Novel electrolytic machining device capable of discharging electrolytic products

Abstract

The utility model discloses a novel electrolytic machining device capable of discharging electrolytic products. The novel electrolytic machining device comprises a base, an electrolytic bath arranged on the base, an electrolytic machining device body and a vertical feeding device used for driving the electrolytic machining device body to move vertically. The electrolytic bath is positioned below the electrolytic machining device; the electrochemical machining device comprises a mounting base, a tool electrode arranged in the mounting base and high-frequency vibration modules arranged on the two sides of the tool electrode. The tool electrode is installed on the connecting base, and the two sides of the connecting base are connected with the high-frequency vibration modules on the two sides respectively. The high-frequency vibration module is used for generating high-frequency vibration and transmitting vibration waves to the tool electrode. According to the novel electrochemical machining device, the tool electrode can be promoted to generate micron-sized vibration in the vertical direction or the horizontal direction, so that the product discharge capacity and discharge efficiency of a flow field are improved, the conductivity fluctuation in a gap is reduced, and the size consistency of a microstructure is improved.

Description

Technical Field

[0001] The utility model belongs to the field of electrolytic processing, and in particular relates to a novel electrolytic processing device capable of discharging electrolytic products. Background Art

[0002] During the electrolytic machining process, hydrogen ions gain electrons and precipitate hydrogen on the cathode surface, while metal elements lose electrons, causing corrosion and oxidation at the anode to generate flocculent electrolytic products. Bubbles and flocculent electrolytic products are mixed in the electrolyte, so that in the actual electrolytic machining process, a three-phase flow consisting of gas phase, liquid phase and solid phase flows through the machining gap. At the same time, due to the resistance loss of the electrolyte, Joule heat will be generated in the electrolyte, and the electrochemical reaction during the machining process will also release some heat, which will affect the temperature field distribution in the machining gap. In addition, during the electrolytic machining process, the accumulation of bubble products will have a certain effect on the conductivity in the gap, thereby making the flow field and electric field distribution in the machining gap uneven, which is easy to cause some distortions, especially at the entrance and exit of the machining gap, the flow field parameters are prone to change sharply, and the volume content of the electrolytic products will also change greatly, making the electrolyte conductivity distribution uneven, which will reduce the machining accuracy and surface quality of electrolytic machining.

[0003] Therefore, if the electrolysis products including bubbles cannot be discharged from the processing gap in time, the anode surface of the workpiece will gradually be covered by tiny bubbles, hindering the further progress of the electrochemical reaction, thereby reducing the processing efficiency. Utility Model Content

[0004] In order to overcome the deficiencies of the prior art, the utility model provides a novel electrolytic processing device capable of discharging electrolytic products, wherein the novel electrolytic processing device can improve the product discharge capacity and discharge efficiency of the flow field, thereby reducing the conductivity fluctuation in the gap, and further facilitating improving the dimensional consistency of the microstructure.

[0005] The technical solution of the utility model to solve the above technical problems is:

[0006] A novel electrolytic processing device capable of discharging electrolytic products comprises a base, an electrolytic cell arranged on the base, an electrolytic processing device and a vertical feeding device for driving the electrolytic processing device to perform vertical movement, wherein the electrolytic cell is located below the electrolytic processing device; the electrolytic processing device comprises a mounting seat, a tool electrode arranged in the mounting seat and high-frequency vibration modules arranged on both sides of the tool electrode, wherein the tool electrode is mounted on a connecting seat, and both sides of the connecting seat are respectively connected to the output ends of the high-frequency vibration modules on both sides; the high-frequency vibration module is used to generate vibration waves and transmit the vibration waves to the tool electrode.

[0007] Preferably, the high-frequency vibration module includes a base plate, a cover plate, a flexible hinge displacement amplification mechanism arranged between the base plate and the cover plate, and a driver for driving the flexible hinge displacement amplification mechanism to move, wherein the flexible hinge amplification mechanism includes a first-level lever amplification mechanism, a first-level triangular amplification mechanism and a second-level triangular amplification mechanism, wherein the first-level lever amplification mechanism is divided into two groups, and the two groups of first-level lever amplification mechanisms are symmetrically arranged; the driving end of the first-level triangular amplification mechanism is connected to the two groups of first-level lever amplification mechanisms; and the two ends of the second-level triangular amplification mechanism are respectively connected to the driving ends of the two groups of first-level lever amplification mechanisms.

[0008] Preferably, the first-level amplification mechanism includes a horizontally arranged first-level horizontal flexible hinge and a vertically arranged first-level vertical flexible hinge; the bottom of the first-level vertical flexible hinge is connected to the end of the first-level horizontal flexible hinge, and a first-level connecting block is arranged in the middle position of the first-level vertical flexible hinge, and the first-level connecting block is connected to the first-level vertical flexible hinge.

[0009] Preferably, the first-level triangular amplifying mechanism includes two groups of first-level triangular flexible hinges symmetrically arranged up and down; the first-level triangular flexible hinge includes a driving block and a first-level flexible connecting rod arranged on the left and right sides of the driving block, wherein one end of the flexible connecting rod is connected to the driving block, and the other side is connected to the first-level connecting block; the driver is located between the upper and lower groups of first-level triangular flexible hinges, and the upper and lower driving ends of the driver are respectively connected to the two groups of driving blocks.

[0010] Preferably, the secondary triangular amplification mechanism includes a secondary connecting block and a secondary flexible connecting rod arranged on the left and right sides of the secondary connecting block, wherein the two sides of the secondary flexible connecting rod are respectively connected to the top of the primary vertical flexible hinge and the secondary connecting block; and the secondary connecting block is connected to the connecting seat.

[0011] Preferably, the connecting seat is located at the bottom of the mounting seat.

[0012] Preferably, the driver is piezoelectric ceramic.

[0013] Preferably, the base is a porous vibration isolation base; the porous vibration isolation base includes an upper support plate, a lower support plate and a shock absorbing block arranged between the upper support plate and the lower support plate, wherein the upper support plate is provided with a plurality of array-arranged mounting holes.

[0014] Preferably, the vertical feeding device includes a bracket, a lifting platform arranged on the bracket, and a lifting drive mechanism for driving the lifting platform to move vertically, wherein the bracket is installed on the base; the lifting motor is installed on the bracket through a motor frame; the lifting drive mechanism includes a lifting motor and a screw transmission mechanism, wherein the main shaft of the lifting motor is connected to the screw in the screw transmission mechanism, and the screw nut in the screw transmission mechanism is installed on the lifting platform.

[0015] Preferably, it also includes a control module for controlling the input current of the piezoelectric ceramic, and the control module includes a single chip microcomputer and its auxiliary circuit structure.

[0016] Compared with the prior art, the utility model has the following advantages and beneficial effects:

[0017] The novel electrolytic machining device of the utility model generates high-frequency vibration through a high-frequency vibration module, and the generated high-frequency vibration is transmitted to the tool electrode through a connecting seat. Under the premise of almost no influence on the machining effect, the tool electrode is caused to vibrate in a micron size in the vertical direction or horizontal direction, and the shear force generated by the high-frequency vibration is used to improve the product discharge capacity and discharge efficiency of the flow field, reduce the conductivity fluctuation in the gap, and thus help to improve the size consistency of the microstructure. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a three-dimensional diagram of a novel electrolytic processing device capable of discharging electrolytic products according to the utility model.

[0019] Figure 2 It is a side view.

[0020] Figure 3 This is a front view of the electrolytic machining device (without the mounting base).

[0021] Figure 4 Schematic diagram of the internal structure of the high-frequency vibration device.

[0022] Figure 5 It is a structural schematic diagram of the flexible hinge displacement amplification mechanism.

[0023] Figure 6 Solid mechanics simulation diagram of the flexible hinge displacement amplification mechanism.

[0024] Figure 7 Input and output displacement curves of the flexible hinge displacement amplification mechanism.

[0025] Figure 8 This is a structural block diagram of a novel electrolytic processing device capable of discharging electrolytic products according to the utility model.

[0026] Fig. 9This is a processing principle diagram of a novel electrolytic processing device capable of discharging electrolytic products according to the utility model. DETAILED DESCRIPTION

[0027] The present invention is further described in detail below in conjunction with embodiments and drawings, but the implementation manner of the present invention is not limited thereto.

[0028] Example 1

[0029] See also Figure 1-Figure 9 The new electrolytic processing device 3 capable of dissolving electrolytic products of the utility model comprises a base 1, an electrolytic cell 4 arranged on the base 1, an electrolytic processing device 3 and a vertical feeding device 2 for driving the electrolytic processing device 3 to perform vertical movement, wherein the electrolytic cell 4 is located below the electrolytic processing device 3; the electrolytic processing device 3 comprises a mounting seat 301, a tool electrode 302 arranged in the mounting seat 301 and a high-frequency vibration module 5 arranged on both sides of the tool electrode 302, wherein the tool electrode 302 is mounted on a connecting seat 6, the connecting seat 6 is located at the bottom of the mounting seat 301, and the two sides of the connecting seat 6 are respectively connected to the high-frequency vibration modules 5 on both sides; the high-frequency vibration module 5 is used to generate high-frequency vibration, and transmit the high-frequency vibration to the tool electrode 302 through the connecting seat 6, so as to cause the tool electrode 302 to vibrate.

[0030] See also Figure 1-Figure 9 The high-frequency vibration module 5 includes a base plate, a cover plate, a flexible hinge displacement amplification mechanism arranged between the base plate and the cover plate, and a driver for driving the flexible hinge displacement amplification mechanism to move; wherein, in this embodiment, the driver is a piezoelectric ceramic 7.

[0031] In this embodiment, according to the main principle of the flexible hinge displacement amplification mechanism, it can be divided into three types: lever amplification principle, triangle amplification principle and buckling amplification principle; wherein each of the three amplification methods has its own characteristics:

[0032] (1) The lever amplification structure is simple, the number of flexible hinges is small, the amplification factor is large, and it is widely used; however, the larger the amplification factor, the larger the structure size, which makes it difficult to coordinate the whole.

[0033] (2) The displacement output of the triangular amplification is related to the oblique angle of the inclined rod. The structure of the triangular amplification is relatively compact, and the amplification factor and the structural stress have a mutually restrictive relationship. However, there is a problem that the amplification factor and the maximum stress are difficult to balance and coordinate;

[0034] (3) Buckling amplification is generally used for the writing of thin plates or shells, and its amplification factor is nonlinear.

[0035] To this end, in combination with the above three amplification methods, a flexible hinge displacement amplification mechanism of this embodiment is designed, which includes a primary lever amplification mechanism, a primary triangular amplification mechanism and a secondary triangular amplification mechanism, wherein the primary lever amplification mechanism is divided into two groups, and the two groups of primary lever amplification mechanisms are symmetrically arranged; the driving end of the primary triangular amplification mechanism is connected to the two groups of primary lever amplification mechanisms; the two ends of the secondary triangular amplification mechanism are respectively connected to the driving ends of the two groups of primary lever amplification mechanisms; wherein,

[0036] The primary amplification mechanism includes a primary horizontal flexible hinge 501 arranged horizontally and a primary vertical flexible hinge 502 arranged vertically; the bottom of the primary vertical flexible hinge 502 is connected to the end of the primary horizontal flexible hinge 501, and a primary connecting block 503 is arranged in the middle of the primary vertical flexible hinge 502, and the primary connecting block 503 is connected to the primary vertical flexible hinge 502;

[0037] The first-level triangular amplification mechanism includes two groups of first-level triangular flexible hinges symmetrically arranged in an upper and lower manner, wherein the first-level triangular flexible hinge includes a driving block 504 and a first-level flexible connecting rod 505 arranged on the left and right sides of the driving block 504, wherein one end of the flexible connecting rod is connected to the driving block 504, and the other side is connected to the first-level connecting block 503; the driver is located between the upper and lower groups of first-level triangular flexible hinges, and the upper and lower driving ends of the driver are respectively connected to the two groups of driving blocks 504;

[0038] The secondary triangular amplification mechanism includes a secondary connecting block 507 and a secondary flexible connecting rod 506 arranged on the left and right sides of the secondary connecting block 507, and the two sides of the secondary flexible connecting rod 506 are respectively connected to the top of the primary vertical flexible hinge 502 and the secondary connecting block 507; the secondary connecting block 507 is connected to the connecting seat 6.

[0039] Through the above arrangement, when the piezoelectric ceramic 7 is energized, it will drive the driving block 504 to move vertically, and through the primary lever amplification mechanism, the primary triangular amplification mechanism and the secondary triangular amplification mechanism, the displacement is amplified, that is, the vertical displacement of the secondary connecting block 507 in the secondary triangular amplification mechanism will be significantly greater than the deformation of the piezoelectric ceramic 7. With the vertical reciprocating motion of the secondary connecting block 507, high-frequency vibration is generated and transmitted to the tool electrode 302 through the connecting seat 6, so that the tool electrode 302 also generates vertical vibration.

[0040] See also Figure 6 and Figure 7In order to verify the effect of the flexible hinge displacement amplification mechanism in this embodiment, solid mechanics simulation was performed in COMSOL. The selected material was 7075 aluminum. The maximum stress of the flexible hinge displacement amplification mechanism and the amplification factor of the flexible hinge displacement amplification mechanism were simulated and analyzed. During the simulation process, the four ends of the flexible hinge displacement amplification mechanism were fixed, and the piezoelectric ceramic 7 was simulated to input a displacement of a specified size to the two ends of the flexible hinge displacement amplification mechanism; wherein the input displacement is an input quantity x that is sinusoidally transformed with time, and its time-varying formula is as follows:

[0041] x = A + A × cos (π + 2πt / T);

[0042] First, a sinusoidal input vibration with a maximum displacement of 10μm is input to both ends of the piezoelectric ceramic 7 according to the sinusoidal law, and the maximum stress of the overall amplified structure is 264MPa. The maximum stress of the structure is at the left and right corners of the triangular structure where the piezoelectric ceramic 7 is installed. This slender part needs to reciprocate for a long time to squeeze and stretch the thick levers on both sides, so it is the place with the greatest stress in the whole structure. However, even the place with the greatest stress is far less than the maximum yield limit of 455MP of 7075 aluminum, the manufacturing material of the flexible hinge; Next, the amplification factor of the flexible hinge displacement amplification mechanism is simulated in COMSOL. First, a sinusoidal input vibration with a maximum displacement of 10μm is input to both ends of the piezoelectric ceramic 7 according to the sinusoidal law. By measuring the output end, it can be found that the output displacement is 108μm, and the amplification factor is 108 / 20=5.4 times, which meets the amplification requirements.

[0043] See also Figure 1-Figure 9 The base 1 is a porous vibration isolation base 1; the porous vibration isolation base 1 includes an upper support plate 103, a lower support plate 101 and a shock absorbing block 102 arranged between the upper support plate 103 and the lower support plate 101, wherein the shock absorbing block 102 is divided into four groups, and the four groups of shock absorbing blocks 102 are divided into four diagonals located at the upper support plate 103 and the lower support plate 101, thereby playing a shock absorbing role; the upper support plate 103 is provided with a plurality of array-arranged mounting holes to facilitate the installation of other processing modules.

[0044] See also Figure 1-Figure 9The vertical feeding device 2 includes a bracket 201, a lifting platform 202 arranged on the bracket 201, and a lifting drive mechanism for driving the lifting platform 202 to move vertically, wherein the bracket 201 is installed on the base 1; the lifting drive mechanism includes a lifting motor 203 and a screw transmission mechanism 204, wherein the lifting motor 203 is installed on the bracket 201 through a motor frame; the main shaft of the lifting motor 203 is connected to the screw in the screw transmission mechanism 204, and the screw nut in the screw transmission mechanism 204 is installed on the lifting platform 202; the mounting seat 301 is installed on the lifting platform 202. The lifting motor 203 drives the screw transmission mechanism 204 to work, thereby driving the lifting platform 202 to move up and down, thereby driving the electrolytic processing device 3 to move up and down.

[0045] See also Figure 1-Figure 9 The novel electrolytic processing device 3 capable of dissolving electrolytic products of the utility model further comprises a control module for controlling the input current of the piezoelectric ceramic 7, wherein the control module comprises a single chip microcomputer and its accessory circuit structure; the current input into the piezoelectric ceramic is controlled by the single chip microcomputer and its accessory circuit structure.

[0046] See also Figure 1-Figure 9 The novel electrolytic processing device 3 of the utility model capable of dissolving electrolytic products further comprises a power module, the positive electrode of the power module is connected to the tool electrode 302 , and the negative electrode is connected to the electrolytic cell 4 in the electrolytic cell 4 .

[0047] Example 2

[0048] The difference between this embodiment and embodiment 1 is that the two groups of high-frequency vibration modules 5 in this embodiment are both arranged horizontally (ie, the installation direction is perpendicular to that of embodiment 1), thereby generating high-frequency vibration in the horizontal direction, causing the tool electrode 302 to vibrate horizontally.

[0049] Example 3

[0050] The difference between this embodiment and embodiment 1 is that the high-frequency vibration module 5 in this embodiment is respectively arranged horizontally and vertically, so as to generate high-frequency vibrations in the horizontal and vertical directions, and the corresponding high-frequency vibration module 5 can be selected to work as needed to cause the tool electrode 302 to vibrate horizontally or vertically, or a composite vibration of horizontal and vertical vibrations.

[0051] The above is a preferred implementation mode of the present invention, but the implementation mode of the present invention is not limited by the above content. Any other changes, modifications, substitutions, combinations, and simplifications that do not deviate from the spirit and principle of the present invention should be equivalent replacement methods and are included in the protection scope of the present invention.

Claims

1. A novel electrolytic processing device capable of discharging electrolytic products, characterized in that: The invention comprises a base, an electrolytic cell arranged on the base, an electrolytic machining device and a vertical feeding device for driving the electrolytic machining device to perform vertical movement, wherein the electrolytic cell is located below the electrolytic machining device; the electrolytic machining device comprises a mounting seat, a tool electrode arranged in the mounting seat and high-frequency vibration modules arranged on both sides of the tool electrode, wherein the tool electrode is mounted on a connecting seat, and both sides of the connecting seat are respectively connected to output ends of the high-frequency vibration modules on both sides; the high-frequency vibration module is used to generate a vibration wave and transmit the vibration wave to the tool electrode; The high-frequency vibration module includes a base plate, a cover plate, a flexible hinge displacement amplification mechanism arranged between the base plate and the cover plate, and a driver for driving the flexible hinge displacement amplification mechanism to move, wherein the flexible hinge amplification mechanism includes a primary lever amplification mechanism, a primary triangular amplification mechanism and a secondary triangular amplification mechanism, wherein the primary lever amplification mechanism is divided into two groups, and the two groups of primary lever amplification mechanisms are symmetrically arranged; the driving end of the primary triangular amplification mechanism is connected to the two groups of primary lever amplification mechanisms; and the two ends of the secondary triangular amplification mechanism are respectively connected to the driving ends of the two groups of primary lever amplification mechanisms.

2. The novel electrolytic processing device capable of discharging electrolytic products according to claim 1 is characterized in that: The first-level lever amplification mechanism includes a horizontally arranged first-level horizontal flexible hinge and a vertically arranged first-level vertical flexible hinge; the bottom of the first-level vertical flexible hinge is connected to the end of the first-level horizontal flexible hinge, and a first-level connecting block is arranged in the middle position of the first-level vertical flexible hinge, and the first-level connecting block is connected to the first-level vertical flexible hinge.

3. The novel electrolytic processing device capable of discharging electrolytic products according to claim 2 is characterized in that: The first-level triangular amplification mechanism includes two groups of first-level triangular flexible hinges symmetrically arranged in the upper and lower parts; the first-level triangular flexible hinge includes a driving block and a first-level flexible connecting rod arranged on the left and right sides of the driving block, wherein one end of the flexible connecting rod is connected to the driving block, and the other side is connected to the first-level connecting block; the driver is located between the upper and lower groups of first-level triangular flexible hinges, and the upper and lower driving ends of the driver are respectively connected to the two groups of driving blocks.

4. The novel electrolytic processing device capable of discharging electrolytic products according to claim 3 is characterized in that: The secondary triangular amplification mechanism includes a secondary connecting block and a secondary flexible connecting rod arranged on the left and right sides of the secondary connecting block, wherein the two sides of the secondary flexible connecting rod are respectively connected to the top of the primary vertical flexible hinge and the secondary connecting block; the secondary connecting block is connected to the connecting seat.

5. The novel electrolytic processing device capable of discharging electrolytic products according to claim 1 is characterized in that: The connecting seat is located at the bottom of the mounting seat.

6. The novel electrolytic processing device capable of discharging electrolytic products according to claim 4 is characterized in that: The driver is piezoelectric ceramic.

7. The novel electrolytic processing device capable of discharging electrolytic products according to claim 1 is characterized in that: The base is a porous vibration isolation base; the porous vibration isolation base includes an upper support plate, a lower support plate and a shock absorbing block arranged between the upper support plate and the lower support plate, wherein the upper support plate is provided with a plurality of array-arranged mounting holes.

8. The novel electrolytic processing device capable of discharging electrolytic products according to claim 1 is characterized in that: The vertical feeding device includes a bracket, a lifting platform arranged on the bracket, and a lifting drive mechanism for driving the lifting platform to move vertically, wherein the bracket is installed on the base; the lifting drive mechanism includes a lifting motor and a screw transmission mechanism, wherein the lifting motor is installed on the bracket through a motor frame; the main shaft of the lifting motor is connected to the screw in the screw transmission mechanism, and the screw nut in the screw transmission mechanism is installed on the lifting platform.

9. The novel electrolytic processing device capable of discharging electrolytic products according to claim 6 is characterized in that: It also includes a control module for controlling the input current of the piezoelectric ceramic, and the control module includes a single chip microcomputer and its auxiliary circuit structure.

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