Horn independent cavity structure of open TWS earphone
By setting up a sealed bracket in the TWS headset, the PCB board and the speaker are separated into independent cavity, and the vent hole and air intake net are used to tune, the problem of insufficient acoustic effect and waterproof performance of the speaker is solved, achieving the best sound quality and high waterproof effect .
Patent Information
- Application Number
- CN202420958512.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-06
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2034-05-06
AI Technical Summary
The acoustic effect of the existing TWS headphones is affected by the dense or sparse air intake net, and the waterproof performance is insufficient, resulting in water inflow of the PCB board and its function fails.
The speaker independent cavity structure of the open TWS headset is adopted. The PCB board and the speaker are separated into the front and rear cavity by setting a sealing bracket in the housing. The sound quality tuning is achieved using the ventilation hole and the intake network, and the sealing bracket is used to prevent water. Enter.
It achieves the best sound quality, while greatly improving the waterproof effect, avoiding the functional failure of the PCB board due to water intrusion.
Smart Images

Figure CN222262992U_ABST
Abstract
Description
Technical field:
[0001] The utility model relates to the technical field of wireless earphones, in particular to an independent cavity structure of a speaker of an open-type TWS earphone. Background technology:
[0002] TWS earphones are wireless earphones. Compared with traditional wired earphones, the biggest feature of TWS earphones is that there is no connecting wire between the two earphones, realizing a truly wireless audio experience. Each TWS earphone contains its own battery, Bluetooth chip, speaker and other components, can work independently, and connect to audio source devices (such as mobile phones, tablets, etc.) through Bluetooth technology.
[0003] TWS earphones mainly include a shell, a PCB board, a battery, a speaker, etc. inside the shell. Among them, the PCB board integrates various electronic components such as the Bluetooth chip. In order to ensure the sound quality and sound transmission, an air inlet is often opened on the shell to connect with the cavity where the speaker is located, and an air inlet net is provided for tuning. However, there will be problems: when the air inlet net is too dense, the acoustic effect of the speaker is not good, and when the air inlet net is sparse, water will enter part of the PCB during the waterproof test, resulting in functional failure.
[0004] For example: the microphone and speaker combination module, earphone and terminal device of Chinese patent application No. 201911157650.6, which includes a first shell 11 and a second shell 12, and a space for accommodating the microphone and speaker combination module 10 is formed between the first shell 11 and the second shell 12, and the microphone and speaker combination module 10 includes a speaker 2, a microphone 3 and a printed circuit board 4, and the speaker 2 and the microphone 3 are fixed on the printed circuit board 4. Among them, a rear cavity 14 of the speaker 2 and the microphone 3 is formed between the first shell 11 and the printed circuit board 4, and a front cavity 15 of the speaker 2 and the microphone 3 is formed between the second shell 12 and the printed circuit board 4, and a damping net 124 is arranged in the front cavity 15, for example, the damping net 124 can be fixed on the inner wall of the ear inlet 123 by bonding, and the high-frequency sound emitted by the speaker 2 can be filtered out by setting the damping net 124, so that the bass effect of the earphone is more significant. In this patent, the speaker 2 and the microphone 3 are fixed to the printed circuit board 4, that is, the speaker 2 is connected to the circuit board 4. When the damping mesh 124 of the front cavity 15 is too dense, the acoustic effect of the speaker 2 is not good, and when the damping mesh 123 of the front cavity 15 is sparse, there will be a waterproof problem, causing water to enter the circuit board 4.
[0005] In view of this, the inventor proposes the following technical solution. Utility model content:
[0006] The purpose of the utility model is to overcome the deficiencies of the prior art and provide an independent speaker cavity structure for an open-type TWS headset.
[0007] In order to solve the above technical problems, the utility model adopts the following technical solutions: an independent speaker cavity structure of an open TWS headset, comprising: a shell, a PCB board and a speaker arranged in the shell, at least one vent hole arranged on the shell and used for the speaker to connect to the outside, and an air intake net arranged in the vent hole and used for tuning, a sealing bracket is also arranged in the shell, which divides the shell into a front cavity and a rear cavity that are not connected to each other, wherein the PCB board is located in the rear cavity, the speaker is located in the front cavity, and the air intake net is located in the front cavity.
[0008] Furthermore, in the above technical solution, the sealing bracket includes a support frame that is clamped in the shell and used to fix the PCB board, hardware arranged on the support frame and used to separate the speaker and the PCB board, and sealant filled in the gap between the outer periphery of the support frame and the shell.
[0009] Furthermore, in the above technical solution, the hardware is a metal panel, which is attached to the support frame and located on one side of the PCB board. The support frame is provided with a plurality of positioning columns for positioning the PCB board, and the periphery of the hardware is provided with card slots corresponding to the positioning columns.
[0010] Furthermore, in the above technical solution, the PCB board is provided with a plurality of positioning holes for positioning columns to penetrate and position, and one side of the PCB board is provided with at least three elastic pins for contact and conduction.
[0011] Furthermore, in the above technical solution, the air inlet net is provided with three pieces, which are respectively located on the front end surface and both sides of the shell, and are all located in the front cavity.
[0012] Furthermore, in the above technical solution, the shell includes a front shell and a rear shell that are tightly fastened together, wherein the sealing bracket limits the speaker in the front shell, and a plurality of positioning columns are provided on the sealing bracket and extend into the rear shell to fix the PCB board.
[0013] Furthermore, in the above technical solution, two ventilation holes are arranged on both sides of the front shell, and the air inlet net is attached to the inner wall of the front shell and blocks the two ventilation holes.
[0014] Furthermore, in the above technical solution, the front shell is provided with a convex eave for docking with the rear shell, the convex eave extends into the rear shell and is formed with a plurality of locking protrusions, the inner wall of the rear shell is provided with a boss groove for the convex eave to be snapped into position, and the inner wall of the boss groove is formed with a plurality of locking grooves for matching with the locking protrusions for clamping and fixing.
[0015] After adopting the above technical scheme, the utility model has the following beneficial effects compared with the prior art: in the utility model, a sealing bracket is set between the PCB board and the speaker for separation, so that the front cavity where the speaker is located can be connected with the outside through the vent hole, and the sound can be tuned through the air intake net to obtain the best sound quality. At the same time, the sealing bracket is used to separate the PCB board in the rear cavity to prevent the water entering from the vent hole from damaging the PCB board, thereby greatly improving the waterproof effect. Description of the drawings:
[0016] Figure 1 It is a three-dimensional diagram of the utility model;
[0017] Figure 2 It is an exploded view of the utility model;
[0018] Figure 3 It is a side view of the utility model;
[0019] Figure 4 yes Figure 3 Cross-sectional view of section XX. Specific implementation method:
[0020] The utility model is further described below in conjunction with specific embodiments and drawings.
[0021] See Figures 1 to 4 As shown, a speaker independent cavity structure of an open TWS headset includes a housing 1, a PCB board 2 and a speaker 3 arranged in the housing 1, at least one vent 4 arranged on the housing 1 and used for the speaker 3 to communicate with the outside, and an air intake net 5 arranged in the vent 4 and used for tuning. A sealing bracket 6 is also arranged in the housing 1, and the sealing bracket 6 separates the housing 1 into a front cavity A and a rear cavity B that are not connected to each other, wherein the PCB board 2 is located in the rear cavity B, the speaker 3 is located in the front cavity A, and the air intake net 5 is located in the front cavity A. The sealing bracket 6 is arranged between the PCB board 2 and the speaker 3 for separation, so that the front cavity A where the speaker 3 is located can be connected to the outside through the vent 4, and the sound can be tuned through the air intake net 5 to obtain the best sound quality. At the same time, the PCB board 2 is separated in the rear cavity B by the sealing bracket 6, and the water entering from the vent 4 is prevented from damaging the PCB board 2, thereby greatly improving the waterproof effect.
[0022] The sealing bracket 6 includes a support frame 61 that is clamped in the housing 1 and used to fix the PCB board 2, a hardware 62 that is arranged on the support frame 61 and used to separate the speaker 3 and the PCB board 2, and a sealant filled in the gap between the outer periphery of the support frame 61 and the housing 1. The hardware 62 is arranged in the middle of the support frame 61 to seal the through hole. The use of the hardware 62 can not only facilitate the connection between the speaker 3 and the PCB board 2, but also achieve a good shielding effect.
[0023] The hardware 62 is a metal panel, which is attached to the support frame 61 and located on one side of the PCB board 2. The support frame 61 is provided with a plurality of positioning posts 611 for positioning the PCB board 2, and the periphery of the hardware 62 is provided with card slots 621 corresponding to the positioning posts 611. The PCB board 2 is provided with a plurality of positioning holes 21 for the positioning posts 611 to penetrate and position, and one side of the PCB board 2 is provided with at least three elastic pins 22 for contact and conduction.
[0024] The air inlet net 5 is provided with three pieces, which are respectively located on the front end surface and both sides of the shell 1, and are all located in the front cavity A.
[0025] The housing 1 includes a front housing 11 and a rear housing 12 that are tightly fastened together, wherein a sealing bracket 6 limits the speaker 3 in the front housing 11, and a plurality of positioning columns 611 are provided on the sealing bracket 6 and extend into the rear housing 12 to fix the PCB board 2.
[0026] Two ventilation holes 4 are disposed on both sides of the front shell 11 , and the air inlet net 5 is attached to the inner wall of the front shell 11 and blocks the two ventilation holes 4 .
[0027] The front shell body 11 is provided with a convex eave 111 for docking and locking with the rear shell body 12. The convex eave 111 extends into the rear shell body 12 and is formed with a plurality of locking protrusions 112. The inner wall of the rear shell body 12 is provided with a boss groove 121 for the convex eave 111 to be locked and positioned. The inner wall of the boss groove 121 is formed with a plurality of locking grooves 122 for matching with the locking protrusions 112 for clamping and fixing.
[0028] In summary, in the utility model, a sealing bracket 6 is added inside the shell 1 to divide the inner cavity of the shell 1 into a front cavity A and a rear cavity B, and the PCB board 2 and the speaker 3 are installed in the front cavity A and the rear cavity B respectively. The sealing bracket 6 is used to isolate the rear cavity B from the outside after the front shell 11 and the rear shell 12 are covered, while the front cavity A is connected to the outside through the vent 4 and the air inlet net 5 to obtain the best sound quality. In this way, the sound quality of the speaker is optimized while the waterproof test can be taken into consideration at the same time.
[0029] Of course, the above description is only a specific embodiment of the present invention and is not intended to limit the scope of implementation of the present invention. Any equivalent changes or modifications made according to the structure, characteristics and principles described in the patent application scope of the present invention should be included in the patent application scope of the present invention.
Claims
1. An open-type TWS earphone speaker independent cavity structure, comprising a housing (1), a PCB board (2) and a speaker (3) arranged in the housing (1), at least one vent (4) arranged on the housing (1) and used for the speaker (3) to communicate with the outside, and an air intake net (5) arranged in the vent (4) and used for tuning, characterized in that: A sealing bracket (6) is also provided in the housing (1), and the sealing bracket (6) separates the housing (1) into a front chamber (A) and a rear chamber (B) that are not connected to each other, wherein the PCB board (2) is located in the rear chamber (B), the speaker (3) is located in the front chamber (A), and the air intake net (5) is located in the front chamber (A).
2. The speaker independent cavity structure of an open TWS headset according to claim 1, characterized in that: The sealing bracket (6) comprises a support frame (61) which is clamped in the housing (1) and used to fix the PCB board (2), a hardware (62) which is arranged on the support frame (61) and used to separate the speaker (3) and the PCB board (2), and a sealing glue which is filled in the gap between the outer periphery of the support frame (61) and the housing (1).
3. The speaker independent cavity structure of an open TWS headset according to claim 2, characterized in that: The hardware (62) is a metal panel, which is attached to the support frame (61) and is located on one side of the PCB board (2). The support frame (61) is provided with a plurality of positioning columns (611) for positioning the PCB board (2), and the periphery of the hardware (62) is provided with card slots (621) corresponding to the positioning columns (611).
4. The speaker independent cavity structure of an open TWS headset according to claim 3, characterized in that: The PCB board (2) is provided with a plurality of positioning holes (21) for positioning columns (611) to penetrate and position, and one side of the PCB board (2) is provided with at least three elastic pins (22) for contact and conduction.
5. The speaker independent cavity structure of an open TWS headset according to claim 1, characterized in that: The air inlet net (5) is provided with three pieces, which are respectively located on the front end surface and both sides of the shell (1), and are all located in the front cavity (A).
6. The speaker independent cavity structure of an open TWS headset according to claim 1, characterized in that: The housing (1) comprises a front housing (11) and a rear housing (12) which are tightly fastened together, wherein a sealing bracket (6) limits the speaker (3) in the front housing (11), and a plurality of positioning columns (611) are provided on the sealing bracket (6) and extend into the rear housing (12) to fix the PCB board (2).
7. The speaker independent cavity structure of an open TWS headset according to claim 6, characterized in that: Two ventilation holes (4) are provided on both sides of the front shell (11), and the air intake net (5) is attached to the inner wall of the front shell (11) and blocks the two ventilation holes (4).
8. The speaker independent cavity structure of an open TWS headset according to claim 6, characterized in that: The front shell (11) is provided with a convex eave (111) for docking and locking with the rear shell (12); the convex eave (111) extends into the rear shell (12) and is formed with a plurality of locking protrusions (112); the inner wall of the rear shell (12) is provided with a boss groove (121) for the convex eave (111) to be locked and positioned; the inner wall of the boss groove (121) is formed with a plurality of locking grooves (122) for matching with the locking protrusions (112) for locking and fixing.
Citation Information
Patent Citations
Microphone and speaker combination modules, headphones and terminal devices
CN112839276B
