Capillary structure and electronic equipment

Abstract

The embodiment of the utility model discloses a capillary structure and electronic equipment, and the electronic equipment can comprise handheld equipment, vehicle-mounted equipment, wearable equipment and terminal equipment or can be connected to any one of a wireless modem, a cellular phone, a smart phone, a personal digital assistant, a computer, a tablet personal computer, a notebook computer and the like. According to the capillary soaking mechanism, the permeability of the first capillary structure layer is small, the pressure difference of media at the evaporation end and the condensation end of the capillary structure can be maintained, the permeability of the second capillary structure layer is large, the backflow resistance of condensed liquid is small, the flowing speed of the condensed liquid can be increased, and the heat exchange efficiency is improved. Therefore, under the condition that the capillary structure can consider the pressure difference and the backflow speed, the thickness is small, and the light and thin design requirement of electronic equipment is met.

Description

Technical Field

[0001] The embodiments of the present application relate to the technical field of electronic products, and in particular to a capillary structure and an electronic device. Background Art

[0002] Mobile phones, laptops and other electronic devices have become necessities of human life, and with the development of science and technology and social progress, electronic devices have more and more functions. The more functions an electronic device has, the more electronic components it has. The power consumption of the electronic device during use is also greater, and the heat generated by the electronic device is also greater. Heat accumulation in electronic devices causes local temperatures to be too high, which will affect the normal operation of electronic components such as processors, causing system freezes at best and damage to electronic components at worst.

[0003] That is, heat dissipation is one of the key factors affecting the performance of electronic equipment, and is one of the important issues that technicians in this field pay attention to in the design of electronic equipment. Utility Model Content

[0004] The embodiments of the present application provide a capillary structure and an electronic device that can improve heat dissipation efficiency and have a relatively thin thickness.

[0005] An embodiment of the present application provides a capillary structure, including a shell, the shell having a sealed cavity, and a steam flow layer, a first capillary structure layer and a second capillary structure layer are arranged in sequence inside the sealed cavity along the thickness direction of the shell; the steam flow layer has a steam flow channel, and the permeability of the first capillary structure layer is less than the permeability of the second capillary structure layer.

[0006] In the embodiment of the present application, taking the heat dissipation of the chip as an example, the outer wall of the shell where the capillary structure is located on one side of the second capillary structure layer is at least partially in direct contact with the chip or indirectly in contact through an intermediate heat-conducting component, as long as the heat of the chip can be transferred to the liquid medium in the first capillary structure layer and the second capillary structure layer. The liquid medium is heated and quickly evaporates into hot air, and the hot air enters the steam flow layer between the first capillary structure layer and the second plate body. The hot air flows in the steam flow layer toward the cold source position with lower temperature. In the embodiment of the present application, the cold source can be a battery, and the temperature of the battery is lower than the chip temperature. Of course, the cold source can also be other chip locations of the electronic device with lower temperature.

[0007] After the hot air flows to the position corresponding to the battery (cold source), it is condensed into liquid and enters the first capillary structure layer. The liquid part entering the first capillary structure layer flows along the first capillary pores, and most of the liquid will enter the second capillary structure layer through the first capillary structure layer, and flow back to the position corresponding to the chip (evaporation source position) along the second capillary pores in the second capillary structure layer. Because the permeability of the second capillary structure layer is relatively large, the reflux resistance of the condensed liquid is relatively small, which can increase the flow rate of the condensed liquid, so that the condensed liquid can quickly flow back to the evaporation source position, improve the overall heat dissipation efficiency of the capillary structure, and the permeability of the second capillary structure layer is relatively large, and more liquid can be stored, which can further improve the heat dissipation efficiency of the capillary structure. In addition, the capillary structure in the embodiment of the present application is relatively thin in thickness while meeting the pressure difference and reflux speed, meeting the requirements of lightweight design of electronic equipment.

[0008] In one example, the second capillary structure layer includes at least one first support body, each first support body is located between the first capillary structure layer and the inner wall of the shell, and the capillary pores of the second capillary structure layer include gaps between adjacent first support bodies and gaps between the first support bodies and the inner wall of the shell. In this embodiment, each first support body forms the second capillary structure layer, the structure is simple, and the first support body can be further formed simultaneously with the shell, further simplifying the assembly of the overall product.

[0009] In one example, the first support body is a strip-shaped boss, and along the first direction, the second capillary structure layer is arranged with a plurality of slot-shaped flow channels, the slot-shaped flow channels extend along the second direction, the capillary pores of the second capillary structure layer include the slot-shaped flow channels, the second direction is the arrangement direction from the condensation end to the evaporation end of the capillary structure, and the first direction and the second direction have an angle. The first direction and the second direction can be approximately perpendicular. In this embodiment, the slot-shaped flow channel has a small flow resistance, is simple to process, and has a low molding cost.

[0010] In one example, the first support body is a columnar boss, and at least part of the first support body is discretely distributed and can be arranged in the form of islands. In this embodiment, the size of the second capillary pores can be guaranteed by reasonably arranging the positions of the first support bodies, and the total volume occupied by the first support body can be relatively small, thereby increasing the volume of the capillary structure to accommodate liquid, thereby improving the heat dissipation performance of the capillary structure.

[0011] In one example, the first support body includes a first end and a second end along the thickness direction of the shell, and the first end is fixedly connected to the inside of the sealed cavity or formed in one piece, which can improve the installation reliability of the first support body; the second end is fixedly connected or not connected to the first capillary structure layer. In other words, the second end of the first support body can be fixed to the first capillary structure layer to further improve the overall stability of the capillary structure. Of course, the second end of the first support body can also be not fixed to the first capillary structure layer, and the two can be detachably abutted to facilitate disassembly and assembly.

[0012] In one example, the steam flow layer includes at least one second support body, and the two ends of the second support body along the thickness of the shell are respectively against the shell and the first capillary structure layer. By reasonably setting the number and size of the second support bodies, it is possible to ensure that a steam flow channel is formed between the shell and the first capillary structure layer to ensure smooth flow of steam. The second support bodies can also be arranged in the form of islands.

[0013] In one example, the housing includes a first plate and a second plate, at least one of which is provided with a groove, the first plate and the second plate are circumferentially sealed and fixedly connected to enclose a sealed cavity, the sealed cavity includes the groove, and the first support body is fixedly connected to the first plate or is integrally formed with the first plate. In the implementation of the present application, the housing is generally a flat plate structure with a relatively small thickness, which reduces the thickness space occupied by the electronic device.

[0014] In one example, the first plate body has a first groove, the first support body is formed on the bottom wall of the first groove, the second plate body has a second groove, the sealed cavity includes the first groove and the second groove, the peripheral walls of the first groove and the second groove are circumferentially sealed and fixedly connected, the bottom wall of the second groove is also formed with a second support body, and the second support body abuts against the shell and the first capillary structure layer at both ends along the thickness of the shell. In the embodiment of the present application, the first plate body and the second plate body are both provided with grooves, and the notches of the two grooves are relatively assembled to form an integral structure, the first support body and the second support body can be respectively formed on the first plate body and the second plate body as a whole, and the assembly is simple and quick.

[0015] In one example, the first support body is formed inside the first groove by an etching process, and the second support body is formed inside the second groove by an etching process. In this embodiment, the first support body and the second support body are directly formed on the first plate body and the second plate body respectively by an etching process, and no subsequent assembly and fixing are required, so the assembly efficiency is relatively high.

[0016] In one example, the first capillary structure layer is located between the first plate body and the second plate body, and the three are fixed by sintering or welding. In this embodiment, the first capillary structure layer, the first plate body, and the second plate body can be directly fixedly connected in the same process, and the connection efficiency is high.

[0017] In one example, the first capillary structure layer is a single-layer structure or a multi-layer structure formed by weaving a filamentous material; the first capillary structure is formed by the weaving process to facilitate assembly.

[0018] Alternatively, the first capillary structure layer includes a porous material layer or is a metal powder layer, which does not require further processing and can be directly installed into the housing of the capillary structure, thereby reducing the use cost.

[0019] In one example, the pore size of the capillary pores of the first capillary structure layer is less than or equal to 0.2 mm, such as 0.1 mm, 0.08 mm, etc.;

[0020] Or / and, the thickness of the first capillary structure layer is less than or equal to 0.06 mm, for example, 0.02 mm, 0.03 mm or 0.04 mm;

[0021] Or / and, the pore size of the second capillary pore is less than or equal to 1.8 mm, such as 1.6 mm, 1.5 mm, etc.;

[0022] Alternatively or / and, the thickness of the second capillary structure layer may be less than or equal to 0.04 mm, for example, 0.02 mm, 0.03 mm or 0.01 mm.

[0023] The above parameters can be any values ​​within the above ranges. By selecting them reasonably, a capillary structure that meets the use requirements and has a small thickness can be obtained.

[0024] In one example, the outer wall of the shell also has a thermally conductive gel layer for bonding and fixing with the heat-generating electronic component. For example, a thermally conductive gel layer is provided between the first plate body and the heat-generating electronic component, so that the heat of the heat-generating electronic component can be further evenly distributed when passing through the thermally conductive gel layer, and the heat after being evenly heated by the thermally conductive gel layer is transferred to the first side wall. The contact area between the heat source and the first side wall is relatively large, which is conducive to expanding the heated area of ​​the liquid medium inside the capillary structure, increasing the evaporation amount of the liquid medium per unit time, and facilitating the rapid dissipation of the chip heat.

[0025] On the other hand, an embodiment of the present application also provides an electronic device, comprising a heat-generating electronic component and any of the above-mentioned capillary structures, wherein at least a portion of an outer wall of the housing located on one side of the second capillary structure layer is in direct or indirect contact with the heat-generating electronic component.

[0026] The electronic device provided in the embodiment of the present application includes the above-mentioned capillary structure, so the electronic device also has the above-mentioned technical effect of the capillary structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0027] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of the present application;

[0028] Figure 2 for Figure 1 a top view of the electronic device shown;

[0029] Figure 3 for Figure 2 AA cross-sectional view of the electronic device shown;

[0030] Figure 4 for Figure 3The illustrated structure only shows the schematic diagram of the capillary structure, battery, mainboard, thermal conductive gel and chip;

[0031] Figure 5 for Figure 4 Schematic diagram of the capillary structure in the structure shown;

[0032] Figure 6 for Figure 5 A schematic structural diagram of a first plate body of the capillary structure shown;

[0033] Figure 7 for Figure 5 A top view of the first plate body shown;

[0034] Figure 8 A top view of a first plate body in another embodiment of the present application;

[0035] Fig. 9 A top view of a first plate body in another embodiment of the present application;

[0036] Fig.10 A top view of the first plate in another embodiment of the present application

[0037] Fig.11 A top view of a first capillary structure layer in an embodiment of the present application;

[0038] Fig.12 for Fig.11 A CC cross-sectional view of the first capillary structure layer shown;

[0039] Fig.13 for Figure 5 A three-dimensional structural diagram of the second plate in the capillary structure shown;

[0040] Fig.14 for Fig.13 A top view of the second plate is shown.

[0041] in, Figures 1 to 13 middle:

[0042] 1 middle frame; 1a installation cavity; 11 peripheral wall; 12 partition plate;

[0043] 2 display screen;

[0044] 3 front cameras;

[0045] 4 Motherboard;

[0046] 5 capillary structure; 501 first plate; 502 second plate; 51 first capillary structure layer; 51a first capillary gap; 52 second capillary structure layer; 52a second capillary gap; 53 steam flow layer; 521 first support body; 54 second support body;

[0047] 6 batteries;

[0048] 7 back cover;

[0049] 8 chips;

[0050] 9 Thermally conductive gel layer. DETAILED DESCRIPTION

[0051] At present, the heat dissipation of electronic equipment is mainly carried out in the following ways: graphite heat dissipation, ice nest heat dissipation, active circulating heat transfer fluid and capillary structure. Among them, the heat dissipation efficiency of the capillary heat dissipation structure is relatively high and it is widely used in electronic equipment. The capillary structure is usually also called a vacuum chamber heat spreader (Vapor Chamber, VC), or a temperature spreader or a heat spreader. The capillary structure includes a shell that surrounds an internal vacuum chamber. Along the thickness direction of the shell, a capillary layer and a condensation layer are arranged inside the vacuum chamber. The capillary layer is filled with coolant. When installed, the capillary layer is close to the heat-generating electronic component. The heat of the electronic component is transferred to the capillary layer through the shell and absorbed by the coolant in the capillary layer. The coolant is heated and evaporated quickly into hot air under the vacuum ultra-low pressure environment. The hot air enters the condensation layer, and the heat exchange between the condensation layer and the cold source outside the shell is condensed into liquid and enters the capillary layer, and flows back to the evaporation source position (heat-generating electronic component) along the micro-capillary pipes in the capillary layer. In this way, the heat dissipation of the electronic component is realized. The capillary layer mainly functions to make the condensed liquid flow back to the evaporation source position. Currently, the capillary layer is mainly a wire mesh structure.

[0052] With the demand for lighter and thinner electronic devices such as mobile phones, the thickness of the wire mesh in the capillary structure is getting smaller and smaller, and the capillary channels formed by the corresponding wire mesh are also getting smaller and smaller. The smaller the capillary channels, the greater the resistance to liquid reflux, which seriously affects the heat dissipation performance of the capillary structure, is not conducive to the heat dissipation of heat-generating electronic components, and thus affects the overall performance of the electronic equipment.

[0053] Therefore, how to improve the heat dissipation performance of the capillary structure is a technical problem that needs to be solved urgently by technicians in this field.

[0054] Based on the current technical research findings, the inventors of this application explored and conducted a large number of experiments, and proposed a capillary structure with a relatively small thickness. The capillary structure can take into account both the requirements of condensate reflux and heat dissipation performance, meet the requirements of lightweight design of electronic equipment, and is conducive to improving the quality of the entire electronic equipment to which it is applied.

[0055] In order to enable those skilled in the art to better understand the technical solutions of the embodiments of the present application, the embodiments of the present application are further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0056] The embodiments of the present application relate to an electronic device, wherein the electronic device may include a handheld device, an in-vehicle device, a wearable device, a terminal device or other processing device connected to a wireless modem, and may also include a cellular phone, a smart phone, a personal digital assistant (PDA) computer, a tablet computer, a laptop computer, a camcorder, a video recorder, a camera, a smart watch, a smart wristband, an augmented reality (AR) device, a virtual reality (VR) device, an in-vehicle computer and other devices with a display screen. The embodiments of the present application do not impose any special restrictions on the specific form of the above-mentioned electronic device. For ease of understanding, the following is an explanation using the electronic device as a mobile phone as an example.

[0057] In order to simplify the description of the technical solution, this article defines the length direction of the electronic device as y, the width direction as x, and the thickness direction as z. Figure 1 Logo.

[0058] Please refer to Figure 1 The electronic device 100 provided in the embodiment of the present application includes a middle frame 1 and a display screen 2. The middle frame 1 mainly supports and protects the electronic components of the electronic device. Figure 2 and Figure 3 , various electronic components of the electronic device can be arranged in the installation cavity 1a of the middle frame 1, and the electronic components installed inside the middle frame 1 may include a mainboard 4, a battery module, a wireless communication module, a camera module, an audio playback module, etc. The arrangement position and installation method of these components are not specifically limited in this application. Among them, the audio playback module may include sound-emitting components such as a receiver and a speaker. Those skilled in the art should understand that the electronic device may include one or more of the electronic components listed above, and of course may also include but are not limited to the electronic components listed above in this article, and may also include other electronic components.

[0059] In an embodiment of the present application, the material of the middle frame 1 can be a whole formed by metal and non-metal. For example, in one embodiment of the present application, the middle frame includes a metal body and a plastic body, and the plastic body is injection molded with the metal body as the skeleton to form a middle frame of an integrated structure. The metal body can be an aluminum alloy, stainless steel, titanium alloy, etc., and the plastic body can be made of polystyrene, polypropylene, polyethylene, etc. Of course, in the case of meeting the use requirements, the middle frame 1 can also only include non-metal, for example, the middle frame only has a plastic body, and the middle frame 1 can be formed by injection molding. Of course, the material of the middle frame can also be ceramic or glass. Of course, the middle frame 1 can also only include a metal body, and the middle frame 1 is formed by machining.

[0060] Please refer to Figure 3 The electronic device 100 may further include a back cover 7. The display screen 2 and the back cover 7 are located on both sides of the middle frame 1 along the thickness direction z. The material of the back cover 7 is not limited herein. In specific practice, those skilled in the art may select it according to actual needs; for example, the back cover 7 may be made of metal, plastic, ceramic or glass.

[0061] The shape of the middle frame can be determined according to the electronic device. Figure 1 , a specific example of an electronic device having a rectangular flat plate shape is shown. Of course, in some other embodiments, the shape of the electronic device may also be a circular flat plate, an oblong flat plate, an N-sided flat plate (N is an integer greater than or equal to 3) or an irregular flat plate structure, etc. The middle frame 1 may include a partition 12 and a peripheral wall 11, the peripheral wall 11 surrounds the partition 12, and components such as the main board 4 may be fixed to the partition 12. The display screen 2 and the back cover 7 are respectively located on both sides of the partition 12.

[0062] In the embodiment of the present application, the display screen 2 can be arranged on the front side of the electronic device 100, or on the back side of the electronic device, or on both the front side and the back side of the electronic device 100. The front side of the electronic device 100 can be understood as the side facing the user when the user uses the electronic device 100, that is, Figure 1 The back side of the electronic device 100 where the display screen is located can be understood as the side facing away from the user when the user uses the electronic device 100.

[0063] In the embodiment of the present application, the display screen 2 is used to display pictures or videos, including a transparent cover and a display module, and the display module has a plurality of functional layers stacked to form, and the functional layers include a polarizing layer, a light-emitting layer, a touch layer and a backlight layer, etc. The display screen 2 can be a liquid crystal display (LCD), an organic light-emitting diode (OLED), an active-matrix organic light-emitting diode or an active-matrix organic light-emitting diode (AMOLED), a flexible light-emitting diode (FLED), a quantum dot light-emitting diode (QLED), an electrophoretic display technology (E-Ink), etc.

[0064] At present, the display screen 2 of electronic devices mostly adopts OLED. The transparent cover plate covers the outer side of the display module to protect the display module. The transparent cover plate can be a glass cover plate, and of course it can also be other transparent materials that can play a protective function, for example, the transparent cover plate can be transparent polyimide. The display screen 2 can also have a touch function, that is, the display screen 2 can be a touch screen.

[0065] The mainboard 4 can be a printed circuit board (PCB), which can be a hard circuit board, a flexible printed circuit board (FPC), or a hard-soft circuit board. The mainboard can use a FR-4 dielectric board, a Rogers dielectric board, or a mixed dielectric board of FR-4 and Rogers. Here, FR-4 is a code for a flame retardant material grade, and the Rogers dielectric board is a high-frequency board. In some embodiments, the mainboard is also referred to as a main circuit board.

[0066] The mainboard 4 may be equipped with a chip 8, and is used to be electrically connected to the battery 6, audio module, antenna module, camera module and other devices of the electronic device, so as to send signals to the electronic components in these modules, or receive signals from the electronic components in these modules. The chip 8 may be a system on chip (System on Chip, SOC), which includes a central processing unit (Central Processing Unit, CPU), a graphics processing unit (Graphics Processing Unit, GPU), an image signal processor (Image Signal Processor, ISP), a neural network processor (Neural Network Processing Unit, NPU), a digital signal processor (Digital Signal Processor, DSP), etc. Of course, the chip may also be other forms of chips, such as a programmable system on chip (System On a Programmable Chip, SOPC), or a microprocessor (Micro Processor Unit, MPU), or a microcontroller (Micro Control Unit, MCU), or others.

[0067] The electronic component that generates the most heat on the motherboard 4 is usually chip 8. Figure 3 In the embodiment of the present application, the capillary structure 5 can be located between the display screen 2 and the battery 6 , a portion of the capillary structure 5 can be bonded and fixed to the chip 8 of the mainboard 4 , and a portion of the capillary structure 5 extends to the battery 6 .

[0068] See also Figure 4 and Figure 5 , Figure 4 The dashed arrow S1 indicates the flow direction of the steam, and the solid arrow S2 indicates the flow direction of the condensed liquid. The embodiment of the present application provides a capillary structure 5, which can be applied to electronic devices to dissipate heat from heat-concentrated areas in electronic devices, especially to dissipate heat from high-power electronic components or integrated components of several electronic components with high heat generation. High-power electronic components with high heat generation include the above-mentioned chip 8, but are not limited to the above-mentioned chip 8, and can also be other heat-generating electronic components.

[0069] The capillary structure 5 in the embodiment of the present application is usually a flat plate structure, which can reduce the space occupied by the capillary structure 5 in the thickness direction. The capillary structure 5 in the embodiment of the present application includes a shell that encloses a sealed cavity 503. Along the thickness direction, the shell includes a first plate body 501 and a second plate body 502, and the two are arranged along the thickness direction z. The first plate body 501 has a first groove, and the second plate body 502 has a second groove. The groove openings of the first plate body 501 and the second plate body 502 are relatively assembled to form a sealed cavity 503. The bottom of the first groove and the second groove can be both flat, and of course can also be a curved surface. There is a capillary structure layer inside the sealed cavity 503, and there is a steam flow layer 53 between the capillary structure layer and the bottom wall of the second groove. The steam flow layer 53 has a steam flow channel 53a, and the steam flow channel 53a can be one or more. The capillary structure layer includes a first capillary structure layer 51 and a second capillary structure layer 52, and the first capillary structure layer 51 and the second capillary structure layer 52 are arranged along the arrangement direction from the first plate body 501 to the second plate body 502, that is, the second capillary structure layer 52 is located between the first capillary structure layer 51 and the first plate body 501. The first capillary structure layer 51 has a first capillary pore inside, and the second capillary structure layer 52 has a second capillary pore 52a inside. The permeability of the first capillary structure layer 51 is based on the pressure difference between the evaporation end and the condensation end of the capillary structure 5. The permeability of the second capillary structure layer 52 is less than the permeability of the first capillary structure, so that compared with the first capillary structure layer 51, the second capillary structure layer 52 has a relatively small flow resistance to the liquid medium. The flow velocity of the condensed liquid medium in the second capillary structure layer 52 is faster than the flow velocity in the first capillary structure layer 51.

[0070] Permeability is the penetration rate of a liquid with a dynamic viscosity coefficient of 1 in a medium (capillary structure layer) when the pressure gradient is 1. The unit of permeability is quadratic micrometer (μm 2 ). Permeability is a parameter that characterizes the ability of soil or rock to conduct liquid. Its size is related to factors such as porosity, the geometric shape of the pores in the direction of liquid penetration, the particle size and the arrangement direction, but has nothing to do with the properties of the liquid moving in the medium. As mentioned above, permeability is the ability of rock to allow fluid to pass under a certain pressure difference. The greater the permeability, the easier it is for liquid to pass through, and the smaller the permeability.

[0071] Permeability can be obtained in the following ways: first, estimating permeability using natural potential logging data; second, estimating permeability using resistivity data; third, estimating permeability using radioactive logging data; fourth, estimating permeability using sonic logging data; and fifth, estimating permeability based on the statistical relationship between reservoir parameters.

[0072] In the embodiment of the present application, the permeability of the first capillary structure layer 51 can be lower than the permeability of the second capillary structure layer 52 by setting parameters such as the size, shape, particle size and arrangement direction of the pores in the first capillary structure layer 51 and the second capillary structure layer 52 .

[0073] In the embodiment of the present application, taking the heat dissipation of chip 8 as an example, the outer wall of the shell of the capillary structure 5 located on the side of the second capillary structure layer 52 is at least partially in direct contact with the chip 8 or indirectly in contact through an intermediate heat-conducting component, as long as the heat of the chip 8 can be transferred to the liquid medium in the first capillary structure layer 51 and the second capillary structure layer 52. The liquid medium is heated and evaporates quickly into hot air, and the hot air enters the steam flow layer 53 between the first capillary structure layer 51 and the second plate body 502. The hot air flows in the steam flow layer 53 toward the cold source position with lower temperature. In the embodiment of the present application, the cold source can be a battery 6, and the temperature of the battery 6 is lower than that of the chip 8. Of course, the cold source can also be other locations of the electronic device where the temperature of the chip 8 is lower.

[0074] After the hot air flows to the position corresponding to the battery 6, it is condensed into liquid and enters the first capillary structure layer 51. The liquid part entering the first capillary structure layer 51 flows along the first capillary pores, and most of the liquid will enter the second capillary structure layer 52 through the first capillary structure layer 51, and flow back to the position corresponding to the chip 8 (evaporation source position) along the second capillary pores 52a in the second capillary structure layer 52. Because the permeability of the second capillary structure layer 52 is relatively large, the reflux resistance of the condensed liquid is relatively small, which can increase the flow rate of the condensed liquid, so that the condensed liquid can quickly flow back to the evaporation source position, thereby improving the overall heat dissipation efficiency of the capillary structure 5. In addition, the permeability of the second capillary structure layer 52 is relatively large, and more liquid can be stored, which can further improve the heat dissipation efficiency of the capillary structure 5. In addition, the capillary structure 5 in the embodiment of the present application is relatively thin in thickness while meeting the pressure difference and reflux speed, meeting the requirements of lightweight design of electronic equipment.

[0075] In the embodiment of the present application, the intermediate heat-conducting component can be a heat-conducting gel, and a heat-conducting gel layer 9 is provided between the first plate body 501 and the heat-generating electronic component, so that the heat-generating electronic component ( Figure 4 The heat of the middle chip 8 can be further evenly distributed when passing through the thermally conductive gel layer 9. The heat after being evenly distributed through the thermally conductive gel layer 9 is transferred to the first side wall. The contact area between the heat source and the first side wall is relatively large, which is beneficial to expanding the heated area of ​​the liquid medium inside the capillary structure 5, increasing the evaporation amount of the liquid medium per unit time, and facilitating the rapid dissipation of heat from the chip 8.

[0076] The shape of the capillary structure 5 can be reasonably determined according to factors such as the internal space of the electronic device, the shape and position of the heat-generating electronic components, and the position of the cold source. The shape of the capillary structure 5 is not limited to the rectangular plate structure shown in the embodiment of the present application.

[0077] In the embodiment of the present application, the pore size of the second capillary pores 52a of the second capillary structure layer 52 is less than or equal to 1.8 mm, and the thickness may be less than or equal to 0.04 mm, for example, 0.02 mm, 0.03 mm or 0.01 mm. In this embodiment, under the premise of meeting the liquid flow rate, the thickness of the second capillary structure layer 52 is relatively small.

[0078] Figures 6 to 9 As shown, all first support bodies 521 may be columnar bosses, and each columnar boss is discretely distributed. Of course, some first support bodies 521 may have gaps, and some first support bodies 521 may have no gaps, and the second capillary pores 52a that meet the use requirements can also be obtained, and the support strength is relatively high. The shapes of the first support bodies 521 can be the same, or they can be different. Figure 6 and Figure 7 As shown, the first support body 521 may be a cylinder. The first support body 521 may also be a polygonal cylinder. Figure 8 The first support body 521 is shown as a triangular prism. The first support body 521 can also be an elliptical prism, such as Fig. 9 As shown. Alternatively, the first support body 521 can also be a water drop-shaped structure. Of course, the first support body 521 can also be a strip-shaped structure. The first support body 521 extends along the second direction. In the embodiment of the present application, the flow direction of the liquid in the second capillary structure layer 52 is defined as the second direction. A strip gap is formed between adjacent first support bodies 521. The strip gap also extends along the second direction, that is, a strip groove is formed between adjacent first support bodies 521. The liquid can flow along the groove from the cold source position to the evaporation source position, and the flow is relatively smooth with less resistance. The larger the volume of the first support body 521, the better the support strength, but the amount of solution may be relatively reduced.

[0079] Please refer to Fig.10In the embodiment of the present application, the second capillary structure layer 52 includes a plurality of first support bodies 521, the first support bodies 521 are located between the first capillary structure layer 51 and the first side wall, all the first support bodies 521 can be strip bosses, one or more strip bosses are arranged along the first direction, and groove-type flow channels are formed between adjacent strip bosses and between the two outermost strip bosses and the corresponding shell inner walls, the capillary pores of the second capillary structure layer 52 include groove-type flow channels, the groove-type flow channels extend along the second direction, wherein there are gaps between adjacent first support bodies 521, and second capillary pores 52a are formed between the first support bodies 521, and the liquid can flow to the evaporation source position along the one or more second capillary pores 52a formed between the first support bodies 521.

[0080] In this embodiment, a plurality of first support bodies 521 are provided to form a groove-shaped flow channel as the second capillary pores 52a, and the structure and process are simple. In addition, the first support bodies 521 can reliably support the first capillary structure layer 51, thereby improving the structural stability of the product.

[0081] The first support body 521 may be fixed only to the housing, or may be fixed only to the first capillary structure layer 51 , or may be fixed to both the housing and the first capillary structure layer 51 .

[0082] In the embodiment of the present application, the first capillary structure layer 51 and the second capillary structure layer 52 can be assembled in the housing by stacking only along the thickness direction, and the process is simple. Of course, the first capillary structure layer 51 and the second capillary structure layer 52 can be fixed in advance by bonding, welding, sintering or other processes to form an assembly, and then installed in the housing. In this embodiment, the first capillary structure layer 51 and the second capillary structure layer 52 have a relatively high fixing reliability.

[0083] Please refer to Fig.11 and Fig.12 In the embodiment of the present application, the first capillary structure layer 51 can be a single-layer structure formed by weaving wires, such as metal wires or alloy metal wires or metal fibers, stainless steel, titanium alloys, etc. The aperture of the first capillary pores 52a of the first capillary structure layer 51 is less than or equal to 0.2 mm, such as 0.1 mm, 0.08 mm, etc. The thickness H of the first capillary structure layer 51 can be less than or equal to 0.06 mm, such as 0.02 mm, 0.03 mm or 0.04 mm. For the metal wire braided structure, the thickness of the first capillary structure layer 51 is 0.02 mm to 0.03 mm, which can meet the pressure difference requirement. The wire can be a heat-conducting wire with heat conductivity.

[0084] The first capillary structure layer 51 may also be a double-layer structure or a multi-layer structure formed by weaving silk threads.

[0085] The metal wire can be copper wire, or other materials with good thermal conductivity, such as aluminum. The first capillary structure layer 51 can also be a non-woven structure, for example, the first capillary structure layer 51 includes a porous material, which can be metal powder, foam metal or other materials.

[0086] Please refer to Fig.13 and Fig.14 In the embodiment of the present application, since the sealed cavity 503 inside the housing is a vacuum cavity, the capillary structure 5 also includes a second support body 54. Figure 5 It is understood that the second support body 54 is located between the first capillary structure layer 51 and the second groove bottom wall of the second plate body 502 to form a steam flow layer 53 between the second plate body 502 and the first capillary structure layer 51. The setting position, shape and number of the second support body 54 are based on the formation of a steam flow layer 53 that meets the design requirements. The second support body 54 is supported between the first capillary structure layer 51 and the second plate body 502 to form a gas flow space with a predetermined thickness, which is conducive to the smooth flow of gas. The shape of the second support body 54 can be in various forms, Fig.13 An example in which the second support body 54 is a cylinder is shown. Of course, the second support body 54 can be in any shape, such as a polygonal column or a water drop column, etc.

[0087] The second support body 54 can be fixedly connected or integrally formed with the second plate body 502. The second support body 54 and the first capillary structure layer 51 can also only be in abutment contact without being fixedly connected, that is, the second support body 54 and the first capillary structure layer 51 are in detachable abutment.

[0088] Similarly, the first support body 521 and the first plate body 501 may be fixedly connected or integrally formed. The first support body 521 and the first capillary structure layer 51 may also only abut against each other but not be fixedly connected, that is, the first support body 521 and the first capillary structure layer 51 are detachably abutted against each other.

[0089] In the embodiment of the present application, the housing includes a first plate 501 and a second plate 502, and the first plate 501 and the second plate 502 are respectively formed with a first support body 521 and a second support body 54, wherein the first support body 521 and the second support body 54 can be formed on the first plate 501 and the second plate 502 by an etching process, and the first capillary structure layer 51 is supported on each first support body 521, and the first capillary structure layer 51 is welded and sealed circumferentially to the first plate 501 and the second plate 502. In this embodiment, the first support body 521 and the second support body 54 are directly formed on the first plate 501 and the second plate 502 by an etching process, and no subsequent assembly and fixing are required, thereby simplifying the fixing process.

[0090] Of course, the first support body 521 and the first plate body 501 can be relatively independent components, and the second support body 54 and the second plate body 502 can also be relatively independent components. The first plate body 501 and the second plate body 502 are both processed with grooves, and the first plate body 501 has a first groove, and the first groove at least partially forms the first capillary pore 52a of the first capillary structure layer 52a. The first support body 521 is installed on the bottom wall 5011 of the first groove, and the first support body 521 can be in the form of islands and distributed discretely. The second plate body 502 has a second groove, and the second support body 54 is installed on the bottom wall 5021 of the second groove, and the second support body 54 can also be in the form of islands and distributed discretely inside the second groove. The first support body 521 is fixed to the inside of the first groove of the first plate body 501 by welding or other process means, and the second support body 54 is fixed to the inside of the second groove of the second plate body 502 by welding or other process means. The sealed cavity includes a first groove and a second groove.

[0091] The first capillary structure layer 51 can be sintered and fixed to the first plate body 501 and the second plate body 502 through a sintering process. Figure 4 A sintered structure 511 is shown in FIG.

[0092] In the embodiment of the present application, the electronic device includes the capillary structure 5 , so the electronic device also has the above-mentioned technical effect of the capillary structure 5 .

[0093] In the description of this application, it should be noted that in the embodiments of this application, the terms "first", "second", etc. are only used for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first", "second", etc. may explicitly or implicitly include one or more of the features.

[0094] In the description of the embodiments of the present application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, "connected" can be detachably connected or non-detachably connected; it can be directly connected or indirectly connected through an intermediate medium. Among them, "fixed connection" means that the two are connected to each other and the relative position relationship after connection remains unchanged.

[0095] The directional terms mentioned in the embodiments of the present application, such as "inside", "outside", etc., are only referenced to the directions of the drawings. Therefore, the directional terms used are for better and clearer description and understanding of the embodiments of the present application, rather than indicating or implying that the devices or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the embodiments of the present application. In addition, unless otherwise specified in the present application, the "multiple" mentioned in the present application refers to two or more.

[0096] In the description of the embodiments of the present application, the terms "include", "comprises" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also includes other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the sentence "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0097] In the embodiments of the present application, "and / or" is only a description of the association relationship of the associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.

[0098] The above are only preferred implementations of the present application. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the present application. These improvements and modifications should also be regarded as the scope of protection of the present application.

Claims

1. A capillary structure, characterized in that: It includes a shell having a sealed cavity, and a steam flow layer, a first capillary structure layer and a second capillary structure layer are sequentially arranged inside the sealed cavity along the thickness direction of the shell; the steam flow layer has a steam flow channel, and the permeability of the first capillary structure layer is less than the permeability of the second capillary structure layer.

2. The capillary structure according to claim 1, characterized in that: The second capillary structure layer includes at least one first support body, each of which is located between the first capillary structure layer and the inner wall of the shell, and the capillary pores of the second capillary structure layer include gaps between adjacent first support bodies and gaps between the first support body and the inner wall of the shell.

3. The capillary structure according to claim 2, characterized in that: The first support body is a strip-shaped boss. Along the first direction, the second capillary structure layer is arranged with a plurality of groove-shaped flow channels, and the groove-shaped flow channels extend along the second direction. The capillary pores of the second capillary structure layer include the groove-shaped flow channels. The second direction is the arrangement direction from the condensation end to the evaporation end of the capillary structure, and the first direction and the second direction have an angle.

4. The capillary structure according to claim 2, characterized in that: The first support body is a columnar boss, and at least part of the first support body is discretely distributed.

5. The capillary structure according to any one of claims 2 to 4, characterized in that: The first support body includes a first end and a second end along the thickness direction of the shell, the first end is fixedly connected to or integrally formed with the interior of the sealed cavity, and the second end is fixedly connected to or detachably abutted with the first capillary structure layer.

6. The capillary structure according to any one of claims 2 to 5, characterized in that: The steam flow layer includes at least one second support body, and two ends of the second support body along the thickness of the shell are respectively against the shell and the first capillary structure layer.

7. The capillary structure according to any one of claims 2 to 6, characterized in that: The shell includes a first plate body and a second plate body, at least one of which is provided with a groove, the first plate body and the second plate body are circumferentially sealed and fixedly connected to enclose the sealed cavity, the sealed cavity includes the groove, and the first support body is fixedly connected to the first plate body or is integrally formed with the first plate body.

8. The capillary structure according to claim 7, characterized in that: The first plate body has a first groove, the first support body is formed on the bottom wall of the first groove, the second plate body has a second groove, the sealed cavity includes the first groove and the second groove, the peripheral walls of the first groove and the second groove are circumferentially sealed and fixedly connected, the bottom wall of the second groove is also formed with a second support body, and the second support body respectively abuts against the shell and the first capillary structure layer at both ends along the thickness of the shell.

9. The capillary structure according to claim 8, characterized in that: The first support body is formed by an etching process, and the second support body is formed by an etching process.

10. The capillary structure according to any one of claims 7 to 9, characterized in that: The first capillary structure layer is located between the first plate body and the second plate body, and the three are fixed by sintering or welding.

11. The capillary structure according to any one of claims 1 to 10, characterized in that: The first capillary structure layer is a single-layer structure or a multi-layer structure formed by weaving filamentous materials; Alternatively, the first capillary structure layer includes a porous material layer or the first capillary structure layer is a metal powder layer.

12. The capillary structure according to any one of claims 1 to 11, characterized in that: The pore size of the capillary pores of the first capillary structure layer is less than or equal to 0.2 mm; Or / and, the thickness of the first capillary structure layer is less than or equal to 0.06 mm; Or / and, the pore size of the second capillary pore is less than or equal to 1.8 mm; Alternatively or / and, the thickness of the second capillary structure layer may be less than or equal to 0.04 mm.

13. The capillary structure according to any one of claims 1 to 12, characterized in that: The outer wall of the shell also has a heat-conducting gel layer for bonding and fixing with the heat-generating electronic component.

14. An electronic device, characterized in that: The invention comprises a heat-generating electronic component and the capillary structure according to any one of claims 1 to 13, wherein at least a part of the outer wall of the housing located on one side of the second capillary structure layer is in direct or indirect contact with the heat-generating electronic component.

Images