Local temperature fault injector with heat dissipation structure

Abstract

The utility model provides a local temperature fault injector with a heat dissipation structure, a heat conduction end of a temperature injection probe is exposed out of an upper cover plate, and a temperature sensor is arranged close to the heat conduction end; the heat dissipation assembly is arranged in the box body along the axis of the temperature injection probe; the condensate water collector is arranged around the temperature injection probe, the heat dissipation assembly is arranged outside the condensate water collector, and the condensate water collector isolates the temperature injection probe from the heat dissipation assembly. The device has the advantages that the temperature of the target integrated circuit in the to-be-tested system is accurately changed through the exposed heat conduction end, so that temperature fault injection only occurs locally, that is, the temperature fault injection operation is implemented only for the local part of the whole system where the target integrated circuit is located. By changing the temperature of the heat conduction end, the local temperature fault injector has local high temperature and local low temperature fault injection capability.

Description

Technical Field

[0001] The utility model relates to the field of integrated circuits and information security, in particular to a local temperature fault injector with a heat dissipation structure. Background Art

[0002] As a carrier of information, semiconductor integrated circuits play a vital role in ensuring the security of information systems. Therefore, it is often necessary to use a variety of technical means to evaluate the security of integrated circuits. It is well known that the characteristics of semiconductor materials are sensitive to temperature changes. Temperature changes can usually affect parameters such as current, voltage, frequency, and switching rate. By utilizing the temperature characteristics of these parameters, effective integrated circuit security defense measures at room temperature may fail within a specific temperature range, thereby threatening the security of information systems based on integrated circuits. This security assessment technology can be called temperature fault injection.

[0003] The dynamic assessment of the safety of an integrated circuit requires evaluating its safety during operation, so an external circuit is required to form an overall system including the target integrated circuit.

[0004] Traditional temperature fault injection usually places the entire system including the target integrated circuit in a temperature chamber, and then adjusts the temperature change (increase / decrease) in the temperature chamber before performing fault injection. However, there is the following problem: due to the change in the ambient temperature of the entire system, when a safety failure occurs, it is difficult to determine whether the safety failure is caused by a problem with the target integrated circuit itself or by other components in the system causing the system safety to fail due to temperature changes, making it difficult to analyze the cause of the safety failure of the target integrated circuit.

[0005] Therefore, a device for only partially implementing temperature fault injection on a target integrated circuit should be provided to solve the problems existing in the above-mentioned traditional temperature fault injection. Utility Model Content

[0006] The utility model provides a local temperature fault injector with a heat dissipation structure, which is used to solve the problem that the existing temperature fault injection technology cannot accurately distinguish between the whole and the local, resulting in unclear reasons for safety failure.

[0007] In order to achieve the above-mentioned purpose, the technical solution of the utility model provides a local temperature fault injector with a heat dissipation structure, which includes: a temperature injection probe, a temperature sensor, a heat dissipation component and a condensed water collector. The heat conduction end of the temperature injection probe is exposed on the upper cover plate, and the temperature sensor is arranged near the heat conduction end; the heat dissipation component is arranged in the box along the axis of the temperature injection probe; the condensed water collector is arranged around the temperature injection probe, and the heat dissipation component is arranged outside it, and the condensed water collector isolates the temperature injection probe and the heat dissipation component.

[0008] As a preferred embodiment of the above technical solution, preferably, the heat-conducting end is covered with a heat-conducting silicone sheet.

[0009] As a preferred embodiment of the above technical solution, preferably, a TEC module is provided under the base of the temperature injection probe, and the condensate collector is arranged around the TEC module.

[0010] As a preferred embodiment of the above technical solution, preferably, the box body is symmetrically provided with ventilation holes, a fan is provided inside the ventilation holes, and the fan is arranged opposite to the fan of the heat dissipation component.

[0011] As a preferred embodiment of the above technical solution, preferably, the heat dissipation component includes an air duct, a fan, and a heat sink. The heat sink is arranged under the TEC module, the fan is symmetrically arranged on both sides of the heat sink, and the air duct is arranged on one side of the heat sink.

[0012] As a preferred embodiment of the above technical solution, preferably, the small-diameter end of the air duct is connected to the heat sink, and the large-diameter end is connected to the other side of the box.

[0013] As a preferred embodiment of the above technical solution, preferably, the upper cover plate is an optical flat plate.

[0014] As a preferred embodiment of the above technical solution, it is preferably provided with side wings, which are symmetrically arranged at both ends of the box body and have shockproof locking holes thereon.

[0015] The technical solution of the utility model provides a local temperature fault injector with a heat dissipation structure, wherein the heat-conducting end of the temperature injection probe is exposed on the upper cover plate, and the temperature sensor is arranged near the heat-conducting end; the heat dissipation component is arranged in the box along the axis of the temperature injection probe; the condensation water collector is arranged around the temperature injection probe, and the heat dissipation component is arranged outside it, and the condensation water collector isolates the temperature injection probe and the heat dissipation component.

[0016] The advantage of the utility model is that the temperature of the target integrated circuit in the system to be tested is accurately changed by the exposed heat conducting end, so that the temperature fault injection occurs only locally, that is, the temperature fault injection operation is only implemented for the local part of the overall system where the target integrated circuit is located. By changing the temperature of the heat conducting end, the local temperature fault injector has the ability to inject temperature faults at local high temperatures and local low temperatures. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, a brief introduction is given below to the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0018] Figure 1 This is an appearance diagram of a local temperature fault injector with a heat dissipation structure provided by the utility model.

[0019] Figure 2 for Figure 1 The schematic diagram of the structure inside the local temperature fault injector box with heat dissipation structure is shown.

[0020] Figure 3 Based on Figure 1 and Figure 2 A module diagram of the implementation process of a local temperature fault injector with a heat dissipation structure is shown. DETAILED DESCRIPTION

[0021] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is a part of the embodiment of the utility model, not all the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of the utility model.

[0022] First, the structure of the utility model is described. Figure 1 and Figure 2 As shown, it includes: a temperature injection probe 201, a temperature sensor 202, a heat dissipation component consisting of an air duct 301, a fan 302, and a heat sink 306, a condensed water collector 308, a TEC module 307, a box 310, a ventilation hole 204, a status indication component, an upper cover plate consisting of an optical plate 203, a heat dissipation control circuit 303, and a temperature regulator 309.

[0023] First, Figure 1 As shown, the upper cover is an optical plate 203, and there is a center hole at the center of the upper cover, and the heat-conducting end of the temperature injection probe 201 extends from the center hole and is exposed on the upper cover. The optical plate 203 is not only used as an upper cover component for protecting the interior of the box 310 in the technical solution of the utility model, but also the plate base composed of each component of the optical plate 203 is used as a fixed base for connecting the overall system where the target integrated circuit is located with the local temperature fault injector.

[0024] Furthermore, the temperature sensor 202 is arranged close to the heat conducting end and is exposed together with the heat conducting end. The heat conducting end is covered with a thermally conductive silicone sheet and is connected to the target integrated circuit. The temperature sensor 202 is used to detect the temperature injected into the target integrated circuit in real time and transmit it to the temperature regulator 309, wherein the temperature regulator 309 preferably adopts TCM-M115.

[0025] The temperature injection probe 201 is preferably in the shape of a brass ingot in the shape of a pyramid, the cross-sectional area of ​​which gradually increases from the top to the bottom, and the cross-sectional area of ​​the top is preferably square.

[0026] The heat dissipation assembly, condensate collector 308, and TEC module 307 are arranged in a box 310. Ventilation holes 204 are symmetrically arranged on both sides of the box 310. Dust filter cotton can be installed inside the ventilation holes 204. A fan 305 is arranged inside the ventilation holes 204. The fan 305 is arranged opposite to the fan 302 of the heat dissipation assembly. The shape of the ventilation holes 204 is preferably honeycomb.

[0027] The box 310 has symmetrical side wings 206 at both ends, and shockproof locking holes 205 at both ends of the side wings 206. The status indicator includes a status indicator mark 207 and a status indicator mark 208, which are used to display the working status of the local temperature fault injector. The shockproof locking holes 205 can be used to lock the embodiment to the shockproof platform.

[0028] Further, the internal structure of the local temperature fault injector provided by the utility model is described, such as Figure 2 As shown:

[0029] The heat dissipation component is arranged in the box 310 along the axis of the temperature injection probe 201, and the condensate collector 308 is arranged around the temperature injection probe 201 and above the TEC module 307. Specifically, a TEC module 307 for generating the high or low temperature required for local temperature fault injection is arranged under the base of the temperature injection probe 201, the condensate collector 308 is arranged around the TEC module 307, and the heat sink 306 is arranged under the condensate collector 308. The condensate collector 308 separates the heat dissipation component from the TEC module 307 to avoid the two from affecting each other. The heat sink 306 dissipates heat for the TEC module 307. A fan is arranged on one side of the heat sink 306 close to the ventilation hole 204, and an air duct 301 is arranged on the other side opposite to the fan. This side is connected to the narrow opening of the air duct 301, and the bell mouth of the air duct 301 is connected to the ventilation hole 204 on the other side of the box 310. A temperature regulator 309 is also provided on the inner wall of the box 310, which is connected with the heat dissipation control circuit 303 and the RS232 interface 304 to form a heat dissipation control circuit path. Preferably, the heat dissipation control circuit 303, the RS232 interface 304 and the temperature regulator 309 are diagonally arranged in the box 310 to avoid the concentration of heat generation points in the box 310. Among them, the heat control circuit 303 is composed of at least a thermistor, a comparator, and an STM32F103.

[0030] The RS232 interface 304 is a communication interface of the present injector, and the user can interact with the present embodiment through the interface, and realize program automation control on this basis.

[0031] The temperature regulator 309, TEC module 307, temperature injection probe 201, and temperature sensor 202 form a temperature regulation loop, which generates stable high or low temperature injection into the target integrated circuit through user control. The temperature regulator 309 interacts with the user through the RS232 interface 304, and displays the working status of the injector in real time through the status indicator 207 and the status indicator 208.

[0032] The technical solution of the utility model is now described in combination with specific usage scenarios: Figure 3 , including a heat dissipation component 100 (air duct 301, fan, heat sink 306, heat dissipation control circuit, including condensate collector), a cold and hot source 101 (TEC module 307), a temperature injection probe 102, a temperature sensor 103 (202), a temperature regulator 104 (309), a status indicator 105, and a communication interface 106 Figure 1 and Figure 2 Schematic diagram of the modules corresponding to the structure shown.

[0033] The function of the heat dissipation component 100 is to dissipate heat for the heat energy generated by the cold and hot sources 101 during operation. It is mainly composed of a heat sink 306, a fan, an air duct 301, and a heat dissipation control circuit. It further includes a condensate collector for collecting condensed water generated by alternating hot and cold. The heat dissipation control circuit is used to control the air flow through the heat dissipation component 100, and has two working modes: fixed air flow and variable air flow (the working mode is solidified before leaving the factory). Further, in combination with Figure 1 and Figure 2 When the structure shown is implemented, preferably, the heat dissipation control circuit is provided with an independent dedicated temperature sensor (not shown), which is arranged near the air outlet of the heat dissipation component 100. In the variable air flow working mode, when the heat dissipation of the cold or heat source 101 is large, the heat dissipation control circuit increases the air flow rate by increasing the fan speed according to the measurement of the temperature sensor and the preset working curve to quickly dissipate the heat. Conversely, the fan speed is reduced according to the preset working curve. This can reduce energy consumption and the operating noise of the local temperature fault injector.

[0034] The cold and hot source 101 has the functions of cooling and heating, and its role is to provide a cold source or a hot source for the temperature injection probe 102. The cold and hot source 101 will generate heat when working, especially a large amount of heat will be generated when cooling, and the heat dissipation component 100 needs to discharge the heat in time.

[0035] One end of the temperature injection probe 102 in the box 310 is connected to the cold and hot source 101 by contact, and the other end exposed outside the box 310 is connected to the target integrated circuit to be tested by contact. The temperature injection probe 102 conducts the low temperature or high temperature of the cold and hot source 101 to the target integrated circuit through contact heat conduction.

[0036] The temperature sensor 103 is closely associated with the temperature regulator 104, and its function is to adjust and stabilize the temperature injected into the target integrated circuit. The temperature sensor 103 is set at the exposed temperature injection end of the temperature injection probe 102, where the temperature is equal to the temperature injected into the target integrated circuit. The temperature sensor 103 transmits the detected temperature value to the temperature regulator 104, and compares it with the temperature value set in the temperature regulator 104 through a preset mode, dynamically adjusts the cold and hot source 101 for cooling or heating, and forms a negative feedback control loop, thereby ensuring that the temperature of the exposed end of the temperature injection probe 102 is stabilized to the set temperature value, thereby achieving the purpose of injecting temperature into the target integrated circuit.

[0037] The state indicator 105 is used to display the current working state of the local temperature fault injector and visualize the working state. The state indicator 105 generates a visualized state according to the signal of the temperature regulator 104 .

[0038] The communication interface 106 is used to provide an interactive channel between the local temperature fault injector and the user for program automation control. On the one hand, the user can set the working parameters of the temperature regulator 104, such as the target temperature value, the overcurrent protection threshold, etc., through the communication interface 106; on the other hand, the user can also query the operating parameters of the temperature regulator 104, such as the current temperature, the current cooling current, etc., through the communication interface 106, which can be used for automatic feedback control.

[0039] In summary, the local temperature fault injector provided by the utility model exposes the temperature injection end of the temperature injection probe to achieve the purpose of only changing the temperature of the integrated circuit to be tested in the system to be tested, and adopts an optical flat plate to form the upper cover plate, which solves the problem of not being able to accurately distinguish between the whole and the local during the temperature fault injection process.

[0040] Finally, it should be noted that the above embodiments are only used to illustrate the technical solution of the utility model, rather than to limit it. Although the utility model has been described in detail with reference to the aforementioned embodiments, ordinary technicians in this field should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not make the essence of the corresponding technical solution deviate from the scope of the technical solution of the embodiments of the utility model.

Claims

1. A local temperature fault injector with a heat dissipation structure, characterized in that: It includes: temperature injection probe, temperature sensor, heat dissipation component and condensation water collector. The heat-conducting end of the temperature injection probe is exposed on the upper cover plate, and the temperature sensor is arranged close to the heat-conducting end; The heat dissipation component is arranged in the box along the axis of the temperature injection probe; The condensed water collector is arranged around the temperature injection probe, and the heat dissipation component is arranged outside the condensed water collector, and the temperature injection probe and the heat dissipation component are isolated by the condensed water collector.

2. The local temperature fault injector according to claim 1, characterized in that: The heat-conducting end is covered with a heat-conducting silicone sheet.

3. The local temperature fault injector according to claim 1, characterized in that: A TEC module is provided under the base of the temperature injection probe, and the condensed water collector is arranged around the TEC module.

4. The local temperature fault injector according to claim 1, characterized in that: The box body is symmetrically provided with ventilation holes, a fan is provided inside the ventilation holes, and the fan is arranged opposite to the fan of the heat dissipation component.

5. The local temperature fault injector according to claim 1, characterized in that: The heat dissipation component includes an air duct, a fan, and a heat sink. The heat sink is arranged below the TEC module under the base of the temperature injection probe, the fans are symmetrically arranged on both sides of the heat sink, and the air duct is arranged on one side of the heat sink.

6. The local temperature fault injector according to claim 5, characterized in that: The small-diameter end of the air duct is connected to the heat sink, and the large-diameter end is butted against the other side of the box.

7. The local temperature fault injector according to claim 1, characterized in that: The upper cover plate is an optical flat plate.

8. The local temperature fault injector according to claim 1, characterized in that: The side wings are symmetrically arranged at two ends of the box body and are provided with shockproof locking holes.

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