Double-layer nameplate structure and electronic product

Abstract

The utility model relates to the technical field of electronic products, in particular to a double-layer nameplate structure and an electronic product, the double-layer nameplate structure comprises a nameplate bottom layer and a nameplate top layer, and the nameplate bottom layer is convexly provided with a first hot melting part; the nameplate top layer is provided with a second hot melting part in a protruding mode, and the second hot melting part is embedded in the first hot melting part so that the nameplate bottom layer can be fixedly connected with the nameplate top layer. According to the nameplate, the iron net structure, the nameplate bottom layer and the nameplate top layer are integrated through the first hot melting part and the second hot melting part, and the resonance problem of the double-layer nameplate is solved.

Description

Technical Field

[0001] The utility model relates to the technical field of electronic products, in particular to a double-layer nameplate structure and an electronic product. Background Art

[0002] Electronic products such as speakers have a double-layer nameplate structure for information identification.

[0003] Among them, most of the speaker shells are provided with an iron mesh structure, and the double-layer nameplate structure includes a nameplate bottom layer and a nameplate top layer. The nameplate top layer is fixed to the nameplate bottom layer in a surface contact manner, and the nameplate top layer has a mounting column, which passes through the nameplate bottom layer and is plugged into the outer shell of the electronic product for preliminary fixation. Then, the mounting column is melted by a hot melt process to form an integrated structure with the nameplate top layer and the iron mesh structure. However, at this time, the nameplate bottom layer is not integrated with the nameplate top layer and the iron mesh structure, and is in a compressed state.

[0004] In the related art, the bottom layer of the nameplate and the iron mesh structure are fixed by double-sided adhesive bonding. At this time, because the top layer and the bottom layer of the nameplate are only connected to the iron mesh structure of the electronic product, the top layer and the bottom layer of the nameplate are only in surface contact; when the electronic product is running, a vibration source will be generated. Because the iron mesh structure and the top layer of the nameplate are connected by surface, and the top layer and the bottom layer of the nameplate are connected by surface, the transmission of vibration can easily lead to different movement amplitudes between the bottom layer and the top layer of the nameplate, thereby generating relative vibration, resulting in looseness and noise between the bottom layer and the top layer of the nameplate and the iron mesh structure. Utility Model Content

[0005] The main purpose of the utility model is to provide a double-layer nameplate structure, aiming to improve the resonance problem of the double-layer nameplate.

[0006] To achieve the above purpose, the double-layer nameplate structure proposed by the utility model includes:

[0007] A nameplate bottom layer, wherein the nameplate bottom layer is provided with a first hot-melt portion; and

[0008] The top layer of the nameplate is provided with a second hot-melt portion protruding from the top layer of the nameplate, and the second hot-melt portion is embedded in the first hot-melt portion so that the bottom layer of the nameplate is fixedly connected to the top layer of the nameplate.

[0009] In an embodiment of the present invention, the second hot-melt portion is a fixed column, the first hot-melt portion is a colloid hollow column, and the fixed column abuts against the inner side wall of the colloid hollow column.

[0010] In an embodiment of the present invention, the colloid hollow column has a tight-fitting section, and the fixing column has a tight-fitting bone position, and the tight-fitting bone position abuts against the inner peripheral wall of the tight-fitting section.

[0011] In one embodiment of the utility model, the colloid hollow column also includes an introduction section, which is located below the tight-fitting section; the cross-sectional area of ​​the introduction section gradually increases from one end connected to the tight-fitting section to one end away from the tight-fitting section, and an introduction gap is formed between the introduction section and the fixed column.

[0012] In one embodiment of the utility model, the colloid hollow column also includes a hot melt section, which is connected to the tight-fitting section and is located above the tight-fitting section. The cross-sectional area of ​​the hot melt section gradually increases from one end connected to the tight-fitting section to one end away from the tight-fitting section, and a hot melt gap is formed between the hot melt section and the fixed column.

[0013] In one embodiment of the present invention, a plurality of the first hot-melt portions are spaced apart on the bottom layer of the nameplate, and the second hot-melt portions are spaced apart on the top layer of the nameplate, and each of the second hot-melt portions is embedded in the first hot-melt portion.

[0014] In an embodiment of the present invention, the double-layer nameplate structure has a buffer gap, and the buffer gap is arranged between the bottom layer of the nameplate and the top layer of the nameplate.

[0015] In one embodiment of the utility model, the top layer of the nameplate is provided with a first spacer frame and a second spacer frame, the first spacer frame and the second hot melt portion are arranged on the same surface of the top layer of the nameplate, and the second spacer frame is arranged on the side of the top layer of the nameplate.

[0016] In one embodiment of the present invention, the first spacer bone position is arranged along the outer edge of the top layer of the nameplate; and the second spacer bone position is arranged around the side surface of the top layer of the nameplate.

[0017] The utility model also provides an electronic product, which includes an iron mesh structure and the double-layer nameplate structure, wherein the iron mesh structure, the nameplate bottom layer and the nameplate top layer are an integrated structure.

[0018] In the technical solution of the utility model, a double-layer nameplate structure is applied to an electronic product, which has an iron mesh structure. The double-layer nameplate structure is fixed on the iron mesh structure. The double-layer nameplate structure includes a nameplate bottom layer and a nameplate top layer. The nameplate bottom layer is convexly provided with a first hot-melt portion, and the nameplate top layer is convexly provided with a second hot-melt portion. The second hot-melt portion is embedded in the first hot-melt portion. Melting the first hot-melt portion and the second hot-melt portion can create an integrated structure among the iron mesh structure, the nameplate top layer and the nameplate bottom layer. When the electronic product vibrates, there will be no relative vibration between the three due to different movement amplitudes, thereby improving the problems of looseness and noise between the double-layer nameplate structure and the electronic product and between the nameplate bottom layer and the nameplate top layer of the double-layer nameplate structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.

[0020] Figure 1 A three-dimensional structural schematic diagram of an embodiment of a double-layer nameplate structure provided by the utility model;

[0021] Figure 2 A three-dimensional structural schematic diagram of another embodiment of the double-layer nameplate structure provided by the utility model;

[0022] Figure 3 A schematic diagram of the three-dimensional structure of an embodiment of the top layer of the nameplate provided by the utility model;

[0023] Figure 4 A schematic diagram of the three-dimensional structure of another embodiment of the top layer of the nameplate provided by the utility model;

[0024] Figure 5 A three-dimensional structural diagram of an embodiment of the bottom layer of the nameplate provided by the utility model;

[0025] Figure 6 for Figure 5 Section view along line AA;

[0026] Figure 7 A three-dimensional structural schematic diagram of another embodiment of the bottom layer of the nameplate provided by the utility model;

[0027] Figure 8 for Figure 7 Sectional view along line BB;

[0028] Fig. 9 for Figure 1 Sectional view along line CC;

[0029] Fig.10 for Figure 2 Cross-sectional view along line DD.

[0030] Description of Figure Numbers:

[0031] Label name Label name 10 Double-layer nameplate structure 122 Fixed column 11 Nameplate bottom 111 First hot melt section 12 Nameplate top 112 Colloidal hollow column 121 Second hot melt section 1121 Tight fitting section 123 First septum bone 1122 Import 124 Second septum bone position 1123 Hot melt section 10A Buffer gap 125 Tight fit

[0032] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0034] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.

[0035] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the meaning of "and / or" appearing in the full text includes three parallel schemes. Taking "A and / or B" as an example, it includes scheme A, or scheme B, or a scheme that satisfies both A and B. In addition, the technical solutions between the various embodiments can be combined with each other, but it must be based on the ability of ordinary technicians in this field to implement. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.

[0036] Please refer to Figures 1 to 10 As shown, the double-layer nameplate structure 10 proposed by the utility model includes:

[0037] A nameplate bottom layer 11, wherein the nameplate bottom layer 11 is provided with a first hot-melt portion 111; and

[0038] The nameplate top layer 12 is provided with a second hot-melt portion 121 convexly thereon. The second hot-melt portion 121 is embedded in the first hot-melt portion 111 so that the nameplate bottom layer 11 is fixedly connected to the nameplate top layer 12 .

[0039] In the technical solution of the utility model, a double-layer nameplate structure 10 is applied to an electronic product, which has an iron mesh structure. The double-layer nameplate structure 10 is fixed on the iron mesh structure. The double-layer nameplate structure 10 includes a nameplate bottom layer 11 and a nameplate top layer 12. The nameplate bottom layer 11 is convexly provided with a first hot-melt portion 111, and the nameplate top layer 12 is convexly provided with a second hot-melt portion 121. The second hot-melt portion 121 is embedded in the first hot-melt portion 111. Melting the first hot-melt portion 111 and the second hot-melt portion 121 can make the iron mesh structure, the nameplate top layer 12 and the nameplate There is an integrated structure between the bottom layer 11 and the three layers of the nameplate. When the electronic product vibrates, there will be no relative vibration between the three layers due to different movement amplitudes, thereby improving the problems of looseness and noise between the double-layer nameplate structure 10 and the electronic product, and between the bottom layer 11 and the top layer 12 of the nameplate of the double-layer nameplate structure 10. Furthermore, when the double-layer nameplate structure 10 proposed in the present application is installed on an electronic product, it is no longer necessary to double-sidedly glue the bottom layer 11 of the nameplate, thereby reducing the assembly steps and, at the same time, eliminating the curing time of the adhesive to improve the assembly efficiency.

[0040] First of all, it needs to be explained that the double-layer nameplate structure 10 is an identification plate that can convey information, and its appearance and shape can also convey relevant information to users, such as brand name, product model, etc. Therefore, the shape of the double-layer nameplate structure 10 can be an appropriate deformation of language and text, such as making it into the shape of Chinese characters and English letters to convey information.

[0041] The double-layer nameplate structure 10 includes a nameplate bottom layer 11 and a nameplate top layer 12. Here, the "bottom layer" and the "top layer" only represent the overlapping position of the nameplate bottom layer 11 and the nameplate top layer 12 after installation. The upper surface of the nameplate bottom layer 11 can fit the iron mesh structure of the electronic product, and the lower surface can contact the nameplate top layer 12. The iron mesh structure, the nameplate bottom layer 11 and the nameplate top layer 12 are stacked in sequence; of course, the "nameplate bottom layer 11" and the "nameplate top layer 12" can also be conceptually adjusted in name, so that the upper surface of the "nameplate top layer 12" can fit the iron mesh structure of the electronic product, and the lower surface can contact the "nameplate bottom layer 11". Therefore, it can be understood that the "bottom layer" and the "top layer" are not conceptually fixed terms with fixed positions. In this application, they only represent the positional relationship in one embodiment and are not limited here.

[0042] A first hot-melt portion 111 is convexly provided on the surface of the nameplate bottom layer 11, and a second hot-melt portion 121 is convexly provided on the surface of the nameplate top layer 12. At the same time, a through hole corresponding to the first hot-melt portion 111 is opened on the nameplate bottom layer 11, so that the second hot-melt portion 121 can pass through the through hole and be embedded in the first hot-melt portion 111, so that the nameplate bottom layer 11 is fixedly connected to the nameplate top layer 12. Subsequently, the double-layer nameplate structure 10 is installed on the iron mesh structure of the electronic product, and the first hot-melt portion 111 and the second hot-melt portion 121 are melted and solidified through a hot-melt process, so that an integrated connection structure exists among the iron mesh structure, the nameplate bottom layer 11 and the nameplate top layer 12. When the electronic product vibrates during operation, even if the vibration frequency is different due to the different structures, shapes, materials and masses of the iron mesh structure, the nameplate bottom layer 11 and the nameplate top layer 12, the problems of looseness and noise generation between the double-layer nameplate structure 10 and the electronic product and between the nameplate bottom layer 11 and the nameplate top layer 12 of the double-layer nameplate structure 10 can be improved. In this embodiment, the second hot-melt portion 121 is cylindrical, and the first hot-melt portion 111 is a hollow cylinder; in another embodiment, the second hot-melt portion 121 may be a solid hemispherical protrusion, and the first hot-melt portion 111 may be a hollow hemispherical protrusion, and the second hot-melt portion 121 may also be embedded in the first hot-melt portion 111 so that the bottom layer 11 of the nameplate is fixedly connected to the top layer 12 of the nameplate.

[0043] In one embodiment of the present invention, Figures 3 to 7 The second hot-melt portion 121 is a fixing column 122 , the first hot-melt portion 111 is a colloid hollow column 112 , and the fixing column 122 abuts against an inner side wall of the colloid hollow column 112 .

[0044] In this embodiment, the second hot-melt portion 121 is a fixed column 122, and the first hot-melt portion 111 is a colloid hollow column 112. The colloid hollow column 112 and the second hot-melt portion 121 are interference fit so that the fixed column 122 abuts against the inner wall of the colloid hollow column 112. At this time, the connection stability between the nameplate bottom layer 11 and the nameplate top layer 12 can be improved by interference fit, and the problem of loose connection between the nameplate top layer 12 and the nameplate bottom layer 11 can be prevented before the double-layer nameplate structure 10 is subjected to the hot-melt process.

[0045] In one embodiment of the present invention, Figure 6 and Figure 8 As shown, the colloid hollow column 112 has a tight-fitting section 1121 , and the fixing column 122 has a tight-fitting bone position 125 , and the tight-fitting bone position 125 abuts against the inner circumferential wall of the tight-fitting section 1121 .

[0046] In this embodiment, the colloid hollow column 112 has a tight-fitting section 1121, and the outer peripheral side of the fixed column 122 has four tight-fitting bone positions 125. The four tight-fitting bone positions 125 are arranged on the outer peripheral side of the fixed column 122 at intervals along the outer peripheral direction of the fixed column 122. The tight-fitting bone positions 125 and the fixed column 122 are an integrally molded structure. When the fixed column 122 is embedded in the colloid hollow column 112, the tight-fitting bone positions 125 tightly abut against the inner side wall of the colloid hollow column 112, so that the bottom layer 11 of the nameplate and the top layer 12 of the nameplate are in a tight-fitting state.

[0047] In one embodiment of the present invention, Figure 6 and Figure 8 As shown, the colloid hollow column 112 also includes an introduction section 1122, and the introduction section 1122 is located below the tight-fitting section 1121; the cross-sectional area of ​​the introduction section 1122 gradually increases from one end connected to the tight-fitting section 1121 to one end away from the tight-fitting section 1121, and an introduction gap is formed between the introduction section 1122 and the fixed column 122.

[0048] In the present embodiment, the colloid hollow column 112 also includes an introduction section 1122, which is located below the tight-fitting section 1121 and connected to the through hole. The introduction section 1122 is in a flared shape, specifically, the cross-sectional area of ​​the introduction section 1122 gradually increases from one end connected to the tight-fitting section 1121 to the end away from the tight-fitting section 1121. At this time, the entrance cross-sectional area of ​​the introduction section 1122 is greater than the cross-sectional area of ​​the fixed column 122, and an introduction gap is formed between the introduction section 1122 and the fixed column 122. The introduction gap facilitates the fixed column 122 to enter and be embedded in the colloid hollow column 112. In the present embodiment, the introduction section 1122 is in a truncated cone shape so that the inner circumferential wall of the introduction section 1122 is a guiding inclined wall; in another embodiment, the introduction section 1122 is in a spherical table shape so that the inner circumferential wall of the introduction section 1122 is a guiding arc wall.

[0049] In one embodiment of the present invention, Figure 6 and Figure 8 As shown, the colloid hollow column 112 also includes a hot melt section 1123, which is connected to the tight-fitting section 1121 and is located above the tight-fitting section 1121. The cross-sectional area of ​​the hot melt section 1123 gradually increases from one end connected to the tight-fitting section 1121 to one end away from the tight-fitting section 1121, and a hot melt gap is formed between the hot melt section 1123 and the fixed column 122.

[0050] In the present embodiment, the colloid hollow column 112 also includes a hot melt section 1123, which is connected to the tight-fitting section 1121 and is located above the tight-fitting section 1121. The hot melt section 1123 is in a flared shape and the flaring direction is opposite to that of the introduction section 1122. Specifically, the cross-sectional area of ​​the hot melt section 1123 gradually increases from one end connected to the tight-fitting section 1121 to the end away from the tight-fitting section 1121. At this time, the cross-sectional area of ​​the inlet end of the hot melt section 1123 is equal to the cross-sectional area of ​​the fixed column 122, and the cross-sectional area of ​​the outlet end is larger than the cross-sectional area of ​​the fixed column 122. A hot melt gap is formed between the hot melt section and the fixed column 122. By setting the hot melt section 1123, the colloid hollow column 112 and the fixed column 122 can be better melted together during hot melting, and the top of the nameplate will not fall off during the hot melting stage.

[0051] In one embodiment of the present invention, Figure 1 and Figure 2 As shown, the nameplate bottom layer 11 is provided with a plurality of first hot-melt portions 111, and the nameplate top layer 12 is provided with a plurality of second hot-melt portions 121; the plurality of first hot-melt portions 111 are arranged at intervals on the nameplate bottom layer 11, and the plurality of second hot-melt portions 121 are arranged at intervals on the nameplate top layer 12, and each of the second hot-melt portions 121 is embedded in the first hot-melt portion 111.

[0052] In this embodiment, the nameplate bottom layer 11 and the nameplate top layer 12 are made into the shape of a capital letter "L", which is generally composed of a straight line with two open ends. Four first hot-melt portions 111 and second hot-melt portions 121 are respectively provided on the nameplate bottom layer 11 and the nameplate top layer 12, wherein two first hot-melt portions 111 and second hot-melt portions 121 are respectively provided at the two ends, and the remaining two first hot-melt portions 111 and second hot-melt portions 121 are respectively provided in the middle section between the two ends. The four first hot-melt portions 111 and second hot-melt portions 121 are arranged at intervals, and each of the second hot-melt portions 121 is embedded in the first hot-melt portion 111, so that the double-layer nameplate structure 10 proposed in this application has a plurality of evenly distributed fixing points, which can improve the connection stability before hot-melting. On the one hand, it can improve the integrity after hot melting under controlled costs; in another embodiment, the nameplate bottom layer 11 and the nameplate top layer 12 are made into the shape of a capital letter "B", which is generally composed of straight lines and curves. In this embodiment, the nameplate bottom layer 11 and the nameplate top layer 12 are respectively provided with six first hot melting parts 111 and second hot melting parts 121, and any two of the first hot melting parts 111 and the second hot melting parts 121 form a pair of hot melting parts, forming a total of three pairs of hot melting parts, and the two first hot melting parts 111 and the second hot melting parts 121 of each group of hot melting parts are spaced apart along the width direction of the double-layer nameplate structure 10, and the three groups of hot melting parts are spaced apart along the length direction of the double-layer nameplate structure 10, so that the double-layer nameplate structure 10 has multiple evenly distributed fixed points. Furthermore, the double-layer nameplate structure 10 can be viewed as a free combination of straight lines and curves in the shape of other uppercase letters or Chinese characters. Therefore, the double-layer nameplate structure 10 of any shape can be provided with the first hot-melt portion 111 and the second hot-melt portion 121 at the end and the non-end according to the specific shape to form multiple fixing points.

[0053] In one embodiment of the present invention, Fig. 9 and Fig.10 As shown, the double-layer nameplate structure 10 has a buffer gap 10A, and the buffer gap is arranged between the nameplate bottom layer 11 and the nameplate top layer 12.

[0054] In this embodiment, the double-layer nameplate structure 10 has a buffer gap 10A, which is arranged between the nameplate bottom layer 11 and the nameplate top layer 12. The buffer gap 10A can reduce the contact area between the nameplate bottom layer 11 and the nameplate top layer 12, and reduce the total area that can transmit vibration, thereby reducing the ratio of the contact area to the total contactable area between the nameplate bottom layer and the nameplate top layer 12, thereby reducing the vibration efficiency and improving the looseness and noise generation problems between the double-layer nameplate structure 10 and the electronic products and between the nameplate bottom layer 11 and the nameplate top layer 12 of the double-layer nameplate structure 10. It can be understood that when the nameplate bottom layer 11 and the nameplate top layer 12 are installed, the nameplate bottom layer 11 as a whole covers the nameplate top layer 12, that is, the side of the nameplate bottom layer 11 facing away from the iron mesh is provided with an installation groove that is adapted to the shape of the nameplate top layer 12, and the nameplate top layer 12 is located in the installation groove, and a protrusion can be provided on the side of the nameplate bottom layer 11 facing the nameplate top layer 12 or on the side of the nameplate top layer 12 facing the nameplate bottom layer 11, and a buffer gap 10A is formed between the nameplate bottom layer 11 and the nameplate top layer 12 through the protrusion, and the protrusion can be a strip formed by a closed loop, or can be an intermittent strip, or can be a point, which is not limited here.

[0055] In one embodiment of the present invention, Fig. 9 and Fig.10 As shown, the nameplate top layer 12 is provided with a first spacer bone position 123 and a second spacer bone position 124 , the first spacer bone position 123 and the second hot melt portion 121 are provided on the same surface of the nameplate top layer 12 , and the second spacer bone position 124 is provided on the side of the nameplate top layer 12 .

[0056] In this embodiment, the top layer 12 of the nameplate is provided with a first spacer bone position 123 and a second spacer bone position 124. The first spacer bone position 123 and the second hot melt portion 121 are arranged on the same surface of the top layer 12 of the nameplate, and the second spacer bone position 124 is arranged on the side of the top layer 12 of the nameplate, so that the top layer 12 of the nameplate and the bottom layer 11 of the nameplate form multiple buffer gaps 10A.

[0057] In one embodiment of the present invention, Figure 3 and Figure 4 As shown, the first spacer bone position 123 is arranged along the outer edge of the top layer 12 of the nameplate; and the second spacer bone position 124 is arranged around the side of the top layer 12 of the nameplate.

[0058] In this embodiment, the first spacer bone position 123 is arranged along the outer edge of the nameplate top layer 12, and the second spacer bone position 124 is arranged around the side of the nameplate top layer 12. The first spacer bone position 123 and the second spacer bone position 124 are made into a closed-loop strip structure, which reduces the steps in the production process and reduces the production difficulty. In another embodiment, the nameplate top layer 12 can also be provided with a spacer bone position in the area surrounded by the first spacer bone position 123 to ensure the formation of the buffer gap 10A.

[0059] The utility model also proposes an electronic product, which includes an iron mesh structure and a double-layer nameplate structure 10. The double-layer nameplate structure 10 includes a nameplate bottom layer 11 and a nameplate top layer 12. The two sides of the nameplate bottom layer 11 can contact the iron mesh structure and the nameplate top layer 12 respectively. A limiting hole for the first hot-melt portion 111 to pass through is provided on the iron mesh structure. When the double-layer nameplate structure 10 is installed on the iron mesh structure, the first hot-melt portion 111 and the second hot-melt portion 121 are melted. After the first hot-melt portion 111 and the second hot-melt portion 121 are re-solidified, the iron mesh structure, the nameplate bottom layer 11 and the nameplate top layer 12 become an integrated structure, thereby improving the problems of looseness and noise between the double-layer nameplate structure 10 and the electronic product and between the nameplate bottom layer 11 and the nameplate top layer 12 of the double-layer nameplate structure 10. The specific structure of the double-layer nameplate structure 10 refers to the above embodiment. Since the electronic product adopts all the technical solutions of all the above embodiments, it at least has all the beneficial effects brought by the technical solutions of the above embodiments, which will not be repeated here.

[0060] The above are only preferred embodiments of the present invention, and do not limit the patent scope of the present invention. All equivalent structural changes made by using the contents of the present invention specification and drawings under the inventive concept of the present invention, or directly / indirectly applied in other related technical fields are included in the patent protection scope of the present invention.

Claims

1. A double-layer nameplate structure (10), fixed to an iron mesh structure of an electronic product, characterized in that: The double-layer nameplate structure (10) comprises: A nameplate bottom layer (11), wherein the nameplate bottom layer (11) is provided with a first hot-melt portion (111); and The nameplate top layer (12) is provided with a second hot-melt portion (121) protruding from the nameplate top layer (12), and the second hot-melt portion is embedded in the first hot-melt portion so that the nameplate bottom layer (11) is fixedly connected to the nameplate top layer (12).

2. The double-layer nameplate structure (10) according to claim 1, characterized in that: The second hot-melt portion (121) is a fixed column (122), the first hot-melt portion (111) is a colloid hollow column (112), and the fixed column (122) abuts against the inner side wall of the colloid hollow column (112).

3. The double-layer nameplate structure (10) according to claim 2, characterized in that: The colloid hollow column (112) has a tight-fitting section (1121), and the fixing column (122) has a tight-fitting bone position (125), and the tight-fitting bone position (125) abuts against the inner peripheral wall of the tight-fitting section (1121).

4. The double-layer nameplate structure (10) according to claim 3, characterized in that: The colloidal hollow column (112) further comprises an introduction section (1122), and the introduction section (1122) is located below the tight-fitting section (1121); the cross-sectional area of ​​the introduction section (1122) gradually increases from one end connected to the tight-fitting section (1121) to one end away from the tight-fitting section (1121), and an introduction gap is formed between the introduction section (1122) and the fixed column (122).

5. The double-layer nameplate structure (10) according to claim 3, characterized in that: The colloid hollow column (112) further comprises a hot melt section (1123), the hot melt section (1123) being connected to the tight-fitting section (1121) and being located above the tight-fitting section (1121), the cross-sectional area of ​​the hot melt section (1123) gradually increasing from one end connected to the tight-fitting section (1121) to one end away from the tight-fitting section (1121), and a hot melt gap is formed between the hot melt section (1123) and the fixed column (122).

6. The double-layer nameplate structure (10) according to any one of claims 1 to 5, characterized in that: The bottom layer (11) of the nameplate is provided with a plurality of the first hot-melt portions, and the top layer (12) of the nameplate is provided with a plurality of the second hot-melt portions (121); the plurality of the first hot-melt portions (111) are arranged at intervals on the bottom layer of the nameplate, and the plurality of the second hot-melt portions (121) are arranged at intervals on the top layer of the nameplate, and each of the second hot-melt portions (121) is embedded in the first hot-melt portion (111).

7. The double-layer nameplate structure (10) according to claim 1, characterized in that: The double-layer nameplate structure (10) has a buffer gap (10A), and the buffer gap (10A) is arranged between the nameplate bottom layer (11) and the nameplate top layer (12).

8. The double-layer nameplate structure (10) according to claim 2, characterized in that: The top layer of the nameplate is provided with a first spacer bone position (123) and a second spacer bone position (124); the first spacer bone position (123) and the second hot-melt portion (121) are arranged on the same surface of the top layer (12) of the nameplate, and the second spacer bone position is arranged on the side of the top layer (12) of the nameplate.

9. The double-layer nameplate structure (10) according to claim 8, characterized in that: The first spacer bone position (123) is arranged along the outer edge of the top layer (12) of the nameplate; and the second spacer bone position (124) is arranged around the side of the top layer (12) of the nameplate.

10. An electronic product, characterized in that: The electronic product comprises an iron mesh structure and a double-layer nameplate structure (10) as claimed in any one of claims 1 to 9, wherein the iron mesh structure, the nameplate bottom layer and the nameplate top layer are an integrated structure.

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