Electromagnetic shielding heat conduction assembly and integrated circuit
By designing an electromagnetic shielding thermal conductive film with a curved and folded structure in electronic devices, combining ferrite wave absorbing layer and graphene thermal shielding layer to form a closed conductive cage, the electromagnetic interference and heating problems in electronic devices are solved and the electromagnetic Shielding and thermal conductivity.
Patent Information
- Application Number
- CN202323483288.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2023-12-20
- Publication Date
- 2024-12-27
- Estimated Expiration
- 2033-12-20
AI Technical Summary
In the 5G era, the electromagnetic interference and heating problems caused by the introduction of high frequency and hardware upgrades of existing electronic devices. Graphene, as a thermal conductivity material, improved thermal conductivity after orientation processing in the thermal interface, but poor electromagnetic shielding performance, making it difficult to effectively improve electromagnetics. Blocking capability.
Design an electromagnetic shielding thermal conduction component, including a substrate and an electromagnetic shielding thermal conduction film. The electromagnetic shielding thermal conduction film adopts a first composite film body and a second composite film body with a curved and folded structure. The first composite film body contains a ferrite wave absorbing layer and The graphene thermally conductive shielding layer, the second composite film body is located outside the substrate for contacting the shielding frame, forming a closed conductive cage to improve electromagnetic shielding capability.
Through the closed structure of the wave absorbing electromagnetic waves and thermal shielding layer, the electromagnetic shielding performance and thermal conductivity of the electromagnetic shielding thermal components are significantly improved, and the problem of graphene's improved thermal conductivity in the thermal interface but poor electromagnetic shielding performance is solved.
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Figure CN222263500U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of electromagnetic shielding, and in particular to an electromagnetic shielding heat-conducting component and an integrated circuit. Background Art
[0002] With the introduction of high frequencies in the 5G era, the upgrading of hardware components, and the exponential growth in the number of Internet devices and antennas, electromagnetic interference between different electronic devices and within the electronic devices themselves is ubiquitous, and the harm of electromagnetic interference and electromagnetic radiation to electronic devices is becoming increasingly serious. At the same time, with the updating and upgrading of electronic devices, the power consumption of electronic devices continues to increase, and the heat generation also rises rapidly.
[0003] In order to solve the problems of electromagnetic radiation and heating, electronic devices will add more and more electromagnetic shielding and thermal conductive devices. For example, graphene is added, but graphene is a thermally anisotropic material. Its thermal conductivity in the two-dimensional plane direction is very high, but its thermal conductivity in the thickness direction is low. Therefore, adding graphene directly to the thermal interface material cannot effectively improve its thermal conductivity, but requires orientation treatment. Even after orientation treatment, the thermal conductivity of the thermal interface material is significantly improved, because graphene does not form a continuous high-conductivity network, its electromagnetic shielding performance is also poor. Summary of the invention
[0004] Based on this, it is necessary to provide an electromagnetic shielding thermal conductive component and an integrated circuit, which are conducive to further improving the electromagnetic shielding capability.
[0005] An electromagnetic shielding heat-conducting component, comprising:
[0006] a substrate; and,
[0007] An electromagnetic shielding thermally conductive film, the electromagnetic shielding thermally conductive film comprises a first composite film body, the first composite film body is arranged in the substrate, the first composite film body is a curved folding structure, the first composite film body comprises a first absorbing layer and a first thermally conductive shielding layer for contacting and cooperating with a shielding frame, the first absorbing layer and the first thermally conductive shielding layer are stacked along the thickness direction of the substrate.
[0008] In one embodiment, the electromagnetic shielding thermally conductive film further includes a second composite film body connected to the first composite film body, the second composite film body is at least partially located outside the substrate, and the second composite film body is used for contacting and cooperating with the shielding frame.
[0009] In one embodiment, the second composite film body includes a second absorbing layer and a second thermally conductive shielding layer for contacting and cooperating with the shielding frame, and the second absorbing layer and the second thermally conductive shielding layer are stacked along the thickness direction of the substrate.
[0010] In one embodiment, two second composite film bodies are provided, the two second composite film bodies are respectively connected to opposite sides of the first composite film body, the two second composite film bodies are completely located outside the substrate, and the second composite film bodies are flat.
[0011] In one embodiment, the first absorbing layer and the second absorbing layer are ferrite films.
[0012] In one embodiment, the thickness of the first absorbing layer and the second absorbing layer is 1 μm to 5 μm.
[0013] In one embodiment, the first heat-conducting shielding layer and the second heat-conducting shielding layer are graphene films or graphite films, and the thickness of the first heat-conducting shielding layer and the second heat-conducting shielding layer is 12 μm to 100 μm.
[0014] In one of the embodiments, the thickness of the electromagnetic shielding thermally conductive film is 0.2 mm to 3 mm, and the thickness of the electromagnetic shielding thermally conductive film is 80% to 100% of the thickness of the substrate.
[0015] In one embodiment, the first composite film body is corrugated or corrugated.
[0016] An integrated circuit comprises a circuit board, a chip, a shielding frame and the above-mentioned electromagnetic shielding heat-conducting component, wherein the chip and the shielding frame are arranged on the circuit board, the shielding frame cover is arranged on the chip, the substrate is arranged on the chip, and the electromagnetic shielding heat-conducting film is in contact with and cooperates with the shielding frame.
[0017] The above-mentioned electromagnetic shielding heat-conducting component and integrated circuit, the electromagnetic shielding heat-conducting film includes a first composite film body, the first composite film body is arranged in the base body, and the first composite film body is a curved folding structure, which can reduce the adverse effect of material orientation problems on heat conduction. The first composite film body includes a first thermally conductive shielding layer, and the two sides of the first thermally conductive shielding layer are in contact with the shielding frame to form a closed conductive cage, so that the first thermally conductive shielding layer can play an electromagnetic shielding role and improve the electromagnetic shielding capability. In addition, since the first composite film body also includes a first absorbing layer, the first absorbing layer and the first thermally conductive shielding layer are stacked, and the first absorbing layer can absorb electromagnetic waves, which can further improve the electromagnetic shielding heat-conducting component's absorption capacity for electromagnetic waves, and further improve the electromagnetic shielding capability of the electromagnetic shielding heat-conducting component. BRIEF DESCRIPTION OF THE DRAWINGS
[0018] Figure 1 It is a schematic structural diagram of an electromagnetic shielding heat-conducting component according to an embodiment of the present application.
[0019] Figure 2 for Figure 1 Schematic diagram of the structure of the electromagnetic shielding thermal conductive film shown.
[0020] Figure 3 It is a schematic diagram of the structure of an integrated circuit according to an embodiment of the present application.
[0021] Description of Figure Numbers:
[0022] 10. Electromagnetic shielding thermal conductive component; 11. substrate; 12. Electromagnetic shielding thermal conductive film; 121. first composite film body; 1211. first thermal conductive shielding layer; 1212. first absorbing layer; 122. second composite film body; 1221. second thermal conductive shielding layer; 1222. second absorbing layer; 20. shielding frame; 30. chip; 40. circuit board. DETAILED DESCRIPTION
[0023] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.
[0024] See also Figure 1 , Figure 2 and Figure 3 , Figure 1 2 shows a schematic diagram of the structure of an electromagnetic shielding heat conducting component according to an embodiment of the present application, and 3 shows Figure 1 The schematic diagram of the structure of the electromagnetic shielding thermal conductive film shown in FIG. Figure 3 A schematic diagram of the structure of an integrated circuit of an embodiment of the present application is shown. An electromagnetic shielding heat-conducting component 10 provided in an embodiment of the present application includes a substrate 11 and an electromagnetic shielding heat-conducting film 12. The electromagnetic shielding heat-conducting film 12 includes a first composite film body 121, which is arranged in the substrate 11, and the first composite film body 121 is a curved folding structure. The first composite film body 121 includes a first absorbing layer 1212 and a first heat-conducting shielding layer 1211 for contacting and cooperating with the shielding frame 20, and the first absorbing layer 1212 and the first heat-conducting shielding layer 1211 are stacked along the thickness direction of the substrate 11.
[0025] Optionally, the substrate 11 is a polymer material, for example, the substrate 11 is made of silicone or acrylic resin. Of course, in other embodiments, the substrate 11 may also be made of other materials, which is not limited thereto.
[0026] Optionally, the electromagnetic shielding heat-conductive film 12 is a flexible film. Of course, in other embodiments, the electromagnetic shielding heat-conductive film 12 can also be made of other materials, and is not limited thereto.
[0027] Understandably, see Figure 1 The first composite film body 121 is a curved folding structure, which means that the first composite film body 121 is wavy, or the first composite film body 121 is corrugated.
[0028] In the above-mentioned electromagnetic shielding heat-conducting component, the electromagnetic shielding heat-conducting film 12 includes a first composite film body 121, and the first composite film body 121 is arranged in the substrate 11. The first composite film body 121 is a curved folding structure, which can reduce the adverse effect of material orientation problems on heat conduction. The first composite film body 121 includes a first heat-conducting shielding layer 1211, and both sides of the first heat-conducting shielding layer 1211 are in contact with the shielding frame 20 to form a closed conductive cage, so that the first heat-conducting shielding layer 1211 can play an electromagnetic shielding role and improve the electromagnetic shielding capability. In addition, since the first composite film body 121 also includes a first absorbing layer 1212, the first absorbing layer 1212 is stacked with the first heat-conducting shielding layer 1211, and the first absorbing layer 1212 can absorb electromagnetic waves, which can further improve the electromagnetic shielding heat-conducting component 10's absorption capacity for electromagnetic waves, and further improve the electromagnetic shielding capability of the electromagnetic shielding heat-conducting component 10.
[0029] In one embodiment, see Figure 2 , the first wave absorbing layer 1212 is a ferrite film. It should be noted that ferrite is a metal oxide with ferrimagnetism. The resistivity of ferrite is much greater than that of single metal or alloy magnetic materials. In addition, ferrite has higher dielectric properties. The magnetic properties of ferrite are also manifested in higher magnetic permeability at high frequencies. In this way, a ferrite layer is provided on the surface of the first thermal conductive shielding layer 1211. The ferrite layer can absorb electromagnetic waves, further improving the electromagnetic shielding capability of the electromagnetic shielding thermal conductive component 10.
[0030] Of course, in other embodiments, the first absorbing layer 1212 may also be other film layers having the function of absorbing electromagnetic waves, and the present invention is not limited thereto.
[0031] In one embodiment, see Figure 2 , the thickness of the first absorbing layer 1212 is 1 μm to 5 μm. Optionally, the thickness of the first absorbing layer 1212 is 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, etc. In this way, the thickness of the first absorbing layer 1212 is within 1 μm to 5 μm, which can improve the electromagnetic shielding capability of the electromagnetic shielding thermal conductive component 10 without affecting the thermal conductivity of the electromagnetic shielding thermal conductive component 10.
[0032] In one embodiment, see Figure 2 The first heat-conducting shielding layer 1211 is a graphene film. It should be noted that graphene is a kind of sp 2The hybridized carbon atoms are composed of quasi-two-dimensional crystalline materials with a thickness of only a single atomic layer or several single atomic layers, which have excellent properties. The thermal conductivity of graphene is as high as 5000W / (mK), which is 13 times that of copper; in addition, the electrical conductivity of graphene is as high as 10 6 S / m is 1.6 times that of silver, so graphene is an ideal thermal conductive electromagnetic shielding material.
[0033] Of course, in other embodiments, the first heat conductive shielding layer 1211 may also be other film layers having thermal conductivity and electromagnetic shielding properties, for example, the first heat conductive shielding layer 1211 is an artificial graphite film or a graphite film.
[0034] In one embodiment, see Figure 2 , the thickness of the first heat conductive shielding layer 1211 is 12 μm to 100 μm. Optionally, the first heat conductive shielding layer 1211 is 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, etc. In this way, the thickness of the first heat conductive shielding is within 12 μm to 100 μm, which can ensure thermal conductivity and electromagnetic shielding performance.
[0035] In this embodiment, the thickness of the first heat conductive shielding layer 1211 is 12 μm.
[0036] In one embodiment, see Figure 1 The thickness of the electromagnetic shielding thermal conductive film 12 is 0.2 mm to 3 mm, wherein the thickness of the electromagnetic shielding thermal conductive film 12 is 80% to 100% of the thickness of the substrate 11. It can be understood that the thickness of the electromagnetic shielding thermal conductive film 12 refers to the size of the electromagnetic shielding thermal conductive film 12 in the thickness direction of the substrate 11.
[0037] In this embodiment, the thickness of the electromagnetic shielding thermal conductive film 12 is 0.2 mm, and the thickness of the substrate 11 is 0.25 mm.
[0038] In one embodiment, the projection of the first composite film 121 on the extension plane overlaps with the projection of the substrate 11 on the extension plane. It should be noted that the extension plane is a plane perpendicular to the thickness direction of the substrate 11. In this way, the electromagnetic shielding performance and thermal conductivity of the electromagnetic shielding thermal conductive component 10 are optimized.
[0039] In one embodiment, the electromagnetic shielding thermal conductive film 12 also includes a second composite film body 122 connected to the first composite film body 121, the second composite film body 122 is at least partially located outside the substrate 11, and the second composite film body 122 is used to contact and cooperate with the shielding frame 20. By setting the second composite film body 122, the second composite film body 122 is overlapped on the shielding frame 20 to form a closed conductive cage, so that the electromagnetic shielding thermal conductive component 10 can play an electromagnetic shielding role and improve the electromagnetic shielding capability. In this way, by setting the second composite film body 122, the second composite film body 122 is at least partially located outside the substrate 11, which facilitates the second composite film body 122 to contact and cooperate with the shielding frame 20.
[0040] Optionally, see Figure 1 The second composite film body 122 is flat and extends along the extension direction of the substrate 11. In this way, since the second composite film body 122 is flat, the second composite film body 122 and the shielding frame 20 are in surface contact, which is beneficial to improve the shielding effect.
[0041] In this embodiment, refer to Figure 1 The second composite film bodies 122 are provided with two, and the two second composite film bodies 122 are respectively connected to the opposite sides of the first composite film body 121, and the two second composite film bodies 122 are completely located outside the base body 11. When in use, the two second composite film bodies 122 are respectively overlapped on the two sides of the shielding frame 20, so as to facilitate the overlap and cooperation between the electromagnetic shielding heat conductive component 10 and the shielding frame 20.
[0042] In one embodiment, the second composite film body 122 further includes a second absorbing layer 1222 and a second thermally conductive shielding layer 1221 for contacting and cooperating with the shielding frame 20, and the second absorbing layer 1222 and the second thermally conductive shielding layer 1221 are stacked along the thickness direction of the substrate 11. Since the second composite film body further includes a second absorbing layer, the second absorbing layer and the second thermally conductive shielding layer are stacked, and the second absorbing layer can absorb electromagnetic waves, which can further improve the electromagnetic shielding heat conductive component's absorption capacity for electromagnetic waves, and further improve the electromagnetic shielding capacity of the electromagnetic shielding heat conductive component.
[0043] In one embodiment, see Figure 2 , the second wave absorbing layer 1222 is a ferrite film. It should be noted that ferrite is a metal oxide with ferrimagnetism. The resistivity of ferrite is much greater than that of single metal or alloy magnetic materials. In addition, ferrite has higher dielectric properties. The magnetic properties of ferrite are also manifested in higher magnetic permeability at high frequencies. In this way, a ferrite layer is provided on the surface of the second thermal conductive shielding layer 1221. The ferrite layer can absorb electromagnetic waves, further improving the electromagnetic shielding capability of the electromagnetic shielding thermal conductive component 10.
[0044] Of course, in other embodiments, the second wave absorbing layer 1222 may also be other film layers having the function of absorbing electromagnetic waves, and the present invention is not limited thereto.
[0045] In one embodiment, the thickness of the second absorbing layer 1222 is 1 μm to 5 μm. Optionally, the thickness of the second absorbing layer 1222 is 1.5 μm, 2 μm, 2.5 μm, 3 μm, 3.5 μm, 4 μm, 4.5 μm, etc. In this way, the thickness of the second absorbing layer 1222 is within the range of 1 μm to 5 μm, which can improve the electromagnetic shielding capability of the electromagnetic shielding thermal conductive component 10 without affecting the thermal conductivity of the electromagnetic shielding thermal conductive component 10.
[0046] In one embodiment, the second heat-conducting shielding layer 1221 is a graphene film. It should be noted that graphene is a material composed entirely of sp 2 The hybridized carbon atoms are composed of quasi-two-dimensional crystalline materials with a thickness of only a single atomic layer or several single atomic layers, which have excellent properties. The thermal conductivity of graphene is as high as 5000W / (mK), which is 13 times that of copper; in addition, the electrical conductivity of graphene is as high as 10 6 S / m is 1.6 times that of silver, so graphene is an ideal thermal conductive electromagnetic shielding material.
[0047] Of course, in other embodiments, the second heat conductive shielding layer 1221 may also be other films having thermal conductivity and electromagnetic shielding properties, for example, the second heat conductive shielding layer 1221 is an artificial graphite film.
[0048] In one embodiment, the thickness of the second heat conductive shielding layer 1221 is 12 μm to 100 μm. Optionally, the second heat conductive shielding layer 1221 is 20 μm, 30 μm, 40 μm, 50 μm, 60 μm, 70 μm, 80 μm, 90 μm, etc. In this way, the thickness of the second heat conductive shielding is within 12 μm to 100 μm, which can ensure thermal conductivity and electromagnetic shielding performance.
[0049] In this embodiment, the thickness of the second heat conductive shielding layer 1221 is 12 μm.
[0050] An integrated circuit provided by an embodiment of the present application, see Figure 3 , including a circuit board 40, a chip 30, a shielding frame 20 and an electromagnetic shielding heat-conducting component 10 of any of the above embodiments. The chip 30 and the shielding frame 20 are arranged on the circuit board 40, and the shielding frame 20 is covered on the chip 30. The substrate 11 is arranged on the chip 30, and the electromagnetic shielding heat-conducting film 12 is in contact with the shielding frame 20.
[0051] Specifically, the first absorbing layer 1212 is located on a side of the first heat conductive shielding layer 1211 away from the shielding frame 20 , and the second absorbing layer 1222 is located on a side of the second heat conductive shielding layer 1221 away from the shielding frame 20 .
[0052] In the above-mentioned integrated circuit, the electromagnetic shielding heat-conductive film 12 includes a first composite film body 121, and the first composite film body 121 is arranged in the substrate 11. The first composite film body 121 is a curved folding structure, which can reduce the adverse effect of material orientation problems on heat conduction. The first composite film body 121 includes a first heat-conductive shielding layer 1211, and both sides of the first heat-conductive shielding layer 1211 are in contact with the shielding frame 20 to form a closed conductive cage, so that the first heat-conductive shielding layer 1211 can play an electromagnetic shielding role and improve the electromagnetic shielding capability. In addition, since the first composite film body 121 also includes a first absorbing layer 1212, the first absorbing layer 1212 is stacked with the first heat-conductive shielding layer 1211, and the first absorbing layer 1212 can absorb electromagnetic waves, which can further improve the electromagnetic shielding heat-conductive component 10's absorption capacity for electromagnetic waves, and further improve the electromagnetic shielding capability of the electromagnetic shielding heat-conductive component 10.
[0053] The electromagnetic shielding heat conducting assembly of this embodiment was used to conduct the test, as follows:
[0054] Embodiment 1:
[0055] Silicone resin is used as the matrix, and the thickness of the matrix is 0.25mm. The electromagnetic shielding thermal conductive film includes an artificial graphite thermal conductive shielding layer with a thickness of 12μm and a ferrite wave absorbing layer with a thickness of 1μm. The thickness of the electromagnetic shielding thermal conductive film is 0.2mm. The first composite film body of the electromagnetic shielding thermal conductive film is wavy, and the second composite film body is flat and completely located outside the matrix.
[0056] Embodiment 2:
[0057] Silicone resin is used as the matrix, and the thickness of the matrix is 0.25mm. The electromagnetic shielding thermal conductive film includes an artificial graphite thermal conductive shielding layer with a thickness of 12μm and a ferrite wave absorbing layer with a thickness of 5μm. The thickness of the electromagnetic shielding thermal conductive film is 0.2mm. The first composite film body of the electromagnetic shielding thermal conductive film is wavy, and the second composite film body is flat and completely located outside the matrix.
[0058] Comparative Example 1:
[0059] Organic silicon resin is used as the matrix, and the thickness of the matrix is 0.25mm. The electromagnetic shielding thermal conductive film includes an artificial graphite thermal conductive shielding layer with a thickness of 12μm, does not contain an absorbing layer, and the thickness of the electromagnetic shielding thermal conductive film is 0.2mm. The first composite film body of the electromagnetic shielding thermal conductive film is wavy, and the second composite film body is flat and completely located outside the matrix.
[0060] The thermal conductivity of the samples of Example 1, Example 2 and Comparative Example 1 in the thickness direction was tested using a laser thermal conductivity tester, and the electromagnetic shielding effectiveness of the samples of Example 1, Example 2 and Comparative Example 1 in the 10 MHz-1 GHz frequency band was tested using a coaxial method. The experimental results are as follows:
[0061]
[0062] Compared with comparative example 1, the thermal conductivity of the electromagnetic shielding thermal conductive components in examples 1 and 2 does not change significantly in the thickness direction, but the electromagnetic shielding effectiveness is significantly improved at 10 MHz-1 GHz, and the thicker the absorbing layer, the higher the electromagnetic shielding effectiveness.
[0063] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.
[0064] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.
[0065] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0066] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.
[0067] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.
[0068] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.
[0069] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.
Claims
1. An electromagnetic shielding heat-conducting component, characterized in that: include: matrix; as well as, An electromagnetic shielding thermally conductive film, the electromagnetic shielding thermally conductive film comprises a first composite film body, the first composite film body is arranged in the substrate, the first composite film body is a curved folded structure, the first composite film body comprises a first absorbing layer and a first thermally conductive shielding layer for contacting and cooperating with a shielding frame, the first absorbing layer is used to absorb electromagnetic waves, and the first absorbing layer and the first thermally conductive shielding layer are stacked along the thickness direction of the substrate.
2. The electromagnetic shielding heat conducting component according to claim 1, characterized in that: The electromagnetic shielding thermal conductive film further comprises a second composite film body connected to the first composite film body, wherein the second composite film body is at least partially located outside the substrate, and the second composite film body is used for contacting and cooperating with the shielding frame.
3. The electromagnetic shielding heat-conducting component according to claim 2, characterized in that: The second composite film body includes a second wave absorbing layer and a second heat conductive shielding layer for contacting and cooperating with the shielding frame. The second wave absorbing layer and the second heat conductive shielding layer are stacked along the thickness direction of the substrate.
4. The electromagnetic shielding heat-conducting component according to claim 2 or 3, characterized in that: There are two second composite film bodies, the two second composite film bodies are respectively connected to opposite sides of the first composite film body, the two second composite film bodies are completely located outside the substrate, and the second composite film bodies are flat.
5. The electromagnetic shielding heat-conducting component according to claim 3, characterized in that: The first absorbing layer and the second absorbing layer are ferrite films.
6. The electromagnetic shielding heat-conducting component according to claim 3, characterized in that: The thickness of the first absorbing layer and the second absorbing layer is 1 μm to 5 μm.
7. The electromagnetic shielding heat-conducting component according to claim 3, characterized in that: The first heat-conducting shielding layer and the second heat-conducting shielding layer are graphene films or graphite films, and the thickness of the first heat-conducting shielding layer and the second heat-conducting shielding layer is 12 μm to 100 μm.
8. The electromagnetic shielding heat-conducting component according to claim 1, characterized in that: The thickness of the electromagnetic shielding heat-conducting film is 0.2 mm to 3 mm, and the thickness of the electromagnetic shielding heat-conducting film is 80% to 100% of the thickness of the substrate.
9. The electromagnetic shielding heat-conducting assembly according to claim 1, characterized in that: The first composite film body is corrugated or corrugated.
10. An integrated circuit, characterized in that: It comprises a circuit board, a chip, a shielding frame and the electromagnetic shielding heat-conducting component described in any one of claims 1 to 9, wherein the chip and the shielding frame are arranged on the circuit board, the shielding frame cover is arranged on the chip, the substrate is arranged on the chip, and the electromagnetic shielding heat-conducting film is in contact with and cooperates with the shielding frame.