Double-interface card

Abstract

The utility model provides a double-interface card, which comprises a card base, a chip and a conducting layer, the card base is provided with a placing groove, the inner wall of the placing groove is provided with a contact groove, the chip is bonded in the placing groove, the conducting layer is arranged on a bonding pad of the chip, and the chip is arranged on the conducting layer. And at least part of the conductive layer extends into the contact groove and is connected with an antenna in the card base. According to the utility model, the quality stability of the dual-interface card can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of dual-interface smart cards, in particular to a dual-interface card. Background Art

[0002] The dual interface card is a single-chip smart card that integrates contact and contactless interfaces. It consists of a PVC layer, a chip, and a coil. The dual interface card has two operation interfaces. The chip can be accessed through contact points or by radio frequency at a certain distance.

[0003] At present, the existing dual-interface cards on the market mainly use enameled copper wire to wind the coil antenna, which is placed in the middle layer of the card base, and then through milling grooves and ACF conductive tape, the two ends of the antenna are connected to the dual-interface chip contact pad, thereby realizing the contactless and contact functions.

[0004] This dual-interface card has certain requirements on the distance between the chip and the card base surface, and has certain requirements on the thickness of the ACF conductive tape, which results in the thickness from the card base surface to the antenna being usually fixed, that is, it can only be used for card bases with relatively fixed structures. However, with the continuous development of new dual-interface cards, card bases with different structures continue to appear, especially card bases with increased layers and thickness. If the original dual-interface card structure is used for packaging, it is easy to cause poor quality stability of the dual-interface card.

[0005] Therefore, it is necessary to adjust the structure of the existing dual-interface card to improve the quality stability of the dual-interface card. Utility Model Content

[0006] The utility model aims to provide a dual-interface card to solve the problem of poor quality stability of the dual-interface card.

[0007] In order to solve the above technical problems, the utility model provides a dual-interface card, including a card base and a chip, and also including a conductive layer. The card base is provided with a placement groove, the inner wall of the placement groove is provided with a contact groove, the chip is bonded in the placement groove, the conductive layer is arranged on the solder pad of the chip, and the conductive layer at least partially extends into the contact groove and is connected to the antenna in the card base.

[0008] Optionally, a conductive adhesive layer is further included, and the conductive adhesive layer is filled in the contact groove.

[0009] Optionally, the cross-sectional area of ​​the conductive layer is smaller than the size of the pad of the chip.

[0010] Optionally, the conductive adhesive layer is located between an end of the conductive layer close to the bottom of the contact groove and the bottom of the contact groove.

[0011] Optionally, the placement groove includes a mounting groove and a structural groove, the structural groove is opened at the bottom of the mounting groove, the contact groove is located at the bottom of the mounting groove, and the back of the chip has a boss, and the boss is located in the structural groove.

[0012] Optionally, the boss is a cylindrical boss.

[0013] Optionally, the number of the contact grooves is two, and the two contact grooves are symmetrically arranged about the center of the structural groove.

[0014] Optionally, the card base includes a positive adhesive film layer, a positive pattern printing layer, a positive compensation layer, an antenna layer, a reverse compensation layer, a reverse pattern printing layer and a reverse adhesive film layer stacked in sequence.

[0015] Optionally, the placement groove is located on the positive resist film layer.

[0016] Optionally, the conductive layer is made of tin.

[0017] The dual-interface card provided by the utility model has the following beneficial effects:

[0018] A placement groove is provided on the card base, a contact groove is provided in the placement groove, the bottom of the contact groove is connected to the antenna in the card base, the conductive layer is provided on the solder pad of the chip, the conductive layer extends into the contact groove and is connected to the antenna at the bottom of the contact groove, so the chip can be connected to the antenna through the conductive layer; the chip is provided in the placement groove, and an adhesive layer is provided between the portion of the back side of the chip where the solder pad is not provided and the placement groove, so that the installation position of the chip can be accurate, that is, the distance between the chip and the surface of the card base meets the requirements, the thickness of the adhesive layer meets the requirements, and the chip can be connected to the antenna in the card base, which can ensure the performance of the dual-interface card and improve the quality stability of the dual-interface card. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] Figure 1 It is a schematic diagram of the structure of the dual interface card in the embodiment of the utility model;

[0020] Figure 2 It is a structural schematic diagram of a card base of a dual-interface card in an embodiment of the utility model;

[0021] Figure 3 It is a schematic diagram of the exploded structure of the unprocessed placement groove and contact groove of the card base of the dual-interface card in the embodiment of the utility model;

[0022] Figure 4 It is a schematic diagram of the front structure of the chip of the dual-interface card in the embodiment of the utility model;

[0023] Figure 5It is a schematic diagram of the back structure of the chip of the dual-interface card in the embodiment of the utility model;

[0024] Figure 6 It is a schematic structural diagram of a conductive layer disposed on the pad of the chip of the dual-interface card in the embodiment of the utility model;

[0025] Figure 7 It is a structural schematic diagram of a dual-interface card chip in an embodiment of the utility model in which a conductive layer is arranged on the pad of the chip and a conductive adhesive layer is coated on the conductive layer.

[0026] Description of reference numerals:

[0027] 100-card base; 110-placement slot; 111-installation slot; 112-structure slot; 120-contact slot; 131-positive adhesive film layer; 132-positive pattern printing layer; 133-positive compensation layer; 134-antenna layer; 135-reverse compensation layer; 136-reverse pattern printing layer; 137-reverse adhesive film layer; 200-chip; 210-boss; 300-conductive layer; 400-adhesive layer; 500-conductive adhesive layer. DETAILED DESCRIPTION

[0028] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, not all of the embodiments. Generally, the components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0029] Therefore, the following detailed description of the embodiments of the present invention provided in the accompanying drawings is not intended to limit the scope of the present invention to be protected, but merely represents selected embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0030] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, further definition and explanation thereof is not required in subsequent drawings.

[0031] In the description of the present utility model, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inside", "outside", etc. indicate the orientation or position relationship based on the orientation or position relationship shown in the accompanying drawings, or the orientation or position relationship in which the utility model product is usually placed when in use, which is only for the convenience of describing the utility model and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present utility model. In addition, the terms "first", "second", "third", etc. are only used to distinguish the description, and cannot be understood as indicating or implying relative importance.

[0032] In addition, the terms "horizontal", "vertical" and the like do not mean that the components are required to be absolutely horizontal or suspended, but can be slightly tilted. For example, "horizontal" only means that its direction is more horizontal than "vertical", and does not mean that the structure must be completely horizontal, but can be slightly tilted.

[0033] In the description of the present invention, it is also necessary to explain that, unless otherwise clearly specified and limited, the terms "set", "install", "connect", and "connect" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0034] refer to Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 , Figure 6 and Figure 7 , Figure 1 It is a schematic diagram of the structure of the dual interface card in the embodiment of the utility model. Figure 2 1 is a schematic diagram of the structure of the card base 100 of the dual-interface card in the embodiment of the utility model. Figure 3 1 is a schematic diagram of the exploded structure of the card base 100 of the dual-interface card in the embodiment of the utility model without processing the placement groove 110 and the contact groove 120. Figure 4 2 is a schematic diagram of the front structure of the chip 200 of the dual-interface card in the embodiment of the utility model. Figure 5 2 is a schematic diagram of the back structure of the chip 200 of the dual-interface card in the embodiment of the utility model. Figure 6 2 is a schematic structural diagram of a dual-interface card in an embodiment of the present invention in which a conductive layer 300 is disposed on the pad of the chip 200. Figure 7The present invention is a schematic structural diagram of a dual-interface card in which a conductive layer 300 is arranged on the pad of the chip 200 and a conductive adhesive layer 500 is coated on the conductive layer 300. The present embodiment provides a dual-interface card, including a card base 100, a chip 200 and a conductive layer 300. The card base 100 is provided with a placement groove 110, and the inner wall of the placement groove 110 is provided with a contact groove 120. The chip is bonded in the placement groove 110. The conductive layer 300 is arranged on the pad of the chip 200. The conductive layer 300 at least partially extends into the contact groove 120 and is connected to the antenna in the card base 110.

[0035] By opening a placement groove 110 on the card base 100, and opening a contact groove 120 on the inner wall of the placement groove 110, the conductive layer 300 is arranged on the pad of the chip 200, and the conductive layer 300 at least partially extends into the contact groove 120 and is connected to the antenna in the card base 110, so that the chip 200 can be connected to the antenna through the conductive layer 300; by bonding the chip in the placement groove 110, the installation position of the chip 200 can be accurate, that is, the distance between the chip 200 and the surface of the card base 100 meets the requirement, the thickness of the adhesive layer 400 meets the requirement, and at the same time, the chip 200 can be connected to the antenna in the card base 100, which can ensure the performance of the dual-interface card and improve the quality stability of the dual-interface card.

[0036] An adhesive layer 400 is disposed between the chip 200 and the placement groove 110. Specifically, the adhesive layer 400 is disposed on a portion of the back side of the chip 200 where no pad is disposed.

[0037] Preferably, the dual interface card further comprises a conductive adhesive layer 500 , and the conductive adhesive layer 500 is filled in the contact groove 120 to improve the conduction stability between the conductive layer 300 and the antenna, and improve the quality stability of the dual interface card.

[0038] The cross-sectional area of ​​the conductive layer 300 is smaller than the size of the pad of the chip 200 .

[0039] The conductive adhesive layer 500 is located between an end of the conductive layer 300 close to the bottom of the contact groove 120 and the bottom of the contact groove 120 .

[0040] The placement groove 110 includes a mounting groove 111 and a structural groove 112 . The structural groove 112 is opened at the bottom of the mounting groove 111 . The contact groove 120 is located at the bottom of the mounting groove 111 . The back of the chip 200 has a boss 210 . The boss 210 is located in the structural groove 112 .

[0041] The boss 210 is a cylindrical boss.

[0042] The end of the boss 210 opposite to the bottom of the structural groove 112 is not provided with the adhesive layer 400 .

[0043] The number of the contact grooves 120 is two, and the two contact grooves 120 are symmetrically arranged about the center of the structural groove 112 .

[0044] The card base 100 includes a positive adhesive film layer 131, a positive pattern printing layer 132, a positive compensation layer 133, an antenna layer 134, a reverse compensation layer 135, a reverse pattern printing layer 136 and a reverse adhesive film layer 137 which are stacked in sequence.

[0045] Preferably, the placement groove 110 is located on the positive resist layer 131 .

[0046] Preferably, the conductive layer 300 is made of tin and is formed by soldering and then milling the top.

[0047] The manufacturing process of the dual interface card is as follows:

[0048] 1) Based on the material and structure of the card base 100, the multi-layer materials including the positive adhesive film layer 131, the positive pattern printing layer 132, the positive compensation layer 133, the antenna layer 134, the reverse compensation layer 135, the reverse pattern printing layer 136 and the reverse adhesive film layer 137 are stacked, bound and laminated, and then punched to form a standard card base 100;

[0049] 2) Using a dedicated milling device to produce the placement groove 110 and the contact groove 120 on the card base 100 according to the thickness of the chip 200 and the built-in depth of the antenna;

[0050] 3) Based on the depth of the placement groove 110 and the contact groove 120, use a tinning and backing glue device to perform soldering and backing glue (conductive glue and adhesive) production operations on the chip 200;

[0051] 4) The milled card base 100 and the tinned back glue chip 200 are respectively packaged and produced by using a dedicated packaging device;

[0052] 5) After the packaging production of the card base 100 and the chip 200 is completed, a dedicated testing device is used to perform a functional test. If qualified, it will flow into the post-process and the production operation is completed.

[0053] The above description is only a description of the preferred embodiment of the utility model, and is not any limitation on the scope of the utility model. Any changes and modifications made by ordinary technicians in the field of the utility model based on the above disclosure shall fall within the scope of protection of the claims.

Claims

1. A dual-interface card, comprising a card base and a chip, characterized in that: It also includes a conductive layer, a placement groove is opened on the card base, a contact groove is opened on the inner wall of the placement groove, the chip is bonded in the placement groove, the conductive layer is arranged on the solder pad of the chip, and the conductive layer at least partially extends into the contact groove and is connected to the antenna in the card base.

2. The dual interface card as claimed in claim 1, wherein: It also includes a conductive adhesive layer, which is filled in the contact groove.

3. The dual interface card as claimed in claim 1, wherein: The cross-sectional area of ​​the conductive layer is smaller than the size of the pad of the chip.

4. The dual interface card as claimed in claim 2, wherein: The conductive adhesive layer is located between an end of the conductive layer close to the bottom of the contact groove and the bottom of the contact groove.

5. The dual interface card as claimed in claim 1, wherein: The placement groove includes a mounting groove and a structural groove. The structural groove is opened at the groove bottom of the mounting groove. The contact groove is located at the groove bottom of the mounting groove. The back side of the chip has a boss, and the boss is located in the structural groove.

6. The dual interface card as claimed in claim 5, characterized in that: The boss is a cylindrical boss.

7. The dual interface card as claimed in claim 5, characterized in that: The number of the contact grooves is two, and the two contact grooves are symmetrically arranged about the center of the structural groove.

8. The dual interface card as claimed in claim 1, wherein: The card base comprises a positive adhesive film layer, a positive pattern printing layer, a positive compensation layer, an antenna layer, a reverse compensation layer, a reverse pattern printing layer and a reverse adhesive film layer which are sequentially stacked together.

9. The dual interface card as claimed in claim 8, characterized in that: The placement groove is located on the positive resist film layer.

10. The dual interface card as claimed in claim 1, wherein: The conductive layer is made of tin.

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