Supporting structure for auxiliary packaging and chip packaging structure
By using support columns and support sheet structures in chip packages, the problem of poor stability in traditional multi-layer chip stacking in wire bonding processes is solved, and higher substrate utilization and storage capacity are achieved.
Patent Information
- Application Number
- CN202420952284.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-04-30
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-04-30
AI Technical Summary
Traditional multi-layer chip stacking is prone to chip jumping or solder joints falling off in the bonding line process, resulting in the number of stacked layers being limited by the suspended distance, reducing substrate utilization and storage capacity.
The support column and the support sheet structure are adopted. The support sheet extends in the first direction and connects the support column. The part of the support sheet is located in the suspended chip part to provide support, prevent the chip from shaking, and fix the support sheet through the support column to improve the stability of the stacked package. sex.
Effectively prevent chip jumps and solder joints from falling off, eliminate the limit on the number of stacked layers by hanging distance, and improve substrate utilization and storage capacity.
Smart Images
Figure CN222261025U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of chip packaging, in particular to a support structure for auxiliary packaging and a chip packaging structure. Background Art
[0002] Traditional packaging can achieve the purpose of expanding storage capacity through multi-layer stacking. However, since multi-layer chip stacking is made by stacking chips together, the suspended part of the multi-layer chip stacking has no support during the wire bonding process, which will cause the chip to jump during wire bonding, resulting in abnormalities such as solder joints falling off. Therefore, the number of stacked layers will be limited by the suspension distance, which greatly reduces the utilization rate of the substrate and limits the increase in storage capacity.
[0003] Therefore, how to improve the stability of stacked packaging, reduce the restrictions of the suspension distance on the number of stacked layers, and improve the utilization rate of the substrate are the problems that need to be solved at present. Summary of the invention
[0004] The technical problem to be solved by the utility model is how to improve the stability of stacked packaging, reduce the limitation of the suspended distance on the number of stacked layers, improve the utilization rate of the substrate, and provide a support structure and a chip packaging structure for auxiliary packaging.
[0005] In order to solve the above problems, the utility model provides a support structure for auxiliary packaging, including: a support column; a plurality of support sheets, the support sheets extending along a first direction, and the plurality of support sheets are arranged along a second direction, each of the support sheets having a support end and a connecting end relatively arranged in the first direction, and the connecting end is connected to the support column, wherein the first direction is perpendicular to the support column, and the second direction is parallel to the support column.
[0006] In order to solve the above problems, the utility model provides a chip packaging structure, comprising: a substrate; a plurality of chips, located on the surface of the substrate and stacked in sequence along a second direction, the latter chip of two adjacent chips exposing the solder pad area of the former chip of the two adjacent chips, and the latter chip has a suspended portion on the side away from the solder pad area; a solder wire, connecting the solder pads in the two adjacent chips; a support structure for auxiliary packaging described in the utility model, wherein the support column is located on the surface of the substrate, the support end of the support sheet is located on the lower surface of the latter chip, and the support end of the support sheet is located between the two adjacent chips, and a part is located at the suspended portion of the latter chip to support the suspended portion of the latter chip, wherein the second direction is parallel to the support column.
[0007] In order to solve the above problems, the utility model provides a chip packaging structure, including: a substrate; a plurality of chips, located on the surface of the substrate and stacked in sequence along a second direction, the latter chip of two adjacent chips exposes the soldering pad area of the former chip of the two adjacent chips, and the latter chip has a suspended portion on the side away from the soldering pad area; a soldering wire connecting the soldering pads in the two adjacent chips; a supporting sheet, located on the lower surface of the latter chip, and a part of the supporting sheet is located between the two adjacent chips, and a part is located at the suspended portion of the latter chip to support the suspended portion of the latter chip; a plastic package covering the surface of the substrate, the chips, the soldering wires and a part of the supporting sheet.
[0008] The above technical solution supports the suspended part of the chip one by one through the support sheet, and fixes the support sheet through the support column. The support structure used for auxiliary packaging can provide good support in the wire bonding process of the multi-chip stacking structure to prevent the chip from shaking, so as to avoid abnormalities such as chip jumping or solder joint falling off during the wire bonding process of the stacked chip, and eliminate the limitation of the suspended distance on the number of stacking layers, thereby improving the utilization rate of the substrate. And because the support structure for auxiliary packaging is set in the non-functional area of the substrate, the area where the stacked chip is projected can also be used, thereby improving the utilization rate of the substrate space.
[0009] It should be understood that the above general description and the detailed description below are only exemplary and explanatory and cannot limit the present invention. The techniques, methods and devices known to ordinary technicians in the relevant field may not be discussed in detail, but in appropriate cases, the techniques, methods and devices should be considered as part of the authorization specification. BRIEF DESCRIPTION OF THE DRAWINGS
[0010] In order to more clearly illustrate the technical solutions in the specific implementation of the utility model, the following is a brief introduction to the drawings required for the description of the specific implementation. Obviously, the drawings described below are only some specific implementations of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.
[0011] Figure 1 The figure is a schematic diagram of a chip packaging structure.
[0012] Figure 2 The figure is a schematic diagram of a chip packaging structure.
[0013] Figure 3 It is a structural schematic diagram of an embodiment of the support structure for auxiliary packaging described in the utility model.
[0014] Figure 4It is a top view of an embodiment of a support sheet of a support structure for auxiliary packaging according to the utility model.
[0015] Figure 5 It is a structural schematic diagram of another embodiment of the support structure for auxiliary packaging described in the utility model.
[0016] Figure 6 It is a top view of another embodiment of the support sheet of the support structure for auxiliary packaging described in the utility model.
[0017] Figure 7 It is a structural schematic diagram of an embodiment of the chip packaging structure of the present invention.
[0018] Figure 8 It is a structural schematic diagram of another embodiment of the chip packaging structure of the present invention.
[0019] Fig. 9 It is a structural schematic diagram of another embodiment of the chip packaging structure of the present invention. DETAILED DESCRIPTION
[0020] The technical scheme in the embodiment of the utility model will be described clearly and completely below in conjunction with the accompanying drawings. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.
[0021] See also Figure 1-2 , are schematic diagrams of a chip packaging structure. Figure 1-2 As shown in the figure, the chip packaging structure includes: a substrate 10 and a chip 11. When the chip 11 on the top of the multi-layer stacked chips is subjected to the wire bonding process, when the suspended part of the chip 11 is subjected to ultrasonic wire bonding (as shown by the black arrow in the figure), since the suspended part has no support, the chip 11 on the top of the stacked chips may jump during wire bonding. Since the adhesive is relatively soft, the chip 11 may be tilted (as shown in the figure). Figure 1 or when bonding wires, the suspended portion of the chip 11 breaks, causing the solder joint to fall off (as shown in FIG. Figure 2 As shown), the chip 11 is damaged. The above two problems limit the number of stacked layers and the suspended distance, greatly reducing the utilization rate of the substrate and limiting the increase of storage capacity.
[0022] In order to solve the above problems, the utility model provides a support structure for auxiliary packaging and a chip packaging structure to improve the stability of the stacked packaging, reduce the limitation of the suspension distance on the number of stacked layers, and improve the utilization rate of the substrate.
[0023] See also Figure 3-4 ,in, Figure 3 This is a schematic structural diagram of an embodiment of a support structure for auxiliary packaging according to the utility model. Figure 4 This is a top view of an embodiment of a support sheet of a support structure for auxiliary packaging according to the utility model. Figure 3 As shown, the supporting structure for auxiliary packaging includes: a supporting column 30 and a plurality of supporting sheets 31. The supporting sheets 31 extend along a first direction D1, and the plurality of supporting sheets 31 are arranged along a second direction D2, each supporting sheet 31 has a supporting end 310 and a connecting end 311 which are arranged opposite to each other in the first direction D1, and the connecting end 311 is connected to the supporting column 30, wherein the first direction D1 is perpendicular to the supporting column 30, and the second direction D2 is parallel to the supporting column 30.
[0024] When the support structure for auxiliary packaging in the above technical solution is applied to a packaging structure of multiple chip stacks, the support sheet is used to support the suspended parts of the stacked chips one by one, and at the same time, the support sheet is fixed by a support column connected to the support sheet. The support structure for auxiliary packaging can provide good support in the wire bonding process of the multiple chip stacking structure to prevent the chip from shaking, so as to avoid abnormalities such as chip jumping or solder joint falling off during the wire bonding process of the stacked chips, eliminate the limitation of the suspension distance on the number of stacking layers, and improve the substrate utilization rate.
[0025] Please continue to refer to Figure 3 In some embodiments, the surface of the support column 30 is provided with a plurality of support platforms 301 arranged along the second direction D2, and the connection end 311 of the support sheet 31 is provided on the upper surface of the support platform 301 to be connected to the support column 30 through the support platform 301. In order to improve the support performance of the support structure for auxiliary packaging, the support platform 301 is integrally formed on the side of the support column 30, so that the connection end 311 of the support sheet 31 is located on the upper surface of the support platform 301.
[0026] Please refer to Figure 3-4 In some embodiments, the upper surface of each supporting platform 301 also has a positioning piece 302, and the connecting end 311 of the supporting sheet 31 has a positioning hole 312, and the positioning piece 302 is inserted into the positioning hole 312 to fix the supporting sheet 31 to the supporting platform 301.
[0027] See also Figure 5-6 ,in, Figure 5 This is a structural schematic diagram of another embodiment of the support structure for auxiliary packaging of the utility model. Figure 6This is a top view of another embodiment of the support sheet of the support structure for auxiliary packaging described in the utility model. Figure 5-6 As shown, this embodiment and Figure 3-4 The embodiment shown is different in that a plurality of slots 501 located in the support column 50 are provided on the side of the support column 50, and the plurality of slots 501 are arranged along the second direction D2, and the connection end 511 of the support sheet 51 is inserted into the slot 501 to be connected to the support column 50 through the slot 501. In order to improve the support performance of the support structure for auxiliary packaging, the slot 501 is integrally formed on the side of the support column 50, so that the connection end 511 of the support sheet 51 is inserted into the slot 501.
[0028] Please refer to Figure 5-6 The edge of each of the slots 501 further includes a limiting column 502 , and the connecting end 511 of the support sheet 51 has a limiting hole 512 , and the limiting column 502 is inserted into the limiting hole 512 to fix the support sheet 51 to the slot 501 .
[0029] In some embodiments, each of the card slots 501 also includes a glue receiving groove 503, and a glue 513 is provided on the back side of one end of the support sheet 51 connected to the support column 50, and the glue receiving groove 503 receives the glue 513 to fix the support sheet 51 and the card slot 501.
[0030] When the support structure for auxiliary packaging in the above technical solution is applied to the packaging structure of chip stacking, the support sheet is used to support the suspended parts of the stacked chips one by one, and at the same time, the support sheet is fixed by the support column connected to the support sheet. The support structure for auxiliary packaging can provide good support for the multi-chip stacking structure in the wire bonding process to prevent the chip from shaking, so as to avoid abnormalities such as chip jumping or solder joint falling off during the wire bonding process of the stacked chips, eliminate the limitation of the suspension distance on the number of stacking layers, and improve the substrate utilization rate.
[0031] Based on the same inventive concept, an embodiment of the present utility model further provides a chip packaging structure.
[0032] See also Figure 7 , which is a schematic diagram of the structure of an embodiment of the chip packaging structure of the utility model. Figure 7As shown, the chip packaging structure includes: a substrate 72, a plurality of chips 73, welding wires 74, and a support structure 75 for auxiliary packaging. The plurality of chips 73 are located on the surface of the substrate 72 and are stacked in sequence along the second direction D2. The latter chip 73 of two adjacent chips 73 exposes the welding pad area 730 of the former chip 73 of the two adjacent chips 73, and the latter chip 73 has a suspended portion 731 on the side away from the welding pad area 730. The welding wires 74 connect the welding pads of the two adjacent chips 73. The support structure 75 for auxiliary packaging adopts the present invention. Figure 3-4 The supporting structure for auxiliary packaging shown in the figure is described in detail above and will not be repeated here. The supporting column 30 is located on the surface of the substrate 72, the supporting end 310 of the supporting sheet 31 is located on the lower surface S1 of the next chip 73, and a part of the supporting sheet 31 is located between two adjacent chips 73, and a part of the supporting sheet 31 is located on the suspended part 731 of the next chip 73 to support the suspended part 731 of the next chip 73, wherein the second direction D2 is parallel to the supporting column 30.
[0033] The above technical solution supports the suspended part of the chip one by one through the support sheet, and fixes the support sheet through the support column. The support structure used for auxiliary packaging can provide good support for the multi-chip stacking structure in the wire bonding process to prevent the chip from shaking, so as to avoid abnormalities such as chip jumping or solder joint falling off during the wire bonding process of the stacked chips, eliminate the limitation of the suspension distance on the number of stacking layers, and improve the substrate utilization rate.
[0034] In some embodiments, the plurality of chips 73 are staggered in the second direction D2 to form a step area 77, and the step area 77 is further provided with a passive component 78. A support structure for auxiliary packaging is provided in a non-functional area of the substrate 72, so that the area where the stacked chips 73 are projected can also be utilized, thereby improving the utilization rate of the space of the substrate 72.
[0035] In some embodiments, in the third direction D3, the width of the support sheet 31 is less than or equal to the width of the chip 73, wherein the third direction D3 is perpendicular to the first direction D1 and the second direction D2. The width of the support sheet 31 is less than or equal to the width of the chip 73, so as to avoid the enlargement of the packaging area due to the excessive width of the support sheet 31.
[0036] In some embodiments, in the first direction D1, the overlapping area of the support sheet 31 and the chip 73 to be supported is greater than or equal to half the area of the chip 73. That is, the support end 310 of the support sheet 31 is at least located at the center of the chip 73 to be supported.
[0037] In some embodiments, the lower surface S1 of the chip 73 further includes an adhesive layer 79, and the support sheet 31 is located between the chip 73 and the adhesive layer 79 to increase the stability of the support sheet 31 in supporting the chip 73 and prevent it from sliding or falling off. Since the adhesive has fluidity, during packaging, the adhesive enters between the lower surface S1 of the chip 73 and the support sheet 31, and the lower surface S1 of the chip 73 and the support sheet 31 can be glued and connected.
[0038] See also Figure 8 , which is a schematic diagram of another embodiment of the chip packaging structure of the utility model. Figure 8 As shown, this embodiment and Figure 7 The difference between the embodiments shown is that the supporting structure for auxiliary packaging adopts the present invention. Figure 5-6 The supporting structure for auxiliary packaging shown in the figure is described in detail above and will not be repeated here.
[0039] See also Fig. 9 , which is a structural schematic diagram of another embodiment of the chip packaging structure of the utility model. Fig. 9 As shown, the chip packaging structure includes: a substrate 92, a chip 93, a bonding wire 94, and a support sheet 95. A plurality of the chips 93 are located on the surface of the substrate 92 and are stacked in sequence along the second direction D2. The latter chip 93 of two adjacent chips 93 exposes the bonding pad area 930 of the former chip 93 of the two adjacent chips 93, and the latter chip 93 has a suspended portion 931 on a side away from the bonding pad area 930. The bonding wire 94 connects the bonding pads of the two adjacent chips 93. The support sheet 95 is located on the lower surface S1 of the latter chip 93, and a part of the support sheet 95 is located between the two adjacent chips 93, and a part of the support sheet 95 is located in the suspended portion 931 of the latter chip 93 to support the suspended portion 931 of the latter chip 93; a plastic encapsulation layer 96 covers the substrate 92, the chip 93, the bonding wire 94, and a part of the support sheet 95.
[0040] Specifically, Fig. 9 The embodiment shown can be Figure 7-Figure 8 The embodiment shown is made by cutting off the support pillars. After completing the wire bonding process of the stacked chips, the support pillars are cut off to achieve the purpose of miniaturization of the package.
[0041] In some embodiments, the plurality of chips 93 are staggered in the second direction D2 to form a step area 97 , in which the ends of the plurality of support sheets 95 extend to the side of the plastic package body 96 and are flush with the side of the plastic package body 96 .
[0042] In some embodiments, a passive element 98 is further disposed on the surface of the substrate 92 located in the step area 97. The support sheet 95 is disposed in a non-functional area of the substrate 92, so that the area where the stacked chips 93 are projected can also be utilized, thereby improving the utilization rate of the substrate 92 space.
[0043] The above technical solution supports the suspended part of the chip one by one through the support sheet, which can provide good support in the wire bonding process of the multi-chip stacking structure, prevent the chip from shaking, and avoid abnormalities such as chip jumping or solder joint falling off during the wire bonding process of the stacked chip, cancel the limitation of the suspended distance on the number of stacking layers, and improve the utilization rate of the substrate. The support sheet is set in the non-functional area of the substrate, so that the area where the stacked chip is projected can also be used, which improves the utilization rate of the substrate space.
[0044] It should be noted that references in the specification to "an embodiment", "an embodiment", "an exemplary embodiment", "some embodiments", etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but every embodiment may not necessarily include the particular feature, structure, or characteristic. Moreover, such phrases do not necessarily refer to the same embodiment. In addition, when a particular feature, structure, or characteristic is described in conjunction with an embodiment, whether or not explicitly described, it is within the knowledge of a technician in the relevant art to implement such feature, structure, or characteristic in conjunction with other embodiments.
[0045] Typically, a term can be understood at least in part from usage in context. For example, the term "one or more" as used herein depends at least in part on the context and can be used to describe any feature, structure or characteristic in a singular sense, or can be used to describe a combination of features, structures or features in a plural sense. Similarly, terms such as "one", "a" or "the" can also be understood to express singular usage or to express plural usage, depending at least in part on the context. In addition, the term "based on" can be understood to not necessarily be intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow for the presence of other factors that are not necessarily explicitly described. It should also be noted in this specification that "connected / coupled" refers not only to the direct coupling of one component to another component, but also to the indirect coupling of one component to another component through an intermediate component.
[0046] It should be noted that the terms "including" and "having" and their variations involved in the documents of the present utility model are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. Unless the context clearly indicates otherwise, it should be understood that the data used in this way can be interchanged under appropriate circumstances. In addition, the embodiments of the present utility model and the features in the embodiments can be combined with each other unless there is a conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concepts of the present utility model. In the above-mentioned embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.
[0047] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the protection scope of the present invention.
Claims
1. A support structure for auxiliary packaging, characterized in that: include: Support columns; A plurality of support sheets, wherein the support sheets extend along a first direction, and the plurality of support sheets are arranged along a second direction, each of the support sheets has a support end and a connection end that are relatively arranged in the first direction, and the connection end is connected to the support column, wherein the first direction is perpendicular to the support column, and the second direction is parallel to the support column.
2. The support structure according to claim 1, characterized in that: A plurality of support platforms arranged along the second direction are arranged on the side of the support column, and the connecting end of the support sheet is arranged on the upper surface of the support platform to be connected to the support column through the support platform.
3. The support structure according to claim 2, characterized in that: The upper surface of each of the support platforms is also provided with a positioning piece, and the connecting end of the support sheet is provided with a positioning hole, and the positioning piece is inserted into the positioning hole to fix the support sheet and the support platform.
4. The support structure according to claim 1, characterized in that: The side of the support column is provided with a plurality of slots located inside the support column, and the plurality of slots are arranged along the second direction, and the connecting end of the support sheet is inserted into the slot to be connected with the support column through the slot.
5. The support structure according to claim 4, characterized in that: The edge of each of the slots further includes a limiting column, the connecting end of the support sheet has a limiting hole, and the limiting column is inserted into the limiting hole to fix the support sheet to the slot.
6. The support structure according to claim 5, characterized in that: Each of the card slots also includes a glue receiving groove, and a glue spot is arranged on the back of one end of the support sheet connected to the support column. The glue receiving groove receives the glue spot to fix the support sheet to the card slot.
7. A chip packaging structure, characterized in that: include: substrate; A plurality of chips are located on the surface of the substrate and are stacked in sequence along the second direction, wherein the latter chip of two adjacent chips exposes the pad area of the former chip of the two adjacent chips, and the latter chip has a suspended portion on a side away from the pad area; A bonding wire connecting the bonding pads of two adjacent chips; The support structure as described in any one of claims 1 to 6, wherein the support column is located on the surface of the substrate, the support end of the support sheet is located on the lower surface of the latter chip, and a portion of the support sheet is located between two adjacent chips, and a portion is located at the suspended portion of the latter chip to support the suspended portion of the latter chip, wherein the second direction is parallel to the support column.
8. The chip packaging structure according to claim 7, characterized in that: In a third direction, the width of the support sheet is less than or equal to the chip width, wherein the third direction is perpendicular to the first direction and the second direction respectively.
9. The chip packaging structure according to claim 7, characterized in that: In the first direction, the area of the overlapping region between the supporting sheet and the chip to be supported is greater than or equal to half of the area of the chip.
10. The chip packaging structure according to claim 7, characterized in that: The lower surface of the chip also includes an adhesive layer, and the support sheet is located between the latter chip and the adhesive layer.
11. A chip packaging structure, characterized in that: include: substrate; A plurality of chips are located on the surface of the substrate and are stacked in sequence along the second direction, wherein the latter chip of two adjacent chips exposes the pad area of the former chip of the two adjacent chips, and the latter chip has a suspended portion on a side away from the pad area; A bonding wire connecting the bonding pads of two adjacent chips; A support sheet, located on the lower surface of the latter chip, with a portion of the support sheet located between two adjacent chips and a portion of the support sheet located at a suspended portion of the latter chip to support the suspended portion of the latter chip; The plastic package covers the surface of the substrate, the chip, the bonding wires and part of the supporting sheet.
12. The chip packaging structure according to claim 11, characterized in that: The plurality of chips are staggered in the second direction to form a step area, in which the ends of the plurality of support sheets extend to the side surface of the plastic package body and are flush with the side surface of the plastic package body.