Improved semiconductor bonding equipment

Abstract

The utility model provides an improved semiconductor bonding device, comprising a pedestal, the upper end of which is respectively provided with a bonding heating plate and an engineering support; the lifting assembly is arranged on the engineering support and comprises a lifting table, a pressure head connecting piece and a driving mechanism for driving the pressure head connecting piece to ascend and descend along the lifting table; the metal pressure head is detachably connected to the lower end of the pressure head connecting piece and is arranged opposite to the bonding heating plate, different metal pressure heads can be replaced according to the size of a device by designing the replaceable metal pressure head, and the pressure applied to the device by the metal pressure head is controlled through the lifting assembly, so that a stable bonding process is realized; the problem of area mismatching caused by a fixed-size pressing interface of traditional equipment is solved, and waste of materials and time is avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor bonding equipment, in particular to an improved semiconductor bonding equipment. Background Art

[0002] Semiconductor bonding equipment is a key tool used in the manufacture of microelectronics and microelectromechanical systems (MEMS), which can precisely bond different materials, such as silicon to silicon, silicon to glass, and silicon to metal. This type of equipment is compatible with many bonding processes, including but not limited to direct bonding, anodic bonding, glass bonding, metal bonding, and bonding methods using adhesives. This bonding process is essential for the construction of multi-layer integrated circuits (ICs), sensors, MEMS, and many micro- and nano-scale devices.

[0003] However, conventional semiconductor bonding equipment faces efficiency challenges: since the bonding interface size is fixed, bonding devices of different areas will result in a waste of time and materials.

[0004] In view of this, the inventor specially designed an improved semiconductor bonding equipment, and this case was thus generated. Utility Model Content

[0005] In order to solve the above problems, the technical solution of the utility model is as follows:

[0006] An improved semiconductor bonding device, comprising:

[0007] The base has a bonding heating plate and an engineering support respectively disposed on its upper end;

[0008] A lifting assembly is arranged on the engineering support, and includes a lifting platform, a pressure head connecting piece, and a driving mechanism for driving the pressure head connecting piece to move up and down along the lifting platform;

[0009] The metal pressing head is detachably connected to the lower end of the pressing head connecting piece and is arranged opposite to the bonding heating plate.

[0010] Preferably, a ceramic connector for heat insulation and electrical insulation is provided between the metal pressure head and the pressure head connector.

[0011] Preferably, a spring buffer for buffering is provided between the metal pressing head and the pressing head connecting piece.

[0012] Preferably, a universal joint assembly for adjusting direction is provided between the metal pressing head and the pressing head connecting piece.

[0013] Preferably, the universal joint comprises a connecting rod and an adjusting seat in order from top to bottom, and a ball joint structure is formed between the bottom end of the connecting rod and the upper end of the adjusting seat.

[0014] Preferably, a connecting nut is provided at the bottom end of the adjusting seat, an internal thread for connection is formed on the inner side of the connecting nut, and the end of the metal pressure head is threadedly connected to the internal thread of the connecting nut.

[0015] Preferably, a ceramic connector, a spring buffer and a universal joint assembly are provided between the metal pressing head and the pressing head connector from top to bottom, and the metal pressing head is detachably connected to the lower end of the universal joint assembly.

[0016] Preferably, the upper end of the ceramic connecting part is threadedly connected to the pressure head connecting part through an upper bolt, and the spring buffer part includes, from top to bottom, an upper base plate, an intermediate spring and a lower base plate fixed to each other, and the upper base plate is threadedly connected to the bottom of the ceramic connecting part through a lower bolt. The universal joint includes, from top to bottom, a connecting rod and an adjusting seat, and a ball joint structure is formed between the bottom end of the connecting rod and the upper end of the adjusting seat. The upper end of the connecting rod is detachably connected to the lower base plate, and a connecting nut is provided at the bottom end of the adjusting seat, and an internal thread for connection is formed on the inner side of the connecting nut. The metal pressure head includes a bottom pressure plate and a connecting shaft provided at the upper end of the bottom pressure plate, and the upper end of the connecting shaft is provided with a threaded section that matches the internal thread.

[0017] Preferably, the lifting platform includes a top plate, a bottom plate and a side plate arranged between the top plate and the bottom plate, the driving mechanism includes a driving screw vertically rotatable between the top plate and the bottom plate, a driving handwheel arranged at the top of the top plate and transmission connected to the driving screw, and guide limit rods symmetrically and parallelly arranged on both sides of the driving screw, the pressure head connecting piece includes a lifting connecting section and a pressure head connecting section extending horizontally outward along the lifting connecting section, a driving screw hole threadedly connected to the driving screw is vertically opened in the middle of the lifting connecting section, and limit holes slidably matched with the guide limit rods are symmetrically arranged on both sides of the driving screw hole, and the metal pressure head is arranged at the lower end of the pressure head connecting section.

[0018] Preferably, a smooth section is provided at the position where the driving screw passes through the top plate, the driving hand wheel is fixed to the upper end of the smooth section, and the top plate is also provided with a limit locking component for pressing the smooth section to limit its rotation.

[0019] The beneficial effects of the utility model are as follows:

[0020] The utility model designs a replaceable metal pressing head, which can realize replacing different metal pressing heads according to the size of the device, and controls the pressure applied by the metal pressing head on the device through the lifting component, thereby realizing a stable bonding process, solving the area mismatch problem caused by the fixed-size pressing interface of traditional equipment, and avoiding the waste of materials and time.

[0021] In addition, the utility model also has the following beneficial effects:

[0022] 1. The lifting assembly and the spring buffer can more accurately control and adjust the pressure applied to the semiconductor device to prevent excessive pressure from causing damage to the semiconductor device.

[0023] 2. The design with ceramic connectors can effectively insulate, slow down the rate of heat transfer, and act as an insulator to prevent the high voltage during bonding from being conducted upward.

[0024] 3. The setting of the universal joint assembly allows adjustment to evenly distribute pressure even if there are level differences between the bottom parts, thus avoiding bonding failure.

[0025] 4. The device has a replaceable metal indenter design, which can be adjusted according to the size of different semiconductor devices, making the device more widely applicable and improving operational flexibility. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] The drawings described herein are used to provide a further understanding of the present invention and constitute a part of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

[0027] in:

[0028] Figure 1 It is a three-dimensional structural schematic diagram of the utility model;

[0029] Figure 2 It is a schematic diagram of the overall structure of the utility model;

[0030] Figure 3 It is a cross-sectional structural schematic diagram of the utility model;

[0031] Figure 4 It is a schematic diagram of a partial explosion structure highlighting the metal pressure head connection structure in the utility model;

[0032] Figure 5 It is a partial structural schematic diagram highlighting the driving mechanism in the utility model.

[0033] Description of labels:

[0034] 10. Base; 11. Ceramic base; 20. Bonding heating plate; 30. Engineering support; 40. Lifting assembly; 41. Lifting platform; 411. Top plate; 412. Bottom plate; 413. Side plate; 42. Press head connector; 421. Lifting connection section; 422. Press head connection section; 43. Driving mechanism; 431. Driving screw; 432. Driving hand wheel; 433. Guide limit rod; 434. Smooth section; 50. Metal press Head; 51, connecting shaft; 52, bottom pressure plate; 60, ceramic connector; 61, upper bolt; 70, spring buffer; 71, upper base plate; 72, middle spring; 73, lower base plate; 80, universal joint assembly; 81, connecting rod; 82, adjusting seat; 83, ball joint structure; 84, connecting nut; 90, limit locking assembly; 91, locking seat; 92, locking shaft; 93, lever; 94, limit slot; 95, opening slot. DETAILED DESCRIPTION

[0035] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer and more understandable, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0036] See also Figures 1 to 5 , is an improved semiconductor bonding device as the best embodiment of the utility model, comprising:

[0037] The base 10 has a bonding heating plate 20 and an engineering support 30 disposed on its upper end. In this embodiment, the engineering support 30 is a double I-shaped base;

[0038] The lifting assembly 40 is disposed on the upper end surface of the engineering support 30, and includes a lifting platform 41, a pressure head connecting member 42, and a driving mechanism 43 for driving the pressure head connecting member 42 to move up and down along the lifting platform 41;

[0039] The metal pressing head 50 is detachably connected to the lower end of the pressing head connecting member 42 and is disposed opposite to the bonding heating plate 20 .

[0040] Preferably, Figure 1-4 As shown, a ceramic connector 60 for heat insulation and electrical isolation is provided between the metal pressure head 50 and the pressure head connector 42 .

[0041] Preferably, Figure 1-4 As shown, a spring buffer 70 for buffering is provided between the metal pressing head 50 and the pressing head connecting member 42 .

[0042] Preferably, Figure 1-4 As shown, a universal joint assembly 80 for adjusting direction is provided between the metal pressing head 50 and the pressing head connecting member 42 .

[0043] Preferably, Figure 1-4 As shown, the universal joint includes a connecting rod 81 and an adjusting seat 82 from top to bottom, and a ball joint structure 83 is formed between the bottom end of the connecting rod 81 and the upper end of the adjusting seat 82.

[0044] Furthermore, a connecting nut 84 is provided at the bottom end of the adjustment seat 82 , and an internal thread (not shown in the figure) for connection is formed inside the connecting nut 84 , and the end of the metal pressing head 50 is threadedly connected to the internal thread of the connecting nut 84 .

[0045] Specifically, Figure 2 , 4 As shown, in this embodiment, a ceramic connector 60 , a spring buffer 70 and a universal joint assembly 80 are provided in sequence from top to bottom between the metal pressing head 50 and the pressing head connector 42 , and the metal pressing head 50 is detachably connected to the lower end of the universal joint assembly 80 .

[0046] like Figure 4 As shown, the upper end of the ceramic connector 60 is threadedly connected to the pressure head connector 42 through an upper bolt 61, and the spring buffer 70 includes, from top to bottom, an upper base plate 71, an intermediate spring 72 and a lower base plate 73 fixed to each other, and the upper base plate 71 is threadedly connected to the bottom of the ceramic connector 60 through a lower bolt. The universal joint includes, from top to bottom, a connecting rod 81 and an adjusting seat 82, and a ball joint structure 83 is formed between the bottom end of the connecting rod 81 and the upper end of the adjusting seat 82, that is, a spherical portion and a spherical groove (not marked in the figure) are formed. The upper end of the connecting rod 81 is detachably connected to the lower base plate 73 (such as by locking, clamping or fixing with a nut), and a connecting nut 84 is provided at the bottom end of the adjusting seat 82, and an internal thread for connection is formed on the inner side of the connecting nut 84. The metal pressure head 50 includes a bottom pressing plate 52 and a connecting shaft 51 arranged at the upper end of the bottom pressing plate 52, and the upper end of the connecting shaft 51 is provided with a threaded section (not marked in the figure) that matches the internal thread.

[0047] Therefore, the lifting assembly 40 in cooperation with the spring buffer 70 can more accurately control and adjust the pressure applied to the semiconductor device, thereby preventing excessive pressure from causing damage to the semiconductor device.

[0048] In addition, the ceramic connector 60 can effectively insulate heat, slow down the rate of heat transfer, and play an insulating role to prevent the high voltage during bonding from being conducted upward.

[0049] In particular, the configuration of the universal joint assembly 80 allows adjustment to evenly distribute pressure even if there are level differences between the components at the bottom, thereby avoiding bonding failure.

[0050] In particular, the device has a replaceable metal pressure head 50 design, which can be adjusted according to the size of different semiconductor devices, making the device more widely applicable and improving the flexibility of operation.

[0051] Preferably, Figure 1 , 2 As shown in , 4 and 5, the lifting platform 41 includes a top plate 411, a bottom plate 412 and a side plate 413 arranged between the top plate 411 and the bottom plate 412, the driving mechanism 43 includes a driving screw 431 vertically rotatable between the top plate 411 and the bottom plate 412, a driving hand wheel 432 arranged at the top of the top plate 411 and drivingly connected to the driving screw 431, and a guide limit rod 433 symmetrically and parallelly arranged on both sides of the driving screw 431, the pressure head connecting piece 42 includes a lifting connection section 421 and a pressure head connecting section 422 extending horizontally outward along the lifting connection section 421, a driving screw hole threadedly connected to the driving screw 431 is vertically opened in the middle of the lifting connection section 421, and limit holes slidably matched with the guide limit rod 433 are symmetrically arranged on both sides of the driving screw hole (not shown in the figure), and the metal pressure head 50 is arranged at the lower end of the pressure head connecting section 422.

[0052] Preferably, Figure 3 , 5 As shown, a smooth section 434 is provided at the position where the driving screw 431 passes through the top plate 411, and a driving hand wheel 432 is fixedly arranged at the upper end of the smooth section 434. A limit locking assembly 90 for pressing the smooth section 434 to limit its rotation is also provided on the top plate 411. In this embodiment, the limit locking assembly 90 includes a locking seat 91, a locking shaft 92 and a lever 93. The locking seat 91 is vertically penetrated with a limit groove 94 that is engaged with the smooth section 434. An opening groove 95 that extends through and extends to the side wall of the locking seat 91 is provided on one side of the limit groove 94. One end of the locking shaft 92 passes through the side wall of one side of the opening groove 95 and can be realized. The lever 93 is connected to the side wall of the opening groove 95 by threading, so that the clearance between the limit groove 94 and the smooth section 434 increases or decreases, thereby achieving the tightening or releasing of the smooth section 434, and then achieving the limitation or release of the rotation state of the driving screw 431, so as to facilitate locking the state of the driving screw 431 behind the metal clamping device and increase the stability of the metal pressing head 50 in the clamping state.

[0053] In addition, if Figure 2 , 3 As shown, in this embodiment, a ceramic base 11 is disposed at the bottom of the bonding heating plate 20, and the direct connection between the bonding heating plate 20 and the base 10 is isolated by the ceramic base 11, thereby achieving a further insulation and heat isolation effect.

[0054] The beneficial effects of the utility model are as follows:

[0055] The utility model designs a replaceable metal pressing head 50, so that different metal pressing heads 50 can be replaced according to the size of the device. The lifting component 40 is used to control the pressure applied by the metal pressing head 50 on the device, thereby achieving a stable bonding process, solving the area mismatch problem caused by the fixed-size pressing interface of traditional equipment, and avoiding waste of materials and time.

[0056] Working process:

[0057] The silicon wafer and the glass wafer are placed on the heating plate 20 of the device respectively.

[0058] The metal pressing head 50 is gradually lowered using the lifting platform 41 until a suitable pressure is exerted on the glass sheet.

[0059] The spring buffer 70 is compressed during this process, providing a flexible pressure to protect the semiconductor device.

[0060] The universal joint assembly 80 adjusts the metal pressure head 50 through its ball joint structure 83 to ensure that the pressure is evenly applied on the entire connection interface.

[0061] The required bonding temperature is achieved through the cooperation of high pressure and the bonding heating plate 20 .

[0062] After the bonding process is completed, the lifting platform 41 can be lifted up to take out the bonded semiconductor device.

[0063] This improved semiconductor bonding equipment provides a more precise and adjustable way of applying pressure and protects devices from damage through unique structural components. It also improves bonding efficiency, saves materials and energy, and is suitable for modern high-precision and high-efficiency microelectronics manufacturing environments.

[0064] The utility model is described above by way of example in conjunction with the accompanying drawings. It is obvious that the specific implementation of the utility model is not limited to the above-mentioned method. As long as various non-substantial improvements are made using the method concept and technical solution of the utility model, or the concept and technical solution of the utility model are directly applied to other occasions without improvement, they are all within the protection scope of the utility model.

Claims

1. An improved semiconductor bonding device, characterized in that: include: A base (10), the upper end of which is provided with a bonding heating plate (20) and an engineering support (30); A lifting assembly (40) is disposed on the engineering support (30), comprising a lifting platform (41), a pressure head connecting member (42), and a driving mechanism (43) for driving the pressure head connecting member (42) to move up and down along the lifting platform (41); The metal pressing head (50) is detachably connected to the lower end of the pressing head connecting piece (42) and is arranged directly opposite to the bonding heating plate (20).

2. The improved semiconductor bonding device according to claim 1, characterized in that: A ceramic connecting piece (60) for heat insulation and electrical insulation is provided between the metal pressing head (50) and the pressing head connecting piece (42).

3. The improved semiconductor bonding device according to claim 1, characterized in that: A spring buffer (70) for buffering is provided between the metal pressure head (50) and the pressure head connecting member (42).

4. The improved semiconductor bonding device according to claim 1, characterized in that: A universal joint assembly (80) for adjusting direction is provided between the metal pressing head (50) and the pressing head connecting piece (42).

5. The improved semiconductor bonding device according to claim 4, characterized in that: The universal joint comprises, from top to bottom, a connecting rod (81) and an adjusting seat (82), and a ball joint structure (83) is formed between the bottom end of the connecting rod (81) and the upper end of the adjusting seat (82).

6. The improved semiconductor bonding device according to claim 5, characterized in that: A connecting nut (84) is provided at the bottom end of the adjusting seat (82), an internal thread for connection is formed on the inner side of the connecting nut (84), and the end of the metal pressing head (50) is threadedly connected to the internal thread of the connecting nut (84).

7. The improved semiconductor bonding equipment according to claim 1, characterized in that: A ceramic connector (60), a spring buffer (70) and a universal joint assembly (80) are arranged in order from top to bottom between the metal pressing head (50) and the pressing head connector (42); the metal pressing head (50) is detachably connected to the lower end of the universal joint assembly (80).

8. The improved semiconductor bonding device according to claim 7, characterized in that: The upper end of the ceramic connector (60) is threadedly connected to the pressure head connector (42) via an upper bolt (61); the spring buffer (70) comprises, from top to bottom, an upper base plate (71), an intermediate spring (72) and a lower base plate (73) fixed to each other; the upper base plate (71) is threadedly connected to the bottom of the ceramic connector (60) via a lower bolt; the universal joint comprises, from top to bottom, a connecting rod (81) and an adjustment seat (82); a ball joint structure (83) is formed between the bottom end of the connecting rod (81) and the upper end of the adjustment seat (82); the upper end of the connecting rod (81) is detachably connected to the lower base plate (73); a connecting nut (84) is provided at the bottom end of the adjustment seat (82); an internal thread for connection is formed on the inner side of the connecting nut (84); the metal pressure head (50) comprises a bottom pressure plate (52) and a connecting shaft (51) provided at the upper end of the bottom pressure plate (52); the upper end of the connecting shaft (51) is provided with a threaded section that matches the internal thread.

9. The improved semiconductor bonding device according to claim 1, characterized in that: The lifting platform (41) comprises a top plate (411), a bottom plate (412) and a side plate (413) arranged between the top plate (411) and the bottom plate (412); the driving mechanism (43) comprises a driving screw (431) arranged vertically between the top plate (411) and the bottom plate (412), a driving hand wheel (432) arranged at the top of the top plate (411) and drivingly connected to the driving screw (431), and guide wheels (432) symmetrically and parallelly arranged on both sides of the driving screw (431). The pressure head connecting member (42) comprises a lifting connection section (421) and a pressure head connecting section (422) extending outwardly horizontally along the lifting connection section (421); a driving screw hole threadedly connected to the driving screw rod (431) is vertically opened in the middle of the lifting connection section (421), and limiting holes slidably matched with the guide limiting rod (433) are symmetrically arranged on both sides of the driving screw hole; and the metal pressure head (50) is arranged at the lower end of the pressure head connecting section (422).

10. The improved semiconductor bonding device according to claim 9, characterized in that: A smooth section (434) is provided at the position where the driving screw rod (431) passes through the top plate (411), the driving hand wheel (432) is fixedly arranged at the upper end of the smooth section (434), and a limit locking assembly (90) for pressing the smooth section (434) to limit its rotation is also provided on the top plate (411).

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