Vehicle-mounted electronic device packaging injection mold

Abstract

The utility model relates to the technical field of packaging injection molding, and discloses a vehicle-mounted electronic device packaging injection mold which comprises a working table, an upper mold is fixedly installed at the lower end of a hydraulic rod, a through hole is formed in the middle of the upper surface of the upper mold, a vertical plate is fixedly installed on the upper surface of the upper mold, and a positive and negative screw rod is movably installed on the adjacent surface of the vertical plate. A servo motor is fixedly mounted on the right surface of the vertical plate, a limiting block is in threaded connection with the outer surface of the forward and reverse screw rod, a discharging pipe is movably mounted on the inner wall of the through hole, a mounting plate is fixedly mounted on the outer surface of the discharging pipe, and a threaded through barrel is fixedly mounted at the lower end of the conveying pipe; through cooperative arrangement of the through hole, the vertical plate, the positive and negative screw rod, a servo motor, a limiting block, a discharging pipe, a mounting plate, a conveying pipe and a threaded through barrel, the effect that the discharging pipe can be conveniently replaced is achieved, and the situation that due to the fact that the same discharging pipe is used for a long time, the interior of the discharging pipe is blocked, discharging is uneven, and even discharging cannot be achieved is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of packaging injection molding, in particular to a packaging injection molding mold for vehicle-mounted electronic devices. Background Art

[0002] Packaging is the process of assembling integrated circuits into final chip products. Simply put, it is to place the integrated circuit die produced by the foundry on a substrate that serves as a carrier, lead out the pins, and then fix the package into a whole. Injection molding refers to the method of using plastic molding molds to make thermoplastic plastics or thermosetting materials into plastic products of various shapes. In the processing of automotive electronic devices, packaging injection molding is particularly important.

[0003] In the process of encapsulating and injecting automotive electronic devices, since the injection liquid is basically a relatively viscous liquid, it will adhere to the inner wall of the discharge pipe during the discharge process, causing the discharge rate of the discharge pipe to slow down or even cause blockage. The traditional way is to replace the injection port, and the replacement method is to replace it in the form of bolts, which is time-consuming. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides an injection mold for encapsulating vehicle-mounted electronic devices to solve the problem mentioned in the above background technology that the injection port cannot be easily replaced, resulting in a slow material discharge rate at the injection port or even blockage and unusability.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: an injection mold for encapsulating vehicle-mounted electronic devices, comprising a workbench, a support column is fixedly installed on the upper surface of the workbench, a top plate is fixedly installed on the upper end of the support column, a hydraulic rod is fixedly installed on the lower surface of the top plate, an upper mold is fixedly installed on the lower end of the hydraulic rod, a through hole is opened in the middle of the upper surface of the upper mold, a vertical plate is fixedly installed on the upper surface of the upper mold, positive and negative screw rods are movably installed on the adjacent surfaces of the vertical plate, a servo motor is fixedly installed on the right surface of the vertical plate, the outer surfaces of the positive and negative screw rods are threadedly connected to a limiting block, a discharge pipe is movably installed on the inner wall of the through hole, a mounting plate is fixedly installed on the outer surface of the discharge pipe, a feed pipe is fixedly installed in the middle of the top plate, and a threaded barrel is fixedly installed on the lower end of the feed pipe.

[0006] Preferably, a telescopic rod is fixedly installed on the lower surface of the top plate, slide slot holes are provided on the left and right surfaces of the upper mold, a slider is movably installed on the inner wall of the slide slot hole, a support frame is movably installed on the inner wall of the upper mold, a lower mold is fixedly installed on the upper surface of the workbench, and a groove is provided on the lower inner wall of the lower mold.

[0007] Preferably, a support frame is fixedly mounted on the upper surface of the top plate, a material barrel is fixedly mounted on the upper surface of the support frame, and the interior of the material barrel and the interior of the material delivery pipe are interconnected.

[0008] Preferably, plate grooves are provided on the left and right sides of the through hole, the inner wall of the plate groove is movably connected to the outer surface of the limit block, the output end of the servo motor is fixedly installed on the right end of the forward and reverse screw rods, the lower end of the discharge pipe is provided with an injection port, and the inner wall of the upper end of the discharge pipe is provided with a thread.

[0009] Preferably, the lower end of the telescopic rod is fixedly connected to the upper surface of the slider, the adjacent surfaces of the slider are fixedly connected to the left and right surfaces of the support frame, and the thickness of the support frame wall matches the width of the groove.

[0010] Compared with the prior art, the beneficial effects of the utility model are:

[0011] 1. The vehicle-mounted electronic device packaging injection mold achieves the effect of convenient replacement of the discharge pipe through the coordinated arrangement of through holes, vertical plates, positive and negative screw rods, servo motors, limit blocks, discharge pipes, mounting plates, feed pipes, and threaded barrels, thereby avoiding long-term use of the same discharge pipe, which causes blockage inside the discharge pipe, resulting in uneven discharge or even failure to discharge.

[0012] 2. The vehicle-mounted electronic device packaging injection mold achieves the effect of packaging and injection molding of electronic devices of different thickness specifications through the coordinated arrangement of the telescopic rod, the slide slot hole, the slider, the support frame, the lower mold, and the groove. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the three-dimensional structure of the utility model;

[0014] Figure 2 This is a schematic diagram of the three-dimensional structure of the upper surface of the upper mold of the utility model;

[0015] Figure 3 It is a schematic diagram of the three-dimensional structure of the upper and lower mold sections of the utility model.

[0016] In the figure: 1. workbench; 2. support column; 3. top plate; 4. hydraulic rod; 5. upper mold; 6. through hole; 7. vertical plate; 8. positive and negative screw rods; 9. servo motor; 10. limit block; 11. discharge pipe; 12. mounting plate; 13. feed pipe; 14. threaded barrel; 15. telescopic rod; 16. slide hole; 17. slider; 18. support frame; 19. lower mold; 20. groove; 21. support frame; 22. material barrel. DETAILED DESCRIPTION

[0017] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0018] Embodiment 1:

[0019] Please refer to Figure 1-3 A vehicle-mounted electronic device packaging injection mold comprises a workbench 1, a support column 2 is fixedly installed on the upper surface of the workbench 1, a top plate 3 is fixedly installed on the upper end of the support column 2, a hydraulic rod 4 is fixedly installed on the lower surface of the top plate 3, an upper mold 5 is fixedly installed on the lower end of the hydraulic rod 4, a through hole 6 is opened in the middle of the upper surface of the upper mold 5, a vertical plate 7 is fixedly installed on the upper surface of the upper mold 5, positive and negative screw rods 8 are movably installed on the adjacent surfaces of the vertical plate 7, a servo motor 9 is fixedly installed on the right surface of the vertical plate 7, the outer surface of the positive and negative screw rods 8 are threadedly connected to a limiting block 10, a discharge pipe 11 is movably installed on the inner wall of the through hole 6, a mounting plate 12 is fixedly installed on the outer surface of the discharge pipe 11, a feed pipe 13 is fixedly installed in the middle of the top plate 3, and a threaded barrel 14 is fixedly installed on the lower end of the feed pipe 13.

[0020] Specifically: the support column 2 only has a supporting function to support the top plate 3. The four support columns 2 make it more stable. The hydraulic rod 4 drives the upper mold 5 to move downward for injection molding. The function of the through hole 6 is to install the discharge pipe 11. The discharge pipe 11 is interconnected with the interior of the material barrel 22 through the feed pipe 13, so as to transport the material to the surface of the electronic device for injection molding. The servo motor 9 drives the forward and reverse screws 8 to rotate, thereby driving the limit block 10 to move away from or towards each other, thereby completing the limitation of the mounting plate 12.

[0021] In this embodiment, a support frame 21 is fixedly mounted on the upper surface of the top plate 3, and a material barrel 22 is fixedly mounted on the upper surface of the support frame 21. The interior of the material barrel 22 and the interior of the feed pipe 13 are mutually connected.

[0022] Specifically, the function of the support frame 21 is to support the material barrel 22 to make it more stable. The material barrel 22 transports the material to the discharge pipe 11 through the feed pipe 13 for injection molding.

[0023] In this embodiment: plate grooves are provided on the left and right sides of the through hole 6, the inner wall of the plate grooves is movably connected to the outer surface of the limit block 10, the output end of the servo motor 9 is fixedly installed to the right end of the forward and reverse screw rods 8, the lower end of the discharge pipe 11 is provided with an injection port, and the upper inner wall of the discharge pipe 11 is provided with a thread.

[0024] Specifically: the plate groove is used to limit the mounting plate 12, and the plate groove restricts the mounting plate 12 from moving forward, backward, left and right. The discharge pipe 11 transports the material to the injection port for injection molding. The thread is designed to connect the thread barrel 14 and the discharge pipe 11, so that the two can be connected to each other.

[0025] Working principle: When the equipment needs to replace the injection head after encapsulation injection molding, first start the servo motor 9 to drive the forward and reverse screw rods 8 to rotate clockwise, and the forward and reverse screw rods 8 rotate clockwise, thereby driving the limit blocks 10 to move away from each other until the distance between the two limit blocks 10 is greater than the length of the farthest distance between the two sides of the mounting plate 12, and then stop moving. At this time, hold the discharge pipe 11 and the delivery pipe 13, twist the discharge pipe 11, so as to separate the upper end of the discharge pipe 11 from the lower end of the delivery pipe 13, and then take out the discharge pipe 11 upwards after separation, and replace it with a new discharge pipe 1 1, the discharge pipe 11 is put back into the inner wall of the through hole 6, and the mounting plate 12 completely enters the interior of the plate groove. At this time, the servo motor 9 reverses according to the above principle, and the forward and reverse screw rods 8 rotate counterclockwise, so as to limit the mounting plate 12 again and complete the replacement of the discharge pipe 11. Compared with the related art, the vehicle-mounted electronic device packaging injection mold provided by the utility model has the following beneficial effects: the design can realize the effect of convenient replacement of the discharge pipe 11, avoid long-term use of the same discharge pipe 11, and avoid blockage inside the discharge pipe 11, which leads to uneven discharge or even failure of discharge.

[0026] Embodiment 2:

[0027] Please refer to Figure 1-3 A telescopic rod 15 is fixedly installed on the lower surface of the top plate 3, a slide slot hole 16 is opened on the left and right surfaces of the upper mold 5, a slider 17 is movably installed on the inner wall of the slide slot hole 16, a support frame 18 is movably installed on the inner wall of the upper mold 5, a lower mold 19 is fixedly installed on the upper surface of the workbench 1, and a groove 20 is opened on the lower inner wall of the lower mold 19.

[0028] Specifically: the telescopic rod 15 is used to drive the support frame 18 to move up and down, the slider 17 and the slide groove are designed to make the support frame 18 more stable during movement, and the groove 20 is used to position and limit the support frame 18 to prevent it from pressing on electronic devices.

[0029] In this embodiment: the lower end of the telescopic rod 15 is fixedly connected to the upper surface of the slider 17 , the adjacent surface of the slider 17 is fixedly connected to the left and right surfaces of the support frame 18 , and the thickness of the frame wall of the support frame 18 matches the width of the groove 20 .

[0030] Specifically, when the support frame 18 moves downward, the lower surface of the support frame 18 will enter the inner wall of the groove 20, thereby limiting the support frame 18 and making it more stable.

[0031] Working principle: When facing electronic devices of different thicknesses, after the upper mold 5 and the lower mold 19 are fitted together, the telescopic rod 15 is started, driving the slider 17 to move downward, and the movement of the slider 17 drives the support frame 18 to move downward. At this time, the lower end of the support frame 18 protrudes from the lower surface of the upper mold 5, thereby supporting the upper mold 5 away from the electronic devices, thereby facilitating injection molding. Compared with related technologies, the utility model provides a vehicle-mounted electronic device packaging injection mold with the following beneficial effects: This design can achieve the effect of packaging and injection molding of electronic devices of different thickness specifications.

[0032] The controller is an existing structure, and the control circuit can be implemented through simple programming by technicians in this field. It belongs to the common knowledge in this field. It is only used without modification, so the control method and circuit connection are not described in detail.

[0033] The above-mentioned equipment is used in different ways for each device. It is selected and used according to actual conditions, and various parameters are referred to, in accordance with the functions of the equipment used and the effects achieved.

[0034] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An injection mold for encapsulating an in-vehicle electronic device, comprising a workbench (1), characterized in that: A support column (2) is fixedly mounted on the upper surface of the workbench (1), a top plate (3) is fixedly mounted on the upper end of the support column (2), a hydraulic rod (4) is fixedly mounted on the lower surface of the top plate (3), an upper mold (5) is fixedly mounted on the lower end of the hydraulic rod (4), a through hole (6) is opened in the middle of the upper surface of the upper mold (5), a vertical plate (7) is fixedly mounted on the upper surface of the upper mold (5), positive and negative screw rods (8) are movably mounted on adjacent surfaces of the vertical plate (7), a servo motor (9) is fixedly mounted on the right surface of the vertical plate (7), the outer surfaces of the positive and negative screw rods (8) are threadedly connected to a limiting block (10), a discharge pipe (11) is movably mounted on the inner wall of the through hole (6), a mounting plate (12) is fixedly mounted on the outer surface of the discharge pipe (11), a feed pipe (13) is fixedly mounted in the middle of the top plate (3), and a threaded barrel (14) is fixedly mounted on the lower end of the feed pipe (13).

2. The vehicle-mounted electronic device packaging injection mold according to claim 1, characterized in that: A telescopic rod (15) is fixedly mounted on the lower surface of the top plate (3); a slide slot hole (16) is provided on the left and right surfaces of the upper mold (5); a slider (17) is movably mounted on the inner wall of the slide slot hole (16); a support frame (18) is movably mounted on the inner wall of the upper mold (5); a lower mold (19) is fixedly mounted on the upper surface of the workbench (1); and a groove (20) is provided on the lower inner wall of the lower mold (19).

3. The vehicle-mounted electronic device packaging injection mold according to claim 1, characterized in that: A support frame (21) is fixedly mounted on the upper surface of the top plate (3), and a material barrel (22) is fixedly mounted on the upper surface of the support frame (21), wherein the interior of the material barrel (22) and the interior of the material conveying pipe (13) are interconnected.

4. The vehicle-mounted electronic device packaging injection mold according to claim 1, characterized in that: Plate grooves are provided on the left and right sides of the through hole (6), the inner wall of the plate groove is movably connected to the outer surface of the limit block (10), the output end of the servo motor (9) is fixedly mounted to the right end of the forward and reverse screw rods (8), the lower end of the discharge pipe (11) is provided with an injection port, and the upper inner wall of the discharge pipe (11) is provided with a thread.

5. The vehicle-mounted electronic device packaging injection mold according to claim 2, characterized in that: The lower end of the telescopic rod (15) is fixedly connected to the upper surface of the slider (17), the adjacent surfaces of the slider (17) are fixedly connected to the left and right surfaces of the support frame (18), and the thickness of the wall of the support frame (18) matches the width of the groove (20).

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