Turnover structure for semiconductor detection

Abstract

The utility model discloses an overturning structure for semiconductor detection, and belongs to the technical field of semiconductor detection. The turnover device mainly comprises a turnover assembly, the turnover assembly comprises a platform, a connecting frame is arranged at the top of the platform, a rotating shaft is fixedly installed in the connecting frame, and a containing frame is installed on the rotating shaft; the placing structure is arranged at the top of the placing frame, the placing structure comprises a bottom plate, the bottom of the bottom plate is fixedly connected with the placing frame, a connecting groove is formed in the bottom plate, and a screw rod is arranged in the connecting groove; a plurality of groups of clamping blocks are mounted in the clamping groove in a sliding manner; the first clamping strip is arranged on one side, far away from the clamping groove, of the bottom plate; mounting grooves are formed in the two sides of the clamping block, a mounting block is arranged in one group of mounting grooves, and a second clamping strip is mounted on the side, away from the mounting block, of the clamping block. According to the overturning structure for semiconductor detection, the placement structure is arranged, so that the overturning structure is suitable for processing semiconductor workpieces of various sizes, and the requirements of different requirements and application scenes are met.

Description

Technical Field

[0001] The present application relates to the field of semiconductor detection technology, and specifically to a flip structure for semiconductor detection. Background Art

[0002] Semiconductor refers to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, and high-power power conversion. The importance of semiconductors is enormous. Most electronic products, such as computers, mobile phones, or core units in digital recorders are closely related to semiconductors. Semiconductors need to be tested during the production process. Currently, a flip structure is often used to assist in the detection of semiconductors.

[0003] The utility model patent with publication number CN213936150U specifically discloses a semiconductor testing flipping fixture that is easy to adjust in size. By setting a first protective pad and a second protective pad for use in coordination with each other, the wear of the semiconductor during flipping is effectively avoided.

[0004] In the above patent, the device provides a first protective pad and a second protective pad so that the flip fixture can better protect the semiconductor when clamping the workpiece. However, when clamping the semiconductor, the device only relies on two sets of protective pads to apply pressure on both sides to clamp it in the fixture. If the workpiece is not placed accurately, the semiconductor is in a tilted state. In this case, the semiconductor is likely to bend when clamped, which may cause damage to the device, performance degradation, or even complete failure. Therefore, it is necessary to provide a flip structure for semiconductor detection that can firmly clamp the workpiece to solve the above problem.

[0005] It should be noted that the above information disclosed in this background technology section is only for understanding the background technology of the present application concept, and therefore, it may contain information that does not constitute the prior art. Summary of the invention

[0006] Based on the above problems existing in the prior art, the problem to be solved by the present application is: to provide a flip structure for semiconductor testing to achieve the effect of firmly clamping the semiconductor.

[0007] The technical solution adopted by the present application to solve its technical problems is: a flip structure for semiconductor detection, including a flip assembly, which includes a platform, a connecting frame is arranged on the top of the platform, a rotating shaft is fixedly installed inside the connecting frame, and a placing frame is installed on the rotating shaft; a placing structure, which is arranged on the top of the placing frame, and the placing structure includes a base plate, the bottom of the base plate is fixedly connected to the placing frame, a connecting groove is opened on the base plate, and a screw is arranged in the connecting groove; a clamping slot, in which multiple groups of clamping blocks are slidably installed; a first clamping strip, which is arranged on the side of the base plate away from the clamping slot; a clamping block, which is threadedly connected to the top of the screw, and installation slots are arranged on both sides of the clamping block, one group of the installation slots is installed with a mounting block, and the side away from the mounting block is installed with a second clamping strip.

[0008] Furthermore, a gear is fixedly installed at one end of the rotating shaft, a rack is meshingly installed at the bottom of the gear, the rack is slidably connected to the outside of the connecting frame, and a cylinder is installed at the bottom of the rack.

[0009] Furthermore, a notch is provided on one side of the installation block and the clamping block that is close to the other side.

[0010] Furthermore, one end of the screw rod is rotatably connected inside the connecting groove, and the other end away from the connecting groove extends out of the connecting groove and is provided with an adjusting wheel.

[0011] Furthermore, the bottom surface of the first clamping strip is in contact with the bottom plate, the top of the first clamping strip is provided with an inclined surface, and the second clamping strip has the same configuration as the first clamping strip.

[0012] The beneficial effect of the present application is that the flipping structure for semiconductor detection provided by the present application, by setting a placement structure, enables the device to clamp large workpieces and small workpieces, and provides reasonable support for the workpieces, thereby ensuring the stability of the workpieces during operation, and is suitable for processing semiconductor workpieces of various sizes, thereby meeting the requirements of different needs and application scenarios.

[0013] In addition to the above-described purposes, features and advantages, the present application also has other purposes, features and advantages. The present application will be further described in detail with reference to the drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] The drawings constituting part of the present application are used to provide a further understanding of the present application. The exemplary embodiments and descriptions of the present application are used to explain the present application and do not constitute an improper limitation on the present application. In the drawings:

[0015] Figure 1 This is an overall schematic diagram of the flip structure for semiconductor testing in this application;

[0016] Figure 2 for Figure 1 Installation diagram of the structure placed in the middle;

[0017] Figure 3 This is a schematic diagram of the installation of large workpieces;

[0018] Figure 4 This is a schematic diagram of the installation of small workpieces;

[0019] Among them, the reference numerals in the figure are:

[0020] 1. Flip assembly; 11. Platform; 12. Connecting frame; 13. Rotating shaft; 131. Placing frame; 14. Gear; 15. Rack; 16. Cylinder; 2. Placing structure; 21. Bottom plate; 22. Connecting groove; 23. Screw; 231. Adjusting wheel; 24. Block; 241. Mounting block; 3. Slot; 31. Clamping block; 4. Clamping plate; 41. First clamping strip; 42. Second clamping strip. DETAILED DESCRIPTION

[0021] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0022] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0023] like Figure 1 As shown, the present application provides a flip structure for semiconductor testing, including a flip assembly 1, which is arranged in a semiconductor testing workshop, and is used to clamp and fix the semiconductor to be tested and provide a flipping function for the semiconductor, so that the semiconductor can meet the testing standards under the testing conditions of different angles;

[0024] The flip assembly 1 includes a platform 11, and a connecting frame 12 is arranged on the top of the platform 11. A rotating shaft 13 is fixedly installed inside the connecting frame 12, and a placing frame 131 is installed on the rotating shaft 13. A placing structure 2 is installed on the placing frame 131, and the placing structure 2 is used to install the semiconductor to be tested;

[0025] At the same time, a gear 14 is fixedly installed at one end of the rotating shaft 13, and a rack 15 is meshed and installed at the bottom of the gear 14. The rack 15 is slidably connected to the outside of the connecting frame 12, and a cylinder 16 is installed at the bottom of the rack 15. The cylinder 16 is suitable for driving the rack 15 to slide on the connecting frame 12 along the length direction of the rack 15, thereby driving the gear 14 meshed with the rack 15 to rotate, so that the placement structure 2 rotates around the rotating shaft 13, so that the semiconductor can reach different detection angles, thereby improving the flexibility and comprehensiveness of the detection.

[0026] like Figure 2-Figure 3 As shown, the placement structure 2 includes a bottom plate 21, the bottom of which is fixedly connected to the placement frame 131, and a connecting groove 22 is provided on the bottom plate 21, a screw 23 is provided in the connecting groove 22, one end of the screw 23 is rotatably connected to the inside of the connecting groove 22, and the other end extends out of the connecting groove 22 and is installed with an adjusting wheel 231, and a clamping block 24 is threadedly connected to the top of the screw 23. When in use, the staff can drive the screw 23 to rotate by rotating the adjusting wheel 231, thereby driving the clamping block 24 to slide on the bottom plate 21 along the length direction of the screw 23;

[0027] At the same time, a card slot 3 is provided on one side of the bottom plate 21, and a plurality of card blocks 31 are slidably installed in the card slot 3. A notch is provided on one side of the card block 31, and the plurality of card blocks 31 are suitable for freely moving in the card slot 3. At the same time, mounting grooves (not shown in the figure) are provided on both sides of the card block 24. A mounting block 241 is inserted into the mounting groove on one side of the card block 24, and a notch is also provided on the mounting block 241.

[0028] When it is necessary to clamp and fix a semiconductor workpiece (such as a large workpiece such as a motherboard), first put one side of the workpiece into the notch in the clamping block 31, and then rotate the adjusting wheel 231 to drive the clamping block 24 to move toward the clamping slot 3, so that the workpiece is clamped in the two sets of notches, and the bottom of the workpiece is in contact with the bottom plate 21. At this time, the bottom of the workpiece is attached to the bottom plate 21, so that the workpiece will not tilt, thereby making the clamping of the workpiece more stable, ensuring the stability and accuracy of the workpiece during the detection process.

[0029] like Figure 4 As shown, a card plate 4 is provided on a side of the bottom plate 21 away from the card slot 3, a first card strip 41 is provided on a side of the card plate 4 close to the card block 24, the bottom surface of the first card strip 41 contacts the bottom plate 21, and a slope is provided on the top of the first card strip 41, and a second card strip 42 is provided on a side of the card block 24 away from the mounting block 241;

[0030] When it is necessary to clamp a small semiconductor workpiece (such as a motherboard, etc.), first, one side of the workpiece is brought into contact with the first clamping strip 41, and then the clamping block 24 is driven to move toward the clamping plate 4 by rotating the adjusting wheel 231, so that the workpiece is clamped between the first clamping strip 41 and the second clamping strip 42. At this time, the bottom of the workpiece is also in contact with the bottom of the base plate 21 to ensure that the workpiece is firmly clamped, so that the device can effectively clamp the small semiconductor workpiece and ensure that it remains stable during detection or other operations.

[0031] In summary, by setting up the placement structure 2, the device can clamp large and small workpieces, and provide reasonable support for the workpieces to ensure the stability of the workpieces during operation. At the same time, it is suitable for processing semiconductor workpieces of various sizes, thereby meeting the requirements of different needs and application scenarios.

[0032] The above description is only the preferred embodiment of the present application and is not intended to limit the present application. For those skilled in the art, the present application may have various modifications and variations. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. Flip structure for semiconductor testing, including: A turning assembly (1), the turning assembly (1) comprising a platform (11), a connecting frame (12) being arranged on the top of the platform (11), a rotating shaft (13) being fixedly installed inside the connecting frame (12), and a placing frame (131) being installed on the rotating shaft (13); A placement structure (2), the placement structure (2) being arranged on the top of the placement rack (131), characterized in that the placement structure (2) comprises: A bottom plate (21), the bottom of the bottom plate (21) being fixedly connected to the placement frame (131), the bottom plate (21) being provided with a connection groove (22), and a screw rod (23) being arranged in the connection groove (22); A card slot (3), wherein a plurality of groups of card blocks (31) are slidably mounted in the card slot (3); A first clamping strip (41), the first clamping strip (41) being arranged on a side of the bottom plate (21) away from the clamping slot (3); A clamping block (24) is threadedly connected to the top of the screw rod (23), and mounting grooves are provided on both sides of the clamping block (24), a mounting block (241) is installed in one group of the mounting grooves, and a second clamping strip (42) is installed on the side away from the mounting block (241).

2. The semiconductor inspection flip structure according to claim 1, characterized in that: A gear (14) is fixedly mounted on one end of the rotating shaft (13); a rack (15) is meshingly mounted on the bottom of the gear (14); the rack (15) is slidably connected to the outside of the connecting frame (12); and a cylinder (16) is mounted on the bottom of the rack (15).

3. The semiconductor inspection flip structure according to claim 2, characterized in that: A notch is provided on one side of the mounting block (241) close to the clamping block (31).

4. The semiconductor inspection flip structure according to claim 3, characterized in that: One end of the screw rod (23) is rotatably connected to the inside of the connecting groove (22), and the other end away from the connecting groove (22) extends out of the connecting groove (22) and is mounted with an adjusting wheel (231).

5. The semiconductor inspection flip structure according to claim 4, characterized in that: The bottom surface of the first clamping strip (41) is in contact with the bottom plate (21), the top of the first clamping strip (41) is provided with an inclined surface, and the second clamping strip (42) and the first clamping strip (41) have the same configuration.

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