Wafer test data analysis device

Abstract

The utility model discloses a wafer test data analysis device, and relates to the technical field of wafer test.The wafer test data analysis device comprises a detection table, a test assembly installed on the detection table and an analysis computer fixedly installed on the outer wall of the top of the detection table, and the test assembly comprises a detection box fixedly connected to the outer wall of the top of the detection table; a rotating table for placing a wafer is rotatably mounted on the inner wall of the bottom of the detection box, detection mechanisms are mounted on the inner walls of the two sides of the detection box, and a driving assembly for driving the rotating table to rotate is arranged in the detection table. The detection mechanism is arranged in the detection box, the distance measuring sensor in the detection mechanism is matched with the rotating table, the thickness of the wafer can be conveniently detected, meanwhile, the position of the distance measuring sensor can be conveniently adjusted through the cooperation between the first electric sliding rail and the second electric sliding rail, and therefore comprehensive detection can be conveniently conducted on the wafer; the problem that an existing detection device is low in detection accuracy is solved.

Description

Technical Field

[0001] The present application relates to the field of wafer testing technology, and in particular to a wafer testing data analysis device. Background Art

[0002] At present, with the continuous development of integrated circuit manufacturing technology, the chip feature size is getting smaller and smaller, the number of interconnection layers is increasing, and the wafer diameter is also increasing. To achieve multi-layer wiring, the wafer surface must have extremely high flatness, smoothness and cleanliness, so the detection equipment is particularly important, so as to reduce the occurrence of defects and improve effective production capacity.

[0003] Wafer testing includes testing its thickness. Existing testing and analysis equipment is prone to mismeasurement during the actual testing process, mainly because the diameter of wafers is getting larger and larger, which makes it inconvenient for existing testing and analysis equipment to perform comprehensive testing on wafers, which in turn leads to large errors in the test results. Utility Model Content

[0004] In order to improve the problem that existing wafer testing and analysis equipment is inconvenient to fully detect wafers, the present application provides a wafer testing data analysis device.

[0005] The present application provides a wafer test data analysis device, comprising a testing platform, a test component installed on the testing platform, and an analysis computer installed and fixed on the top outer wall of the testing platform, the test component comprising a testing box fixedly connected to the top outer wall of the testing platform, and a rotating table for placing wafers is rotatably installed on the bottom inner wall of the testing box, testing mechanisms are installed on the inner walls on both sides of the testing box, and a driving component for driving the rotating table to rotate is arranged inside the testing platform.

[0006] By adopting the above structure, the thickness data of the wafer is collected through the test component, and then the collected data is analyzed by the analysis computer. The setting of the rotating table is convenient for placing and testing the wafer, and the setting of the driving component is convenient for driving the rotating table to rotate, so as to facilitate comprehensive thickness detection of the wafer.

[0007] The detection mechanism comprises a mounting frame fixedly connected to the inner wall of the detection box, and an electric slide rail 1 is fixedly connected to the outer wall on the opposite side of the mounting frame.

[0008] With the above structure, the electric slide rail 1 can be easily installed and fixed by setting the installation frame.

[0009] The two electric slide rails 1 are slidably connected to the same sliding seat, and the outer wall of the bottom of the sliding seat is fixedly connected to the electric slide rail 2.

[0010] With the above structure, the sliding seat is driven to move by the electric slide rail 1, and the electric slide rail 2 is installed on the sliding seat.

[0011] The electric slide rail 2 is slidably connected with a driving frame, and the inner wall of the driving frame is fixedly connected with an electric telescopic rod.

[0012] With the above structure, the electric telescopic rod can be easily installed through the arrangement of the driving frame.

[0013] The output shaft of the electric telescopic rod is fixedly connected with a distance measuring sensor, and the distance measuring sensor is located above the rotating platform.

[0014] With the above structure, the height of the distance measuring sensor can be adjusted conveniently by setting the electric telescopic rod.

[0015] An installation groove for installing a driving component is provided on an outer wall of one side of the detection platform, and a mesh plate is fixedly connected to the inner wall of the installation groove.

[0016] With the above structure, the installation slot can be easily closed by setting the mesh plate.

[0017] The driving assembly includes a servo motor fixedly connected to the inner wall of the installation groove, and a pulley 2 is fixedly connected to the output shaft of the servo motor. A pulley 1 fixedly connected to the rotating table by a transmission shaft is rotatably connected to the top inner wall of the installation groove, and the same belt is connected between pulley 1 and pulley 2.

[0018] With the above structure, the servo motor cooperates with the belt to directly drive the rotating table to rotate, thereby driving the wafer to rotate to facilitate comprehensive inspection.

[0019] A rectangular opening is provided on one outer wall of the detection box, and a box door is connected to the inner wall of the rectangular opening.

[0020] With the above structure, the detection box can be easily closed by setting the box door.

[0021] In summary, the beneficial effects of this application are as follows:

[0022] 1. The present application sets a detection mechanism in the detection box. The cooperation between the distance measuring sensor and the rotating table in the detection mechanism facilitates the detection of the thickness of the wafer. At the same time, the cooperation between the electric slide rail 1 and the electric slide rail 2 facilitates the adjustment of the position of the distance measuring sensor, thereby facilitating comprehensive detection of the wafer and solving the problem of low accuracy of existing detection equipment.

[0023] 2. The present application provides a driving assembly on the testing table, and the cooperation between the servo motor and the belt in the driving assembly facilitates direct driving of the rotating table to rotate, thereby facilitating comprehensive testing of the auxiliary wafer. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the entire application;

[0025] Figure 2 It is a front view schematic diagram of this application;

[0026] Figure 3 It is a schematic diagram of the test components of this application;

[0027] Figure 4 It is a schematic diagram of the internal structure of the test component of this application;

[0028] Figure 5 It is a schematic diagram of the testing organization for this application.

[0029] Explanation of the accompanying reference numerals: 1. Testing table; 2. Analysis computer; 3. Test assembly; 4. Mesh plate; 5. Mounting slot; 6. Drive assembly; 7. Testing box; 8. Box door; 9. Pulley 1; 10. Servo motor; 11. Belt; 12. Turntable; 13. Testing mechanism; 14. Mounting frame; 15. Electric slide rail 1; 16. Sliding seat; 17. Electric slide rail 2; 18. Drive frame; 19. Electric telescopic rod; 20. Distance measuring sensor. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-5 This application is described in further detail.

[0031] See also Figure 1-3 A wafer test data analysis device comprises a test platform 1, a test component 3 installed on the test platform 1 and an analysis computer 2 fixed on the top outer wall of the test platform 1. The thickness data of the wafer is collected by the test component 3, and then the collected data is analyzed by the analysis computer 2. The test component 3 comprises a test box 7 fixedly connected to the top outer wall of the test platform 1, and a rotating table 12 for placing the wafer is rotatably installed on the bottom inner wall of the test box 7. The setting of the rotating table 12 is convenient for placing and testing the wafer. The inner walls on both sides of the test box 7 are installed with detection mechanisms 13. A driving component 6 for driving the rotating table 12 to rotate is arranged inside the test platform 1. The setting of the driving component 6 is convenient for driving the rotating table 12 to rotate, so as to facilitate comprehensive thickness detection of the wafer.

[0032] Reference Figure 4-5 The detection mechanism 13 includes a mounting frame 14 fixedly connected to the inner wall of the detection box 7, and an electric slide rail 15 is fixedly connected to the outer wall on the opposite side of the mounting frame 14. The setting of the mounting frame 14 facilitates the installation and fixation of the electric slide rail 15.

[0033] Reference Figure 3 The two electric slide rails 15 are slidably connected to the same sliding seat 16, and the outer wall at the bottom of the sliding seat 16 is fixedly connected to the electric slide rail 2 17. The sliding seat 16 is driven to move by the electric slide rail 15, and the electric slide rail 2 17 is installed on the sliding seat 16.

[0034] Reference Figure 5 A driving frame 18 is slidably connected to the electric slide rail 17, and an electric telescopic rod 19 is fixedly connected to the inner wall of the driving frame 18. The setting of the driving frame 18 facilitates the installation of the electric telescopic rod 19.

[0035] Reference Figure 5 A distance sensor 20 is fixedly connected to the output shaft of the electric telescopic rod 19 , and the distance sensor 20 is located above the rotating table 12 . The arrangement of the electric telescopic rod 19 facilitates the adjustment of the height of the distance sensor 20 .

[0036] Reference Figure 1 An installation slot 5 for installing a driving assembly 6 is provided on one side outer wall of the detection platform 1, and a mesh plate 4 is fixedly connected to the inner wall of the installation slot 5, and the installation slot 5 is conveniently closed by the arrangement of the mesh plate 4.

[0037] Reference Figure 3 The driving assembly 6 includes a servo motor 10 fixedly connected to the inner wall of the mounting groove 5, and a pulley 2 is fixedly connected to the output shaft of the servo motor 10. The top inner wall of the mounting groove 5 is rotatably connected to a pulley 9 fixedly connected to the rotating table 12 by a transmission shaft. The same belt 11 is connected between the pulley 1 9 and the pulley 2. The servo motor 10 cooperates with the belt 11 to directly drive the rotating table 12 to rotate, thereby driving the wafer to rotate for convenient comprehensive detection.

[0038] Reference Figure 3 A rectangular opening is provided on one side outer wall of the detection box 7, and a box door 8 is connected to the inner wall of the rectangular opening. The detection box 7 is conveniently closed by the arrangement of the box door 8.

[0039] The implementation principle of the present application is as follows: when in use, the box door 8 is opened, and the wafer to be inspected is placed on the rotating table 12. During inspection, the distance between the distance measuring sensor 20 and the rotating table 12 is adjusted according to the specifications of the wafer. At the same time, the cooperation between the electric slide rail 15 and the electric slide rail 2 17 facilitates the distance measuring sensor 20 to adjust the position. At the same time, the servo motor 10 in the driving component 6 cooperates with the belt 11 to drive the rotating table 12 to rotate. When the rotating table 12 rotates, it drives the wafer to rotate, so as to facilitate the comprehensive detection of the thickness of the wafer with the distance measuring sensor 20.

[0040] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A wafer test data analysis device, comprising a test platform (1), a test assembly (3) mounted on the test platform (1), and an analysis computer (2) mounted and fixed on the top outer wall of the test platform (1), characterized in that: The test assembly (3) comprises a test box (7) fixedly connected to the top outer wall of the test platform (1), and a rotating table (12) for placing wafers is rotatably mounted on the bottom inner wall of the test box (7), and a test mechanism (13) is mounted on the inner walls on both sides of the test box (7), and a driving assembly (6) for driving the rotating table (12) to rotate is arranged inside the test platform (1).

2. A wafer test data analysis device according to claim 1, characterized in that: The detection mechanism (13) comprises a mounting frame (14) fixedly connected to the inner wall of the detection box (7), and an electric slide rail (15) is fixedly connected to the outer wall on the opposite side of the mounting frame (14).

3. A wafer test data analysis device according to claim 2, characterized in that: The two electric slide rails (15) are slidably connected to the same slide seat (16), and the bottom outer wall of the slide seat (16) is fixedly connected to the electric slide rail (17).

4. The wafer test data analysis device according to claim 3, characterized in that: The second electric slide rail (17) is slidably connected to a drive frame (18), and an electric telescopic rod (19) is fixedly connected to the inner wall of the drive frame (18).

5. The wafer test data analysis device according to claim 4, characterized in that: A distance measuring sensor (20) is fixedly connected to the output shaft of the electric telescopic rod (19), and the distance measuring sensor (20) is located above the rotating platform (12).

6. The wafer test data analysis device according to claim 5, characterized in that: An installation groove (5) for installing a drive assembly (6) is provided on one side outer wall of the detection platform (1), and a mesh plate (4) is fixedly connected to the inner wall of the installation groove (5).

7. The wafer test data analysis device according to claim 6, characterized in that: The driving assembly (6) comprises a servo motor (10) fixedly connected to the inner wall of the mounting groove (5), and a second pulley is fixedly connected to the output shaft of the servo motor (10), and a first pulley (9) whose transmission shaft is fixedly connected to the rotating table (12) is rotatably connected to the top inner wall of the mounting groove (5), and a same belt (11) is connected between the first pulley (9) and the second pulley.

8. The wafer test data analysis device according to claim 7, characterized in that: A rectangular opening is provided on one outer wall of the detection box (7), and a box door (8) is connected to the inner wall of the rectangular opening.

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