Blowing device for preventing electrostatic adsorption of chip on tray cover plate

Abstract

The utility model relates to the technical field of Tray cover plates, and discloses a blowing device for preventing electrostatic adsorption of a chip on a Tray cover plate, which comprises a blowing pipeline and an air outlet pipeline, and the blowing pipeline is positioned at the top of the air outlet pipeline. According to the utility model, through the cooperative use of the air blowing pipeline and the air outlet pipeline, the problems that the overturning space of the Tray is very narrow, an ion fan with a larger volume is difficult to install, the blowing mode of most of the ion fans is a direct blowing mode, and the ion wind cannot cover a large-area whole disc of chips to carry out static elimination work, so that the cost is low are solved. Due to the fact that the Tray disc cover plate is provided with the electrostatic adsorption function, after the front face and the back face of the Tray disc provided with the chip are overturned, the chip is easily adsorbed on the Tray disc cover plate due to the electrostatic adsorption function, when the Tray disc cover plate is moved away, the chip falls off and is damaged, the product yield loss is caused, and due to the occurrence of the events, the high quality abnormity manual processing cost is increased for companies. And meanwhile, the customer satisfaction is also reduced.

Description

Technical Field

[0001] The utility model belongs to the technical field of Tray cover plates, and in particular relates to an air blowing device for preventing a chip from being electrostatically adsorbed on a Tray cover plate. Background Art

[0002] In addition, Tray refers to the "Tray disk" in computer storage, which is a storage device used to store hard drives, optical disks, etc. In this case, the Tray disk is usually a removable shelf or box that allows storage devices to be easily inserted and removed.

[0003] At present, when the existing tray containing chips is turned over, it is very easy for the chips to be adsorbed on the tray cover due to electrostatic adsorption. At the same time, because the space for turning the existing tray is very narrow, it is difficult to install a large-volume ion blower, and most ion blowers are in direct blowing mode, and their ion wind cannot cover a large area of ​​the entire tray of chips to perform static elimination. Therefore, it is very easy for the tray containing chips to be adsorbed on the tray cover due to electrostatic adsorption after the tray is turned over. When the tray cover is removed, the chip falls and is damaged, resulting in a loss of product yield. The occurrence of such incidents will increase the company's high labor cost for handling quality abnormalities, and will also reduce customer satisfaction;

[0004] To this end, an air blowing device is provided to prevent the chip from being electrostatically adsorbed on the tray cover, which solves the problem that the chip in the tray is dropped and damaged due to electrostatic adsorption after the chip in the tray is turned over. Utility Model Content

[0005] In view of the problems existing in the prior art, the utility model provides an air blowing device for preventing the electrostatic adsorption of chips on the tray cover plate, which can overcome the above problems or at least partially solve the above problems.

[0006] The utility model is implemented as follows: an air blowing device for preventing a chip from being electrostatically adsorbed on a tray cover plate comprises an air blowing duct and an air outlet duct, wherein the air blowing duct is located at the top of the air outlet duct, and is characterized in that: the air outlet duct comprises an air outlet hole and a guide plate, and the air outlet hole is opened at the bottom of the guide plate;

[0007] The air outlet duct is used to prevent the chip from being adsorbed on the tray cover due to electrostatic adsorption.

[0008] In order to improve, preferably, the blowing duct is fixedly connected to the guide plate, and ion wind flows in the blowing duct and the air outlet duct. The ion wind is input from the upper end of the blowing duct and discharged from multiple air outlets. Then a large amount of ion wind is blown to the upper surface of the chip, thereby preventing the chip from being adsorbed on the Tray cover due to electrostatic adsorption, thereby avoiding damage to the chip. When high-speed ion wind enters from the lower end of the blowing duct, the ion wind will hit the guide plate, and then the ion wind will disperse and evenly fill the entire air outlet duct. When the pressure in the air outlet duct is higher than the pressure outside the air outlet, the ion wind will be discharged from the air outlet.

[0009] In order to improve, preferably, the two rows of air holes in the middle of the bottom of the guide plate are straight-blowing air holes, and the air holes on both sides of the bottom of the guide plate are designed to be 45° oblique, and the ion wind is blown out vertically downward. The air holes on both sides of the bottom of the guide plate are designed to be 45° oblique, that is, the wind direction of the ion wind will be blown out at a 45° oblique angle, which can ensure that the chips on the edge are blown, preventing the chips on both sides of the Tray from being adsorbed on the Tray cover.

[0010] Compared with the prior art, the beneficial effects of the utility model are as follows:

[0011] The utility model solves the problem that the space where the tray is turned over is very narrow and it is difficult to install a large ion blower by setting the blowing duct and the air outlet duct in coordination, and the blowing mode of most ion blowers is a direct blowing mode, and the ion wind thereof cannot cover a large area of ​​the entire tray of chips to perform static elimination work. Therefore, it is very easy for the tray containing chips to be adsorbed on the tray cover due to static adsorption after the tray is turned over front and back. When the tray cover is removed, the chips fall and are damaged, thereby causing a loss in product yield. The occurrence of such incidents will increase the company's high labor cost for handling quality abnormalities and will also reduce customer satisfaction. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 It is a schematic diagram of a three-dimensional structure provided by an embodiment of the utility model;

[0013] Figure 2 It is a three-dimensional schematic diagram of the bottom of the structure provided by the embodiment of the utility model.

[0014] In the figure: 1, air blowing duct; 2, air outlet duct; 201, air outlet hole; 202, guide plate. DETAILED DESCRIPTION

[0015] In order to further understand the content, features and effects of the present invention, the following embodiments are given as examples and described in detail with reference to the accompanying drawings.

[0016] The structure of the utility model is described in detail below in conjunction with the accompanying drawings.

[0017] like Figure 1 to Figure 2 As shown, an embodiment of the utility model provides an air blowing device for preventing a chip from being electrostatically adsorbed on a tray cover, comprising an air blowing duct 1 and an air outlet duct 2, wherein the air blowing duct 1 is located at the top of the air outlet duct 2, and is characterized in that: the air outlet duct 2 comprises an air outlet hole 201 and a guide plate 202, and the air outlet hole 201 is arranged at the bottom of the guide plate 202; the air outlet duct 2 is used to prevent the chip from being adsorbed on the tray cover due to electrostatic adsorption; the air blowing duct 1 is fixedly connected to the guide plate 202, and ion wind flows in the air blowing duct 1 and the air outlet duct 2, the ion wind is input from the upper end of the air blowing duct 1, and discharged from a plurality of air outlet holes 201, and then a large amount of ion wind is blown to the upper surface of the chip, thereby preventing the chip from being adsorbed on the tray cover due to electrostatic adsorption. , to avoid damage to the chip, when the high-speed ion wind enters from the lower end of the blowing duct 1, the ion wind will hit the guide plate 202, and then the ion wind will disperse and evenly fill the entire outlet duct 2. When the pressure in the outlet duct 2 is higher than the pressure outside the air outlet 201, the ion wind will be discharged from the air outlet 201; the two rows of air holes 201 in the middle of the bottom of the guide plate 202 are straight-blowing air holes 201, and the air outlet holes 201 on both sides of the bottom of the guide plate 202 are designed at a 45° oblique angle, and the ion wind blows vertically downward. The air outlet holes 201 on both sides of the bottom of the guide plate 202 are designed at a 45° oblique angle, that is, the wind direction of the ion wind will be blown out at a 45° oblique angle, which can ensure that the chips on the edge are blown to prevent the chips on both sides of the Tray from being adsorbed on the Tray cover.

[0018] The working principle of this utility model:

[0019] When in use, when the ion wind blows directly in from the top and blows directly out vertically downward from the air outlet 201, the area that can be covered for static elimination is small. If you choose to add a guide plate 202, when the ion wind directly enters the air outlet 2 from the blowing duct 1, the ion wind will first contact the guide plate 202 in the air outlet duct 2. The high-speed anti-static ion wind contacts the guide plate 202 and then rebounds and disperses, filling the entire air outlet duct 2 evenly, making it convenient for the air outlets 201 at multiple positions at the lower end of the subsequent air outlet duct 2 to output ion wind at the same time, thereby increasing the anti-static coverage area. The high-speed anti-static ion wind is input at the upper end of the blowing duct 1, which is convenient for subsequent increase. The wind speed of the ion wind coming out of the air outlet 201 can blow down the chips that are statically adsorbed on the tray cover to a great extent, so that they fall safely on the supporting tray at the lower end. The 45° oblique air outlet 201 design on both sides of the air outlet duct 2 can ensure that the chips on both sides are covered by the anti-static ion wind, ensuring that the chips at all positions of the tray can play the role of anti-static adsorption. By adding a large number of air outlets 201 at multiple positions, the anti-static ion wind can be transported to a small space, solving the problem of chips falling and being damaged due to static adsorption of chips on the tray cover, thereby improving the yield of the product;

[0020] It is suitable for a variety of scenarios, such as chip top and bottom appearance inspection, chip anti-static breakdown of internal circuits, electronic components anti-static breakdown of internal circuits, etc. It solves the problem of chips being adsorbed on the Tray cover due to electrostatic adsorption, and avoids the problem of the Tray cover being damaged due to the remaining chips inside during subsequent movement, thereby improving the product yield. At the same time, the unique design of multiple air holes can cover the entire Tray cover with anti-static ion wind, ensuring that there will be no chips with static adsorption on the entire Tray cover. It is suitable for installation in a small space to perform static elimination work, ensuring that the chip will not be affected by static electricity during the test process.

[0021] It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device.

[0022] The above description is only a preferred embodiment of the utility model, and does not constitute any form of limitation to the utility model. Although the utility model has been disclosed as a preferred embodiment as above, it is not used to limit the utility model. Any technician familiar with this patent will not depart from the scope of the technical solution of the utility model.

Claims

1. An air blowing device for preventing a chip from being electrostatically adsorbed on a tray cover, comprising an air blowing duct (1) and an air outlet duct (2), wherein the air blowing duct (1) is located at the top of the air outlet duct (2), and is characterized in that: The air outlet duct (2) comprises an air outlet hole (201) and a guide plate (202), wherein the air outlet hole (201) is provided at the bottom of the guide plate (202); The air outlet duct (2) is used to prevent the chip from being adsorbed on the tray cover due to electrostatic adsorption.

2. The blowing device for preventing the chip from being electrostatically adsorbed on the tray cover as claimed in claim 1, characterized in that: The air blowing duct (1) is fixedly connected to the guide plate (202), and ion wind flows through the air blowing duct (1) and the air outlet duct (2).

3. The blowing device for preventing the chip from being electrostatically adsorbed on the tray cover as claimed in claim 1, characterized in that: The two rows of air holes (201) in the middle of the bottom of the guide plate (202) are straight-blowing air holes (201), and the air holes (201) on both sides of the bottom of the guide plate (202) are designed to be inclined at 45 degrees.

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