Magnetic control, evaporation and electron beam efficient physical lamination coating device

Abstract

The utility model discloses a magnetic control, evaporation and electron beam efficient physical lamination coating device which comprises a vacuum cavity, an unwinding roller and a winding roller are arranged in the vacuum cavity, and a magnetic control sputtering coating mechanism, an electron beam coating mechanism and an evaporation coating mechanism are sequentially arranged in the vacuum cavity along a thin film tape walking path. A first metal layer, a second metal layer and a third metal layer are sequentially plated on the same film surface of the thin film, and the thickness of the first metal layer, the thickness of the second metal layer and the thickness of the third metal layer are sequentially increased. According to the utility model, various coating technologies are combined, respective advantages are fully exerted, and the coating efficiency and quality are improved. The magnetron sputtering coating mechanism is firstly used for bottoming a film, then the electron beam coating mechanism is used for thickening a metal layer, the heat resistance of the metal layer can be improved, holes generated in the follow-up coating process are reduced, finally coating is completed through the evaporation coating mechanism, the whole coating process can be rapidly completed, and the production efficiency is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of conductive film production, and more specifically to a magnetron, evaporation and electron beam high-efficiency physical layer deposition coating device. Background Art

[0002] Conductive film is a thin film material that can achieve specific electronic functions. It has conductive properties and can be used to manufacture various electronic devices and circuits. There are many types of conductive films, which can be divided into many types according to different materials and processes. For example, metal film is a common conductive film, such as aluminum, gold, silver and other metal films, which have good conductive properties and stability. In addition, semiconductor film is also an important conductive film, such as films made of semiconductor materials such as silicon and germanium, which have excellent conductive properties and photoelectric properties.

[0003] There are many manufacturing processes for conductive films, including vacuum evaporation, sputtering, chemical vapor deposition, physical vapor deposition, etc. Currently, vacuum evaporation is generally used to form a coating on the base film, but the current coating method is either inefficient or has too many holes, and it is impossible to achieve a balance between efficiency and holes.

[0004] The above shortcomings need to be improved. Summary of the invention

[0005] In order to solve or alleviate the problems of low production efficiency and many holes in the existing coating devices, the utility model provides a magnetron, evaporation, and electron beam high-efficiency physical layer deposition coating device.

[0006] The technical solution of the utility model is as follows:

[0007] A magnetron, evaporation, and electron beam high-efficiency physical layer deposition coating device comprises a vacuum chamber, wherein a unwinding roller and a winding roller are arranged inside the vacuum chamber, a film roll is placed on the unwinding roller, the unwinding roller is used to release the film on the film roll, and the winding roller is used to wind up the released film; a magnetron sputtering coating mechanism, an electron beam coating mechanism and an evaporation coating mechanism are arranged in sequence along the film tape path inside the vacuum chamber, the magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism successively coat a first metal layer, a second metal layer and a third metal layer on the same film surface of the film, and the thickness of the first metal layer, the thickness of the second metal layer and the thickness of the third metal layer increase in sequence.

[0008] Furthermore, the total thickness of the first metal layer, the second metal layer and the third metal layer is 1 micrometer.

[0009] Furthermore, the thickness of the first metal layer is 5 nanometers to 10 nanometers, the thickness of the second metal layer is 20 nanometers to 70 nanometers, and the thickness of the third metal layer is 920 nanometers to 975 nanometers.

[0010] Furthermore, the magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism are each provided with two, which are respectively provided on the two sides of the film.

[0011] Furthermore, cooling rollers are respectively arranged inside the vacuum chamber at the magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism.

[0012] Furthermore, a plurality of rollers and tension rollers are arranged inside the vacuum chamber, wherein the rollers are used to guide the film running direction, and the tension rollers are used to adjust the film running tension.

[0013] Furthermore, the evaporation coating mechanism comprises a crucible, the crucible is a columnar body with a hollow interior, and the inner wall of the crucible is coated with a protective coating.

[0014] Furthermore, the protective coating is an aluminum nitride protective coating, a silicon nitride protective coating or an aluminum oxide protective coating.

[0015] Furthermore, the average reflectivity of the protective coating is less than 0.9.

[0016] Furthermore, the crucible is made of one of graphite, boron nitride, aluminum nitride and metal alloy.

[0017] The utility model according to the above scheme has the beneficial effect that the utility model combines multiple coating technologies to give full play to their respective advantages and improve coating efficiency and quality. First, the magnetron sputtering coating mechanism is used to prime the film, which can increase its heat resistance and reduce the generation of holes in the subsequent coating process; then the metal layer is thickened by the electron beam coating mechanism, which can further ensure the integrity and stability of the film; finally, the evaporation coating mechanism is used to complete the coating, which can quickly complete the entire coating process and improve production efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0019] Figure 1 It is a schematic diagram of the structure of single-sided coating in the utility model;

[0020] Figure 2It is a schematic diagram of the structure after the thin film is coated in the utility model;

[0021] Figure 3 It is a schematic diagram of the structure of double-sided coating in the utility model;

[0022] Figure 4 It is a schematic diagram of the structure of the crucible in the utility model.

[0023] Among them, the figure marks in the figure are: 1, vacuum chamber; 2, unwinding roller; 3, winding roller; 4, film; 401, first metal layer; 402, second metal layer; 403, third metal layer; 5, magnetron sputtering coating mechanism; 6, electron beam coating mechanism; 7, evaporation coating mechanism; 701, crucible; 702, protective coating; 8, cooling roller; 9, passing roller; 10, tensioning roller. DETAILED DESCRIPTION

[0024] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0025] It should be noted that when a component is referred to as being "fixed" or "set" or "connected" to another component, it may be located directly or indirectly on the other component. The directions or positions indicated by the terms "upper", "lower", "left", "right", "front", "back", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. are based on the directions or positions shown in the accompanying drawings and are only for the convenience of description and should not be construed as limitations on the present technical solution. The terms "first", "second", etc. are only used for the convenience of description and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features. "Multiple" means two or more, unless otherwise clearly and specifically defined. "Several" means one or more, unless otherwise clearly and specifically defined.

[0026] like Figure 1 and Figure 2As shown, a magnetron, evaporation, and electron beam high-efficiency physical layer deposition coating device described in an embodiment of the utility model includes a vacuum chamber 1, a unwinding roller 2 and a winding roller 3 are arranged inside the vacuum chamber 1, a film roll is placed on the unwinding roller 2, the unwinding roller 2 is used to release the film 4 on the film roll, and the winding roller 3 is used to wind up the released film 4; a magnetron sputtering coating mechanism 5, an electron beam coating mechanism 6, and an evaporation coating mechanism 7 are sequentially arranged inside the vacuum chamber 1 along the film 4 tape path, the magnetron sputtering coating mechanism 5, the electron beam coating mechanism 6, and the evaporation coating mechanism 7 are sequentially coated with a first metal layer 401, a second metal layer 402, and a third metal layer 403 on the same film surface of the film 4, and the thickness of the first metal layer 401, the thickness of the second metal layer 402, and the thickness of the third metal layer 403 increase sequentially.

[0027] When the present embodiment is working, the film 4 is released from the unwinding roller 2 and passes through the magnetron sputtering coating mechanism 5, the electron beam coating mechanism 6 and the evaporation coating mechanism 7 in sequence. The magnetic field and the electric field in the magnetron sputtering coating mechanism 5 work together to ionize inert gases such as argon near the target material to form a plasma. The positive ions in the plasma are accelerated by the electric field and bombard the target material, so that the atoms or molecules on the surface of the target material gain energy and sputter out. Under the action of the magnetic field, the sputtered atoms or molecules are directed to the substrate material, that is, the surface of the film 4, and deposited thereon to form a first metal layer 401. The electron beam coating mechanism 6 generates a high-energy electron beam directed to a specific evaporation source. When the electron beam hits the metal material in the evaporation source, the metal material is locally heated to a high temperature and evaporated. The evaporated metal atoms or molecules are then deposited on the film 4 that has been magnetron sputtered, that is, deposited on the first metal layer 401 to form a second metal layer 402. In the evaporation coating mechanism 7, the metal material reaches its evaporation temperature by heating. The evaporated metal atoms or molecules diffuse in the vacuum chamber 1 and are finally deposited on the second metal layer 402 to form a third metal layer 403. The film 4 that has been coated is rolled up by the winding roller 3. The rolled up film 4 is then unrolled again to form a metal layer of the same thickness on the other side.

[0028] This embodiment combines multiple coating technologies to give full play to their respective advantages and improve coating efficiency and quality. First, the magnetron sputtering coating mechanism 5 is used to prime the film 4, which can increase its heat resistance and reduce the generation of holes in the subsequent coating process; then the metal layer is thickened by the electron beam coating mechanism 6, which can further ensure the integrity and stability of the film 4; finally, the evaporation coating mechanism 7 is used to complete the coating, which can quickly complete the entire coating process and improve production efficiency.

[0029] like Figure 2As shown, in a preferred embodiment, the sum of the thicknesses of the first metal layer 401, the second metal layer 402 and the third metal layer 403 is 1 micron. The thickness of the first metal layer 401 is 5 nanometers to 10 nanometers, the thickness of the second metal layer 402 is 20 nanometers to 70 nanometers, and the thickness of the third metal layer 403 is 920 nanometers to 975 nanometers.

[0030] Specifically: the thickness of the first metal layer 401 is 5 nanometers, the thickness of the second metal layer 402 is 20 nanometers, and the thickness of the third metal layer 403 is 975 nanometers. Or, the thickness of the first metal layer 401 is 6 nanometers, the thickness of the second metal layer 402 is 24 nanometers, and the thickness of the third metal layer 403 is 970 nanometers. Or, the thickness of the first metal layer 401 is 7 nanometers, the thickness of the second metal layer 402 is 33 nanometers, and the thickness of the third metal layer 403 is 960 nanometers. Or, the thickness of the first metal layer 401 is 8 nanometers, the thickness of the second metal layer 402 is 32 nanometers, and the thickness of the third metal layer 403 is 960 nanometers. Or, the thickness of the first metal layer 401 is 10 nanometers, the thickness of the second metal layer 402 is 70 nanometers, and the thickness of the third metal layer 403 is 920 nanometers. The above examples are for reference only, and the specific thickness combination can be adjusted and optimized according to actual needs and experimental results. At the same time, considering the quality and performance requirements of the film 4, it is necessary to combine various factors for comprehensive analysis and selection in actual applications.

[0031] In this embodiment, the first metal layer 401 has a relatively low thickness, which can provide good heat resistance, and the heat resistance of the film 4 is increased, and it is not easy to generate holes later. The second metal layer 402 has a medium thickness, and the thickening of the metal layer further improves the heat resistance of the film 4. By depositing the first metal layer 401 and the second metal layer 402 on the film 4, the film 4 has good heat resistance, and a thicker metal layer can be deposited at one time. The third metal layer 403 has a large thickness, which can ensure the overall stability and durability of the film 4. And combined with the three technical features of magnetron sputtering coating, electron beam evaporation coating and evaporation coating, efficient and high-quality deposition of the film 4 can be achieved. Magnetron sputtering coating can provide a high-purity metal layer, electron beam evaporation coating can achieve fast and uniform metal layer deposition, and evaporation coating can provide a large area and continuous metal layer.

[0032] like Figure 3 As shown, in a preferred embodiment, two magnetron sputtering coating mechanisms 5 , two electron beam coating mechanisms 6 and two evaporation coating mechanisms 7 are provided, which are respectively provided on two sides of the film 4 . Figure 3The tape path of the film 4 and the positions of each coating mechanism are only for illustration, and are not the actual tape path of the film 4 and the actual positions of the coating mechanisms. In this embodiment, both sides of the film 4 can be coated at one time, first forming a first metal layer 401 on the first side of the film 4, then forming a first metal layer 401 on the second side of the film 4, and then forming a second metal layer 402 on the first metal layer 401 on the first side, and then forming a second metal layer 402 on the first metal layer 401 on the second side. Then, a third metal layer 403 is formed on the second metal layer 402 on the first side, and then a third metal layer 403 is formed on the second metal layer 402 on the second side, thereby completing the coating. At this time, secondary coating is no longer required, and the product can be formed in one step in the vacuum chamber 1, thereby improving production efficiency.

[0033] like Figure 1 As shown, in a preferred embodiment, cooling rollers 8 are respectively provided at the magnetron sputtering coating mechanism 5, the electron beam coating mechanism 6 and the evaporation coating mechanism 7 inside the vacuum chamber 1. In this embodiment, the film 4 absorbs a large amount of heat during coating, and the film 4 is wound around the cooling roller 8 to absorb the heat generated by the film 4 during coating, thereby ensuring that the temperature of the film 4 during the coating process is kept within a safe range, and further preventing the film 4 from being burned through by high temperature.

[0034] like Figure 1 As shown, in a preferred embodiment, a plurality of rollers 9 and tension rollers 10 are arranged inside the vacuum chamber 1. The rollers 9 are used to guide the film 4 in the running direction, and the tension rollers 10 are used to adjust the film 4 running tension. In this embodiment, the film 4 is guided by the rollers 9 to run. The guidance of the rollers 9 can increase the contact area between the film 4 and the cooling roller 8, thereby improving the cooling efficiency. The tension rollers 10 control the film 4 running tension by adjusting the contact pressure with the film 4, thereby ensuring that the film 4 maintains appropriate tension during the running process to prevent the film 4 from loosening or wrinkling.

[0035] like Figure 4 As shown, in a preferred embodiment, the evaporation coating mechanism 7 includes a crucible 701, which is a hollow column, and the inner wall of the crucible 701 is coated with a protective coating 702. The protective coating 702 is an aluminum nitride protective coating 702, a silicon nitride protective coating 702, or an aluminum oxide protective coating 702, and the average reflectivity of the protective coating 702 is less than 0.9. The material of the crucible 701 is one of graphite, boron nitride, aluminum nitride, and a metal alloy.

[0036] In this embodiment, during the evaporation coating process, the crucible 701 is used as an evaporation source and is first heated to a sufficiently high temperature to melt and evaporate the metal material inside. After the metal material melts and evaporates, since the inner wall of the crucible 701 is coated with a protective coating 702, the coating can prevent the molten metal from directly contacting the inner wall of the crucible 701, thereby preventing the molten metal from penetrating into the crucible 701 and damaging the crucible 701. The average reflectivity of the protective coating 702 is less than 0.9, which can make the heat preservation and heat absorption effect of the interior of the crucible 701 good, and the material inside the crucible 701 is heated evenly, so that the thickness of the metal layer on the film 4 is uniform.

[0037] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. A magnetron, evaporation, and electron beam high-efficiency physical layer deposition device, characterized in that: It comprises a vacuum chamber, wherein a reel and a reel are arranged inside the vacuum chamber, a film roll is placed on the reel, the reel is used to release the film on the film roll, and the reel is used to reel in the released film; A magnetron sputtering coating mechanism, an electron beam coating mechanism and an evaporation coating mechanism are sequentially arranged inside the vacuum chamber along the film tape path. The magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism sequentially coat a first metal layer, a second metal layer and a third metal layer on the same film surface of the film, and the thickness of the first metal layer, the thickness of the second metal layer and the thickness of the third metal layer increase sequentially.

2. According to the magnetron, evaporation, and electron beam high-efficiency physical layer deposition device described in claim 1, it is characterized in that: The total thickness of the first metal layer, the second metal layer and the third metal layer is 1 micrometer.

3. According to the magnetron, evaporation, and electron beam high-efficiency physical layer deposition device described in claim 2, it is characterized in that: The thickness of the first metal layer is 5 nanometers to 10 nanometers, the thickness of the second metal layer is 20 nanometers to 70 nanometers, and the thickness of the third metal layer is 920 nanometers to 975 nanometers.

4. A magnetron, evaporation, or electron beam high-efficiency physical layer deposition device according to any one of claims 1 to 3, characterized in that: The magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism are each provided with two, and are respectively arranged on the two sides of the film.

5. A magnetron, evaporation, or electron beam high-efficiency physical layer deposition device according to any one of claims 1 to 3, characterized in that: Cooling rollers are respectively arranged inside the vacuum chamber at the magnetron sputtering coating mechanism, the electron beam coating mechanism and the evaporation coating mechanism.

6. A magnetron, evaporation, or electron beam high-efficiency physical layer deposition device according to any one of claims 1 to 3, characterized in that: A plurality of rollers and tension rollers are arranged inside the vacuum chamber. The rollers are used to guide the film running direction, and the tension rollers are used to adjust the film running tension.

7. A magnetron, evaporation, or electron beam high-efficiency physical layer deposition device according to any one of claims 1 to 3, characterized in that: The evaporation coating mechanism comprises a crucible, which is a hollow columnar body, and the inner wall of the crucible is coated with a protective coating.

8. A magnetron, evaporation, and electron beam high-efficiency physical layer deposition device according to claim 7, characterized in that: The protective coating is an aluminum nitride protective coating, a silicon nitride protective coating or an aluminum oxide protective coating.

9. A magnetron, evaporation, and electron beam high-efficiency physical layer deposition device according to claim 7, characterized in that: The average reflectivity of the protective coating is less than 0.

9.

10. The magnetron, evaporation, and electron beam high-efficiency physical layer deposition device according to claim 7, characterized in that: The crucible is made of one of graphite, boron nitride, aluminum nitride and metal alloy.

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