Discharging device for vehicle battery and vehicle

Abstract

The discharging device for the vehicle battery comprises a first heat exchange piece, a semiconductor chilling plate, a second heat exchange piece and a first electric connecting piece, a first containing space is formed in the first heat exchange piece, and an opening communicated with the first containing space is formed in a wall plate of the first heat exchange piece; the semiconductor chilling plate is provided with a first side face and a second side face which are oppositely arranged, the semiconductor chilling plate is located in the first containing space, and the first side face is attached to the wall plate of the first heat exchange piece; the second heat exchange piece is located in the first containing space and attached to the second side face. The first electric connecting piece is electrically connected with the vehicle battery and the semiconductor chilling plate. According to the discharging device for the vehicle battery, refrigeration and heating occur at the same time and are counteracted, and the environment is not affected; and the power consumed when the semiconductor chilling plate is electrified is relatively high, so that the electric quantity stored in a vehicle battery is quickly consumed, the waiting time is shortened, and the safety coefficient is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of vehicles, in particular to a discharge device for a vehicle battery and a vehicle. Background Art

[0002] In the related technology, there is a risk of spontaneous combustion of power batteries due to various reasons. Although the probability of explosion after spontaneous combustion of power batteries is very low, it cannot be completely avoided. Moreover, the explosion of fully charged batteries after spontaneous combustion is more destructive, especially in the production, transportation and maintenance of electric vehicles. Reducing the amount of power stored in the power battery can reduce the destructive power of battery spontaneous combustion and reduce the probability of explosion. Utility Model Content

[0003] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, one purpose of the utility model is to provide a discharge device for vehicle batteries, in which cooling and heating occur simultaneously and offset each other, and have no impact on the environment. When the semiconductor cooling sheet is powered on, the power consumed is relatively large, which can improve the discharge efficiency of the vehicle battery.

[0004] The utility model also provides a vehicle with the discharge device.

[0005] According to the first aspect of the present invention, a discharge device for a vehicle battery includes: a first heat exchange member, wherein a first accommodating space is provided in the first heat exchange member, and a wall plate of the first heat exchange member has an opening connected to the first accommodating space; a semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet has a first side surface and a second side surface that are oppositely arranged, the semiconductor refrigeration sheet is located in the first accommodating space, and the first side surface is in contact with the wall plate of the first heat exchange member; a second heat exchange member, wherein the second heat exchange member is located in the first accommodating space, and is in contact with the second side surface; and a first electrical connector, wherein the first electrical connector electrically connects a vehicle battery and the semiconductor refrigeration sheet.

[0006] According to the discharge device for vehicle batteries of the embodiment of the utility model, the semiconductor refrigeration plate and the second heat exchange element are both located in the first accommodating space of the first heat exchange element, the first side surface of the semiconductor refrigeration plate is in contact with the wall plate of the first heat exchange element, and the second side surface of the semiconductor refrigeration plate is in contact with the second heat exchange element. After the semiconductor refrigeration plate is connected to the vehicle battery and powered on, the cold on the first side surface can be transferred to the first heat exchange element, and the heat on the second side surface can be transferred to the second heat exchange element, or the heat on the first side surface can be transferred to the first heat exchange element, and the cold on the second side surface can be transferred to the second heat exchange element. Cooling and heating occur simultaneously and offset each other, and have no impact on the environment. Moreover, the power consumed by the semiconductor refrigeration plate when powered on is relatively large, so that the power stored in the vehicle battery is quickly consumed, thereby shortening the waiting time and improving the safety factor.

[0007] According to some embodiments of the utility model, a plurality of the semiconductor refrigeration sheets are provided, and the plurality of the semiconductor refrigeration sheets are spaced apart from each other.

[0008] According to some embodiments of the present invention, at least two semiconductor refrigeration fins are provided, and at least two semiconductor refrigeration fins are arranged on both sides of the first direction of the second heat exchange element.

[0009] According to some embodiments of the present invention, the second heat exchange element includes a plurality of heat exchange fins and a heat exchange baffle connected to both sides of the heat exchange fins, the plurality of heat exchange fins are arranged at intervals along the second direction, two of the heat exchange baffles are located on both sides of the plurality of heat exchange fins in the first direction, and the heat exchange baffles are in contact with the semiconductor refrigeration sheet in the first direction, wherein the first direction is perpendicular to the second direction.

[0010] According to some embodiments of the present invention, the second heat exchange component also includes a fan, which is located on one side of the third direction of the heat exchange fins, wherein the two wall panels of the first accommodating space in the third direction both have a first opening and a second opening opposite to the heat exchange fins, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

[0011] According to some embodiments of the present invention, the first heat exchange component includes a first wall plate, a second wall plate and a third wall plate connected between the first wall plate and the second wall plate, and the first wall plate, the second wall plate and the third wall plate are constructed in a U shape and define the first accommodating space.

[0012] According to some embodiments of the present invention, the thickness of the first wall panel and the thickness of the second wall panel are both smaller than the thickness of the third wall panel, and a second accommodating space is provided in the third wall panel.

[0013] According to some embodiments of the present invention, the first wall plate, the second wall plate and the third wall plate are all metal parts, and the second heat exchange element includes a heat exchange baffle, which is a metal part.

[0014] According to some embodiments of the present invention, a plurality of first legs are provided at the bottom of the first wall plate, the second wall plate and the third wall plate, and / or a plurality of second legs are connected to the bottom of the heat exchange baffle.

[0015] A vehicle according to an embodiment of the second aspect of the utility model comprises: a discharge device for a vehicle battery according to an embodiment of the first aspect of the utility model.

[0016] According to the vehicle of the embodiment of the utility model, by providing the above-mentioned discharge device, cooling and heating occur simultaneously and offset each other, and have no impact on the environment; and the power consumed by the semiconductor refrigeration plate when powered on is relatively large, which can quickly consume the power stored in the vehicle battery, thereby shortening the waiting time and improving the safety factor.

[0017] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0019] Figure 1 is a schematic diagram of the application of the discharge device according to some embodiments of the utility model;

[0020] Figure 2 is a schematic diagram of a discharge device according to some embodiments of the utility model;

[0021] Figure 3 yes Figure 2 A schematic diagram of another direction of the discharge device;

[0022] Figure 4 yes Figure 2 A schematic diagram of a first heat exchange element;

[0023] Figure 5 yes Figure 2 Schematic diagram of semiconductor cooling chip;

[0024] Figure 6 yes Figure 2 Schematic diagram of the heat exchange baffle;

[0025] Figure 7 yes Figure 2 Schematic diagram of heat exchange fins;

[0026] Figure 8 yes Figure 2 Schematic diagram of the fan;

[0027] Fig. 9 yes Figure 2 Schematic diagram of the first and second legs;

[0028] Fig.10 yes Figure 2 Schematic diagram of electrical control for changing the first side and the second side of the semiconductor refrigeration plate for cooling or heating.

[0029] Reference numerals:

[0030] 100. Discharge device;

[0031] 10. first heat exchange member; 11. first wall plate; 12. second wall plate; 13. third wall plate; 131. second accommodation space; 14. first accommodation space; 15. first support leg; 16. first opening;

[0032] 20. semiconductor cooling sheet; 21. first side surface; 22. second side surface; 23. electrode pin;

[0033] 30. Second heat exchange element; 31. Heat exchange fins; 32. Heat exchange baffle; 33. Fan; 34. Second support leg;

[0034] 41. First electrical connection member; 42. Combination switch; 421. Linkage switch. DETAILED DESCRIPTION

[0035] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0036] In the description of the present utility model, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", etc. indicate directions or positional relationships based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first" and "second" are used for descriptive purposes only, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present utility model, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0037] In the description of the present utility model, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in the present utility model can be understood according to specific circumstances.

[0038] Reference below Figure 1-Figure 10A discharge device 100 for a vehicle battery according to an embodiment of the present invention is described.

[0039] According to the discharge device 100 for vehicle batteries of the first embodiment of the utility model, a large amount of electricity is stored in the vehicle battery during the production or transportation of the vehicle, or when the vehicle needs to be returned to the factory for repair. The explosion of a fully charged battery after spontaneous combustion is more destructive, and reducing the amount of electricity stored in the vehicle battery can reduce the destructive power of spontaneous combustion of the vehicle battery and reduce the probability of explosion. Therefore, the discharge device 100 can be used to release the electricity in the vehicle battery.

[0040] The discharge device 100 includes a first heat exchange element 10, a semiconductor cooling plate 20 and a second heat exchange element 30. The first heat exchange element 10 has a first accommodating space 14. The wall panel of the first heat exchange element 10 has an opening. The first accommodating space 14 is connected to the opening. The semiconductor cooling plate 20 can be placed in the first accommodating space 14 through the opening, and the second heat exchange element 30 can also be placed in the first accommodating space 14 through the opening.

[0041] The first electrical connector 41 is used to electrically connect the vehicle battery and the semiconductor cooling sheet 20. The vehicle battery can supply power to the semiconductor cooling sheet 20 through the first electrical connector 41. For example, the semiconductor cooling sheet 20 has two electrode pins 23 spaced apart, and the first electrical connector 41 is electrically connected to the electrode pins 23.

[0042] The semiconductor refrigeration chip 20 has a first side surface 21 and a second side surface 22 which are arranged opposite to each other. When the semiconductor refrigeration chip 20 is powered on, a cold end effect is generated on the first side surface 21, and a hot end effect is generated on the second side surface 22; or when the semiconductor refrigeration chip 20 is powered on, a hot end effect is generated on the first side surface 21, and a cold end effect is generated on the second side surface 22.

[0043] The first side surface 21 is in contact with the wall panel of the first heat exchanger 10, and the second side surface 22 is in contact with the second heat exchanger 30. For example, thermal conductive glue can be applied between the first side surface 21 of the semiconductor refrigeration plate 20 and the wall panel of the first heat exchanger 10, and thermal conductive glue can also be applied between the second side surface 22 of the semiconductor refrigeration plate 20 and the second heat exchanger 30 to fix the semiconductor refrigeration plate 20 between the first heat exchanger 10 and the second heat exchanger 30.

[0044] After the semiconductor refrigeration sheet 20 is powered on, the first side 21 generates a hot end effect, and the heat of the first side 21 is transferred to the first heat exchange element 10, and the second side 22 generates a cold end effect, and the cold of the second side 22 is transferred to the second heat exchange element 30, which is located in the first accommodating space 14 of the first heat exchange element 10, and the heat of the first heat exchange element 10 and the cold of the second heat exchange element 30 can be exchanged with each other; or, the first side 21 generates a cold end effect, and the cold of the first side 21 is transferred to the first heat exchange element 10, and the second side 22 generates a hot end effect, and the heat of the second side 22 is transferred to the second heat exchange element 30, which is located in the first accommodating space 14 of the first heat exchange element 10, and the cold of the first heat exchange element 10 and the heat of the second heat exchange element 30 can be exchanged with each other; cooling and heating occur at the same time and offset each other, and have no impact on the environment; and the power consumed by the semiconductor refrigeration sheet 20 when powered on is large, so that the power stored in the vehicle battery is quickly consumed, thereby shortening the waiting time and improving the safety factor.

[0045] The first electrical connector 41 is also suitable for detachable connection with the vehicle battery. When the discharge device 100 is needed to discharge the vehicle battery, the first electrical connector 41 can be electrically connected to the vehicle battery so that the semiconductor cooling plate 20 consumes the power of the vehicle battery. When the discharge device 100 finishes discharging the vehicle battery, the first electrical connector 41 can be separated from the vehicle battery. For example, the first electrical connector 41 can be a discharge gun.

[0046] In a specific example, the second heat exchange element 30 is located in the first accommodating space 14 and can be attached to the first heat exchange element 10. After the semiconductor refrigeration plate 20 is connected to the vehicle battery and powered on, the heat of the first side 21 of the semiconductor refrigeration plate 20 can be transferred to the first heat exchange element 10, and the coldness of the second side 22 of the semiconductor refrigeration plate 20 can be transferred to the second heat exchange element 30. The second heat exchange element 30 can be attached to the first heat exchange element 10, and the heat of the first heat exchange element 10 can be directly offset by the coldness of the second heat exchange element 30; or, the coldness of the first side 21 of the semiconductor refrigeration plate 20 can be transferred to the first heat exchange element 10, and the heat of the second side 22 of the semiconductor refrigeration plate 20 can be transferred to the second heat exchange element 30. The second heat exchange element 30 can be attached to the first heat exchange element 10, and the coldness of the first heat exchange element 10 can be directly offset by the heat of the second heat exchange element 30.

[0047] In another specific example, referring to Fig.10The discharge device 100 further includes a combination switch 42, which is connected between the first electrical connector 41 and the semiconductor cooling sheet 20. A linkage switch 421 is provided in the combination switch 42, and the linkage switch 421 has a first sub-switch and a second sub-switch, wherein the first sub-switch is connected to one electrode pin 23, and the second sub-switch is connected to the other electrode pin 23; a positive power supply and a negative power supply are also provided in the combination switch 42, when the first sub-switch is connected to the negative power supply and the second sub-switch is connected to the positive power supply, the first side 21 is heated and the second side 22 is cooled; when the first sub-switch is connected to the positive power supply and the second sub-switch is connected to the negative power supply, the first side 21 is cooled and the second side 22 is heated. By changing the polarity of the DC power supply of the semiconductor cooling sheet 20, the cooling or heating mode of the first side 21 and the second side 22 can be changed.

[0048] According to the discharge device 100 for vehicle batteries of the embodiment of the utility model, the semiconductor refrigeration sheet 20 and the second heat exchange element 30 are both located in the first accommodating space 14 of the first heat exchange element 10, the first side surface 21 of the semiconductor refrigeration sheet 20 is in contact with the wall plate of the first heat exchange element 10, and the second side surface 22 of the semiconductor refrigeration sheet 20 is in contact with the second heat exchange element 30. After the semiconductor refrigeration sheet 20 is connected to the vehicle battery and powered on, the cooling capacity of the first side surface 21 can be transferred to the first heat exchange element 10, and the heat of the second side surface 22 can be transferred to the second heat exchange element 30, or the heat of the first side surface 21 can be transferred to the first heat exchange element 10, and the cooling capacity of the second side surface 22 can be transferred to the second heat exchange element 30. Cooling and heating occur simultaneously and offset each other, and have no impact on the environment. Moreover, the power consumed by the semiconductor refrigeration sheet 20 when powered on is relatively large, so that the power stored in the vehicle battery is quickly consumed, thereby shortening the waiting time and improving the safety factor.

[0049] According to some embodiments of the present invention, referring to Figure 1-Figure 6 There are multiple semiconductor cooling sheets 20, and the multiple semiconductor cooling sheets 20 are spaced apart. After the multiple semiconductor cooling sheets 20 are powered on, the power is relatively large, which can further increase the efficiency of consuming the battery power of the vehicle. There are two or more semiconductor cooling sheets 20, and the first side 21 of each semiconductor cooling sheet 20 is attached to the wall plate of the first heat exchange member 10, and the second side 22 of each semiconductor cooling sheet 20 is attached to the second heat exchange member 30.

[0050] The semiconductor cooling sheet 20 can change the cooling or heating mode of the first side 21 and the second side 22 by changing the polarity of the DC power supply. For example, a plurality of semiconductor cooling sheets 20 are connected in parallel, and the cooling and heating modes of the first side 21 and the second side 22 of the plurality of semiconductor cooling sheets 20 can be different.

[0051] In a specific example, referring to Fig.10There are multiple linkage switches 421, each linkage switch 421 corresponds to a semiconductor refrigeration plate 20, and each linkage switch 421 can control the cooling or heating mode of the first side 21 and the second side 22 of the corresponding semiconductor refrigeration plate 20.

[0052] According to some embodiments of the present invention, referring to Figure 1-Figure 6 , the semiconductor refrigeration sheet 20 is provided with at least two, the semiconductor refrigeration sheet 20 may be provided with two or more, at least two semiconductor refrigeration sheets 20 are arranged in the first direction of the second heat exchange element 30 (for example, refer to Figure 2 on both sides of the e1 direction).

[0053] When two semiconductor refrigeration plates 20 are provided, the two semiconductor refrigeration plates 20 are arranged on both sides of the first direction of the second heat exchange member 30, and the two semiconductor refrigeration plates 20 are connected in parallel. After the two semiconductor refrigeration plates 20 are powered on, the cooling and heating modes of the first side surfaces 21 and the second side surfaces 22 of the two semiconductor refrigeration plates 20 may be different. The first side surface 21 of one semiconductor refrigeration plate 20 may be used for heating, and the first side surface 21 of the other semiconductor refrigeration plate 20 may be used for cooling; or the first side surface 21 of one semiconductor refrigeration plate 20 may be used for cooling, and the first side surface 21 of the other semiconductor refrigeration plate 20 may be used for heating.

[0054] In one case, when the two semiconductor refrigeration plates 20 are powered on, the first side 21 of one semiconductor refrigeration plate 20 generates heat, and the heat is transferred to the first heat exchange element 10, while the second side 22 generates cooling, and the cold is transferred to the second heat exchange element 30; the first side 21 of the other semiconductor refrigeration plate 20 generates cooling, and the cold is transferred to the first heat exchange element 10, while the second side 22 generates heating, and the heat is transferred to the second heat exchange element 30. The first heat exchange element 10 has both heat and cold, and the second heat exchange element 30 also has both heat and cold, and the heat and cold can offset each other.

[0055] Another situation is that when the two semiconductor refrigeration plates 20 are powered on, the first side 21 of one semiconductor refrigeration plate 20 generates heat, and the heat is transferred to the first heat exchange element 10, while the second side 22 generates cooling, and the cold is transferred to the second heat exchange element 30; the first side 21 of the other semiconductor refrigeration plate 20 generates heat, and the heat is transferred to the first heat exchange element 10, while the second side 22 generates cooling, and the cold is transferred to the second heat exchange element 30. The first heat exchange element 10 can dissipate heat, and the second heat exchange element 30 can dissipate heat and cold.

[0056] In another case, when the two semiconductor refrigeration plates 20 are powered on, the first side 21 of one semiconductor refrigeration plate 20 cools the air, and the cold air is transferred to the first heat exchange element 10, while the second side 22 heats the air, and the heat is transferred to the second heat exchange element 30; the first side 21 of the other semiconductor refrigeration plate 20 cools the air, and the cold air is transferred to the first heat exchange element 10, while the second side 22 heats the air, and the heat is transferred to the second heat exchange element 30. The first heat exchange element 10 can dissipate the cold air, and the second heat exchange element 30 can dissipate the heat.

[0057] According to some embodiments of the present invention, referring to Figure 1-Figure 7 The second heat exchange element 30 includes a plurality of heat exchange fins 31 and a heat exchange baffle 32. The heat exchange baffle 32 is connected to opposite sides of the heat exchange fins 31. The plurality of heat exchange fins 31 are arranged along the second direction (for example, see the attached Figure 2 The two heat exchange baffles 32 are arranged at intervals in the first direction of the plurality of heat exchange fins 31 to increase the heat exchange area of ​​the second heat exchange element 30 and improve the heat exchange efficiency when the air flows. The two heat exchange baffles 32 are located on both sides of the first direction of the plurality of heat exchange fins 31, and the two heat exchange baffles 32 are respectively attached to the two semiconductor refrigeration sheets 20 in the first direction, wherein the first direction is perpendicular to the second direction. For example, the heat exchange fins 31 can be metal sheets, and can be made of metal materials such as copper or aluminum.

[0058] The heat or cold of the two semiconductor refrigeration plates 20 can be quickly transferred to the heat exchange fins 31 through the heat exchange baffle 32. There are multiple heat exchange fins 31, and the multiple heat exchange fins 31 are arranged at intervals, which can increase the heat exchange efficiency of the heat exchange fins 31 and further increase the heat exchange efficiency of the second heat exchange element 30.

[0059] According to some embodiments of the present invention, referring to Figure 1-Figure 8 The second heat exchange element 30 further includes a fan 33, which is located in the third direction of the heat exchange fin 31 (for example, see the attached Figure 2 e3 direction in the middle), wherein the two wall plates of the first accommodation space 14 in the third direction both have a first opening 16 and a second opening opposite to the heat exchange fins 31, wherein the first direction, the second direction, and the third direction are perpendicular to each other. After power is turned on, when the fan 33 is running, the air flow rate between the multiple heat exchange fins 31 can be increased; furthermore, when the fan 33 is running, the flow rate of the air entering the heat exchange fins 31 through the first opening 16 and the second opening can be accelerated, and the speed at which heat or cold is transferred from the heat exchange fins 31 to the air can also be accelerated, thereby improving the heat exchange efficiency.

[0060] According to some embodiments of the present invention, referring to Figure 1-Figure 4The first heat exchange member 10 includes a first wall plate 11, a second wall plate 12 and a third wall plate 13. The third wall plate 13 is connected between the first wall plate 11 and the second wall plate 12. The first wall plate 11, the second wall plate 12 and the third wall plate 13 are configured in a U shape and define a first accommodation space 14. The first wall plate 11, the second wall plate 12 and the third wall plate 13 together enclose a space shape similar to a "U" letter, which is the first accommodation space 14.

[0061] The U-shaped structure is beneficial to the transfer of heat or cold generated by the semiconductor refrigeration plate 20 within the first heat exchange element 10, thereby improving the heat exchange efficiency. The opening of the U-shaped structure allows external cooling medium (such as air) to enter and contact the semiconductor refrigeration plate 20 to achieve effective heat exchange. In addition, this structure is compact and is beneficial to the effective transmission and dissipation of heat.

[0062] According to some embodiments of the present invention, referring to Figure 1-Figure 4 The thickness of the first wall plate 11 and the thickness of the second wall plate 12 are both smaller than the thickness of the third wall plate 13 , and a second accommodating space 131 is provided in the third wall plate 13 .

[0063] In a specific example, when the semiconductor refrigeration chip 20 is powered on, the first side 21 of the semiconductor refrigeration chip 20 generates heat, and the heat is transferred to the first wall plate 11, the second wall plate 12 and the third wall plate 13 of the first heat exchanger 10. At this time, some structural parts that need to be heated can be placed in the second accommodating space 131. For example, two parts glued together with adhesive can be easily separated by heating the adhesive, thereby increasing the function of the discharge device 100.

[0064] When the semiconductor refrigeration plate 20 is powered on, the first side 21 of the semiconductor refrigeration plate 20 is cooled, and the cold energy is transferred to the first wall plate 11, the second wall plate 12 and the third wall plate 13 of the first heat exchange element 10. At this time, some structural parts that need to be cooled and solidified can be placed in the second accommodating space 131, for example, for freezing sludge, thereby increasing the function of the discharge device 100.

[0065] According to some embodiments of the present invention, referring to Figure 1-Figure 6 , Fig. 9 The first wall plate 11, the second wall plate 12 and the third wall plate 13 are all metal parts. The second heat exchanger 30 includes a heat exchange baffle 32. The heat exchange baffle 32 is a metal part. The material of the metal part has high thermal conductivity efficiency, which can increase the thermal conductivity of the first heat exchanger 10 and the second heat exchanger 30. For example, the first wall plate 11, the second wall plate 12, the third wall plate 13 and the heat exchange baffle 32 can all be made of metal materials such as copper or aluminum.

[0066] A plurality of first legs 15 are provided at the bottom of the first wall panel 11, the second wall panel 12 and the third wall panel 13 for supporting the entire first heat exchange element 10. At the same time, the plurality of first legs 15 can also transfer the heat or cold of the first heat exchange element 10 to the external environment through the first legs 15. By providing the plurality of first legs 15, there can be sufficient ventilation space between the bottom of the first wall panel 11, the second wall panel 12 and the third wall panel 13 and the external supporting structure, which is beneficial to the circulation of air and improves the heat exchange efficiency.

[0067] A plurality of second legs 34 are connected to the bottom of the heat exchange baffle 32 for supporting the heat exchange baffle 32, that is, for supporting the second heat exchange element 30. At the same time, the plurality of second legs 34 can also transfer the heat or cold of the second heat exchange element 30 to the external environment through the second legs 34. By setting a plurality of second legs 34, there can be sufficient ventilation space between the bottom of the heat exchange baffle 32 and the external supporting structure, which is beneficial to the circulation of air and improves the heat exchange efficiency.

[0068] According to some embodiments of the present invention, referring to Figure 1-Figure 4 The first heat exchanger 10 is an integrally formed metal part, which can increase the structural strength and durability of the first heat exchanger 10; the first heat exchanger 10 is a metal part, which can increase the thermal conductivity of the first heat exchanger 10. For example, the first heat exchanger 10 can be made of metal materials such as copper or aluminum.

[0069] For example, the first heat exchanger 10 includes a first wall plate 11, a second wall plate 12 and a third wall plate 13. The first wall plate 11, the second wall plate 12 and the third wall plate 13 are directly manufactured into an integral component with a U-shaped structure through metal casting, stamping, forging and other processes at one time.

[0070] The vehicle according to the second embodiment of the utility model comprises: the discharge device 100 for the vehicle battery according to the first embodiment of the utility model.

[0071] According to the vehicle of the embodiment of the utility model, by providing the above-mentioned discharge device 100, cooling and heating occur simultaneously and offset each other, and have no impact on the environment; and the power consumed by the semiconductor refrigeration sheet 20 when powered on is relatively large, so that the power stored in the vehicle battery is quickly consumed, thereby shortening the waiting time and improving the safety factor.

[0072] In the description of this specification, the description with reference to the terms "some embodiments", "optionally", "further" or "some examples" etc. means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the utility model. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner.

[0073] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. A discharge device for a vehicle battery, characterized in that: include: A first heat exchange element, wherein a first accommodation space is formed in the first heat exchange element, and a wall plate of the first heat exchange element has an opening communicating with the first accommodation space; A semiconductor refrigeration sheet, wherein the semiconductor refrigeration sheet has a first side surface and a second side surface that are arranged opposite to each other, the semiconductor refrigeration sheet is located in the first accommodation space, and the first side surface is in contact with the wall plate of the first heat exchange member; a second heat exchange member, the second heat exchange member being located in the first accommodation space and in contact with the second side surface; A first electrical connector electrically connects a vehicle battery and the semiconductor cooling sheet.

2. The discharge device for a vehicle battery according to claim 1, characterized in that: There are a plurality of semiconductor cooling sheets, and the plurality of semiconductor cooling sheets are spaced apart from each other.

3. The discharge device for a vehicle battery according to claim 2, characterized in that: There are at least two semiconductor refrigeration fins, and at least two of the semiconductor refrigeration fins are arranged on both sides of the second heat exchange element in the first direction.

4. The discharge device for a vehicle battery according to claim 1, characterized in that: The second heat exchange component includes a plurality of heat exchange fins and a heat exchange baffle connected to both sides of the heat exchange fins, the plurality of heat exchange fins are arranged at intervals along the second direction, the two heat exchange baffles are located on both sides of the first direction of the plurality of heat exchange fins, the heat exchange baffles are attached to the semiconductor refrigeration plate in the first direction, wherein the first direction is perpendicular to the second direction.

5. The discharge device for a vehicle battery according to claim 4, characterized in that: The second heat exchange component also includes a fan, which is located on one side of the third direction of the heat exchange fins, wherein the two wall panels of the first accommodating space in the third direction both have a first opening and a second opening opposite to the heat exchange fins, wherein the first direction, the second direction, and the third direction are perpendicular to each other.

6. The discharge device for a vehicle battery according to claim 1, characterized in that: The first heat exchange member includes a first wall plate, a second wall plate, and a third wall plate connected between the first wall plate and the second wall plate. The first wall plate, the second wall plate, and the third wall plate are configured in a U shape and define the first accommodating space.

7. The discharge device for a vehicle battery according to claim 6, characterized in that: The thickness of the first wall plate and the thickness of the second wall plate are both smaller than the thickness of the third wall plate, and a second accommodating space is provided in the third wall plate.

8. The discharge device for a vehicle battery according to claim 6, characterized in that: The first wall plate, the second wall plate and the third wall plate are all metal parts, the second heat exchange part comprises a heat exchange baffle, and the heat exchange baffle is a metal part.

9. The discharge device for a vehicle battery according to claim 6, characterized in that: The bottoms of the first wall plate, the second wall plate and the third wall plate are provided with a plurality of first legs, and / or the second heat exchange element comprises a heat exchange baffle plate, the bottom of which is connected with a plurality of second legs.

10. A vehicle, characterized in that: include: A discharge device for a vehicle battery according to any one of claims 1 to 9.

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