Solar cell film coating support plate and film coating equipment

Abstract

The utility model relates to the technical field of solar cell manufacturing, in particular to a solar cell coating carrier plate and coating equipment. The solar cell coating carrier plate comprises a tray, a first step part and a second step part. Wherein a first step part and a second step part are arranged on the peripheral side of the tray, the second step part is located on the peripheral side of the first step part, and the height of the second step part is larger than that of the first step part; the first step part is used for placing a silicon wafer, the second step part is used for limiting the silicon wafer, and when the silicon wafer is placed on the first step part, a first gap is formed between the silicon wafer and the upper end face of the tray; a first air hole groove is formed in the lower end face of the first step part, and the side wall of the first air hole groove communicates with the first gap. The solar cell film coating support plate can reduce the phenomenon of deformation of the silicon wafer, improve the reliability and stability of sucking the silicon wafer by the sucking disc, improve the product yield and achieve the purpose of saving the cost.

Description

Technical Field

[0001] The utility model relates to the technical field of solar cell manufacturing, in particular to a solar cell coating carrier plate and coating equipment. Background Art

[0002] In the process of solar cell manufacturing, the silicon wafers to be processed need to be placed on the tray of the coating carrier, and then the transmission device transfers the coating carrier carrying the silicon wafers to the vacuum chamber for coating process. The coating carrier includes a tray and a frame. Figure 1 As shown, in the prior art, a portion of the tray 100 is a non-air-permeable slot structure, which results in a closed state under the silicon wafer 10. During the vacuum coating process, a pressure difference will be formed between the upper and lower sides of the silicon wafer 10, and the residual air under the silicon wafer 10 will overflow, which not only makes the silicon wafer 10 easy to deform, but also causes problems in the automated equipment to absorb the silicon wafer 10, reducing the stability and reliability of the suction cup to absorb the silicon wafer 10. Figure 2 As shown, in the prior art, another part of the tray 100 is provided with a through slot 1' and the slot 1' is directly under the silicon wafer 10. This may easily cause the undesirable phenomenon of plating around the back of the silicon wafer 10 during the coating process, thereby reducing product yield and increasing costs.

[0003] Therefore, it is urgent to design a solar cell coating carrier and coating equipment to solve the above technical problems. Utility Model Content

[0004] The first purpose of the utility model is to provide a solar cell coating carrier, which can reduce the deformation of silicon wafers, improve the reliability and stability of the suction cup to absorb silicon wafers, and at the same time improve the product yield and save costs.

[0005] To achieve this purpose, the utility model adopts the following technical solutions:

[0006] The utility model provides a solar cell coating carrier plate, comprising:

[0007] A tray, wherein a first step portion and a second step portion are provided on the outer circumference of the tray, the second step portion is located on the outer circumference of the first step portion, and the height of the second step portion is higher than the height of the first step portion; the first step portion is used to place a silicon wafer, and the second step portion is used to limit the silicon wafer, when the silicon wafer is placed on the first step portion, the silicon wafer and the upper end surface of the tray form a first gap; the lower end surface of the first step portion is provided with a first air hole groove, and the side wall of the first air hole groove is connected to the first gap;

[0008] and / or,

[0009] A second pore groove is formed on the upper end surface of the first step portion, and a side wall of the second pore groove is connected to the first gap. When the silicon wafer is placed on the first step portion, at least a portion of the second pore groove is not covered by the silicon wafer.

[0010] As an optional technical solution for a solar cell coating carrier, the height of the tray is set to Ha, the height of the first step portion is set to Hb; the height of the first pore groove is set to H1, and the height of Ha

[0011] As an optional technical solution for a solar cell coating carrier, the height of the tray is set to Ha, the height of the first step portion is set to Hb; the height of the second air hole groove is set to H2, H2≤Hb-Ha.

[0012] As an optional technical solution for a solar cell coating carrier, a third pore groove is formed on the upper end surface of the second step portion, and the third pore groove is communicated with the second pore groove.

[0013] As an optional technical solution for a solar cell coating carrier, the height of the tray is set to Ha, the height of the first step portion is set to Hb; the height of the second step portion is set to Hc; the height of the first pore groove is set to H1, the height of the second pore groove is set to H2, and the height of the third pore groove is set to H3, Hc-Hb <H3≤Hc-Ha。

[0014] As an optional technical solution for a solar cell coating carrier, the first step portion and the second step portion are both provided in plurality, and the second pore grooves of two adjacent first step portions are both connected to the third pore groove of one second step portion.

[0015] As an optional technical solution for a solar cell coating carrier, a fourth air pore groove is provided on the upper end surface of the tray, and a fifth air pore groove is provided on the lower end surface of the tray. The fourth air pore groove and the fifth air pore groove are staggered, and the first gap, the fourth air pore groove and the fifth air pore groove are connected in sequence.

[0016] As an optional technical solution for a solar cell coating carrier, a fourth air pore groove is provided on the upper end surface of the tray, the fourth air pore groove is offset from the first air pore groove, and the first gap, the fourth air pore groove and the first air pore groove are connected in sequence.

[0017] As an optional technical solution for a solar cell coating carrier, a second gap is provided between the side wall of the second step portion and the side edge of the silicon wafer.

[0018] ​The second purpose of the utility model is to provide a coating device, which can improve the product yield of solar cells and save costs; at the same time, it can also reduce the deformation of silicon wafers, facilitate the suction cup to take and place silicon wafers, and improve work efficiency.

[0019] To achieve this purpose, the utility model adopts the following technical solutions:

[0020] The utility model provides a coating device, which comprises a vacuum chamber, a conveying device and the above-mentioned solar cell coating carrier, wherein the solar cell coating carrier is arranged on the conveying device and enters and exits the vacuum chamber through the conveying device.

[0021] The beneficial effects of the utility model include at least:

[0022] The utility model provides a solar cell coating carrier, which includes a tray, a first step portion and a second step portion. The first step portion and the second step portion are arranged on the outer peripheral side of the tray, the second step portion is located on the outer peripheral side of the first step portion, and the height of the second step portion is higher than the height of the first step portion; the first step portion is used to place a silicon wafer, and the second step portion is used to limit the silicon wafer, when the silicon wafer is placed on the first step portion, a first gap is formed between the silicon wafer and the upper end surface of the tray; the lower end surface of the first step portion is provided with a first air hole groove, the side wall of the first air hole groove is connected to the first gap, that is, the first air hole groove does not penetrate the first step portion, and at the same time, because the first step portion is located on the outer peripheral side of the tray, the first air hole groove is located on the side of the silicon wafer, so that the first air hole groove will not be directly below the silicon wafer, so that when the coating process is carried out, the phenomenon of plating around the back of the silicon wafer can be reduced, the product yield is improved, and the cost is saved. At the same time, the side wall of the first air hole groove is connected to the first gap, which can increase the air permeability of the tray. That is to say, during the coating process, the residual gas under the silicon wafer (the first gap) can be smoothly discharged through the first air hole groove, avoiding the formation of pressure difference between the upper and lower sides of the silicon wafer, thereby reducing the risk of deformation of the silicon wafer, improving the reliability and stability of the suction cup to absorb the silicon wafer, and improving the working efficiency.

[0023] The utility model also provides a coating device, which can improve the product yield of solar cells and save costs; at the same time, it can also reduce the deformation of silicon wafers, facilitate the suction cup to take and place silicon wafers, and improve work efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments of the present invention. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the contents of the embodiments of the present invention and these drawings without paying any creative work.

[0025] Figure 1 The structure of the solar cell coating carrier in the prior art is shown in FIG. Figure 1 ;

[0026] Figure 2 The structure of the solar cell coating carrier in the prior art is shown in FIG. Figure 2 ;

[0027] Figure 3 A cross-sectional view of a solar cell coating carrier provided in Embodiment 1 of the utility model;

[0028] Figure 4 for Figure 3 A partial enlarged view of the middle A;

[0029] Figure 5 A schematic diagram of the structure of a solar cell coating carrier provided in the second embodiment of the utility model;

[0030] Figure 6 for Figure 5 A partial enlarged view of point B in the middle;

[0031] Figure 7 A cross-sectional view of a solar cell coating carrier provided in the second embodiment of the present utility model;

[0032] Figure 8 A top view of a silicon wafer placed on a solar cell coating carrier provided in the second embodiment of the utility model;

[0033] Fig. 9 A schematic diagram of the structure of a solar cell coating carrier provided in the third embodiment of the present utility model;

[0034] Fig.10 for Fig. 9 A partial enlarged view of point C in the middle;

[0035] Fig.11 A cross-sectional view of a solar cell coating carrier provided in Embodiment 3 of the present utility model;

[0036] Fig.12 A top view of a silicon wafer placed on a solar cell coating carrier provided in the third embodiment of the utility model;

[0037] Fig.13A cross-sectional view of a solar cell coating carrier provided in the fourth embodiment of the present utility model;

[0038] Fig.14 for Fig.13 A partial enlarged view of point D in the middle.

[0039] Reference numerals

[0040] 1', through slot;

[0041] 10. Silicon wafer; 100. Tray; 110. Fourth air hole groove; 200. First step portion; 210. First air hole groove; 220. Second air hole groove; 300. Second step portion; 310. Third air hole groove; 400. First gap; 500. Second gap. DETAILED DESCRIPTION

[0042] In order to make the technical problems solved by the present invention, the technical solutions adopted and the technical effects achieved more clearly, the technical solutions of the present invention are further explained below with reference to the accompanying drawings and through specific implementation methods.

[0043] In the description of the present invention, unless otherwise clearly specified and limited, the terms "connected", "connected", and "fixed" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0044] In the present utility model, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0045] In the description of this embodiment, the terms "upper", "lower", "left", "right" and other directions or positional relationships are based on the directions or positional relationships shown in the drawings, and are only for the convenience of description and simplified operation, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation of the present invention. In addition, the terms "first" and "second" are only used to distinguish in the description and have no special meaning.

[0046] The present embodiment provides a solar cell coating carrier, which can reduce the deformation of silicon wafers, improve the reliability and stability of the suction cup in absorbing silicon wafers, and at the same time improve the product yield, reduce the back-side coating of silicon wafers, and save costs.

[0047] Embodiment 1

[0048] like Figure 3-Figure 4 As shown, the solar cell coating carrier mainly includes a tray 100, a first step portion 200 and a second step portion 300. The first step portion 200 and the second step portion 300 are arranged on the outer peripheral side of the tray 100, the second step portion 300 is located on the outer peripheral side of the first step portion 200, and the height of the second step portion 300 is higher than the height of the first step portion 200; the first step portion 200 is used to place the silicon wafer 10, and the second step portion 300 is used to limit the silicon wafer 10. When the silicon wafer 10 is placed on the first step portion 200, the silicon wafer 10 forms a first gap 400 with the upper end surface of the tray 100; the lower end surface of the first step portion 200 is provided with a first air hole groove 210, and the side wall of the first air hole groove 210 is connected to the first gap 400.

[0049] Based on the above design, the tray 100, the first step portion 200 and the second step portion 300 in this embodiment are integrally formed, thereby improving the processing efficiency of the solar cell coating carrier, facilitating processing and saving time. In this embodiment, a first pore groove 210 is provided on the lower end surface of the first step portion 200, and the side wall of the first pore groove 210 is connected to the first gap 400, that is, the first pore groove 210 does not penetrate the first step portion 200. In addition, since the first step portion 200 is located on the outer peripheral side of the tray 100, the first pore groove 210 is located on the side of the silicon wafer 10 at this time, so that the first pore groove 210 will not be directly below the silicon wafer 10, so that when the coating process is performed, the phenomenon of plating around the back of the silicon wafer 10 can be reduced, the product yield is improved, and the cost is saved.

[0050] In the present embodiment, the side wall of the first air hole groove 210 is connected to the first gap 400, which can increase the air permeability of the tray 100. That is, during the coating process, the residual gas below the silicon wafer 10 (the first gap 400) can be smoothly discharged through the first air hole groove 210, avoiding the formation of a pressure difference between the upper and lower sides of the silicon wafer 10, thereby reducing the risk of deformation of the silicon wafer 10, improving the reliability and stability of the suction cup in sucking the silicon wafer 10, and improving the operating efficiency.

[0051] Specifically, the height of the tray 100 is set to Ha, the height of the first step portion 200 is set to Hb; the height of the first air hole groove 210 is set to H1. Preferably, Ha

[0052] Optionally, the first air hole slots 210 may be provided in plurality, for example, two, three, four, five, etc., and the plurality of first air hole slots 210 are arranged at equal intervals, thereby improving the uniformity of gas flow and the uniformity of force on the tray 100 .

[0053] like Figure 3-Figure 4 As shown, in this embodiment, a second gap 500 is provided between the side wall of the second step portion 300 and the side edge of the silicon wafer 10. The provision of the second gap 500 can facilitate the suction cup to smoothly place the silicon wafer 10 on the first step portion 200 of the solar cell coating carrier, avoiding the edge collapse caused by friction and interference between the side edge of the silicon wafer 10 and the side wall of the first step portion 200, thereby improving product yield and saving costs.

[0054] Optionally, the distance of the second gap 500 can be set to between 0.5 mm and 10 mm.

[0055] This embodiment also provides a coating device, which includes a vacuum chamber, a conveying device and the above-mentioned solar cell coating carrier, the solar cell coating carrier is arranged on the conveying device, and enters and exits the vacuum chamber through the conveying device. The conveying device can be set as a conveyor belt, and the solar cell coating carrier is sent into or out of the vacuum chamber through the conveyor belt, thereby improving the automation of the coating device.

[0056] The coating equipment can improve the product yield of solar cells and save costs; at the same time, it can also reduce the deformation of the silicon wafer 10, facilitate the suction cup to take and place the silicon wafer 10, and improve the working efficiency.

[0057] Embodiment 2

[0058] like Figure 5-Figure 8 ​As shown, the present embodiment provides a solar cell coating carrier, the upper end surface of the first step portion 200 of the solar cell coating carrier is provided with a second pore groove 220, and the side wall of the second pore groove 220 is connected to the first gap 400. When the silicon wafer 10 is placed on the first step portion 200, due to the second gap 500 between the silicon wafer 10 and the second step 300, at least part of the second pore groove 220 is not covered by the silicon wafer 10.

[0059] Specifically, the height of the tray 100 is set to Ha, the height of the first step 200 is set to Hb; the height of the second pore groove 220 is set to H2, preferably, H2≤Hb-Ha. In this way, the second pore groove 220 does not exceed the height of the first step 200, thereby not only avoiding the adverse effect of grooving the position of the silicon wafer 10, but also making the edges and the middle position of the silicon wafer 10 evenly heated during the vacuum coating process, thereby reducing the temperature gradient difference inside the silicon wafer 10, improving the coating yield of the product, and saving costs. When H2=Hb-Ha, it is more convenient to process the second pore groove 220.

[0060] In the present embodiment, the side wall of the second air hole groove 220 is connected to the first gap 400, which can increase the air permeability of the tray 100. That is, during the coating process, the residual gas below the silicon wafer 10 (the first gap 400) can be smoothly discharged through the second air hole groove 220, avoiding the formation of a pressure difference between the upper and lower sides of the silicon wafer 10, thereby reducing the risk of deformation of the silicon wafer 10, improving the reliability and stability of the suction cup in sucking the silicon wafer 10, and improving the operating efficiency.

[0061] Optionally, the second air hole slots 220 may be provided in plurality, for example, two, three, four, five, etc., and the plurality of second air hole slots 220 are arranged at equal intervals, thereby improving the uniformity of gas flow and the uniformity of force on the tray 100 .

[0062] The remaining structures of the solar cell coating carrier plate of this embodiment are the same as those of the first embodiment, and will not be described in detail here.

[0063] Embodiment 3

[0064] like Figure 9-12As shown in the figure, this embodiment provides a carrier plate for coating a solar cell. The upper end surface of the second step portion 300 of the carrier plate for coating a solar cell is provided with a third air hole groove 310, and the third air hole groove 310 communicates with the second air hole groove 220. Since when the silicon wafer 10 is placed on the tray 100, there may be no gap between one side edge of the silicon wafer 10 and the third step portion 300, and the silicon wafer 10 completely covers the second step portion 200, resulting in poor air intake on one side of the silicon wafer 10. Therefore, the third air hole groove 310 is provided, which needs to communicate with the second air hole groove 220 to make the air intake on all four sides of the silicon wafer 10 uniform. In addition, for the height of the third air hole groove 310, it should not be too high so as not to affect the strength of the carrier plate.

[0065] Specifically, the height of the tray 100 is set to Ha, the height of the first step portion 200 is set to Hb; the height of the second step portion 300 is set to Hc; the height of the second air hole groove 220 is set to H2, and the height of the third air hole groove 310 is set to H3.

[0066] Preferably, Hc - Hb < H3 ≤ Hc - Ha, that is to say, the height H3 of the third air hole groove 310 should be higher than the height of the second step portion 300, but not exceed the height of the first step portion 200. This is conducive to the communication between the third air hole groove 310 and the second air hole groove 220 and improves the efficiency of air flow.

[0067] Furthermore, both the first step portion 200 and the second step portion 300 in this embodiment are provided in multiple numbers. The second air hole grooves 220 of two adjacent first step portions 200 are all communicated with the third air hole groove 310 of one second step portion 300. For example, both the first step portion 200 and the second step portion 300 are provided in four numbers. The third air hole groove 310 communicates with the second air hole grooves 220 on two adjacent trays 100, so that the two first gaps 400 on two adjacent trays 100 can be communicated, improving the efficiency of residual gas flow.

[0068] Optionally, the third air hole groove 310 can be provided in multiple numbers, such as two, three, four, five, etc. And multiple third air hole grooves 310 are arranged at equal intervals, thereby improving the uniformity of gas flow and the uniformity of the force on the tray 100.

[0069] It should be noted that this embodiment is a progressive solution to Embodiment 2.

[0070] The remaining structures of the carrier plate for coating a solar cell in this embodiment are the same as those in Embodiment 1, and will not be elaborated here.

[0071] Embodiment 4

[0072] As Figure 13-14As shown, this embodiment provides a solar cell coating carrier, the upper end surface of the tray 100 of the solar cell coating carrier is provided with a fourth pore groove 110, the fourth pore groove 110 is staggered with the first pore groove 210, and the first gap 400, the fourth pore groove 110 and the first pore groove 210 are connected in sequence.

[0073] Specifically, the height of the tray 100 is set to Ha, the height of the fourth pore groove 110 is set to H4, the height of the first pore groove 210 is set to H1, and the common area cut off from the fourth pore groove 110 and the first pore groove 210 constitutes a side pore groove, so that the side pore groove is not directly facing the silicon wafer 10, which is conducive to the consistency of pressure on the upper and lower sides of the silicon wafer 10, reduces the deformation of the silicon wafer 10, and facilitates the automatic equipment to suck and place the silicon wafer 10. Specifically, H4+H1>Ha, so that the fourth pore groove 110 and the first pore groove 210 can jointly form a folded-line side pore groove.

[0074] Optionally, the fourth pore slot 110 and the first pore slot 210 can be multiple, and the fourth pore slot 110 and the first pore slot 210 are arranged one-to-one. For example, the fourth pore slot 110 and the first pore slot 210 are both arranged in two, three, four, five or the like.

[0075] The remaining structures of the solar cell coating carrier plate of this embodiment are the same as those of the first embodiment, and will not be described in detail here.

[0076] Embodiment 5

[0077] This embodiment provides a solar cell coating carrier, wherein the upper end surface of the tray 100 of the solar cell coating carrier is provided with a fourth air hole groove 110, and the lower end surface of the tray 100 is provided with a fifth air hole groove (not shown in the figure), the fourth air hole groove 110 and the fifth air hole groove are staggered, and the first gap 400, the fourth air hole groove 110 and the fifth air hole groove are connected in sequence. The difference between this embodiment and the fourth embodiment is that the fifth air hole groove is provided on the lower end surface of the tray 100, and does not overlap with the first step portion 200 in the vertical direction.

[0078] Specifically, the height of the tray 100 is set to Ha, the height of the fourth air hole groove 110 is set to H4, and the height of the fifth air hole groove is set to H5. The common area cut off by the fourth air hole groove 110 and the fifth air hole groove constitutes a side air hole groove, so that the side air hole groove is not directly facing the silicon wafer 10, which is conducive to the upper and lower sides of the silicon wafer 10 to achieve consistency of pressure, reduce the deformation of the silicon wafer 10, and facilitate the automatic equipment to suck the silicon wafer 10. Specifically, H4+H5>Ha, so that the fourth air hole groove 110 and the fifth air hole groove can jointly form a folded line side air hole groove.

[0079] Optionally, the fourth pore slot 110 and the fifth pore slot can be multiple, and the fourth pore slot 110 and the fifth pore slot are arranged one-to-one. For example, the fourth pore slot 110 and the fifth pore slot are both arranged in two, three, four, five or the like.

[0080] The remaining structures of the solar cell coating carrier plate of this embodiment are the same as those of the first embodiment, and will not be described in detail here.

[0081] Obviously, the above are only preferred embodiments of the present invention and the technical principles used. Those skilled in the art will understand that the present invention is not limited to the specific embodiments herein, and that various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the scope of protection of the present invention. Therefore, although the present invention is described in more detail through the above embodiments, the present invention is not limited to the above embodiments, and may include more other equivalent embodiments without departing from the concept of the present invention, and the scope of the present invention is determined by the scope of the appended claims.

[0082] Note that in the description of this specification, the reference terms "some embodiments", "other embodiments", etc., mean that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

Claims

1. A solar cell coating substrate, characterized in that: include: A tray (100), wherein a first step portion (200) and a second step portion (300) are provided on the outer peripheral side of the tray (100), the second step portion (300) is located on the outer peripheral side of the first step portion (200), and the height of the second step portion (300) is higher than the height of the first step portion (200); the first step portion (200) is used to place a silicon wafer (10), and the second step portion (300) is used to limit the position of the silicon wafer (10), and when the silicon wafer (10) is placed on the first step portion (200), a first gap (400) is formed between the silicon wafer (10) and the upper end surface of the tray (100); a first air hole groove (210) is provided on the lower end surface of the first step portion (200), and the side wall of the first air hole groove (210) is connected to the first gap (400); and / or, A second pore groove (220) is provided on the upper end surface of the first step portion (200), and a side wall of the second pore groove (220) is connected to the first gap (400); when the silicon wafer (10) is placed on the first step portion (200), at least a portion of the second pore groove (220) is not covered by the silicon wafer (10).

2. The solar cell coating carrier according to claim 1, characterized in that: The height of the tray (100) is set to Ha, the height of the first step portion (200) is set to Hb; the height of the first air hole groove (210) is set to H1, and Ha <H1<Hb。 3. The solar cell coating carrier according to claim 1, characterized in that: The height of the tray (100) is set to Ha, the height of the first step portion (200) is set to Hb; the height of the second air hole groove (220) is set to H2, H2≤Hb-Ha.

4. The solar cell coating carrier according to claim 1, characterized in that: A third air hole groove (310) is provided on the upper end surface of the second step portion (300), and the third air hole groove (310) is communicated with the second air hole groove (220).

5. The solar cell coating carrier according to claim 4, characterized in that: The height of the tray (100) is set to Ha, the height of the first step portion (200) is set to Hb; the height of the second step portion (300) is set to Hc; the height of the first air hole groove (210) is set to H1, the height of the second air hole groove (220) is set to H2, and the height of the third air hole groove (310) is set to H3, Hc-Hb <H3≤Hc-Ha。 6. The solar cell coating carrier according to claim 5, characterized in that: The first step portion (200) and the second step portion (300) are both provided in plurality, and the second pore grooves (220) of two adjacent first step portions (200) are both connected to the third pore groove (310) of one second step portion (300).

7. The solar cell coating carrier according to claim 1, characterized in that: The upper end surface of the tray (100) is provided with a fourth air hole groove (110), the fourth air hole groove (110) and the first air hole groove (210) are arranged in a staggered manner, and the first gap (400), the fourth air hole groove (110) and the first air hole groove (210) are connected in sequence.

8. The solar cell coating carrier according to claim 1, characterized in that: The upper end surface of the tray (100) is provided with a fourth air hole groove (110), and the lower end surface of the tray (100) is provided with a fifth air hole groove, the fourth air hole groove (110) and the fifth air hole groove are staggered, and the first gap (400), the fourth air hole groove (110) and the fifth air hole groove are connected in sequence.

9. The solar cell coating carrier according to any one of claims 1 to 8, characterized in that: A second gap (500) is provided between the side wall of the second step portion (300) and the side edge of the silicon wafer (10).

10. A coating device, characterized in that: It comprises a vacuum chamber, a conveying device and a solar cell coating carrier according to any one of claims 1 to 9, wherein the solar cell coating carrier is arranged on the conveying device and enters and exits the vacuum chamber through the conveying device.

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