Display unit and array substrate

Abstract

The utility model discloses a display unit and an array substrate, and relates to the technical field of display. The display unit comprises a light-emitting unit and a packaging layer; the light-emitting unit comprises a driving circuit board and a micro light-emitting diode, and the packaging layer comprises an organic buffer layer and an inorganic protective layer; the micro light-emitting diodes are arranged on the driving circuit board; the organic buffer layer is filled on the driving circuit board and covers the micro light-emitting diodes; the inorganic protective layer is arranged on the organic buffer layer and covers the organic buffer layer and the side wall of the driving circuit board. According to the technical scheme, the capability of blocking water and oxygen invasion of the packaging layer can be improved, so that the purpose of improving the reliability of the micro light-emitting diode is achieved.

Description

Technical Field

[0001] The present application relates to the field of display technology, and in particular to a display unit and an array substrate. Background Art

[0002] Micro LED is a micro display technology, mainly used in special military display and civilian consumer electronics. Military applications include gun sights, individual combat helmet displays, pilot helmets, etc. Civilian consumer electronics applications include AR, VR, micro projectors, aerial photography, etc. Micro LED has the advantages of small size, light weight, low power consumption, high contrast, and high resolution.

[0003] The commonly used encapsulation layer of existing micro-LEDs is generally an organic layer, such as epoxy resin. When the epoxy resin is irradiated by external ultraviolet light and invaded by water and oxygen, it will produce yellowing problems, thereby affecting the optical effect of the micro-LED.

[0004] Therefore, how to improve the ability of the encapsulation layer to block the intrusion of water and oxygen is still a technical problem that technicians in this field need to solve urgently. Utility Model Content

[0005] In view of this, in order to solve the above technical problems, the present application provides a display unit and an array substrate.

[0006] To achieve the above-mentioned purpose, one of the technical solutions adopted in the present application is to provide a display unit, which includes a light-emitting unit and a packaging layer; the light-emitting unit includes a driving circuit board and a micro light-emitting diode, and the packaging layer includes an organic buffer layer and an inorganic protective layer; the micro light-emitting diode is arranged on the driving circuit board; the organic buffer layer is filled on the driving circuit board and covers the micro light-emitting diode; the inorganic protective layer is arranged on the organic buffer layer and covers the side walls of the organic buffer layer and the driving circuit board.

[0007] Optionally, the light-emitting unit includes a first bonding portion and a second bonding portion; the first bonding portion and the second bonding portion are arranged under the driving circuit board; and one electrode of the driving circuit board is electrically connected to the first bonding portion, and another electrode of the driving circuit board is electrically connected to the second bonding portion.

[0008] Optionally, the inorganic protective layer extends to cover the periphery of the first bonding portion and the second bonding portion.

[0009] Optionally, there are multiple micro LEDs, each of which is electrically connected to a driving circuit board; the multiple micro LEDs include at least one or more of a red light emitting diode, a blue light emitting diode and a green light emitting diode.

[0010] Optionally, the organic buffer layer includes a covering portion and a filling portion, the filling portion fills an area on the driving circuit board located at the periphery of the micro-LED; the covering portion covers the micro-LED and the filling portion, and the covering portion and the filling portion are connected into an integrated structure.

[0011] Optionally, looking down at the micro light emitting diode from a side of the inorganic protective layer away from the organic buffer layer, the organic buffer layer is located inside an edge of the driving circuit board or overlaps with an edge of the driving circuit board.

[0012] In order to solve the above technical problems, another technical solution adopted in the present application is to provide an array substrate, which includes a substrate and a plurality of display units, wherein the plurality of display units are arranged on the substrate and distributed in an array; the display unit is any one of the display units mentioned above; a separation groove is formed between two adjacent light-emitting units; the inorganic protective layer of the plurality of display units distributed in the array further extends along the bottom wall of the separation groove and is connected as a whole.

[0013] Optionally, the inorganic protective layer includes a first part, a second part and a third part that are interconnected; the first part is the part of the inorganic protective layer covering the organic buffer layer, the second part is the part of the inorganic protective layer extending along the side wall and bottom wall of the separation groove, and the third part is the part of the inorganic protective layer covering the substrate and extending along the edge of the substrate.

[0014] Optionally, the thickness of the inorganic protective layer is 0.5-5 um.

[0015] Optionally, the thickness of the covering portion is 0.5-5 um.

[0016] Beneficial effects: Different from the prior art, in the present application, firstly, the use of an organic buffer layer can release the stress of the encapsulation layer and play a buffering effect. Secondly, the organic buffer layer has a good bonding effect, which is conducive to the adhesion of the inorganic protective layer. Thirdly, the inorganic protective layer can block water and oxygen, thereby preventing water and oxygen from invading the organic buffer layer, and further improving the ability of the encapsulation layer to block water and oxygen intrusion, so as to achieve the purpose of improving the reliability of the micro-LED. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 is a schematic diagram of the structure of the array substrate of the present application;

[0018] Figure 2 is a schematic diagram of the structure of the component to be packaged provided in step S110 of the array substrate preparation method of the present application;

[0019] Figure 3 is a schematic diagram of the step S120 of the array substrate preparation method of the present application;

[0020] Figure 4It is the array substrate prepared in step S130 of the array substrate preparation method of the present application.

[0021] Description of reference numerals:

[0022] 1-array substrate; 100-substrate; 200-display unit; 210-light-emitting unit; 220-encapsulation layer; 300-separation groove; 400-nozzle;

[0023] 211 - driving circuit board; 212 - micro light emitting diode; 213 - first bonding portion; 214 - second bonding portion;

[0024] 221 - organic buffer layer; 222 - inorganic protective layer; 223 - covering part; 224 - filling part. DETAILED DESCRIPTION

[0025] In order to enable those skilled in the art to better understand the technical solution of the present application, the present application is further described in detail below in conjunction with the accompanying drawings and specific implementation methods. Obviously, the described implementation methods are only part of the implementation methods of the present application, rather than all the implementation methods. Based on the implementation methods in the present application, all other implementation methods obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0026] See also Figure 1 The array substrate 1 of the present application includes a substrate 100 and a plurality of display units 200, and the plurality of display units 200 are arranged on the substrate 100 and distributed in an array. The display unit 200 includes a light-emitting unit 210 and an encapsulation layer 220. The light-emitting unit 210 includes a driving circuit board 211 and a micro-light-emitting diode 212. The encapsulation layer 220 includes an organic buffer layer 221 and an inorganic protective layer 222. The micro-light-emitting diode 212 is arranged on the driving circuit board 211. The organic buffer layer 221 is filled on the driving circuit board 211 and covers the micro-light-emitting diode 212. The inorganic protective layer 222 is arranged on the organic buffer layer 221 and covers the side walls of the organic buffer layer 221 and the driving circuit board 211.

[0027] The above method has at least three beneficial effects. First, the organic buffer layer can release the stress of the encapsulation layer 220 and play a buffering role. Second, the organic buffer layer 221 has a good adhesion effect, which is conducive to the adhesion of the inorganic protective layer 222. Third, the inorganic protective layer 222 can block water and oxygen, thereby preventing water and oxygen from invading the organic buffer layer 221, and further improving the ability of the encapsulation layer 220 to block water and oxygen intrusion, thereby achieving the purpose of improving the reliability of the micro-LED 212.

[0028] Optionally, the material of the organic buffer layer 221 includes, but is not limited to, one or more of acrylic, epoxy resin, epoxy silane, organic siloxane, nano-grade silicon oxide, fluorocarbon coating, and silicone (such as organic silicone, silicone).

[0029] Optionally, the material of the inorganic protective layer 222 includes a single inorganic material or a combination of two or more inorganic materials. The inorganic material may be a metal oxide or a semiconductor oxide (such as silicon oxide and aluminum oxide), a metal nitride or a semiconductor nitride (such as boron nitride and silicon nitride), or a metal oxynitride or a semiconductor oxynitride (such as aluminum oxynitride or silicon oxynitride).

[0030] Furthermore, if Figure 1 As shown, the light-emitting unit 210 includes a first bonding portion 213 and a second bonding portion 214. The first bonding portion 213 and the second bonding portion 214 are disposed under the driving circuit board 211. One electrode of the driving circuit board 211 is electrically connected to the first bonding portion 213, and the other electrode of the driving circuit board 211 is electrically connected to the second bonding portion 214. The first bonding portion 213 and the second bonding portion 214 are respectively bonded to the substrate 100 to be electrically connected to the substrate 100. In this way, the substrate 100 can be electrically connected to the driving circuit board 211 through the first bonding portion 213 and the second bonding portion 214, and then the micro-light-emitting diode 212 is driven to emit light or extinguish through the driving circuit board 211 to achieve the corresponding display effect.

[0031] Furthermore, if Figure 1 As shown, the inorganic protective layer 222 extends to cover the periphery of the first bonding portion 213 and the second bonding portion 214. In this way, the inorganic protective layer 222 further achieves a more comprehensive sealing effect on the driving circuit board 211, the first bonding portion 213 and the second bonding portion 214, thereby further preventing water and oxygen from invading the driving circuit board 211, the first bonding portion 213 and the second bonding portion 214.

[0032] Alternatively, if Figure 1 As shown, there are a plurality of micro-LEDs 212, each of which is electrically connected to the driving circuit board 211. The plurality of micro-LEDs 212 at least include one or more of a red light emitting diode, a blue light emitting diode, and a green light emitting diode. By way of example and not limitation, the driving circuit board 211 can independently drive each micro-LED 212 to be lit or extinguished. The display of the picture is achieved by the coordination of the different light emitting states of the plurality of micro-LEDs 212.

[0033] Preferably, the plurality of micro LEDs 212 include red LEDs, blue LEDs and green LEDs, and different color displays are achieved by coordinating different light emitting states of the red LEDs, blue LEDs and green LEDs.

[0034] Furthermore, if Figure 1 As shown, the organic buffer layer 221 includes a covering portion 223 and a filling portion 224, and the filling portion 224 fills the area on the driving circuit board 211 located at the periphery of the micro-LED 212. The covering portion 223 covers the micro-LED 212 and the filling portion 224, and the covering portion 223 and the filling portion 224 are connected to form an integral structure.

[0035] In this way, the area on the periphery of the micro-LED 212 on the driving circuit board 211 is filled with the filling portion 224, so that the surface of the covering portion 223 away from the micro-LED 212 can be made flatter. In this way, the inorganic protective layer 222 is advantageously flattened in the portion covering the organic buffer layer 221.

[0036] Alternatively, if Figure 1 As shown, when looking down at the micro-LED 212 from the side of the inorganic protective layer 222 away from the organic buffer layer 221, the organic buffer layer 221 is located inside the edge of the driving circuit board 211 or overlaps with the edge of the driving circuit board 211. In this way, the organic buffer layer 221 is formed only in the area where the driving circuit board 211 is located, which can reduce the waste of materials for preparing the organic buffer layer 221.

[0037] Furthermore, if Figure 1 As shown, a separation groove 300 is formed between two adjacent light-emitting units 210. The inorganic protective layer 222 of the plurality of display units 200 distributed in an array further extends along the bottom wall of the separation groove 300 and is connected as a whole. In this way, the sealing performance of the inorganic protective layer 222 to the organic buffer layer 221, the driving circuit board 211, the first bonding portion 213 and the second bonding portion 214 can be further improved.

[0038] Optionally, the inorganic protective layer 222 includes a first portion (not labeled in the figure), a second portion (not labeled in the figure), and a third portion (not labeled in the figure) that are interconnected. The first portion is the portion where the inorganic protective layer 222 covers the organic buffer layer 221, the second portion is the portion where the inorganic protective layer 222 extends along the side wall and the bottom wall of the separation groove 300, and the third portion is the portion where the inorganic protective layer 222 covers the substrate 100 and extends along the edge of the substrate 100. In this way, the inorganic protective layer 222 can achieve a better sealing effect on the organic buffer layer 221, the driving circuit board 211, the first bonding portion 213, and the second bonding portion 214.

[0039] Optionally, the thickness of the inorganic protective layer 222 is 0.5-5um (for example, 0.5um, 1um, 3um, 5um), preferably, the thickness of the inorganic protective layer 222 is 1um. Optionally, the thickness of the covering portion 223 is 0.5-5um (for example, 0.5um, 1um, 3um, 5um), preferably, the thickness of the covering portion 223 is 1um.

[0040] The following combination Figure 1 See also Figure 2-Figure 4 The method for preparing the array substrate 1 is described. The method for preparing the array substrate 1 includes steps S110 to S130.

[0041] Step S110: providing a component to be packaged.

[0042] like Figure 2 As shown, the packaged component includes a substrate 100 and a plurality of light-emitting units 210, and the plurality of light-emitting units 210 are arranged on the substrate 100 and distributed in an array. A separation groove 300 is formed between two adjacent light-emitting units 210. The light-emitting unit 210 includes a driving circuit board 211 and a micro light-emitting diode 212. The micro light-emitting diode 212 is arranged on the driving circuit board 211.

[0043] The detailed structure of the light emitting unit 210 is the same as that of the light emitting unit 210 in the above array substrate 1 , and will not be described again.

[0044] Step S120: using inkjet printing technology to generate an organic buffer layer covering the micro light emitting diodes on the driving circuit board.

[0045] The inkjet printing (IJP) technology is preferably a scanning inkjet printing technology, so that local spraying can be performed according to design requirements, with the characteristics of direct molding, reducing the demand for metal masks and reducing the demand for vacuum environment production. Inkjet printing includes but is not limited to the use of inkjet printers. Inkjet printers include but are not limited to inkjet heads and nozzles arranged in the inkjet heads. Optionally, the diameter of the nozzle is not greater than 100 μm, so that the material sprayed from the nozzle is small and dense, and can achieve fine spraying process capabilities.

[0046] like Figure 3 As shown, the material of the organic buffer layer 221 is disposed on the driving circuit board 211 by spraying using a nozzle 400, and then the material of the organic buffer layer 221 disposed on the driving circuit board 211 is cured by light curing or heat curing to form the organic buffer layer 221. In this way, the area where the driving circuit board 211 is located can be sprayed locally through the inkjet printing technology, thereby saving materials.

[0047] Step S130: forming an inorganic protective layer covering the organic buffer layer on the substrate by using vacuum deposition technology.

[0048] like Figure 4 As shown, the inorganic protective layer 222 includes a first portion (not labeled in the figure), a second portion (not labeled in the figure), and a third portion (not labeled in the figure) that are connected to each other. The first portion is the portion where the inorganic protective layer 222 covers the organic buffer layer 221, the second portion is the portion where the inorganic protective layer 222 extends along the sidewall and bottom wall of the separation groove 300, and the third portion is the portion where the inorganic protective layer 222 covers the substrate 100 and extends along the edge of the substrate 100.

[0049] Optionally, vacuum deposition techniques include, but are not limited to, physical vapor deposition techniques or chemical vapor deposition techniques. Physical vapor deposition techniques include, but are not limited to, sputtering and electron beam physical vapor deposition (PVD) techniques, or atomic layer deposition (ALD) techniques. Chemical vapor deposition techniques include, but are not limited to, plasma enhanced and plasma assisted chemical vapor deposition (CVD) techniques.

[0050] The above are only implementation methods of the present application, and are not intended to limit the patent scope of the present application. Any equivalent structure or equivalent process transformation made using the contents of the present application specification and drawings, or directly or indirectly applied in other related technical fields, are also included in the patent protection scope of the present application.

Claims

1. A display unit, comprising a light-emitting unit and an encapsulation layer; the light-emitting unit comprises a driving circuit board and a micro light-emitting diode, the encapsulation layer comprises an organic buffer layer and an inorganic protective layer; the micro light-emitting diode is arranged on the driving circuit board; the organic buffer layer is filled on the driving circuit board and covers the micro light-emitting diode; the inorganic protective layer is arranged on the organic buffer layer and covers the side wall of the organic buffer layer and the driving circuit board.

2. The display unit according to claim 1, characterized in that The light-emitting unit includes a first bonding portion and a second bonding portion; the first bonding portion and the second bonding portion are arranged under the driving circuit board; and an electrode of the driving circuit board is electrically connected to the first bonding portion, and another electrode of the driving circuit board is electrically connected to the second bonding portion.

3. The display unit according to claim 2, characterized in that The inorganic protective layer extends to cover the peripheries of the first bonding portion and the second bonding portion.

4. The display unit according to claim 1, characterized in that There are a plurality of micro-LEDs, each of which is electrically connected to the driving circuit board; the plurality of micro-LEDs include at least one or more of a red light emitting diode, a blue light emitting diode and a green light emitting diode.

5. The display unit according to claim 1, characterized in that The organic buffer layer includes a covering portion and a filling portion, wherein the filling portion fills an area on the driving circuit board located at the periphery of the micro-LED; the covering portion covers the micro-LED and the filling portion, and the covering portion and the filling portion are connected to form an integral structure.

6. The display unit according to claim 1, characterized in that Looking down at the micro light emitting diode from a side of the inorganic protective layer away from the organic buffer layer, the organic buffer layer is located inside the edge of the driving circuit board or overlaps with the edge of the driving circuit board.

7. An array substrate, characterized in that: The array substrate includes a substrate and a plurality of display units, wherein the plurality of display units are arranged on the substrate and distributed in an array; the display unit is a display unit according to any one of claims 1 to 6; a separation groove is formed between two adjacent light-emitting units; the inorganic protective layer of the plurality of display units distributed in an array further extends along the bottom wall of the separation groove and is connected as a whole.

8. The array substrate according to claim 7, characterized in that: The inorganic protective layer includes a first part, a second part and a third part that are interconnected; the first part is the part of the inorganic protective layer covering the organic buffer layer, the second part is the part of the inorganic protective layer extending along the side wall and the bottom wall of the separation groove, and the third part is the part of the inorganic protective layer covering the substrate and extending along the edge of the substrate.

9. The array substrate according to claim 7, characterized in that: The thickness of the inorganic protective layer is 0.5-5 um.

10. The array substrate according to claim 7, characterized in that: The thickness of the covering portion is 0.5-5 um.

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