Metal nickel plating bath solution impurity removal device

Abstract

The utility model relates to the technical field of metal nickel-plating bath solutions, and discloses a metal nickel-plating bath solution impurity removal device which comprises a workbench, a precipitation tank is arranged on the left side of the top of the workbench, and a metal nickel-plating bath solution is injected into the precipitation tank through a water pump and flows into an electrolytic bath in an overflow manner through an overflow tank for follow-up treatment. Heavy metal impurities can be reserved in the precipitation tank as much as possible, a metal nickel plating tank solution can be preliminarily filtered by arranging the intercepting net, the impurities precipitated in the precipitation tank can be prevented from being rolled up by water flow by arranging the arc-shaped baffle, and copper ions are reduced and separated out through electrolysis performed through cooperation of the negative pole and the positive pole. And the metal impurities gathered due to the enrichment principle are collected through the round holes formed in the barrel wall of the collecting barrel, and the metal impurities can be conveniently taken out through the annular drawing box to be treated in a centralized mode.

Description

Technical Field

[0001] The utility model relates to the technical field of metal nickel plating bath liquid, in particular to a metal nickel plating bath liquid impurity removal device. Background Art

[0002] In the decorative electroplating Cu-Ni-Cr system, whether it is plastic electroplating or metal electroplating, the coating is plated by Cu, then Ni, and finally Cr. As the products continuously enter and a few products fall into the chrome plating tank, and the chrome plating tank liquid has strong oxidizing properties, it is bound to cause the content of impurity ions (such as Cu2+, Ni2+, Cl-, etc.) in the chrome plating tank to increase, thereby seriously affecting the covering ability of the Cr plating liquid, and easily causing the product to burn or yellow, or even the tank liquid has to be scrapped, increasing the cost.

[0003] Prior art publication number: CN204174303U, provides a technical solution: a chrome plating tank impurity removal device, including a chrome plating tank, a ceramic barrel, a nickel-plated plate and a chrome-plated anode plate; the upper end of the chrome plating tank has two support rods placed in parallel, and the two ends of the support rods are respectively supported at the two ends of the chrome plating tank, and the ceramic barrel is suspended in the chrome plating tank through the support rods, and both sides of the upper end of the ceramic barrel have support plates extending outward; the ceramic barrel is inserted with a nickel-plated plate, and a chrome-plated anode plate is arranged between the ceramic barrel and the chrome plating tank; the ceramic barrel has a plurality of pores connected to the ceramic barrel around it, and the pores have a diameter between 0.5μm-2μm. The advantage of the utility model is that by adding a ceramic barrel in the chrome plating tank, and the ceramic barrel has a plurality of pores that only allow small-diameter metal ions to pass through, and the ceramic barrel is electrolyzed continuously by direct current, so that the metal impurities in the chrome plating tank liquid will become less and less, the plating liquid purity will become higher and higher, and the performance will become better and better.

[0004] but:

[0005] In the nickel electroplating process, the amount of impurities in the plating solution directly affects the quality and stability of the coating, especially copper ions, which directly affect the brightness and density of the coating. Therefore, it is particularly important to remove impurities from the plating solution. The existing methods for removing impurities from the plating solution include chemical impurity removal and electrolytic impurity removal. The chemical impurity removal method usually adds chemical reagents to the plating solution to purify and remove copper ions, but the impurity removal process requires shutdown, resulting in inability to produce continuously; electrolytic impurity removal is through an external impurity removal instrument, which is connected to the plating solution tank through a pipeline to circulate the plating solution. During the circulation process, the copper ions are reduced and precipitated by electrolysis. However, after the existing impurity removal instrument has been used for a period of time, the metal impurities adsorbed on the cathode plate will be directly discharged into the sewage pool by water washing, which cannot be recycled and reused, and increases the difficulty of sewage treatment. It can be seen that the existing technology needs to be improved and improved. Utility Model Content

[0006] 1. Technical issues to be resolved

[0007] In view of the deficiencies of the prior art, the utility model provides a device for removing impurities from a metal nickel plating bath liquid.

[0008] (II) Technical solution

[0009] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a metal nickel plating tank liquid impurity removal device, comprising a workbench, a sedimentation tank is provided at the left side of the top of the workbench, an electrolytic tank is provided at the right side of the top of the workbench, a mounting groove is provided at the front of the workbench near the bottom, a water pump for injecting liquid into the sedimentation tank is fixedly installed on the left side of the inner wall of the mounting groove, and a water pipe at the output end of the water pump passes through one side of the workbench and extends to the inside of the sedimentation tank, an electrolytic tank is fixedly installed on the right side of the inner wall of the mounting groove, an overflow groove is provided on the top of the workbench between the electrolytic tank and the sedimentation tank, the metal nickel plating tank liquid is injected into the sedimentation tank by the water pump, and flows into the electrolytic tank by overflowing the overflow groove for subsequent treatment, so that as much heavier metal impurities as possible can be retained in the sedimentation tank.

[0010] Preferably, an interception net for intercepting metal impurities is fixedly installed at the left side of the inner wall of the precipitation tank, and the metal nickel plating tank liquid can be preliminarily filtered by setting the interception net.

[0011] Preferably, a row of arc-shaped baffles for assisting sedimentation are fixedly connected to the bottom of the inner wall of the sedimentation tank near the right side. The arc-shaped baffles can prevent impurities precipitated in the sedimentation tank from being swept up by the water flow.

[0012] Preferably, a positive pole is fixedly connected to the bottom of the inner wall of the electrolytic cell near the back, a negative pole is fixedly connected to the bottom of the inner wall of the electrolytic cell near the front, an electric controller is fixedly connected to the right side of the inner wall of the mounting groove, and the positive and negative poles of the electric controller are electrically connected to the positive pole and the negative pole respectively.

[0013] Preferably, the negative electrode column is composed of a collecting tube, a guide column, and an annular drawer box.

[0014] Preferably, a circular hole for the passage of metal impurities is opened in the wall of the collecting cylinder, the guide column is fixedly connected to the bottom of the inner wall of the collecting cylinder, and an annular drawer box is slidably connected to the inner wall of the collecting cylinder. The copper ions are reduced and precipitated by electrolysis through the cooperation of the negative electrode column and the positive electrode column, and the metal impurities gathered due to the enrichment principle are collected by setting the circular hole opened in the wall of the collecting cylinder, and the metal impurities are conveniently taken out for centralized treatment through the annular drawer box.

[0015] (III) Beneficial effects

[0016] Compared with the prior art, the utility model provides a metal nickel plating tank liquid impurity removal device, which has the following beneficial effects:

[0017] 1. A metal nickel plating tank liquid impurity removal device, which injects the metal nickel plating tank liquid into the sedimentation tank through a water pump, and flows into the electrolytic tank through the overflow tank for subsequent treatment, so that heavier metal impurities can be retained in the sedimentation tank as much as possible, and the metal nickel plating tank liquid can be preliminarily filtered by setting an interception net, and the impurities precipitated in the sedimentation tank can be prevented from being rolled up by the water flow by setting an arc baffle.

[0018] 2. This metal nickel plating tank liquid impurity removal device reduces and precipitates copper ions through electrolysis by the cooperation of the negative electrode column and the positive electrode column, collects metal impurities gathered due to the enrichment principle through the circular holes opened in the wall of the collecting cylinder, and conveniently takes out the metal impurities through the annular drawer box for centralized treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0020] Figure 1 It is the front view of the utility model;

[0021] Figure 2 It is a partial cross-sectional view of the utility model;

[0022] Figure 3 It is a cross-sectional view of the negative electrode column of the present utility model.

[0023] In the figure: 1. workbench; 2. mounting groove; 21. water pump; 22. electric controller; 3. sedimentation tank; 31. interception net; 32. arc baffle; 4. electrolytic cell; 5. overflow tank; 6. positive pole; 7. negative pole; 71. collecting cylinder; 72. guide column; 73. annular drawer box. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present invention will be described clearly and completely below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, rather than all of the embodiments.

[0025] Example 1

[0026] like Figure 1-3As shown, the utility model provides a metal nickel plating tank liquid impurity removal device, including a workbench 1, a sedimentation tank 3 is opened at the left side of the top of the workbench 1, an electrolytic tank 4 is opened at the right side of the top of the workbench 1, a mounting groove 2 is opened at the front of the workbench 1 near the bottom, a water pump 21 for injecting liquid into the sedimentation tank 3 is fixedly installed on the left side of the inner wall of the mounting groove 2, and a water pipe at the output end of the water pump 21 passes through one side of the workbench 1 and extends to the inside of the sedimentation tank 3, an electrolytic tank 4 is fixedly installed on the right side of the inner wall of the mounting groove 2, and an overflow is opened at the top of the workbench 1 between the electrolytic tank 4 and the sedimentation tank 3. The flow trough 5 injects the metal nickel plating bath liquid into the sedimentation tank 3 through the water pump 21, and flows into the electrolytic tank 4 through the overflow trough 5 for subsequent treatment, so that the heavier metal impurities can be retained in the sedimentation tank 3 as much as possible. An interception net 31 for intercepting metal impurities is fixedly installed on the left side of the inner wall of the sedimentation tank 3. The metal nickel plating bath liquid can be preliminarily filtered by setting the interception net 31. A row of arc baffles 32 for auxiliary sedimentation are fixedly connected to the bottom of the inner wall of the sedimentation tank 3 near the right side. The arc baffles 32 can prevent the impurities precipitated in the sedimentation tank 3 from being rolled up by the water flow.

[0027] In this embodiment, the metal nickel plating tank liquid is injected into the sedimentation tank 3 by the water pump 21, and flows into the electrolytic tank 4 by overflowing the overflow tank 5 for subsequent treatment, so that the heavier metal impurities can be retained in the sedimentation tank 3 as much as possible. The metal nickel plating tank liquid can be preliminarily filtered by setting the interception net 31, and the impurities precipitated in the sedimentation tank 3 can be prevented from being rolled up by the water flow by setting the arc baffle 32.

[0028] Example 2

[0029] like Figure 1-3 As shown, on the basis of Example 1, the utility model provides a technical solution: preferably, a positive pole 6 is fixedly connected to the bottom of the inner wall of the electrolytic cell 4 near the back, a negative pole 7 is fixedly connected to the bottom of the inner wall of the electrolytic cell 4 near the front, an electric controller 22 is fixedly connected to the right side of the inner wall of the mounting groove 2, and the positive and negative poles of the electric controller 22 are electrically connected to the positive pole 6 and the negative pole 7 respectively, the negative pole 7 is composed of a collecting cylinder 71, a guide column 72, and an annular drawer 73, a cylinder wall of the collecting cylinder 71 is provided with a circular hole for metal impurities to pass through, the guide column 72 is fixedly connected to the bottom of the inner wall of the collecting cylinder 71, and an annular drawer 73 is slidably connected to the inner wall of the collecting cylinder 71, and the copper ions are reduced and precipitated by electrolysis through the cooperation of the negative pole 7 and the positive pole 6, and the metal impurities gathered due to the enrichment principle are collected by setting the circular hole opened in the cylinder wall of the collecting cylinder 71, and the metal impurities are conveniently taken out for centralized treatment through the annular drawer 73.

[0030] In this embodiment, copper ions are reduced and precipitated by electrolysis through the cooperation of the negative electrode column 7 and the positive electrode column 6, and the metal impurities gathered due to the enrichment principle are collected by the circular holes opened in the wall of the collecting cylinder 71, and the metal impurities are conveniently taken out for centralized treatment through the annular drawer box 73.

[0031] The working principle of this metal nickel plating tank liquid impurity removal device is described in detail below.

[0032] like Figure 1-3 As shown, when in use, the metal nickel plating bath liquid is injected into the precipitation tank 3 through the water pump 21, and flows into the electrolytic tank 4 through the overflow tank 5 for subsequent treatment, so that the heavier metal impurities can be retained in the precipitation tank 3 as much as possible, and the metal nickel plating bath liquid can be preliminarily filtered by setting the interception net 31, and the impurities precipitated in the precipitation tank 3 can be prevented from being rolled up by the water flow by setting the arc baffle 32, and the copper ions are reduced and precipitated by electrolysis through the cooperation of the negative electrode column 7 and the positive electrode column 6, and the metal impurities gathered due to the enrichment principle are collected by the circular holes opened in the wall of the collecting cylinder 71, and the metal impurities are conveniently taken out for centralized treatment through the annular draw box 73.

Claims

1. A device for removing impurities from a metal nickel plating bath, comprising a workbench (1), characterized in that: A sedimentation tank (3) is provided at the left side of the top of the workbench (1), an electrolytic tank (4) is provided at the right side of the top of the workbench (1), a mounting groove (2) is provided at the front of the workbench (1) near the bottom, a water pump (21) for injecting liquid into the sedimentation tank (3) is fixedly installed on the left side of the inner wall of the mounting groove (2), and a water pipe at the output end of the water pump (21) passes through one side of the workbench (1) and extends to the inside of the sedimentation tank (3), an electrolytic tank (4) is fixedly installed on the right side of the inner wall of the mounting groove (2), and an overflow groove (5) is provided at the top of the workbench (1) between the electrolytic tank (4) and the sedimentation tank (3).

2. The device for removing impurities from a metal nickel plating bath according to claim 1, characterized in that: An interception net (31) for intercepting metal impurities is fixedly installed at the left side of the inner wall of the precipitation tank (3).

3. The device for removing impurities from a metal nickel plating bath according to claim 1, characterized in that: A row of arc-shaped baffles (32) for assisting sedimentation are fixedly connected to the bottom of the inner wall of the sedimentation tank (3) near the right side.

4. The device for removing impurities from a metal nickel plating bath according to claim 1, characterized in that: A positive pole (6) is fixedly connected to the bottom of the inner wall of the electrolytic cell (4) near the back, a negative pole (7) is fixedly connected to the bottom of the inner wall of the electrolytic cell (4) near the front, an electric controller (22) is fixedly connected to the right side of the inner wall of the mounting groove (2), and the positive pole and negative pole of the electric controller (22) are electrically connected to the positive pole (6) and the negative pole (7) respectively.

5. A metal nickel plating bath liquid impurity removal device according to claim 4, characterized in that: The negative electrode column (7) is composed of a collecting tube (71), a guide column (72), and an annular drawer box (73).

6. A device for removing impurities from a metal nickel plating bath according to claim 5, characterized in that: The wall of the collecting cylinder (71) is provided with a circular hole for metal impurities to pass through, the guide column (72) is fixedly connected to the bottom of the inner wall of the collecting cylinder (71), and the inner wall of the collecting cylinder (71) is slidably connected to an annular drawer box (73).

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