Wireless charging heat dissipation device, wireless charging device and vehicle

Abstract

The utility model provides a wireless charging heat dissipation device, a wireless charging device and a vehicle, and the device comprises a supporting panel which is used for bearing electronic equipment and is provided with a supporting part which is used for supporting a battery region of the electronic equipment; the semiconductor refrigeration part is arranged on the supporting panel and used for cooling the supporting panel; and the soaking piece is arranged between the semiconductor refrigeration piece and the supporting part and is in heat conduction connection with the semiconductor refrigeration piece so as to cool the supporting part. Through the arrangement, the semiconductor refrigeration technology is adopted, noise is low, occupied space is small, the structure is stable, refrigeration efficiency is high, and the heat dissipation effect can be improved; and under the action of the soaking sheet, the cooling effect of the battery area of the electronic equipment can be improved, and the problem that the service life of the battery is attenuated due to too high wireless charging temperature is avoided.

Description

Technical Field

[0001] The present application relates to the field of wireless charging technology, and in particular to a wireless charging heat dissipation device, a wireless charging device and a vehicle. Background Art

[0002] Wireless charging functions are becoming more and more popular, and the power of wireless charging is getting higher and higher, which leads to the heat generated by mobile phones during wireless charging, causing the mobile phone to automatically shut down due to overheating, and the life of the built-in battery of the mobile phone to decrease. The heat dissipation structure of the current wireless charging heat dissipation device mostly adopts the form of fan blowing, which is greatly affected by the room temperature, has low heat dissipation efficiency and high noise. Utility Model Content

[0003] In view of this, the present application provides a wireless charging heat dissipation device, a wireless charging device and a vehicle, which have good heat dissipation effect, low noise and small space occupation.

[0004] In order to achieve the above objectives, this application provides the following technical solutions:

[0005] A wireless charging heat dissipation device, comprising:

[0006] A support panel, used to carry the electronic device, and having a support portion for supporting a battery area of ​​the electronic device;

[0007] A semiconductor refrigeration component is arranged on the support panel and is used to cool the support panel;

[0008] The heat spreader is disposed between the semiconductor refrigeration element and the support portion and is thermally connected to the semiconductor refrigeration element to cool the support portion.

[0009] Optionally, a plurality of heat dissipation channels are distributed in an array inside the heat spreader so that the heat dissipation medium flows in the plurality of heat dissipation channels.

[0010] Optionally, a hollow cavity is provided inside the heat spreader, and two side walls of the hollow cavity are connected by a plurality of heat dissipation columns distributed in an array to form the heat dissipation channel between adjacent heat dissipation columns.

[0011] Optionally, the heat spreader is configured to be wavy and is pressed tightly between the semiconductor refrigeration element and the support panel.

[0012] Optionally, a plurality of convex pillars are distributed in an array on the outer side surface of the heat spreader, so that the heat dissipation medium flows between adjacent convex pillars.

[0013] Optionally, a heat conducting sheet is further included, which is arranged between the semiconductor refrigeration element and the heat spreader and is thermally connected to the semiconductor refrigeration element and the heat spreader to enlarge the cooling area of ​​the semiconductor refrigeration element.

[0014] Optionally, the semiconductor refrigeration element has a refrigeration portion, the area of ​​the heat conducting plate is larger than the area of ​​the refrigeration portion, and the refrigeration portion is located within the outer contour of the heat conducting plate.

[0015] Optionally include:

[0016] A first clamping member and a second clamping member are provided on the support panel and can move closer to and farther from each other to clamp the electronic device on the support panel;

[0017] A driving member is arranged on the supporting panel and is transmission-connected to the first clamping member and / or the second clamping member through a ball screw mechanism so as to drive the first clamping member and the second clamping member to move closer to and away from each other.

[0018] Optionally, a wireless charging module is included for charging the electronic device on the supporting panel; and the semiconductor cooling element and the heat spreader are both arranged between the wireless charging module and the supporting panel.

[0019] A wireless charging device, comprising:

[0020] A wireless charging heat dissipation device, configured as the wireless charging heat dissipation device described in any one of the above items;

[0021] A wireless charging module, used to charge the electronic device on the support panel;

[0022] Wherein, the semiconductor cooling element and the heat spreader are both arranged between the wireless charging module and the supporting panel.

[0023] A vehicle comprises a wireless charging heat dissipation device, wherein the wireless charging heat dissipation device is any one of the wireless charging heat dissipation devices described above.

[0024] In the wireless charging heat dissipation device, wireless charging device and vehicle provided by the present application, the heat dissipation component includes a semiconductor refrigeration element and a heat spreader, wherein the refrigeration element is arranged on the support panel, and refrigeration is performed through the refrigeration element to cool the support panel. After the semiconductor refrigeration element is connected to the support panel, the refrigeration part of the semiconductor refrigeration element is attached to the second side of the support panel to achieve cooling of the support panel. In this way, the use of semiconductor refrigeration technology can reduce noise, occupy a small space, have a stable structure, and have high refrigeration efficiency, which is conducive to improving the heat dissipation effect. The heat spreader is arranged between the support part of the support panel and the semiconductor refrigeration element. The heat spreader can be pressed against the support part of the support panel through the semiconductor refrigeration element, so that the heat spreader and the support panel have a larger contact area and better thermal conductivity, which is conducive to the support part to dissipate heat through the heat spreader. Moreover, the heat spreader is thermally connected to the semiconductor cooling element so that the semiconductor cooling element and the support part can exchange heat on the heat spreader. Under the action of the heat spreader, the heat exchange efficiency between the semiconductor cooling element and the support part can be improved, thereby improving the heat dissipation effect of the support part, thereby improving the cooling effect of the battery area of ​​the electronic device, and avoiding the problem of battery life reduction caused by excessive wireless charging temperature. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying any creative work.

[0026] Figure 1 An exploded view of a wireless charging heat dissipation device according to some embodiments;

[0027] Figure 2 A front view of a heat spreader shown in some embodiments;

[0028] Figure 3 for Figure 2 Partial cross-sectional view at the AA position;

[0029] Figure 4 An exploded view of a heat dissipation assembly is shown for some embodiments;

[0030] Figure 5 A structural diagram of a clamping assembly shown in some embodiments;

[0031] Figure 6 A rear perspective view of a wireless charging and heat dissipation device (with one carrying position) shown in some embodiments;

[0032] Figure 7The front side stereogram of the wireless charging heat dissipation device (with one loading position) shown in some embodiments Figure 1 ;

[0033] Figure 8 The front side stereogram of the wireless charging heat dissipation device (with one loading position) shown in some embodiments Figure 2 ;

[0034] Fig. 9 A rear perspective view of a wireless charging heat dissipation device (having two loading positions) shown in some embodiments;

[0035] Fig.10 A front perspective view of a wireless charging heat dissipation device (having two loading positions) shown in some embodiments;

[0036] In the figure: 1. electronic device; 2. supporting panel; 3. heat spreader; 4. heat conductive sheet; 5. semiconductor refrigeration component; 6. clamping assembly; 7. wireless charging module; 21. bearing slot; 31. wall panel; 32. heat dissipation column; 33. heat dissipation channel; 51. refrigeration part; 52. heat dissipation part; 61. first clamping part; 62. second clamping part; 63. driving part; 64. ball screw mechanism. DETAILED DESCRIPTION

[0037] The following will be combined with the drawings in the embodiments of the present application to clearly and completely describe the technical solutions in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0038] like Figure 1-Figure 10 As shown, an embodiment of the present application provides a wireless charging heat dissipation device, including a support panel 2 and a heat dissipation component.

[0039] The support panel 2 is used to carry the electronic device 1 (such as a mobile phone, a tablet, etc.), and the wireless charging module 7 is used to charge the electronic device 1 on the support panel 2. The support panel 2 is provided with a support portion, and when the support panel 2 carries the electronic device 1, the support portion is supported on the battery area of ​​the electronic device 1. Specifically, the support panel 2 has a first side surface and a second side surface opposite to each other, and the first side surface is provided with a carrying groove 21, and the carrying groove 21 is used to accommodate the electronic device 1, and a part of the groove bottom of the carrying groove 21 is provided as the above-mentioned supporting portion.

[0040] The heat dissipation component includes a semiconductor refrigeration element 5 and a heat spreader 3, wherein the refrigeration element is arranged on the support panel 2, and refrigeration is performed by the refrigeration element to cool the support panel 2. For example, the semiconductor refrigeration element 5 is arranged as a semiconductor refrigeration element. After the semiconductor refrigeration element 5 is connected to the support panel 2, the refrigeration part 51 of the semiconductor refrigeration element 5 is attached to the second side surface of the support panel 2 to achieve cooling of the support panel 2. In this way, the semiconductor refrigeration technology can reduce noise, occupy less space, have a stable structure, and have high refrigeration efficiency, which is conducive to improving the heat dissipation effect.

[0041] The heat spreader 3 is arranged between the support portion of the support panel 2 and the semiconductor refrigeration element 5. The heat spreader 3 can be pressed against the support portion of the support panel 2 (i.e., the second side of the support panel 2) through the semiconductor refrigeration element 5, so that the heat spreader 3 and the support panel 2 have a larger contact area and better heat conduction effect, which is conducive to the heat dissipation of the support portion through the heat spreader 3. Moreover, the heat spreader 3 is thermally connected to the semiconductor refrigeration element 5, so that the semiconductor refrigeration element 5 and the support portion can exchange heat on the heat spreader 3. Under the action of the heat spreader 3, the heat exchange efficiency of the semiconductor refrigeration element 5 and the support portion can be improved, thereby improving the heat dissipation effect of the support portion, thereby improving the cooling effect of the battery area of ​​the electronic device 1, and avoiding the problem of battery life reduction caused by excessive wireless charging temperature.

[0042] Such a setting adopts semiconductor refrigeration technology, which has low noise, small space occupation, stable structure, high refrigeration efficiency, and is conducive to improving the heat dissipation effect; and under the action of the heat spreader 3, the cooling effect of the battery area of ​​the electronic device 1 can be improved, avoiding the problem of battery life reduction caused by excessive wireless charging temperature.

[0043] In this solution, a plurality of heat dissipation channels 33 are arranged inside the heat spreader 3 so that the heat spreader 3 has a larger inner surface area. The plurality of heat dissipation channels 33 are arranged in an array inside the heat spreader 3. For example, the arrangement direction of the plurality of heat dissipation channels 33 is parallel to the plane where the heat spreader 3 is located. During use, the heat of the support portion is transferred to the heat spreader 3, so that the heat dissipation medium (such as air, water, etc.) inside the heat spreader 3 flows in the plurality of heat dissipation channels 33. At the same time, the heat dissipation medium contacts the inner surface of the heat spreader 3, which can amplify the heat exchange and heat dissipation effect of the heat spreader 3, thereby improving the cooling effect of the support portion.

[0044] like Figure 3As shown, the interior of the heat spreader is provided with a hollow cavity and a plurality of heat dissipation columns 32. Specifically, the heat spreader has two parallel and spaced wall panels 31, a hollow cavity is formed between the two wall panels 31, each heat dissipation column 32 is arranged between the two wall panels 31 (i.e., between the two side walls of the hollow cavity), and a plurality of heat dissipation columns 32 are arranged in an array in the hollow cavity to form a heat dissipation channel 33 between two adjacent heat dissipation columns 32. In this way, by providing a plurality of heat dissipation columns 32, the inner surface area of ​​the hollow cavity can be greatly increased, the contact area between the heat dissipation medium and the hollow cavity is larger, and the heat exchange and heat dissipation effect of the heat spreader can be improved.

[0045] The heat spreader 3 is arranged in a wavy shape, for example, the heat spreader is arranged in a wavy shape along the height direction of the support panel 2, so that the heat dissipation medium in the hollow cavity rises after being heated, and contacts more with the side wall of the hollow cavity during the rising process, further improving the heat exchange and heat dissipation effect of the heat spreader. Moreover, during the assembly process, the semiconductor refrigeration component 5 presses the heat spreader against the second side surface of the support panel 2. Due to the wavy design, a certain pre-tightening force can be provided, so that each component contacts more closely, which is conducive to improving the heat conduction effect.

[0046] It should be noted that, when in use, the support panel 2 is tilted relative to the horizontal direction so that the first side of the support panel 2 is higher than the second side, and the direction from the first side to the second side is the height direction of the support panel 2. When the support panel 2 carries the electronic device 1, the battery area of ​​the electronic device 1 is close to the second side of the support panel 2, and the high heat of the battery area is transferred to the support part, and then transferred from the support part to the heat spreader 3, and heat exchange and temperature reduction are performed in the heat spreader 3.

[0047] In another solution, a plurality of protrusions are provided on the outer side of the heat spreader 3, and the plurality of protrusions are arranged in an array and cover one or two outer sides of the heat spreader 3. In this way, an air duct can be formed between adjacent protrusions, and the heat on the heat spreader can be driven by the air flow on the side of the heat spreader, thereby improving the heat dissipation effect.

[0048] Here, the heat spreader 3 is made of stainless steel, which has low cost and good heat dissipation efficiency.

[0049] In some embodiments, Figure 4 As shown, the wireless charging heat dissipation device also includes a heat conductive sheet 4, which is arranged between the cooling sheet and the heat spreader 3, and the semiconductor cooling element 5, the heat conductive sheet 4 and the heat spreader 3 are in thermal contact, so that the temperature of the semiconductor cooling element 5 can be transferred to the heat conductive sheet 4 and the heat spreader 3. Among them, the heat conductive sheet 4 is used to enlarge the cooling area of ​​the semiconductor cooling element 5, thereby increasing the heat dissipation area of ​​the heat dissipation component, which is conducive to all-round cooling of the electronic device 1 on the support panel 2, and is conducive to greatly reducing the temperature of the electronic device 1.

[0050] like Figure 4As shown, the semiconductor refrigeration element 5 has a refrigeration portion 51, which is arranged in a sheet shape and constitutes the refrigeration area of ​​the semiconductor refrigeration element 5, the area of ​​the heat conductive sheet 4 is larger than the area of ​​the refrigeration portion 51, and the refrigeration portion 51 is located within the outer contour of the heat conductive sheet 4, so that the heat conductive sheet 4 can diffuse the refrigeration area formed on the refrigeration portion 51 along the edge of the heat conductive sheet 4, thereby increasing the refrigeration area. Correspondingly, in order to realize the refrigeration of the refrigeration portion 51, the semiconductor refrigeration element 5 also has a heat dissipation portion 52, which is away from the refrigeration portion 51 and connected to the refrigeration portion 51.

[0051] Specifically, the heat conducting sheet 4 is set as copper foil, which has a good heat conduction effect. The second side of the support panel 2 is provided with a mounting groove, and the heat conducting sheet 4 is embedded in the mounting groove and is snapped into the mounting groove by a buckle, and the heat spreader 3 is pressed between the heat conducting sheet 4 and the bottom of the mounting groove.

[0052] It can be understood that the area of ​​the heat spreader 3 is also smaller than the area of ​​the heat conductive sheet 4, so that a part of the heat conductive sheet 4 abuts against the heat spreader 3, and the other part directly abuts against the second side of the support panel 2. This can not only cool the entire support panel 2, but also locally cool the supporting part of the support panel 2.

[0053] like Fig.10 As shown, the support panel 2 is provided with a plurality of bearing positions, and the plurality of bearing positions can bear a plurality of electronic devices 1, thereby improving the bearing performance of the support panel 2. The bearing positions can be provided with two, three or four, for example, the first side surface of the support panel 2 is provided with two bearing grooves 21 to form two bearing positions.

[0054] Among them, the heat conductive sheet 4 is attached to the second side surface of the support panel 2 and corresponds to all the load-bearing positions, and the semiconductor refrigeration component 5 is arranged on the second side surface of the support panel 2 and corresponds to one of the load-bearing positions. In this way, through the extended design of the heat conductive sheet 4, the cooling area of ​​the semiconductor refrigeration component 5 can be extended from one of the load-bearing positions to all the load-bearing positions, and then the electronic equipment 1 on multiple load-bearing positions can be cooled by one semiconductor refrigeration component 5.

[0055] In some embodiments, the wireless charging and heat dissipation device also includes a clamping component, which is arranged on the support panel 2 and can clamp the electronic device 1 on the support panel 2, thereby fixing the electronic device 1 on the support panel 2, thereby preventing the electronic device 1 from slipping and improving the wireless charging stability of the electronic device 1.

[0056] like Figure 5As shown, the clamping assembly includes a first clamping member 61, a second clamping member 62 and a driving member 63. The first clamping member 61 and the second clamping member 62 are arranged on the second side of the supporting panel 2 and can approach and move away from each other. When the first clamping member 61 and the second clamping member 62 are close to each other, the first clamping member 61 and the second clamping member 62 can pass through the supporting panel 2 so that parts of the first clamping member 61 and the second clamping member 62 are located on the first side of the supporting panel 2 and clamp the electronic device 1. For example, the first clamping member 61 and the second clamping member 62 can pass through the side wall of the supporting groove 21 of the supporting panel 2.

[0057] The driving member 63 is arranged on the second side surface of the support panel 2, and can drive the first clamping member 61 and the second clamping member 62 to approach and move away, wherein the driving member 63 can be set as a motor, and is connected to the first clamping member 61 and the second clamping member 62 through a ball screw mechanism 64, so that the position of the electronic device 1 can be accurately located and the clamping effect can be improved. Of course, the driving member 63 can also be connected to the first clamping member 61 or the second clamping member 62 only, and the approach and distance can be achieved by fixing one and moving the other.

[0058] The embodiment of the present application provides a wireless charging device, including a wireless charging heat dissipation device and a wireless charging module. The wireless charging heat dissipation device is the wireless charging heat dissipation device in the above embodiment. The wireless charging module 7 is used to charge the electronic device 1 on the support panel 2. The heat dissipation component is arranged between the wireless charging module 7 and the support panel 2, which can cool down the electronic device 1 on the support panel 2 and the wireless charging module 7, which is conducive to improving the charging efficiency and safety.

[0059] The wireless charging device will be described in detail below in conjunction with the above embodiments.

[0060] During the assembly process, the heat spreader 3 is first fixed in the installation groove of the second side of the support panel 2 by pre-hanging with glue, and then the thermal conductive sheet 4 is clamped in the installation groove by a buckle, and the thermal conductive sheet 4 is pressed against the heat spreader 3, and then the clamping assembly is connected to the support panel 2, and finally the clamped semiconductor refrigeration component 5 and the wireless charging module 7 are screwed to the support panel 2.

[0061] It should be noted that the heat spreader 3, the heat conductive sheet 4, the semiconductor cooling element 5, the first clamping member 61, the second clamping member 62 and the driving member 63 are all arranged on the support panel 2, wherein the heat spreader 3, the heat conductive sheet 4 and the semiconductor cooling element 5 are sequentially stacked and arranged in the middle area of ​​the support panel 2, and the first clamping member 61 and the second clamping member 62 are connected to the edge area (such as the upper edge and the lower edge) of the support panel 2 through the driving member 63. Although each component is connected to the support panel 2, the connection and function of each component can be made not to interfere with each other through the spatial layout design.

[0062] The embodiment of the present application provides a vehicle, including a wireless charging heat dissipation device, which is the wireless charging heat dissipation device in the above embodiment. Such a configuration uses semiconductor refrigeration technology, has low noise, small space occupation, stable structure, high refrigeration efficiency, and is conducive to improving the heat dissipation effect; and under the action of the heat spreader 3, the cooling effect of the battery area of ​​the electronic device 1 can be improved, avoiding the problem of battery life reduction caused by excessive wireless charging temperature.

[0063] The basic principles of the present application are described above in conjunction with specific embodiments. However, it should be noted that the advantages, strengths, effects, etc. mentioned in the present application are only examples and not limitations, and it cannot be considered that these advantages, strengths, effects, etc. are required by each embodiment of the present application. In addition, the specific details disclosed above are only for the purpose of illustration and ease of understanding, not for limitation, and the above details do not limit the present application to being implemented by adopting the above specific details.

[0064] The block diagrams of the devices, apparatuses, equipment, and systems involved in this application are only illustrative examples and are not intended to require or imply that they must be connected, arranged, and configured in the manner shown in the block diagram. As will be appreciated by those skilled in the art, these devices, apparatuses, equipment, and systems can be connected, arranged, and configured in any manner. Words such as "including", "comprising", "having", etc. are open words, referring to "including but not limited to", and can be used interchangeably with them. The words "or" and "and" used here refer to the words "and / or" and can be used interchangeably with them, unless the context clearly indicates otherwise. The words "such as" used here refer to the phrase "such as but not limited to", and can be used interchangeably with them.

[0065] It should also be noted that in the apparatus, device and method of the present application, each component or each step can be decomposed and / or recombined. Such decomposition and / or recombination should be regarded as equivalent solutions of the present application.

[0066] The above description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other aspects without departing from the scope of the present application. Therefore, the present application is not intended to be limited to the aspects shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

[0067] It should be understood that the qualifiers "first", "second", "third", "fourth", "fifth" and "sixth" used in the description of the embodiments of the present application are only used to more clearly explain the technical solutions and cannot be used to limit the scope of protection of the present application.

[0068] The above description has been given for the purpose of illustration and description. In addition, this description is not intended to limit the embodiments of the present application to the forms disclosed herein. Although multiple example aspects and embodiments have been discussed above, those skilled in the art will recognize certain variations, modifications, changes, additions and sub-combinations thereof.

Claims

1. A wireless charging heat dissipation device, characterized in that: include: A support panel, used to carry the electronic device, and having a support portion for supporting a battery area of ​​the electronic device; A semiconductor refrigeration component is arranged on the support panel and is used to cool the support panel; The heat spreader is disposed between the semiconductor refrigeration element and the support portion and is thermally connected to the semiconductor refrigeration element to cool the support portion.

2. The wireless charging heat dissipation device according to claim 1, characterized in that: A plurality of heat dissipation channels are arranged in an array inside the heat spreader so that the heat dissipation medium can flow in the plurality of heat dissipation channels.

3. The wireless charging heat dissipation device according to claim 2, characterized in that: A hollow cavity is arranged inside the heat spreader, and two side walls of the hollow cavity are connected by a plurality of heat dissipation columns distributed in an array, so as to form the heat dissipation channel between adjacent heat dissipation columns.

4. The wireless charging heat dissipation device according to claim 1, characterized in that: The heat spreader is configured to be wavy and is pressed tightly between the semiconductor refrigeration component and the support panel.

5. The wireless charging heat dissipation device according to claim 1, characterized in that: The outer side surface of the heat spreader is provided with a plurality of convex columns in an array so that the heat dissipation medium flows between adjacent convex columns.

6. The wireless charging heat dissipation device according to claim 1, characterized in that: It also includes a heat conducting sheet, which is arranged between the semiconductor refrigeration element and the heat spreader and is thermally connected to the semiconductor refrigeration element and the heat spreader to enlarge the refrigeration area of ​​the semiconductor refrigeration element.

7. The wireless charging heat dissipation device according to claim 6, characterized in that: The semiconductor refrigeration element has a refrigeration portion, the area of ​​the heat conducting plate is larger than the area of ​​the refrigeration portion, and the refrigeration portion is located within the outer contour of the heat conducting plate.

8. The wireless charging heat dissipation device according to claim 1, characterized in that: include: A first clamping member and a second clamping member are provided on the support panel and can move closer to and farther from each other to clamp the electronic device on the support panel; A driving member is arranged on the supporting panel and is transmission-connected to the first clamping member and / or the second clamping member through a ball screw mechanism so as to drive the first clamping member and the second clamping member to move closer to and away from each other.

9. A wireless charging device, characterized in that: include: A wireless charging heat dissipation device, configured as the wireless charging heat dissipation device according to any one of claims 1 to 8; A wireless charging module, used to charge the electronic device on the support panel; Wherein, the semiconductor cooling element and the heat spreader are both arranged between the wireless charging module and the supporting panel.

10. A vehicle, comprising a wireless charging and heat dissipation device, characterized in that: The wireless charging heat dissipation device is the wireless charging heat dissipation device as described in any one of claims 1-8.

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