Vamp cooling and shaping equipment

Abstract

The utility model provides vamp cooling and shaping equipment, which belongs to the field of vamp cooling and shaping, and comprises a cooling and shaping component, the cooling and shaping assembly comprises two cooling and shaping lower dies fixed to the base, two moving plates arranged in a sliding mode are arranged on the mounting frame in a penetrating mode, a driving mechanism for driving the two moving plates to synchronously move in different directions is mounted on the mounting frame, and cooling and shaping upper dies are fixedly connected to the bottoms of the two moving plates; a plurality of heat exchange arc-shaped grooves are formed in the upper end of the cooling shaping upper die, and the mounting frame is an inverted U-shaped plate and is welded and fixed to the base. The vamp shaping device can alternatively shape vamps, time is reserved for workers to take and place the vamps, working efficiency is improved, and the vamps can be effectively cooled and shaped by matching the fan and the semiconductor chilling plate with the heat exchange arc-shaped groove.

Description

Technical Field

[0001] The utility model relates to the technical field of shoe upper cooling and shaping, in particular to a shoe upper cooling and shaping device. Background Art

[0002] The prior art publication number is CN113170953B, which is a shoe upper cooling and shaping equipment, including an operating table, a pressing mechanism and a cylinder, wherein the cylinder is installed on the top plate at the upper end of the support rod, the pressing mechanism includes a protective cover, a pair of cooling boxes and a pair of guide pillars, the protective cover is movably arranged on multiple support rods through a pair of limit blocks, the cylinder includes a pressing and shaping lower die and a buffer mechanism, the pressing and shaping lower die is provided with a pair of fixing mechanisms to fix the shoe upper placed on the pressing and shaping lower die; the buffer mechanism is accommodated inside the cylinder, and the buffer mechanism includes a pair of springs, a pair of V-shaped rocker arms, a pair of mounting seats and a buffer device.

[0003] The above-mentioned prior art has the disadvantage that only one shoe upper can be cooled and shaped at a time, that is, the next shoe upper can only be cooled and shaped after the shoe upper is removed after cooling and shaping. This reduces the efficiency of cooling and shaping the shoe upper. For this reason, the present application proposes a shoe upper cooling and shaping device. Utility Model Content

[0004] Aiming at the deficiencies in the prior art, the utility model provides a shoe upper cooling and shaping device.

[0005] The embodiment of the utility model provides a shoe upper cooling and shaping device, comprising:

[0006] A base, to which a mounting frame is fixedly connected;

[0007] Cooling and forming component; the cooling and forming component includes two cooling and forming lower molds fixed on the base, two sliding movable plates are penetrated on the mounting frame, and a driving mechanism for driving the two movable plates to move synchronously and in different directions is installed on the mounting frame. The bottoms of the two movable plates are fixedly connected to the cooling and forming upper molds, and the upper end of the cooling and forming upper molds is provided with multiple heat exchange arc grooves.

[0008] Furthermore, the mounting frame is an inverted U-shaped plate, and the mounting frame is welded and fixed on the base.

[0009] Furthermore, the driving mechanism includes a mounting plate fixed on a mounting frame, a motor is mounted on the mounting plate, a gear is fixedly connected to the output end of the motor, and L-shaped rack plates are fixedly connected to opposite sides of the two movable plates, the gear is located between the two rack plates and the gear is meshed with the two rack plates.

[0010] Furthermore, an extension slot is formed through the mounting frame, and the extension slot is arranged opposite to the rack plate.

[0011] Furthermore, support plates located above the cooling and shaping upper mold are fixed on both sides of the movable plate, a fan opposite to the cooling and shaping upper mold is installed through the support plate, and a semiconductor refrigeration plate is installed at the air inlet end of the fan.

[0012] Furthermore, a heat exchanger is installed at the heating end of the semiconductor refrigeration plate.

[0013] Compared with the prior art, the utility model has the following beneficial effects:

[0014] The utility model can alternately shape the shoe upper, leaving time for workers to take and put materials, thereby improving work efficiency. The fan and semiconductor refrigeration sheet cooperate with the heat exchange arc groove to effectively cool and shape the shoe upper. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a structural schematic diagram of a shoe upper cooling and shaping device described in an embodiment of the utility model.

[0016] Figure 2 It is a rear view of a shoe upper cooling and shaping device described in an embodiment of the utility model.

[0017] Figure 3 It is a schematic diagram of a cooling and shaping upper mold in a shoe upper cooling and shaping device described in an embodiment of the utility model.

[0018] In the above drawings: 1 base, 2 mounting frame, 3 moving plate, 4 rack plate, 5 mounting plate, 6 gear, 7 cooling and shaping upper die, 8 cooling and shaping lower die, 9 heat exchange arc groove, 10 motor, 11 support plate, 12 fan, 13 semiconductor refrigeration plate. DETAILED DESCRIPTION

[0019] The technical solution of the present utility model is further described below in conjunction with the accompanying drawings and embodiments.

[0020] like Figure 1-Figure 3 As shown, the embodiment of the utility model provides a shoe upper cooling and shaping device, comprising:

[0021] A base 1, to which a mounting frame 2 is fixedly connected, the mounting frame 2 being an inverted U-shaped plate, and the mounting frame 2 is welded and fixed on the base 1;

[0022] Cooling and shaping component; the cooling and shaping component includes two cooling and shaping lower molds 8 fixed on the base 1, two sliding movable plates 3 are penetrated on the mounting frame 2, and a driving mechanism for driving the two movable plates 3 to move synchronously and in different directions is installed on the mounting frame 2, and the driving mechanism includes a mounting plate 5 fixed on the mounting frame 2, and a motor 10 is installed on the mounting plate 5, and a gear 6 is fixedly connected to the output end of the motor 10, and L-shaped rack plates 4 are fixedly connected to the opposite sides of the two movable plates 3, respectively, and the gear 6 is located between the two rack plates 4 and the gear 6 is meshed with the two rack plates 4. The motor 10 drives the gear 6 to rotate when it works, and the rotation of the gear 6 drives the two rack plates 4 to move, and the two rack plates 4 move upward and downward respectively, thereby driving the two movable plates 3 to move synchronously and move upward and downward respectively;

[0023] The shoe upper to be shaped is placed on the upper cover of the cooling and shaping lower mold 8, and then the motor 10 is started to move the corresponding cooling and shaping upper mold 7 downward until it is against the shoe upper. The shoe upper can be shaped by the cooperation of the cooling and shaping upper mold 7 and the cooling and shaping lower mold 8. At this time, the other cooling and shaping upper mold 7 is located on the upper side, and the shaped shoe upper can be removed from the cooling and shaping lower mold 8. When the upper inclined surface of one cooling and shaping lower mold 8 is shaped, the upper mold of the other cooling and shaping lower mold 8 is completed and can be removed. In this way, the shoe upper can be alternately shaped, leaving time for the staff to take and put materials, avoiding the disadvantage of low work efficiency caused by the prior art that the shoe upper must be removed after cooling and shaping is completed before the next shoe upper can be cooled and shaped.

[0024] In addition, an extension slot is provided through the mounting frame 2, and the extension slot is arranged opposite to the rack plate 4, so that the moving space of the rack plate 4 can be increased to avoid interference from the mounting frame 2;

[0025] The bottoms of the two movable plates 3 are fixedly connected with a cooling and shaping upper die 7, and a plurality of heat exchange arc grooves 9 are provided at the upper end of the cooling and shaping upper die 7. Support plates 11 located above the cooling and shaping upper die 7 are fixed on both sides of the movable plates 3. A fan 12 opposite to the cooling and shaping upper die 7 is installed through the support plate 11. A semiconductor cooling sheet 13 is installed at the air inlet end of the fan 12, and a heat exchanger is installed at the heating end of the semiconductor cooling sheet 13 to ensure the stable operation of the semiconductor cooling sheet 13.

[0026] When the cooling and molding upper mold 7 and the cooling and molding lower mold 8 cooperate for molding, the fan 12 can blow the air cooled by the cooling end of the semiconductor refrigeration plate 13 to the multiple heat exchange arc grooves 9 on the cooling and molding upper mold 7. The provision of multiple heat exchange arc grooves 9 can increase the contact area with the cold air, so that the cooling and molding upper mold 7 can be better cooled, and then the shoe upper can be effectively cooled and molded.

[0027] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model rather than to limit it. Although the utility model has been described in detail with reference to the preferred embodiments, ordinary technicians in the field should understand that the technical solution of the utility model can be modified or replaced by equivalents without departing from the purpose and scope of the technical solution of the utility model, which should be included in the scope of the claims of the utility model.

Claims

1. A shoe upper cooling and shaping device, characterized in that: include: A base (1), wherein a mounting frame (2) is fixedly connected to the base (1); A cooling and shaping component; the cooling and shaping component comprises two cooling and shaping lower dies (8) fixed on a base (1); two sliding movable plates (3) are provided through the mounting frame (2); a driving mechanism for driving the two movable plates (3) to move synchronously and in different directions is installed on the mounting frame (2); the bottoms of the two movable plates (3) are fixedly connected to a cooling and shaping upper die (7); and the upper end of the cooling and shaping upper die (7) is provided with a plurality of heat exchange arc grooves (9).

2. A shoe upper cooling and shaping device according to claim 1, characterized in that: in: The mounting frame (2) is an inverted U-shaped plate, and the mounting frame (2) is welded and fixed on the base (1).

3. The shoe upper cooling and shaping device according to claim 1, characterized in that: in: The driving mechanism comprises a mounting plate (5) fixed on a mounting frame (2), a motor (10) being mounted on the mounting plate (5), an output end of the motor (10) being fixedly connected to a gear (6), and L-shaped rack plates (4) being fixedly connected to opposite sides of the two moving plates (3), the gear (6) being located between the two rack plates (4) and the gear (6) being meshed with the two rack plates (4).

4. The shoe upper cooling and shaping device according to claim 3, characterized in that: in: An extension groove is provided through the mounting frame (2), and the extension groove is arranged opposite to the rack plate (4).

5. The shoe upper cooling and shaping device according to claim 1, characterized in that: in: Support plates (11) located above the cooling and shaping upper mold (7) are fixed on both sides of the movable plate (3); a fan (12) opposite to the cooling and shaping upper mold (7) is installed through the support plate (11); and a semiconductor cooling plate (13) is installed at the air inlet end of the fan (12).

6. The shoe upper cooling and shaping device according to claim 5, characterized in that: in: A heat exchanger is installed at the heating end of the semiconductor refrigeration sheet (13).

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