Optical module

Abstract

The utility model belongs to the technical field of optoelectronic device packaging, and particularly relates to an optical module, which comprises a shell and a photoelectric conversion device arranged in the shell, the photoelectric conversion device comprises a PCB (printed circuit board), and a golden finger, a transmitting end optical assembly and a receiving end optical assembly which are arranged on the PCB, the transmitting end optical assembly comprises a bare chip type driving chip, a transmitting sub-assembly and a first optical fiber connection adapter which are arranged in sequence, the driving chip is arranged close to the golden finger, a first protective cover plate is arranged on the transmitting sub-assembly, and the transmitting sub-assembly is connected with the first optical fiber connection adapter through a first optical fiber. According to the transmitting end optical assembly, the bare chip type driving chip is adopted, and the driving chip is arranged close to the golden finger, so that the signal transmission distance can be shortened, the electric signal attenuation caused by an overlong transmission path can be reduced, the signal quality can be improved, and the power consumption of the optical module can be reduced; and the signal transmission time can be correspondingly reduced, and the delay of the system is reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of optoelectronic device packaging, and in particular relates to an optical module. Background Art

[0002] In recent years, with the development of AI technology, big data and large models have put forward higher requirements for computer computing power. As the infrastructure of modern information society, the improvement of computing power is often accompanied by huge consumption of power resources. Therefore, it is necessary to provide a low-latency, low-power optical module. Utility Model Content

[0003] In order to overcome the deficiencies of the prior art, the present invention aims to provide an optical module that can reduce power consumption and delay.

[0004] To achieve the above-mentioned purpose, the technical solution of the utility model is an optical module, including a shell and a photoelectric conversion device arranged in the shell, the photoelectric conversion device includes a PCB circuit board and a gold finger, a transmitting end optical component and a receiving end optical component arranged on the PCB circuit board, the transmitting end optical component includes a driver chip in the form of a bare chip, a transmitting sub-component, and a first optical fiber connection adapter arranged in sequence, the driver chip is arranged close to the gold finger, the transmitting sub-component is provided with a first protective cover, and the transmitting sub-component is connected to the first optical fiber connection adapter through a first optical fiber.

[0005] As one of the embodiments, the transmitting subassembly includes a laser chip, an optical combining element, an optical isolator, and a first optical collimator arranged in sequence. The laser chip is arranged close to the driving chip, and the distance between the laser chip and the driving chip is an integer multiple of 1 / 2 wavelength of the transmission signal.

[0006] As one of the implementation modes, a thermoelectric cooler is arranged on the PCB circuit board, and the laser chip is arranged on the thermoelectric cooler.

[0007] As one of the embodiments, a first supporting substrate is provided on the PCB circuit board, and the optical combining element and the optical isolator are provided on the first supporting substrate; a first mounting structure is also provided on the first supporting substrate, and the first mounting structure is provided with a circular hole, and the first optical collimator is installed in the circular hole.

[0008] As one of the implementation modes, a glue injection hole is provided on the top surface of the first mounting structure, and the glue injection hole is connected to the circular hole.

[0009] As one of the embodiments, the receiving end optical component includes a second optical fiber connection adapter and a receiving sub-component arranged in sequence, the receiving sub-component is arranged close to the gold finger, a second protective cover is arranged on the receiving sub-component, and the receiving sub-component is connected to the second optical fiber connection adapter through a second optical fiber.

[0010] As one of the implementation modes, the receiving subassembly includes a second optical collimator, a wave splitting optical element, and a detector assembly which are arranged in sequence, and the detector assembly is arranged close to the gold finger.

[0011] As one of the embodiments, the detector assembly includes a transimpedance amplifier, a detector, a first lens, a reflecting prism and a second lens, the second lens is arranged between the reflecting prism and the wave splitting optical element, the first lens is arranged below the reflecting prism, the detector is arranged below the first lens, and the transimpedance amplifier is arranged on the side of the detector away from the wave splitting optical element.

[0012] As one of the embodiments, a second supporting substrate is provided on the PCB circuit board, and the wave splitting optical element is provided on the second supporting substrate; a second mounting structure is also provided on the second supporting substrate, and the second mounting structure is provided with a semicircular groove, and the second optical collimator is installed in the semicircular groove.

[0013] As one of the implementation modes, the shell includes a base, an upper cover covering the base, and a pull ring installed on the upper cover and the base, and the PCB circuit board is arranged on the base.

[0014] Compared with the prior art, the utility model has the following beneficial effects:

[0015] (1) The transmitting end optical component of the utility model can shorten the signal transmission distance by adopting a bare chip driver chip and placing the driver chip close to the gold finger. It can not only reduce the attenuation of the electrical signal caused by the long transmission path, improve the signal quality, and reduce the power consumption of the optical module, but also can correspondingly reduce the signal transmission time and reduce the system delay;

[0016] (2) The utility model also arranges the laser chip and the detector assembly close to the gold finger, which can further reduce the delay and power consumption. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 A schematic diagram of the structure of an optical module provided in an embodiment of the utility model;

[0019] Figure 2 A schematic diagram of the structure of an optical module provided in an embodiment of the utility model;

[0020] Figure 3 A schematic diagram of the structure of a photoelectric conversion device provided by an embodiment of the utility model;

[0021] Figure 4 A schematic diagram of the structure of a photoelectric conversion device provided by an embodiment of the utility model;

[0022] Figure 5 A schematic diagram of the structure of a detector assembly provided in an embodiment of the utility model;

[0023] In the figure: 1. housing; 101. base; 102. upper cover; 103. pull ring; 104. fixing screw; 2. photoelectric conversion device; 201. PCB circuit board; 202. transmitting end optical component; 2021. driver chip; 2022. first protective cover; 20221. laser chip; 20222. thermoelectric cooler; 20223. optical wave combining element; 20224. optical isolator; 20225. first supporting substrate; 20226. first optical collimator; 202 3. first optical fiber; 2024. first optical fiber connection adapter; 203. receiving end optical component; 2031. second protective cover; 20311. detector component; 20312. array lens; 20313. wave splitting optical element; 20314. second supporting substrate; 20315. second optical collimator; 2032. second optical fiber; 2033. second optical fiber connection adapter; 301. transimpedance amplifier; 302. first lens; 303. reflecting prism; 304. second lens. DETAILED DESCRIPTION

[0024] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0025] In the description of the present invention, it should be understood that the terms "center", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc., indicating directions or positional relationships, are based on the directions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific direction, be constructed and operated in a specific direction, and therefore should not be understood as a limitation on the present invention.

[0026] The terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features; in the description of the present utility model, unless otherwise specified, "plurality" means two or more.

[0027] like Figure 1-Figure 4 As shown, this embodiment provides an optical module, including a housing 1 and an optoelectronic conversion device 2 arranged in the housing 1, the optoelectronic conversion device 2 includes a PCB circuit board 201 and a gold finger arranged on the PCB circuit board 201, a transmitting end optical component 202 and a receiving end optical component 203, the transmitting end optical component 202 includes a driver chip 2021 in the form of a bare chip, a transmitting subcomponent, and a first optical fiber connection adapter 2024 arranged in sequence, the driver chip 2021 is arranged close to the gold finger, a first protective cover plate 2022 is arranged on the transmitting subcomponent, and the transmitting subcomponent is connected to the first optical fiber connection adapter 2024 through a first optical fiber 2023. The transmitting end optical component 202 of this embodiment adopts a driver chip 2021 in the form of a bare chip, and the driver chip 2021 is arranged close to the gold finger, so that the signal transmission distance can be shortened, which can not only reduce the attenuation of the electrical signal caused by the long transmission path, improve the signal quality, and reduce the power consumption of the optical module, but also can correspondingly reduce the signal transmission time and reduce the system delay.

[0028] Furthermore, the transmitting subassembly includes a laser chip 20221, an optical wave combining element 20223, an optical isolator 20224, and a first optical collimator 20226, which are arranged in sequence. The laser chip 20221 is arranged close to the driver chip 2021, and the distance between the laser chip 20221 and the driver chip 2021 is an integer multiple of 1 / 2 wavelength of the transmission signal. In this embodiment, the laser chip 20221 is arranged close to the driver chip 2021, which can reduce the signal transmission distance, not only can reduce signal attenuation, improve signal quality, reduce power consumption, but also improve signal transmission efficiency and reduce delay; the distance between the laser chip 20221 and the driver chip 2021 is designed to be an integer multiple of 1 / 2 wavelength of the transmission signal, which can reduce signal quality degradation and ensure signal stability and reliability.

[0029] The above embodiment is optimized, a thermoelectric cooler 20222 is provided on the PCB circuit board 201, and the laser chip 20221 is provided on the thermoelectric cooler 20222. In this embodiment, by providing the thermoelectric cooler 20222 below the laser chip 20221, the temperature of the laser can be effectively controlled to prevent the performance and reliability of the laser from being affected by excessive temperature, while reducing the power consumption of the system.

[0030] Furthermore, a first supporting substrate 20225 is provided on the PCB circuit board 201, and the optical wave combining element 20223 and the optical isolator 20224 are provided on the first supporting substrate 20225; a first mounting structure is also provided on the first supporting substrate 20225, and the first mounting structure is provided with a circular hole, and the first optical collimator 20226 is installed in the circular hole. Figure 4 As shown, the circular hole passes through the first mounting structure in the horizontal direction to facilitate the installation of the first optical collimator 20226, and the size of the circular hole matches the size of the first optical collimator 20226.

[0031] The above embodiment is optimized, and a glue injection hole is provided on the top surface of the first mounting structure, and the glue injection hole is connected to the circular hole. After the first optical collimator 20226 is inserted into the circular hole of the first mounting structure, glue can be injected into the circular hole through the glue injection hole on the top surface of the first mounting structure, so that the first optical collimator 20226 is fixed in the first mounting structure, thereby improving the reliability and stability of the bonding of the first optical collimator 20226 and preventing the first optical collimator 20226 from moving or vibrating during operation.

[0032] In one embodiment, the receiving end optical component 203 includes a second optical fiber connection adapter 2033 and a receiving sub-component arranged in sequence, the receiving sub-component is arranged close to the gold finger, a second protective cover plate 2031 is arranged on the receiving sub-component, and the receiving sub-component is connected to the second optical fiber connection adapter 2033 through a second optical fiber 2032.

[0033] This embodiment can effectively prevent the transmitting subassembly and the receiving subassembly from being invaded by external impurities such as dust, dirt, moisture, and external forces such as vibration and impact, by respectively arranging the transmitting subassembly and the receiving subassembly on the first protective cover plate 2022 and the second protective cover plate 2031, thereby improving the stability and reliability of the transmitting subassembly and the receiving subassembly.

[0034] The above embodiment is optimized, the receiving subassembly includes a second optical collimator 20315, a wave splitting optical element 20313, an array lens 20312, and a detector assembly 20311, which are arranged in sequence, and the detector assembly 20311 is arranged close to the gold finger. In this embodiment, by arranging the detector assembly 20311 close to the gold finger, the signal transmission distance can be shortened, the signal quality can be improved, the power consumption can be reduced, and the delay can be reduced.

[0035] like Figure 5 As shown, the detector assembly 20311 includes a transimpedance amplifier 301, a detector, a first lens 302, a reflection prism 303, and a second lens 304, wherein the second lens 304 is disposed between the reflection prism 303 and the wave splitting optical element 20313, the first lens 302 is disposed below the reflection prism 303, the detector is disposed below the first lens 302, and the transimpedance amplifier 301 is disposed on a side of the detector away from the wave splitting optical element 20313. Pads are disposed below the first lens 302, the reflection prism 303, and the second lens 304.

[0036] Furthermore, a second supporting substrate 20314 is disposed on the PCB circuit board 201, and the wave splitting optical element 20313 is disposed on the second supporting substrate 20314; a second mounting structure is also disposed on the second supporting substrate 20314, and the second mounting structure is provided with a semicircular groove, and the second optical collimator 20315 is installed in the semicircular groove. Figure 4 As shown, the diameter of the semicircular groove matches the diameter of the second optical collimator 20315, and the second optical collimator 20315 can be fixed in the semicircular groove by glue, thereby ensuring the reliability and stability of the second optical collimator 20315 fixed in the second mounting structure.

[0037] In this embodiment, the housing 1 includes a base 101, an upper cover 102 covering the base 101, and a pull ring 103 installed on the upper cover 102 and the base 101. The optical module can be installed and removed from the device through the pull ring 103. The PCB circuit board 201 is arranged on the base 101. The upper cover 102 and the base 101 are provided with a plurality of corresponding screw holes, and the corresponding screw holes are connected by fixing screws 104. Specifically, Figure 1 and Figure 2 As shown, screw holes can be respectively provided at the four corners of the upper cover 102 and the base 101 , and the upper cover 102 and the base 101 can be fixedly connected by four fixing screws 104 .

[0038] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the protection scope of the present invention.

Claims

1. An optical module, comprising a housing and a photoelectric conversion device arranged in the housing, wherein the photoelectric conversion device comprises a PCB circuit board and a gold finger arranged on the PCB circuit board, a transmitting end optical component and a receiving end optical component, characterized in that: The transmitting end optical component includes a bare chip-type driver chip, a transmitting sub-component, and a first optical fiber connection adapter arranged in sequence, the driver chip is arranged close to the gold finger, a first protective cover is arranged on the transmitting sub-component, and the transmitting sub-component is connected to the first optical fiber connection adapter through a first optical fiber.

2. The optical module according to claim 1, wherein: The transmitting subassembly includes a laser chip, an optical combining element, an optical isolator, and a first optical collimator which are arranged in sequence. The laser chip is arranged close to the driving chip, and the distance between the laser chip and the driving chip is an integer multiple of 1 / 2 wavelength of the transmission signal.

3. The optical module according to claim 2, wherein: A thermoelectric cooler is arranged on the PCB circuit board, and the laser chip is arranged on the thermoelectric cooler.

4. The optical module according to claim 2, wherein: A first supporting substrate is arranged on the PCB circuit board, and the optical combining element and the optical isolator are arranged on the first supporting substrate; a first mounting structure is also arranged on the first supporting substrate, and the first mounting structure is provided with a circular hole, and the first optical collimator is installed in the circular hole.

5. The optical module according to claim 4, wherein: A glue injection hole is provided on the top surface of the first mounting structure, and the glue injection hole is communicated with the circular hole.

6. The optical module according to claim 1, wherein: The receiving end optical component includes a second optical fiber connection adapter and a receiving sub-component which are arranged in sequence. The receiving sub-component is arranged close to the gold finger. A second protective cover is arranged on the receiving sub-component, and the receiving sub-component is connected to the second optical fiber connection adapter through a second optical fiber.

7. The optical module according to claim 6, wherein: The receiving subassembly includes a second optical collimator, a wave splitting optical element, and a detector assembly which are arranged in sequence, and the detector assembly is arranged close to the gold finger.

8. The optical module according to claim 7, wherein: The detector assembly includes a transimpedance amplifier, a detector, a first lens, a reflecting prism and a second lens, wherein the second lens is arranged between the reflecting prism and the wave splitting optical element, the first lens is arranged below the reflecting prism, the detector is arranged below the first lens, and the transimpedance amplifier is arranged on a side of the detector away from the wave splitting optical element.

9. The optical module according to claim 7, wherein: A second supporting substrate is arranged on the PCB circuit board, and the wave splitting optical element is arranged on the second supporting substrate; a second mounting structure is also arranged on the second supporting substrate, and the second mounting structure is provided with a semicircular groove, and the second optical collimator is installed in the semicircular groove.

10. The optical module according to claim 1, wherein: The shell comprises a base, an upper cover covering the base, and a pull ring installed on the upper cover and the base, and the PCB circuit board is arranged on the base.

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