Tray carrier

Abstract

The utility model relates to a tray carrier which comprises a bottom plate, a cover plate and a magnetic plate, a first containing groove is formed in the first face of the bottom plate, a first feeding port is formed in one end of the bottom plate and communicated with the first end of the first containing groove, the cover plate covers the bottom plate, the cover plate movably seals the first containing groove, and the magnetic plate is arranged in the first containing groove. The magnetic plate is magnetically connected with the second face of the bottom plate, the bottom plate is provided with the first containing groove communicated with the first feeding port, and the cover plate covers the bottom plate to seal the first containing groove, so that when the IC chip is loaded on the tray carrier, a pipe body packaged with the IC chip is inserted into the first containing groove through the first feeding port, and the IC chip is loaded on the tray carrier through the magnetic plate. According to the IC chip loading device, the tube body is arranged on the base plate, then the tube body is pulled away from the first containing groove in the inclined state, IC chips can be placed in the first containing groove in the base plate in a batch mode at a time, the IC chips can be rapidly loaded, and the loading efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of IC chip trays, in particular to a tray carrier. Background Art

[0002] An IC (Integrated Circuit) chip is a chip made by placing an integrated circuit formed by a large number of microelectronic components on a plastic substrate. An IC chip is an indispensable component of modern electronic devices. By performing multiple functions such as calculation, control, storage, communication, interface and protection, it provides powerful functional and performance support for electronic devices. It has a wide range of uses, covering almost all areas of modern electronic technology.

[0003] At present, general IC chips are packaged in tubes, that is, multiple IC chips are packaged in batches in a tubular structure, which can protect the IC chips from physical damage, chemical corrosion and electromagnetic interference during transportation and storage.

[0004] When mounting an IC chip, the IC chip needs to be taken out of the tubular structure, placed on a tray and moved to a mounting device for mounting. However, the existing tray is a plate with multiple placement slots. When mounting, each IC chip needs to be placed into the placement slot one by one manually. The loading efficiency is low, and it is difficult to match the mounting speed of the mounting device, which affects the production efficiency. Utility Model Content

[0005] Based on this, it is necessary to provide a pallet carrier.

[0006] The utility model solves the above technical problems with the following technical solutions: a pallet carrier, comprising:

[0007] A bottom plate, wherein a first receiving groove is formed on a first surface of the bottom plate, a first feed port is formed on one end of the bottom plate, and the first feed port is connected to a first end of the first receiving groove;

[0008] A cover plate, the cover plate is disposed on the bottom plate, and the cover plate movably closes the first containing groove;

[0009] A magnetic plate is magnetically connected to the second surface of the bottom plate.

[0010] In one embodiment, a limiting column is disposed on the first surface of the bottom plate, a limiting hole is formed on the cover plate, and the limiting column is embedded in the limiting hole.

[0011] In one embodiment, the number of the limiting columns is set to be multiple, and the limiting columns are evenly distributed on the first surface of the bottom plate, and the number of the limiting holes is equal to the number of the limiting columns.

[0012] In one embodiment, the number of the first containing grooves is set to be multiple, the number of the first feed ports is equal to the number of the first containing grooves, and the first containing grooves are evenly distributed on the first surface of the bottom plate.

[0013] In one embodiment, a plurality of second receiving grooves are provided on the cover plate, and a plurality of second feed ports are provided on one end of the cover plate, each of the second feed ports is connected to a first end of a second receiving groove, each of the second receiving grooves is movably aligned with and connected to a first receiving groove to form a receiving cavity, and each of the second feed ports is movably aligned with and connected to a first feed port to form a feed port.

[0014] In one embodiment, a plurality of positioning grooves are formed on the first surface of the bottom plate, each of the positioning grooves is sequentially spaced apart from each of the first accommodating grooves, and a plurality of positioning strips are formed on the cover plate, each of the positioning strips is embedded in one of the positioning grooves.

[0015] In one embodiment, a locking block is disposed on the side wall of the second end of the first accommodating groove.

[0016] In one embodiment, a taking notch is provided on the bottom plate.

[0017] In one embodiment, the width of the first feed opening is greater than the width of the first containing groove.

[0018] In one embodiment, the base plate is made of iron or nickel.

[0019] The beneficial effect of the utility model is as follows: a tray carrier provided by the utility model has a first receiving groove connected to the first feed port opened on the bottom plate, and a cover plate is arranged on the bottom plate to close the first receiving groove. In this way, when IC chips are loaded onto the tray carrier, a tube body encapsulating the IC chips is inserted into the first receiving groove through the first feed port, and then the tube body is pulled out of the first receiving groove in an inclined state, so that IC chips can be placed in batches in the first receiving groove on the bottom plate at one time, and the IC chips can be loaded quickly with high loading efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0021] Figure 1 This is a schematic structural diagram of a pallet carrier according to an embodiment of the utility model;

[0022] Figure 2 This is a schematic diagram of a three-dimensional exploded structure of a pallet carrier according to an embodiment of the utility model;

[0023] Figure 3 The figure is a schematic structural diagram of a base plate according to an embodiment of the utility model.

[0024] In the accompanying drawings, 10, tray carrier; 100, bottom plate; 110, first receiving groove; 120, first feed port; 130, limiting column; 140, positioning block; 150, taking notch; 200, cover plate; 210, limiting hole; 300, magnetic plate. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The technical solution of the present invention will be further described below in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0026] It should be understood that the same or similar numbers in the drawings of the embodiments correspond to the same or similar parts. In the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom" and the like indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] In one embodiment, Figure 1 , Figure 2 and Figure 3 As shown, a pallet carrier 10 includes: a base plate 100, a cover plate 200 and a magnetic plate 300, a first receiving groove 110 is opened on the first surface of the base plate 100, a first feed port 120 is opened on one end of the base plate 100, the first feed port 120 is connected with the first end of the first receiving groove 110, the cover plate 200 is covered on the base plate 100, the cover plate 200 movably closes the first receiving groove 110, and the magnetic plate 300 is magnetically connected to the second surface of the base plate 100.

[0028] In this embodiment, the cross-sectional shape of the base plate 100 and the cover plate 200 is square, the length and width of the base plate 100 are 250 mm and 120 mm respectively, the length and width of the cover plate 200 are 250 mm and 120 mm respectively, the width of the first receiving groove 110 is 5 mm, and the cover plate 200 is covered on the first surface of the base plate 100 to seal the first receiving groove 110, which can limit the moving direction of the IC chip when it is tilted and poured, and prevent the IC chip from tilting out of the first receiving groove 110 during the pouring process. The magnetic plate 300 is magnetically connected to the second surface of the base plate 100, and the material of the base plate 100 is iron or nickel. The magnetic field generated by the magnetic plate 300 can attract the IC chip in the first receiving groove 110, that is, the IC chip is affected by gravity, which can make the IC chip stably placed in the first receiving groove 110.

[0029] In this embodiment, a first receiving groove 110 connected to a first feed port 120 is opened on the base plate 100, and a cover plate 200 is covered on the base plate 100 to seal the first receiving groove 110. In this way, when the IC chip is loaded onto the tray carrier 10, the tube body encapsulating the IC chip is inserted into the first receiving groove 110 through the first feed port 120, and then the tube body is pulled out of the first receiving groove 110 in an inclined state. The IC chips can be placed in batches in the first receiving groove 110 on the base plate 100 at one time, and the IC chips can be loaded quickly with high loading efficiency, which can match the mounting speed of the mounting device, thereby improving the mounting efficiency of the IC chips.

[0030] In one embodiment, Figure 2 As shown, a limiting column 130 is disposed on the first surface of the base plate 100 , a limiting hole 210 is formed on the cover plate 200 , and the limiting column 130 is embedded in the limiting hole 210 . Specifically, the number of the limiting posts 130 is set to be multiple, and each limiting post 130 is evenly distributed on the first surface of the base plate 100, and the number of the limiting holes 210 is equal to the number of the limiting posts 130. For example, the number of the limiting posts 130 and the limiting holes 210 are both four, and the four limiting posts 130 are spaced apart at the four corners on the first surface of the base plate 100, and the limiting holes 210 are correspondingly opened at the four corners of the cover plate 200. When the cover plate 200 is covered on the first surface of the base plate 100, each limiting post 130 is located in a limiting hole 210, which can prevent the cover plate 200 from shifting in the horizontal and vertical directions, so that the position between the cover plate 200 and the base plate 100 is relatively fixed, and the cover plate 200 can stably close the first accommodating groove 110, which can well limit the moving direction of the IC chip when it is tilted and poured, and prevent the IC chip from tilting out of the first accommodating groove 110 during the pouring process.

[0031] In one embodiment, Figure 2 and Figure 3 As shown, a positioning block 140 is provided on the side wall of the second end of the first receiving groove 110. Specifically, when the tube body encapsulated with the IC chip is inserted into the first receiving groove 110 through the first feed port 120, one end of the tube body is engaged with the positioning block 140, and at this time, the tube body abuts against the side wall of the second end of the first receiving groove 110, so that when the tube body is withdrawn from the first receiving groove 110, the first IC chip in the tube body can be accurately placed at the second end of the first receiving groove 110, and the first IC chip can also be stably placed, so that the subsequent IC chips are arranged in sequence after the first IC chip, so that the IC chips can be quickly and smoothly placed in the first receiving groove 110.

[0032] In one embodiment, Figure 3 As shown, the bottom plate 100 is provided with a taking notch 150. Specifically, the number of the taking notches 150 is set to two, and the two taking notches 150 are spaced apart on both sides of the bottom plate 100, so that the operator can take the cover plate 200 provided on the bottom plate 100 through the taking notches 150, and can better remove the cover plate 200 from the bottom plate 100.

[0033] In one embodiment, Figure 3 As shown, the width of the first feed port 120 is greater than the width of the first receiving groove 110. Specifically, by setting the width of the first feed port 120 to be greater than the width of the first receiving groove 110, it is convenient to insert the tube body encapsulated with the IC chip into the first receiving groove 110 through the first feed port 120, and it is convenient to quickly place the IC chip in the tube body into the first receiving groove 110 on the bottom plate 100 to complete the loading.

[0034] In one embodiment, Figure 2 and Figure 3 As shown, the number of the first receiving grooves 110 is set to be multiple, the number of the first feeding ports 120 is equal to the number of the first receiving grooves 110, and the first receiving grooves 110 are evenly distributed on the first surface of the bottom plate 100. Specifically, the first receiving grooves 110 are evenly spaced and distributed on the first surface of the bottom plate 100, each first feeding port 120 is connected to the first end of a first receiving groove 110, and the distance between two adjacent first receiving grooves 110 is 6 mm, so that the single IC chip loading capacity of the tray carrier 10 can be greatly increased.

[0035] In one embodiment, a plurality of second receiving grooves are formed on the cover plate 200, and a plurality of second feed ports are formed on one end of the cover plate 200, each of the second feed ports is connected to a first end of a second receiving groove, each of the second receiving grooves is movably aligned with a first receiving groove 110 and connected to form a receiving cavity, and each of the second feed ports is movably aligned with a first feed port 120 and connected to form a feed port. Specifically, the second receiving grooves are evenly spaced apart on a surface of the cover plate 200 facing the base plate 100. When the cover plate 200 is covered on the first surface of the base plate 100, the second receiving grooves are aligned with and connected to the first receiving grooves 110 to form a receiving cavity. The second feed port is aligned with and connected to the first feed port 120 to form a feed port. In this way, when the IC chip is loaded onto the tray carrier 10, the tube body encapsulating the IC chip is inserted into the receiving cavity through the feed port, and then the tube body is pulled out of the receiving cavity in an inclined state. The IC chips can be placed in the receiving cavity in batches at one time. Finally, after the cover plate 200 is removed from the base plate 100, the IC chips can protrude to the outside of the first receiving groove 110, which is convenient for the mounting device to absorb and mount the IC chips.

[0036] In one embodiment, a plurality of positioning grooves are provided on the first surface of the base plate 100, and each of the positioning grooves is arranged in sequence with each of the first receiving grooves 110, and a plurality of positioning strips are provided on the cover plate 200, and each of the positioning strips is embedded in one of the positioning grooves. Specifically, each of the positioning strips is evenly spaced and distributed on the side of the cover plate 200 facing the base plate 100. When the cover plate 200 is covered on the first surface of the base plate 100, each of the positioning strips is located in a positioning groove, which can play a positioning role, so that the first receiving groove 110 and the second receiving groove can be accurately aligned and connected to form a receiving cavity, avoiding the situation where the first receiving groove 110 and the second receiving groove are misaligned with each other, so that the IC chip can be loaded.

[0037] In one embodiment, a fixing groove is opened on the second surface of the base plate 100, and the shape and size of the fixing groove are adapted to the shape and size of the magnetic plate 300. The magnetic plate 300 is arranged in the fixing groove. In this way, the magnetic plate 300 can be prevented from shifting, and the magnetic plate 300 can be stably installed on the second surface of the base plate 100.

[0038] In one embodiment, the tray carrier further includes: a plurality of first ejector seats, a plurality of first springs and a plurality of first ejector pins, a plurality of first mounting grooves are formed on the side wall of the first side of the first accommodating groove, each of the first ejector seats is arranged in one of the first mounting grooves, a first telescopic cavity is formed in the first ejector seat, a first ejector port is formed on the side wall of the first telescopic cavity, the first spring is arranged in the first telescopic cavity, a first end of the first spring is connected to the side wall of the first telescopic cavity, a second end of the first spring is connected to the first end of the first ejector pin, and the first end of the first ejector pin is movably abutted against the outer edge of the first ejector port, and the second end of the first ejector pin protrudes into the first accommodating groove through the first ejector port. Specifically, each first installation groove is evenly spaced and distributed on the side wall of the first side of the first receiving groove along the opening direction of the first receiving groove. When the first ejector seat is installed in the first installation groove, the outer surface of the first ejector seat is flush with the side wall of the first side of the first receiving groove, and only the second end of the first ejector pin is telescopically located in the first receiving groove. Each first ejector pin is evenly spaced and distributed on the side wall of the first side of the first receiving groove. In this way, when the tube body encapsulated with the IC chip is inserted into the first receiving groove through the first feed port, the outer surface of the tube body abuts against the second end of the first ejector pin, so that the first spring contracts, the first ejector pin contracts into the first ejector seat, and finally the tube body is removed from the first feeding port. The first ejector pin is gradually pulled out of a receiving groove. When the tube body moves and is pulled out to release the first IC chip, the outer surface of the tube body is separated from the second end of the first ejector pin, that is, they are staggered. At this time, the first spring in the first ejector pin seat recovers the deformation and stretches, so that the second end of the first ejector pin protrudes into the first receiving groove and is located on one side of the first IC chip. In this reciprocating manner, each first ejector pin is located on one side of an IC chip in turn, that is, two adjacent IC chips are spaced by the first ejector pins, and the IC chips placed in the first receiving groove can be spaced in an orderly manner, so that the placement device can absorb and place the IC chips in turn.

[0039] In one embodiment, the tray carrier further includes: a plurality of second ejector seats, a plurality of second springs and a plurality of second ejectors, a plurality of second mounting grooves are provided on the side wall of the second side of the first accommodating groove, each of the second mounting grooves is aligned with a first mounting groove, each of the second ejector seats is arranged in a second mounting groove, a second telescopic cavity is provided in the second ejector seat, a second ejector opening is provided on the side wall of the second telescopic cavity, the second spring is arranged in the second telescopic cavity, a first end of the second spring is connected to the side wall of the second telescopic cavity, a second end of the second spring is connected to the first end of the second ejector, and the first end of the second ejector is movably abutted against the outer edge of the second ejector opening, and the second end of the second ejector protrudes into the first accommodating groove through the second ejector opening. Specifically, each second installation groove is evenly spaced and distributed on the side wall of the second side of the first receiving groove along the opening direction of the first receiving groove. When the second ejector seat is installed in the second installation groove, the outer surface of the second ejector seat is flush with the side wall of the second side of the first receiving groove, and only the second end of the second ejector pin is telescopically located in the first receiving groove. Each second ejector pin corresponds to each first ejector pin and is evenly spaced and distributed on the side walls of both sides of the first receiving groove. In this way, when the tube body encapsulated with the IC chip is inserted into the first receiving groove through the first feed port, the outer surface of the tube body abuts against the second end of the second ejector pin, so that the second spring contracts, and the second ejector pin contracts into the second ejector seat, and finally the tube body is removed from The tube body is gradually pulled out of the first accommodating groove. When the tube body moves and is pulled out to release the first IC chip, the outer surface of the tube body is separated from the second end of the first second ejector pin, that is, they are staggered. At this time, the second spring in the first second ejector pin seat recovers the deformation and stretches, so that the second end of the first second ejector pin protrudes into the first accommodating groove and is located on one side of the first IC chip. In this reciprocating manner, each second ejector pin is located on one side of an IC chip in turn, that is, two adjacent IC chips are spaced by the first ejector pin and the second ejector pin, which can better space the IC chips placed in the first accommodating groove in an orderly manner, thereby facilitating the placement device to absorb and place the IC chips in turn.

[0040] Compared with the prior art, the utility model has at least the following advantages:

[0041] The utility model provides a tray carrier, which is provided with a first receiving groove connected with a first feed port on a bottom plate, and a cover plate is arranged on the bottom plate to close the first receiving groove. In this way, when IC chips are loaded onto the tray carrier, a tube body encapsulating the IC chips is inserted into the first receiving groove through the first feed port, and then the tube body is withdrawn from the first receiving groove in an inclined state, so that IC chips can be placed in batches in the first receiving groove on the bottom plate at one time, and the IC chips can be loaded quickly with high loading efficiency.

[0042] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A pallet carrier, characterized in that: include: A bottom plate, wherein a first receiving groove is formed on a first surface of the bottom plate, a first feed port is formed on one end of the bottom plate, and the first feed port is connected to a first end of the first receiving groove; A cover plate, the cover plate is disposed on the bottom plate, and the cover plate movably closes the first containing groove; A magnetic plate is magnetically connected to the second surface of the bottom plate.

2. The pallet carrier according to claim 1, characterized in that: A limiting column is arranged on the first surface of the bottom plate, a limiting hole is arranged on the cover plate, and the limiting column is embedded in the limiting hole.

3. The pallet carrier according to claim 2, characterized in that: The number of the limiting columns is set to be multiple, and the limiting columns are evenly distributed on the first surface of the bottom plate, and the number of the limiting holes is equal to the number of the limiting columns.

4. The pallet carrier according to claim 1, characterized in that: The number of the first containing grooves is set to be multiple, the number of the first feed ports is equal to the number of the first containing grooves, and the first containing grooves are evenly distributed on the first surface of the bottom plate.

5. The pallet carrier according to claim 4, characterized in that: A plurality of second receiving grooves are provided on the cover plate, and a plurality of second feed ports are provided on one end of the cover plate, each of the second feed ports is connected with a first end of a second receiving groove, each of the second receiving grooves is movably aligned with and connected to a first receiving groove to form a receiving cavity, and each of the second feed ports is movably aligned with and connected to a first feed port to form a feed port.

6. The pallet carrier according to claim 1, characterized in that: A plurality of positioning grooves are formed on the first surface of the bottom plate, and each of the positioning grooves is sequentially spaced apart from each of the first accommodating grooves. A plurality of positioning strips are formed on the cover plate, and each of the positioning strips is embedded in one of the positioning grooves.

7. The pallet carrier according to claim 1, characterized in that: A locking block is arranged on the side wall of the second end of the first accommodating groove.

8. The pallet carrier according to claim 1, characterized in that: The bottom plate is provided with a taking-out notch.

9. The pallet carrier according to claim 1, characterized in that: The width of the first feed opening is greater than the width of the first containing groove.

10. The pallet carrier according to claim 1, characterized in that: The material of the bottom plate is iron or nickel.

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