved, the cutting process is relatively simple, and the yield of products is guaranteed.

Description

Technical Field

[0001] The utility model belongs to the technical field of solder, and relates to solder forming equipment. Background Art

[0002] Solder is a general term for metal alloy materials used to fill welds, cladding layers and brazing seams. For hollow, thin-walled, and cylindrical solders with a certain height, the traditional molding process requires first forming a thin strip, then rolling the thin strip into a hollow, thin-walled cylindrical shape, and cutting off the excess material at both ends of the fusion welding joint before molding. This molding method not only has many processing steps, but also is difficult to operate and has a very low yield rate.

[0003] Therefore, there is an urgent need to develop a device that can directly shape a hollow-walled, thin, cylindrical solder having a certain height. Utility Model Content

[0004] In view of this, the utility model provides a solder forming device, which solves the technical problems of traditional solder forming equipment such as multiple processing steps, great operating difficulty and low yield when forming hollow, thin-walled cylindrical solders with a certain height.

[0005] In order to solve the above problems, according to one aspect of the present application, an embodiment of the utility model provides a solder molding device, which includes a bracket assembly and a push rod assembly, a heating cavity and an extrusion molding assembly arranged on the bracket assembly, the extrusion molding assembly is located in the heating cavity, the heating cavity can heat the solder, the extrusion molding assembly has a molding flow channel, and the output end of the push rod assembly moves in a horizontal direction to push the solder heated by the heating cavity into the molding flow channel.

[0006] In some embodiments, the extrusion molding assembly includes a first mold, a second mold and a molding rod core, the first mold and the second mold are arranged side by side, and the molding rod core is inserted into the first mold and the second mold; the first mold has a plurality of feed ports on a side away from the second mold, and the molding channel is formed between the second mold and the molding rod core, and the feed port corresponds to the molding channel so that the solder entering through the feed port is extruded into the molding channel; wherein, the molding channel is annular so that the solder is molded into a hollow columnar solder.

[0007] In some embodiments, the extrusion molding component also includes an extrusion channel opened in the second mold, and the feed port is connected to the molding channel through the extrusion channel; and along the direction from close to the feed port to away from the feed port, the diameter of the extrusion channel gradually decreases, and the center line of the extrusion channel is closer to the axis of the first mold.

[0008] In some embodiments, one end of the forming rod core is fixed to the side wall of the feed port through a connecting wall, and the other end of the forming rod core is suspended.

[0009] In some embodiments, the solder forming equipment further includes a discharge support belt, which is fixed to the bracket assembly and is located behind the other end of the forming rod core for supporting the columnar solder.

[0010] In some embodiments, the discharge support belt includes a first support plate and a second support plate, one side of the first support plate is connected to one side of the second support plate, and the first support plate and the second support plate are inclined to form a V-shaped groove for supporting the columnar solder.

[0011] In some embodiments, the bracket assembly includes a fixed base, a first bracket and a second bracket which are sequentially arranged, the push rod assembly and the heating chamber are arranged on the fixed base, and the first bracket and the second bracket are located below the discharge support belt for supporting the discharge support belt.

[0012] In some embodiments, the push rod assembly includes a hydraulic push rod and an extrusion push rod, one end of the extrusion push rod is connected to the output end of the hydraulic push rod, and the other end of the extrusion push rod can push the solder heated by the heating cavity into the molding flow channel.

[0013] In some embodiments, the solder forming equipment also includes a fixing assembly for preventing the heating chamber from following the movement of the push rod assembly. The fixing assembly is disposed on the bracket assembly, and one end of the fixing assembly is fixed to the push rod assembly, and the other end of the fixing assembly is fixed outside the heating chamber.

[0014] In some embodiments, the fixing assembly includes a first fixing plate, a second fixing plate and a connecting rod, the first fixing plate is fixed on the push rod assembly, the second fixing plate is fixed outside the heating chamber, one end of the connecting rod is connected to the first fixing plate, and the other end of the connecting rod is connected to the second fixing plate.

[0015] Compared with the prior art, the solder forming equipment of the utility model has at least the following beneficial effects:

[0016] The solder molding equipment provided by the utility model includes a bracket assembly and a push rod assembly, a heating cavity and an extrusion molding assembly arranged on the bracket assembly. The extrusion molding assembly is located in the heating cavity, the heating cavity can heat the solder, the extrusion molding assembly has a molding flow channel, and the output end of the push rod assembly moves in a horizontal direction to push the solder heated by the heating cavity into the molding flow channel.

[0017] When in use, the solder is first heated to a semi-solid state by a heating cavity, and then, under the action of the push rod assembly, the semi-solid solder is extruded into the extrusion molding assembly and enters the molding flow channel. The shape of the solder finally formed depends on the shape of the molding flow channel. For example, when a hollow, thin-walled, cylindrical solder with a certain height is required, the molding flow channel can be set to a ring shape. The solder molding equipment provided by the utility model can control the shape of the solder, for example, the solder is continuously molded into a hollow, thin-walled cylindrical solder, and then the finished solder can be formed by segmented cutting by a cutting machine, which greatly improves the production efficiency, and the cutting process is relatively simple, thereby ensuring the product yield.

[0018] The above description is only an overview of the technical solution of the utility model. In order to more clearly understand the technical means of the utility model and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the utility model in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the utility model, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 It is a structural schematic diagram of a solder forming device provided in an embodiment of the utility model;

[0021] Figure 2 It is a cross-sectional view of a solder forming device provided by an embodiment of the utility model;

[0022] Figure 3 It is a structural schematic diagram of an extrusion molding component in a solder molding device provided by an embodiment of the utility model;

[0023] Figure 4 It is another structural schematic diagram of a solder forming device provided by an embodiment of the utility model;

[0024] Figure 5 It is a cross-sectional view of an extrusion molding component in a solder molding device provided by an embodiment of the utility model;

[0025] Figure 6 yes Figure 5 A partial enlarged view of point A in the middle.

[0026] in:

[0027] 1. Bracket assembly; 11. Fixed base; 12. First bracket; 13. Second bracket;

[0028] 2. Push rod assembly; 21. Hydraulic push rod; 22. Extrusion push rod;

[0029] 3. Heating cavity;

[0030] 4. Extrusion molding assembly; 41. Molding flow channel; 42. First mold; 43. Second mold; 44. Molding rod core; 45. Feed inlet; 46. Extrusion flow channel; 47. Connecting wall; 48. Fixing nut;

[0031] 5. Solder;

[0032] 6. Columnar solder;

[0033] 7. Discharging support belt; 71. First support plate; 72. Second support plate;

[0034] 8. Fixing assembly; 81. First fixing plate; 82. Second fixing plate; 83. Connecting rod. DETAILED DESCRIPTION

[0035] In order to further explain the technical means and effects adopted by the utility model to achieve the predetermined utility model purpose, the specific implementation methods, structures, features and effects of the utility model application are described in detail below in conjunction with the accompanying drawings and preferred embodiments. In the following description, different "one embodiment" or "embodiment" does not necessarily refer to the same embodiment. In addition, specific features, structures, or characteristics in one or more embodiments may be combined in any suitable form.

[0036] In the description of the present invention, it should be clarified that the terms "first", "second", etc. in the specification and claims of the present invention and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence; the terms "vertical", "lateral", "longitudinal", "front", "rear", "left", "right", "up", "down", "horizontal", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the drawings, and are only for the convenience of describing the present invention, and do not mean that the referred device or element must have a specific direction or position, and therefore cannot be understood as a limitation on the present invention.

[0037] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0038] This embodiment provides a solder forming device, such as Figure 1-6 As shown, the solder molding equipment includes a bracket assembly 1 and a push rod assembly 2, a heating cavity 3 and an extrusion molding assembly 4 arranged on the bracket assembly 1, the extrusion molding assembly 4 is located in the heating cavity 3, the heating cavity 3 can heat the solder 5, the extrusion molding assembly 4 has a molding flow channel 41, and the output end of the push rod assembly 2 moves in a horizontal direction to push the solder 5 heated by the heating cavity 3 into the molding flow channel 41.

[0039] Specifically, the support assembly 1 is used to provide support for the push rod assembly 2, the heating cavity 3 and the extrusion molding assembly 4. The push rod assembly 2 is used to provide power so that the solder 5 can move. The heating cavity 3 is a hollow columnar structure, which is used to heat the solder of the cylinder to make it semi-solid. The extrusion molding assembly 4 is used to mold the semi-solid solder to make its shape meet the requirements.

[0040] In this embodiment, the meaning of semi-solid is: controlling the solid-liquid temperature range to obtain a solid-liquid mixed slurry in which a certain solid phase component is uniformly suspended in a liquid metal mother liquid (the solid phase component can even be as high as 60%). This semi-solid metal slurry has rheological properties, that is, it has good fluidity; this form of solder is the form of solder obtained after heating in the heating cavity 3.

[0041] When in use, the solder is first heated to a semi-solid state by the heating cavity 3, and then the semi-solid solder is extruded into the extrusion molding assembly 4 and enters the molding flow channel 41 under the action of the push rod assembly 2. The shape of the solder finally formed depends on the shape of the molding flow channel 41. For example, when a hollow, thin-walled, cylindrical solder with a certain height is required, the molding flow channel 41 can be set to a ring shape.

[0042] The solder forming equipment provided in this embodiment can control the shape of the solder, for example, allowing the solder to be continuously formed into a hollow-walled thin cylindrical solder, which can then be cut in sections by a cutting machine to form a finished solder. The production efficiency is greatly improved, and the cutting process is relatively simple, thereby ensuring the product yield.

[0043] In a specific embodiment, the extrusion molding component 4 includes a first mold 42, a second mold 43 and a molding rod core 44, the first mold 42 and the second mold 43 are arranged in parallel, and the molding rod core 44 is inserted into the first mold 42 and the second mold 43; the first mold 42 has a plurality of feed ports 45 on a side away from the second mold 43, and the molding channel 41 is formed between the second mold 43 and the molding rod core 44, and the feed port 45 corresponds to the molding channel 41 so that the solder 5 entering through the feed port 45 is extruded into the molding channel 41; wherein, the molding channel 41 is annular so that the solder 5 is molded into a hollow columnar solder 6.

[0044] Specifically, the first mold 42 and the second mold 43 are both columnar structures with a certain thickness, and the two are closely arranged; wherein the first mold 42 is close to the push rod assembly 2. Of course, the first mold 42 and the second mold 43 can also be formed in one piece. A fixing nut 48 is arranged on a side of the second mold 43 away from the first mold 42.

[0045] In addition, the heating cavity 3 is a hollow columnar structure. For better description, the space inside the heating cavity is divided into two parts, one part is a first space close to the push rod assembly 2, and the other part is a second space away from the push rod assembly 2; in the first space, the solder is heated to a semi-solid state, and the extrusion molding assembly 4 is arranged in the second space.

[0046] In the specific implementation process, the solder is heated in the first space and becomes a cylindrical semi-solid state. Then, under the action of the push rod assembly 2, the semi-solid cylindrical solder enters the first mold 42 and the second mold 43 in sequence through the feed port 45. In the second mold 43, the solder is formed into the required shape.

[0047] In a specific embodiment, the extrusion molding component 4 also includes an extrusion channel 46 opened in the second mold 43, and the feed port 45 is connected to the molding channel 41 through the extrusion channel 46; and along the direction from close to the feed port 45 to away from the feed port 45, the diameter of the extrusion channel 46 gradually decreases, and the center line of the extrusion channel 46 is closer to the axis of the first mold 42.

[0048] Specifically, in this embodiment, the solder heated by the heating cavity 3 enters the molding flow channel 41 through the feed port 45 and the extrusion flow channel 46 in sequence.

[0049] It should be noted that the diameter of the extrusion flow channel 46 gradually decreases, and in order to ensure that the extrusion flow channel does not deviate toward the outer surface of the extrusion molding component 4, the present embodiment defines that along the direction from close to the feed port 45 to away from the feed port 45, the center line of the extrusion flow channel 46 is closer to the axis of the first mold 42, that is, the extrusion flow channel 46 always has one side substantially close to the molding rod core 44;

[0050] In addition, when a hollow, thin-walled, cylindrical solder with a certain height is required, the molding channel 41 is set to be annular, and in order to cooperate with the annular molding channel 41, the extrusion channel 46 is a circle of gap opened in the second mold 43. That is to say, the general outline of the extrusion channel 46 is a cylindrical structure with a gradually decreasing diameter, similar to a hollow truncated cone. This structure can ensure that the semi-solid solder can better enter the molding channel 41.

[0051] In a specific embodiment, one end of the forming rod core 44 is fixed to the side wall of the feed port 45 through a connecting wall 47, and the other end of the forming rod core 44 is suspended.

[0052] In a specific embodiment, the solder forming device further includes a discharge support belt 7 , which is fixed to the bracket assembly 1 and is located behind the other end of the forming rod core 44 for supporting the columnar solder 6 .

[0053] The discharge support belt 7 provides support for the formed columnar solder 6 to prevent it from breaking.

[0054] In a specific embodiment, the discharge support belt 7 includes a first support plate 71 and a second support plate 72, one side of the first support plate 71 is connected to one side of the second support plate 72, and the first support plate 71 and the second support plate 72 are inclined to form a V-shaped groove for supporting the columnar solder 6.

[0055] Specifically, the first support plate 71 has a first side and a second side, and the second support plate 72 also has a first side and a second side. When the first side of the first support plate 71 and the first side of the second support plate 72 are connected, the first side of the first support plate 71 and the first side of the second support plate 72 are both tilted downward, so that a V-shaped groove is formed between the first support plate 71 and the second support plate 72.

[0056] Compared with horizontally arranging the first support plate 71 and the second support plate 72 , the inclined arrangement of the present embodiment enables the columnar solder 6 to be placed on the discharge support belt 7 more stably.

[0057] In addition, since the continuous hollow-walled thin cylindrical solder is still a semi-solid solder when it is just extruded and will not take shape until it cools down, the arrangement of the first support plate 71 and the second support plate 72 can also prevent it from bending.

[0058] In a specific embodiment, the bracket assembly 1 includes a fixed base 11, a first bracket 12 and a second bracket 13 which are arranged in sequence, the push rod assembly 2 and the heating chamber 3 are arranged on the fixed base 11, and the first bracket 12 and the second bracket 13 are located below the discharge support belt 7 for supporting the discharge support belt 7.

[0059] The general outline of the fixed base 11 is a plate-like structure with a certain thickness, which mainly provides support for the push rod assembly 2 and the heating chamber 3. The first bracket 12 and the second bracket 13 are used to provide support for the discharge support belt 7. Of course, a third bracket can also be included. The number of brackets depends on the length of the first support plate 71 and the second support plate 72.

[0060] In a specific embodiment, the push rod assembly 2 includes a hydraulic push rod 21 and an extrusion push rod 22, one end of the extrusion push rod 22 is connected to the output end of the hydraulic push rod 21, and the other end of the extrusion push rod 22 can push the solder 5 heated by the heating cavity 3 into the molding flow channel 41.

[0061] In this embodiment, the hydraulic push rod 21 can be driven by a liquid cylinder. Under the action of the hydraulic cylinder, the hydraulic push rod 21 can move in the horizontal direction, thereby driving the extrusion push rod 22 connected thereto to move in the horizontal direction, so as to push the solder in the heating cavity 3.

[0062] In a specific embodiment, the solder forming equipment also includes a fixing component 8 for preventing the heating cavity 3 from following the movement of the push rod assembly 2. The fixing component 8 is arranged on the bracket assembly 1, and one end of the fixing component 8 is fixed on the push rod assembly 2, and the other end of the fixing component 8 is fixed outside the heating cavity 3.

[0063] The setting of the fixing assembly 8 fixes the push rod assembly 2 and the heating chamber 3, thereby preventing the heating chamber 3 from moving when the hydraulic push rod 21 is working.

[0064] In a specific embodiment, the fixing assembly 8 includes a first fixing plate 81, a second fixing plate 82 and a connecting rod 83, the first fixing plate 81 is fixed on the push rod assembly 2, the second fixing plate 82 is fixed outside the heating chamber 3, one end of the connecting rod 83 is connected to the first fixing plate 81, and the other end of the connecting rod 83 is connected to the second fixing plate 82.

[0065] The specific working process of the solder forming equipment provided in this embodiment is as follows:

[0066] The cylindrical solder is heated to a semi-solid state by the heating cavity 3, and the extrusion push rod 22 moves horizontally under the action of the hydraulic push rod 21. Then, under the action of the extrusion push rod 22, the semi-solid cylindrical solder flows into the extrusion molding die through the feed port 45. The extrusion molding die includes a second die 43 and a molding rod core 44. A molding flow channel 41 is arranged between the second die 43 and the molding rod core 44. When the semi-solid solder is squeezed into the molding flow channel 41, it will become a continuous hollow wall thin cylindrical solder. An extrusion flow channel 46 is arranged at one end of the molding flow channel 41. The extrusion flow channel 46 From one end close to the feed port 45 to the other end close to the molding channel 41, the diameter of the extrusion channel 46 gradually decreases. The extrusion channel 46 is also a cylindrical shape with a gradually decreasing diameter, similar to a hollow truncated cone. The extrusion channel 46 is the key to ensuring uniform inflow of semi-solid solder into the molding channel 41. One end of the molding rod core 44 is connected to the side wall of the feed port 45 through a plurality of connecting walls 47, and the other end of the molding rod core 44 is a free end, that is, suspended, so as to ensure that the semi-solid solder is continuously discharged after passing through the molding channel 41 to form a continuous hollow-walled thin cylindrical solder.

[0067] In summary, it is easy for those skilled in the art to understand that, under the premise of no conflict, the above-mentioned advantageous technical features can be freely combined and superimposed.

[0068] The above are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form. Any simple modifications, equivalent changes and modifications made to the above embodiments based on the technical essence of the present invention are still within the scope of the technical solution of the present invention.

Claims

1. A solder forming device, characterized in that: The solder forming device comprises a support assembly (1), a push rod assembly (2) arranged on the support assembly (1), a heating cavity (3) and an extrusion forming assembly (4), wherein the extrusion forming assembly (4) is located in the heating cavity (3), the heating cavity (3) is capable of heating the solder (5), the extrusion forming assembly (4) has a forming flow channel (41), and the output end of the push rod assembly (2) moves in a horizontal direction to push the solder (5) heated by the heating cavity (3) into the forming flow channel (41).

2. The solder forming equipment according to claim 1, characterized in that: The extrusion molding assembly (4) comprises a first mold (42), a second mold (43) and a molding rod core (44); the first mold (42) and the second mold (43) are arranged in parallel, and the molding rod core (44) is inserted into the first mold (42) and the second mold (43); a side of the first mold (42) away from the second mold (43) has a plurality of feed ports (45); the molding flow channel (41) is formed between the second mold (43) and the molding rod core (44); the feed ports (45) correspond to the molding flow channel (41) so that the solder (5) entering through the feed ports (45) is extruded into the molding flow channel (41); wherein the molding flow channel (41) is annular so that the solder (5) is molded into a hollow columnar solder (6).

3. The solder forming equipment according to claim 2, characterized in that: The extrusion molding component (4) also includes an extrusion flow channel (46) opened in the second mold (43), and the feed port (45) is connected to the molding flow channel (41) through the extrusion flow channel (46); and along the direction from close to the feed port (45) to away from the feed port (45), the diameter of the extrusion flow channel (46) gradually decreases, and the center line of the extrusion flow channel (46) is closer to the axis of the first mold (42).

4. The solder forming equipment according to claim 2 or 3, characterized in that: One end of the forming rod core (44) is fixed to the side wall of the feed port (45) via a connecting wall (47), and the other end of the forming rod core (44) is suspended in the air.

5. The solder forming equipment according to claim 4, characterized in that: The solder forming equipment also includes a discharge support belt (7), which is fixed to the bracket assembly (1) and is located behind the other end of the forming rod core (44) for supporting the columnar solder (6).

6. The solder forming equipment according to claim 5, characterized in that: The discharge support belt (7) comprises a first support plate (71) and a second support plate (72), one side of the first support plate (71) is connected to one side of the second support plate (72), and the first support plate (71) and the second support plate (72) are inclined to form a V-shaped groove for supporting the columnar solder (6).

7. The solder forming equipment according to claim 5, characterized in that: The support assembly (1) comprises a fixed base (11), a first support (12) and a second support (13) which are arranged in sequence; the push rod assembly (2) and the heating chamber (3) are arranged on the fixed base (11); the first support (12) and the second support (13) are located below the discharge support belt (7) for supporting the discharge support belt (7).

8. The solder forming equipment according to any one of claims 1 to 3, characterized in that: The push rod assembly (2) comprises a hydraulic push rod (21) and an extrusion push rod (22); one end of the extrusion push rod (22) is connected to the output end of the hydraulic push rod (21); and the other end of the extrusion push rod (22) is capable of pushing the solder (5) heated by the heating cavity (3) into the molding flow channel (41).

9. The solder forming equipment according to any one of claims 1 to 3, characterized in that: The solder forming equipment also includes a fixing assembly (8) for preventing the heating chamber (3) from following the movement of the push rod assembly (2); the fixing assembly (8) is arranged on the bracket assembly (1), and one end of the fixing assembly (8) is fixed on the push rod assembly (2), and the other end of the fixing assembly (8) is fixed outside the heating chamber (3).

10. The solder forming equipment according to claim 9, characterized in that: The fixing assembly (8) comprises a first fixing plate (81), a second fixing plate (82) and a connecting rod (83), wherein the first fixing plate (81) is fixed on the push rod assembly (2), the second fixing plate (82) is fixed outside the heating chamber (3), one end of the connecting rod (83) is connected to the first fixing plate (81), and the other end of the connecting rod (83) is connected to the second fixing plate (82).

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