Glue dispensing execution unit and glue dispensing device for chip substrate

Abstract

The utility model provides an adhesive dispensing execution unit and an adhesive dispensing device for a chip substrate, the adhesive dispensing execution unit for the chip substrate comprises a support table and an adhesive dispensing head, and the adhesive dispensing head is mounted on the support table; a linear driving module is mounted on the supporting table; a magnetic force acting piece is further installed on the supporting table and provides balance force after the dispensing glue head ascends and descends, the magnetic force acting piece comprises a fixed part and a movable part, the fixed part and the movable part are permanent magnets, the movable part can be inserted into the fixed part in an up-down sliding mode and is restrained by magnetic force, and the fixed part is fixedly connected with the supporting table. The movable part is fixedly connected with the dispensing glue head; when the linear driving module stops providing the driving force, the total load weight borne by the movable part is equivalent to the magnetic force borne by the movable part. According to the glue dispensing device, the operation precision of the glue dispensing head is guaranteed, noise and fatigue deformation cannot be generated, and the whole device has better practicability and durability.

Description

Technical Field

[0001] The utility model relates to the technical field of chip packaging equipment, in particular to a glue dispensing execution unit and a glue dispensing device for a chip substrate. Background Art

[0002] The chip dispensing / painting process used in chip packaging is mainly to perform bonding, sealing, reinforcement and waterproof protection on the chip, which can well extend the use effect and working life of the chip on the chip substrate, thereby adding new impetus to the electronic products industry. In the process of dispensing glue, in order to ensure the accuracy of the dispensing action, it is necessary to improve the smoothness of the dispensing action. In the prior art, mechanical springs are often installed on the dispensing glue head to improve the smoothness of the dispensing action, but mechanical springs will generate noise, and their elastic force will change with displacement, which will affect the positioning accuracy of the dispensing glue operation. Moreover, fatigue deformation will occur after long-term use, and it does not have good durability. Utility Model Content

[0003] The embodiment of the utility model provides a glue dispensing execution unit and a glue dispensing device for a chip substrate to solve the problem in the prior art that a mechanical spring is used to improve the smoothness of the glue dispensing action, which affects the positioning accuracy of the glue dispensing operation and makes the overall durability of the device low.

[0004] To achieve the above purpose, the present invention adopts the following technical solutions:

[0005] A glue dispensing execution unit for a chip substrate comprises a support platform and a glue dispensing head, wherein the glue dispensing head is used for dispensing glue in glue dispensing and glue painting operations, and the glue dispensing head is mounted on the support platform;

[0006] A linear drive module is installed on the support table, which can drive the dotting glue head to move up and down;

[0007] A magnetic acting part is also installed on the support platform to provide a balancing force after the dot painting glue head moves up and down. The magnetic acting part includes a fixed part and a movable part. Both the fixed part and the movable part are permanent magnets. The movable part can be inserted into the fixed part by sliding up and down and is constrained by the magnetic force. The fixed part is fixedly connected to the support platform, and the movable part is fixedly connected to the dot painting glue head.

[0008] When the linear drive module stops providing driving force, the total weight of the load borne by the movable part is equivalent to the magnetic force borne by the movable part, and is maintained in a balanced state.

[0009] Furthermore, the glue dot execution unit further comprises a support plate, which is escalably mounted on the support platform, and a side of the support plate facing away from the support platform carries and mounts the glue dot head;

[0010] The movable part of the magnetic force acting member is fixedly connected to the supporting plate.

[0011] Furthermore, the support platform includes a support seat, a side of the support seat facing the support plate is provided with a vertically arranged slide rail, a slidable slider is installed on the slide rail, and the slider is installed and connected to the support plate;

[0012] The fixing portion of the magnetic force acting member is fixedly connected to the supporting seat.

[0013] Furthermore, the linear drive module includes a linear drive module mover and a linear drive module stator. The linear drive module stator is longitudinally installed on the support platform. The linear drive module mover is installed on the side of the support plate close to the support platform. The linear drive module mover is driven by the linear drive module stator.

[0014] A glue dispensing device for chip substrates, comprising a base, a gantry and a glue dispensing execution unit as claimed in any one of claims 1 to 4, wherein the gantry is slidably mounted on the base;

[0015] The gantry comprises two supporting arms and a frame beam connected between the supporting arms, and the dispensing glue execution unit is slidably mounted on the frame beam.

[0016] Furthermore, a longitudinal drive is provided on the base, and the longitudinal drive is used to drive the gantry to move along the base.

[0017] Furthermore, the support platform is installed on a frame beam, and a transverse movement driver is installed on the frame beam, and the transverse movement driver is used to drive the dispensing glue execution unit to move along the frame beam.

[0018] The beneficial effects of the utility model are:

[0019] The utility model provides a glue dispensing device for chip substrates. By improving the glue dispensing execution unit and configuring a magnetic action member, the vibration of the glue dispensing head during movement is reduced and the movement smoothness is improved, while the operation accuracy of the glue dispensing head is ensured, and noise and fatigue deformation are not generated, so that the device as a whole has better practicality and durability. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] Figure 1 A three-dimensional diagram of a glue dispensing device for a chip substrate;

[0021] Figure 2 A three-dimensional diagram of a dispensing glue execution unit for a chip substrate;

[0022] Figure 3 An exploded view of a dispensing glue execution unit for a chip substrate;

[0023] Figure 4 is a front view of the support platform 31;

[0024] Figure 5 This is an exploded view of the magnetic force acting parts.

[0025] Description of reference numerals:

[0026] 1. Base; 11. Longitudinal drive; 2. Gantry; 21. Support arm; 22. Frame beam; 221. Transverse drive; 3. Glue dispensing execution unit; 31. Support table; 311. Support seat; 312. Slide rail; 313. Slider; 314. Magnetic action part; 3141. Fixed part; 3142. Movable part; 315. Linear drive module stator; 32. Support plate; 321. Linear drive module mover; 33. Glue dispensing head. DETAILED DESCRIPTION

[0027] The specific implementation of the present application is described in detail below in conjunction with the accompanying drawings. It should be understood that the specific implementation described here is only used to illustrate and explain the present application, and is not used to limit the present application.

[0028] like Figure 1 As shown, an embodiment of the utility model provides a glue dispensing device for a chip substrate (a chip substrate includes a carrier, a boat, a substrate, a PCB, a lead frame, a wafer, etc.), which mainly includes a base 1, a gantry 2 installed above the base 1, and a glue dispensing execution unit 3 installed on the gantry 2; the gantry 2 can be installed on the base 1 in a linear sliding manner along a horizontal plane and is driven by the base 1, the glue dispensing execution unit 3 can be installed on the gantry 2 in a linear sliding manner along a horizontal plane and is driven by the gantry 2, and the movement direction of the glue dispensing execution unit 3 is perpendicular to the movement direction of the gantry 2, so that the glue dispensing execution unit 2 has two-axis linear motion freedom.

[0029] Furthermore, the gantry 2 includes two supporting arms 21 and a frame beam 22 connected between the supporting arms 21; a longitudinal movement driver 11 is arranged on the base 1, and the longitudinal movement driver 11 is used to drive the gantry 2 to move along the base 1; the aforementioned support platform 31 is installed on the frame beam 22, and a transverse movement driver 221 is installed on the frame beam 22, and the transverse movement driver 221 is used to drive the dispensing glue execution unit 3 to move along the frame beam 22 (the moving direction of the gantry 2 driven by the longitudinal movement driver 11 and the moving direction of the dispensing glue execution unit 3 driven by the transverse movement driver 221 are both within the water surface, and the moving directions of the gantry 2 and the dispensing glue execution unit 3 are perpendicular, so they are distinguished by transverse movement and longitudinal movement).

[0030] like Figure 2-5As shown, the embodiment of the utility model also provides a dispensing glue execution unit for chip substrates, and the dispensing glue execution unit 3 includes a support platform 31, a support plate 32 and a dispensing glue head 33, and the dispensing glue head 33 is used for dispensing glue in dispensing and dispensing glue operations; the support platform 31 is installed on the aforementioned gantry 2 and is driven by the gantry 2; the support platform 31 includes a support seat 311, and a side of the support seat 311 away from the gantry 2 is provided with a slide rail 312 arranged in a direction perpendicular to the horizontal plane, and a slider 313 is installed on the slide rail 312, and the slider 313 is installed and connected to the support plate 32; a linear drive is longitudinally installed on the support platform 31 Module stator 315, a linear drive module mover 321 is installed on the side of the support plate 32 close to the support platform 31, and the linear drive module mover 321 is driven by the linear drive module stator 315 to move in the vertical direction (the linear drive module mover 321 and the linear drive module stator 315 constitute a group of linear drive modules), so that the support plate 32 can move in the vertical direction (perpendicular to the horizontal plane) relative to the support seat 311; the side of the support plate 32 away from the support seat 311 carries the installation of the dot painting glue head 33, and other auxiliary parts such as a suction cup, a blowing head, etc. can also be installed on the side of the support plate 32 away from the support seat 311.

[0031] As a major improvement of the embodiment of the utility model, a magnetic action member 314 is also installed on the support seat 311, and the magnetic action member 314 includes a fixed part 3141 and a movable part 3142. The fixed part 3141 and the support seat 311 are fixedly connected, and the movable part 3142 and the support plate 32 are fixedly connected; the movable part 3142 can be installed in the fixed part 3141 so as to slide up and down. Under the action of magnetic force, the movable part 3142 elastically supports the support plate 32, and provides a balancing force when the support plate 32 is raised and lowered, so that the movement process of the support plate 32 is smoother. Compared with the mechanical spring in the prior art, the magnetic action member 314 will not generate noise and fatigue deformation, and has better practicality and durability. As a more preferred embodiment, the movable part 3142 and the fixed part 3141 are both permanent magnets. Through the selection of the magnetic action member 314, in the event of an accidental power outage (i.e., when the linear drive module stops driving force), the movable part 3142 and the fixed part 3141 can move relative to each other until the movable part 3142 is in a force balance state (the total weight of the load borne by the movable part 3142 is equivalent to the magnetic force borne by the movable part 3142). At this time, the support plate 32 can be effectively supported, thereby preventing the support plate 32 from falling and causing collisions; when the magnetic action member 314 is selected with a larger magnetic force specification, the power outage will cause the magnetic action member 314 to reset directly, that is, each power outage will cause the support plate 32 to return to its fixed initial position.

[0032] The utility model provides a glue dispensing device for chip substrates. By improving the glue dispensing execution unit and configuring a magnetic action member, the vibration of the glue dispensing head during movement is reduced, the movement smoothness is improved, and the operation accuracy of the glue dispensing head is guaranteed. No noise and fatigue deformation are generated, so that the device as a whole has better practicality and durability.

[0033] The above-mentioned embodiments only express the implementation methods of the utility model, but they cannot be understood as limiting the scope of the patent of the utility model. It should be pointed out that for ordinary technicians in this field, several modifications and improvements can be made without departing from the concept of the utility model, which all belong to the protection scope of the utility model. Therefore, the protection scope of the utility model patent shall be based on the attached claims.

Claims

1. A dispensing glue execution unit for a chip substrate, characterized in that: It comprises a support platform (31) and a glue dot painting head (33), wherein the glue dot painting head (33) is used for dispensing glue during glue dot painting operations, and the glue dot painting head (33) is mounted on the support platform (31); A linear drive module is installed on the support platform (31), and the linear drive module can drive the dotting glue head (33) to move up and down; A magnetic action member (314) is also installed on the support platform (31) to provide a balancing force for the dot painting glue head (33) after it moves up and down. The magnetic action member (314) includes a fixed part (3141) and a movable part (3142). Both the fixed part (3141) and the movable part (3142) are permanent magnets. The movable part (3142) can be inserted into the fixed part (3141) in a sliding manner up and down and is constrained by magnetic force. The fixed part (3141) and the support platform (31) are fixedly connected, and the movable part (3142) and the dot painting glue head (33) are fixedly connected. When the linear drive module stops providing the driving force, the total weight of the load borne by the movable part (3142) is equivalent to the magnetic force borne by the movable part (3142), and is maintained in a balanced state.

2. The dispensing glue execution unit for chip substrate according to claim 1, characterized in that: The glue dispensing execution unit further comprises a support plate (32), the support plate (32) being movably mounted on the support platform (31), and a side of the support plate (32) facing away from the support platform (31) being supported and mounted with a glue dispensing head (33); The movable portion (3142) of the magnetic force acting member (314) is fixedly connected to the supporting plate (32).

3. The dispensing glue execution unit for chip substrate according to claim 2, characterized in that: The support platform (31) comprises a support seat (311), a vertically arranged slide rail (312) is provided on one side of the support seat (311) facing the support plate (32), a slidable slider (313) is installed on the slide rail (312), and the slider (313) is installed and connected to the support plate (32); The fixing portion (3141) of the magnetic force acting member (314) is fixedly connected to the supporting seat (311).

4. The dispensing glue execution unit for chip substrate according to claim 2, characterized in that: The linear drive module comprises a linear drive module mover (321) and a linear drive module stator (315); the linear drive module stator (315) is longitudinally mounted on a support platform (31); the linear drive module mover (321) is mounted on a side of a support plate (32) close to the support platform (31); and the linear drive module mover (321) is driven by the linear drive module stator (315).

5. A glue dispensing device for chip substrates, characterized in that: It comprises a base (1), a gantry (2) and a dispensing glue execution unit (3) as claimed in any one of claims 1 to 4, wherein the gantry (2) is slidably mounted on the base (1); The gantry (2) comprises two support arms (21) and a frame beam (22) connected between the support arms (21), and the dispensing glue execution unit (3) is slidably mounted on the frame beam (22).

6. The glue dispensing device for chip substrate according to claim 5, characterized in that: A longitudinal movement driver (11) is provided on the base (1), and the longitudinal movement driver (11) is used to drive the gantry (2) to move along the base (1).

7. The glue dispensing device for chip substrate according to claim 5, characterized in that: The support platform (31) is mounted on a frame beam (22), and a transverse movement driver (221) is mounted on the frame beam (22). The transverse movement driver (221) is used to drive the dispensing glue execution unit (3) to move along the frame beam (22).

Images