Photomask taking mechanism of chip photoetching machine

Abstract

The utility model discloses a photolithography mask reclaiming mechanism of a chip lithography machine, and relates to the technical field of reclaiming mechanisms, the photolithography mask reclaiming mechanism comprises a placing plate, a lithography machine body, a reclaiming assembly and a rotating assembly are fixedly arranged on the surface of the placing plate, the reclaiming assembly comprises a vacuum pump, a suction pipe and a suction cup, the bottom of the vacuum pump is fixedly connected with a supporting block, and the bottom of the vacuum pump is fixedly connected with the rotating assembly. One end of the suction pipe is connected to the input end of the vacuum pump in a penetrating mode, the other end of the suction pipe is connected to the top of the suction cup in a penetrating mode, and the rotating assembly comprises a servo motor, a transmission rod and a rotating rod; compared with the prior art, the material taking device has the advantages that the material taking assembly is arranged, the vacuum pump is started, the suction pipe and the suction cup generate adsorption force, and the photolithography mask is sucked into the suction cup, so that the photolithography mask is prevented from being manually taken, and the damage to the photolithography mask in the material taking process is prevented.

Description

Technical Field

[0001] The utility model relates to the technical field of material taking mechanisms, in particular to a photolithography plate taking mechanism for a chip photolithography machine. Background Art

[0002] The photolithography machine, also known as the mask alignment exposure machine, exposure system, photolithography system, etc., is the core equipment for chip manufacturing. It uses a technology similar to photo printing to print the fine patterns on the mask plate onto the photolithography plate through light exposure;

[0003] After searching, the applicant found that a Chinese patent disclosed "a photolithography plate retrieval device for chip manufacturing", and its publication (announcement) number is "CN214827074U". This patent mainly fixes the silicon wafer through a first spring and a movable plate. The movable plate and the fixed plate can prevent the bottom of the silicon wafer from fitting against the engraving seat, thereby ensuring the normal use of the silicon wafer. However, the device requires manual removal of the photolithography plate, which causes the photolithography plate to be touched twice, affecting the product quality. For this reason, we propose a photolithography plate retrieval mechanism for a chip lithography machine. Utility Model Content

[0004] The utility model aims to provide a photolithography plate taking mechanism for a chip photolithography machine.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solution: the photolithography plate picking mechanism of the chip lithography machine includes a placement plate, on the surface of which a lithography machine body, a picking assembly and a rotating assembly are fixedly mounted, the picking assembly includes a vacuum pump, a suction pipe and a suction cup, the bottom of the vacuum pump is fixedly connected to a support block, one end of the suction pipe is through-connected to the input end of the vacuum pump, and the other end of the suction pipe is through-connected to the top of the suction cup.

[0006] As a further solution of the utility model: the rotating assembly includes a servo motor, a transmission rod and a rotating rod, and the servo motor is fixedly installed inside the cabin.

[0007] As a further solution of the utility model: the output end of the servo motor is spline-connected to one end of the transmission rod, and the other end of the transmission rod is fixedly connected to one end of the rotating rod.

[0008] As a further solution of the utility model: the other end of the rotating rod is fixedly connected to one end of the electric telescopic rod, and the other end of the electric telescopic rod is fixedly connected to one end of the fixing ring.

[0009] As a further solution of the utility model: the other end of the fixing ring is fixedly connected to the surface of the supporting block and is located behind the vacuum pump.

[0010] As a further solution of the utility model: a material taking plate is fixedly connected to the surface of the placement plate, and the material taking plate is located directly below the photolithography machine body.

[0011] As a further solution of the utility model: a corner of the surface of the placement board is fixedly connected to a storage box, and the surface of the storage box is slidably connected to a slide plate.

[0012] By adopting the above technical solution, compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The utility model starts the vacuum pump by setting the material taking component, generates adsorption force through the suction tube and the suction cup, and sucks the photoresist into the suction cup, thereby avoiding manual collection of the photoresist and preventing damage to the photoresist during the material taking process.

[0014] 2. The utility model adopts the setting of the rotating assembly and the electric telescopic rod, and the servo motor drives the transmission rod to rotate the rotating rod, driving the fixed ring and the supporting block to move, thereby adjusting the position of the suction cup and accurately grabbing the photolithography plate.

[0015] Other advantages, objectives and features of the present invention will be described in the following description to some extent, and will be apparent to those skilled in the art based on the following examination and study, or may be taught from the practice of the present invention to some extent. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is an overall schematic diagram of an embodiment of the utility model;

[0017] Figure 2 This is a schematic diagram of a material taking component in an embodiment of the utility model;

[0018] Figure 3 This is a schematic diagram of placing a plate in an embodiment of the utility model;

[0019] Figure 4 It is a schematic diagram of the machine room in the embodiment of the utility model.

[0020] In the figure: 1. Placement plate; 2. Photolithography machine body; 3. Material picking assembly; 31. Vacuum pump; 32. Suction tube; 33. Suction cup; 34. Support block; 4. Rotation assembly; 41. Servo motor; 42. Transmission rod; 43. Rotating rod; 44. Machine chamber; 5. Electric telescopic rod; 6. Fixing ring; 7. Material picking plate. DETAILED DESCRIPTION

[0021] The specific implementation methods of the present invention are further described below in conjunction with the accompanying drawings. It should be noted that the description of these implementation methods is used to help understand the present invention, but does not constitute a limitation of the present invention. In addition, the technical features involved in each implementation method of the present invention described below can be combined with each other as long as they do not conflict with each other.

[0022] Example 1, please refer to the attached Figure 1 -Attached Figure 4 The photolithography plate picking mechanism of the chip lithography machine includes a placing plate 1, on the surface of which a lithography machine body 2, a picking assembly 3 and a rotating assembly 4 are fixedly mounted, the picking assembly 3 includes a vacuum pump 31, a suction pipe 32 and a suction cup 33, the bottom of the vacuum pump 31 is fixedly connected to a support block 34, one end of the suction pipe 32 is connected to the input end of the vacuum pump 31, and the other end of the suction pipe 32 is connected to the top of the suction cup 33.

[0023] In this embodiment, the rotating assembly 4 includes a servo motor 41, a transmission rod 42 and a rotating rod 43, and the servo motor 41 is fixedly installed inside the machine compartment 44;

[0024] By setting the rotating rod 43, the position of the material taking component 3 can be adjusted.

[0025] In this embodiment, the output end of the servo motor 41 is spline-connected to one end of the transmission rod 42, and the other end of the transmission rod 42 is fixedly connected to one end of the rotating rod 43;

[0026] The transmission rod 42 is provided to connect the servo motor 41 and the rotating rod 43 .

[0027] In this embodiment, the other end of the rotating rod 43 is fixedly connected to one end of the electric telescopic rod 5, and the other end of the electric telescopic rod 5 is fixedly connected to one end of the fixing ring 6;

[0028] The setting of the fixing ring 6 plays a role in connecting the electric telescopic rod 5 and the supporting block 34 .

[0029] Specifically, by setting the material taking component 3, the vacuum pump 31 is started, and the suction force is generated through the suction tube 32 and the suction cup 33 to suck the photoresist into the suction cup 33, thereby avoiding manual collection of the photoresist and preventing damage to the photoresist during the material taking process.

[0030] Example 2, please refer to the attached Figure 1 -Attached Figure 4The photolithography plate picking mechanism of the chip lithography machine includes a placing plate 1, on the surface of which a lithography machine body 2, a picking assembly 3 and a rotating assembly 4 are fixedly mounted, the picking assembly 3 includes a vacuum pump 31, a suction pipe 32 and a suction cup 33, the bottom of the vacuum pump 31 is fixedly connected to a support block 34, one end of the suction pipe 32 is connected to the input end of the vacuum pump 31, and the other end of the suction pipe 32 is connected to the top of the suction cup 33.

[0031] In this embodiment, the other end of the fixing ring 6 is fixedly connected to the surface of the supporting block 34 and is located behind the vacuum pump 31;

[0032] The support block 34 is provided to support the vacuum pump 31 .

[0033] In this embodiment, a pick-up plate 7 is fixedly connected to the surface of the placement plate 1, and the pick-up plate 7 is located directly below the photolithography machine body 2;

[0034] The setting of the material taking plate 7 plays a role in placing the photolithography plate.

[0035] In this embodiment, a storage box is fixedly connected to one corner of the surface of the placement board 1, and a slide plate is slidably connected to the surface of the storage box;

[0036] The setting of the slide plate plays a role in protecting the photolithography plate inside the placement box.

[0037] Specifically, by setting the rotating assembly 4 and the electric telescopic rod 5, the servo motor 41 drives the transmission rod 42 to rotate the rotating rod 43, driving the fixing ring 6 and the supporting block 34 to move, thereby adjusting the position of the suction cup 33 and accurately grabbing the photolithography plate.

[0038] Working principle:

[0039] First, start the vacuum pump 31, which generates adsorption force through the suction tube 32 and the suction cup 33 to grab the photoresist plate. The servo motor 41 drives the rotating rod 43 to rotate through the transmission rod 42, and the electric telescopic rod 5 is extended and retracted, thereby adjusting the position of the suction cup 33 to achieve accurate grasping. The grabbed photoresist plate can be processed later as needed and can be placed in a storage box after completion. At this point, the entire workflow is completed.

[0040] The above-mentioned front, back, left, right, top and bottom are all based on the figures in the specification. Figure 1 As a benchmark, according to the person's observation perspective, the side of the device facing the observer is defined as the front, the left side of the observer is defined as the left, and so on.

[0041] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating orientations or positional relationships, are based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the scope of protection of the present invention.

[0042] It should be noted that the equipment structure and drawings of the utility model mainly describe the principle of the utility model. In terms of the technology of the design principle, the settings of the power mechanism, power supply system and control system of the device are not fully described. On the premise that the technical personnel in this field understand the principle of the above-mentioned utility model, the details of its power mechanism, power supply system and control system can be clearly known. The control method of the application document is automatic control through a controller, and the control circuit of the controller can be realized by simple programming by technical personnel in this field.

[0043] The standard parts used therein can all be purchased from the market and can be customized according to the instructions and drawings. The specific connection methods of each part adopt conventional means such as mature bolts, rivets, welding, etc. in the prior art. The machinery, parts and equipment all adopt conventional models in the prior art, and the structures and principles of the components known to technical personnel in this field can be known by these technical personnel through technical manuals or through conventional experimental methods.

[0044] The embodiments of the present invention are described in detail above with reference to the accompanying drawings, but the present invention is not limited to the described embodiments.

[0045] For those skilled in the art, various changes, modifications, substitutions and variations can be made to these implementations without departing from the principles and spirit of the present invention, and they still fall within the protection scope of the present invention.

Claims

1. A photomask material taking mechanism for a chip photolithography machine, comprising a placing plate (1), characterized in that: The surface of the placement plate (1) is fixedly mounted with a photolithography machine body (2), a material taking assembly (3) and a rotating assembly (4); the material taking assembly (3) comprises a vacuum pump (31), a suction pipe (32) and a suction cup (33); the bottom of the vacuum pump (31) is fixedly connected to a support block (34); one end of the suction pipe (32) is connected to the input end of the vacuum pump (31); and the other end of the suction pipe (32) is connected to the top of the suction cup (33).

2. The photomask material taking mechanism of a chip photolithography machine according to claim 1, characterized in that: The rotating assembly (4) comprises a servo motor (41), a transmission rod (42) and a rotating rod (43); the servo motor (41) is fixedly installed inside the machine compartment (44).

3. The photomask material taking mechanism of a chip photolithography machine according to claim 2, characterized in that: The output end of the servo motor (41) is spline-connected to one end of a transmission rod (42), and the other end of the transmission rod (42) is fixedly connected to one end of a rotating rod (43).

4. The photomask material taking mechanism of a chip photolithography machine according to claim 2, characterized in that: The other end of the rotating rod (43) is fixedly connected to one end of the electric telescopic rod (5), and the other end of the electric telescopic rod (5) is fixedly connected to one end of the fixing ring (6).

5. The photomask material taking mechanism of a chip photolithography machine according to claim 4, characterized in that: The other end of the fixing ring (6) is fixedly connected to the surface of the supporting block (34) and is located behind the vacuum pump (31).

6. The photomask material taking mechanism of a chip photolithography machine according to claim 1, characterized in that: A material taking plate (7) is fixedly connected to the surface of the placement plate (1), and the material taking plate (7) is located directly below the photolithography machine body (2).

7. The photomask taking mechanism of a chip photolithography machine according to claim 1, characterized in that: A storage box is fixedly connected to one corner of the surface of the placement plate (1), and a slide plate is slidably connected to the surface of the storage box.

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