Water cooling structure of MPCVD chemical vapor deposition equipment

Abstract

The utility model discloses a water cooling structure of MPCVD (Micro-Pressure Chemical Vapor Deposition) equipment, which comprises a bottom plate, a shell is fixed above the bottom plate, a water inlet is arranged on one side of the lower part of the shell, a water outlet is arranged on one side of the upper part of the shell, a chemical vapor deposition furnace is arranged on the inner side of the shell, and a water outlet is arranged on one side of the lower part of the shell. A cooling pipe is wound on the outer side of the chemical vapor deposition furnace; according to the water cooling structure of the MPCVD chemical vapor deposition equipment, through cooperative use of the cooling plate, a fan, a second bolt, heat dissipation fins, a return pipe and a water tank, in the using process of the device, water enters the water tank in the cooling plate, a switch of the fan is turned on, and the fan and the heat dissipation fins are matched to cool the water in the cooling plate; and then the cooled water enters the cooling box through the backflow pipe, efficient utilization of water resources can be achieved through recycling of the water resources, consumption of the water resources is reduced, then the water resources are saved, and the environment-friendly and energy-saving effects of the water resources are improved.

Description

Technical Field

[0001] The utility model relates to the technical field related to water cooling structures, in particular to a water cooling structure for MPCVD chemical vapor deposition equipment. Background Art

[0002] Chemical vapor deposition is a chemical technology that uses gaseous or vaporous substances to react in the gas phase or at the gas-solid interface to generate solid deposits. Chemical vapor deposition technology is widely used in many fields, such as composite material preparation, microelectronics technology, semiconductor optoelectronic technology, solar energy utilization, optical fiber communication, superconducting technology and protective coatings. The water cooling structure is added to the chemical vapor deposition equipment mainly to control the heat generated by the equipment during operation, ensure the stable operation of the equipment and extend its service life.

[0003] In the existing water cooling structure of chemical vapor deposition equipment, water resources are not recycled, which increases the consumption of water resources and has a certain impact on the environmental protection and energy-saving effect of water resources. Therefore, it is necessary to propose a water cooling structure for MPCVD chemical vapor deposition equipment. Utility Model Content

[0004] The utility model aims to provide a water cooling structure for MPCVD chemical vapor deposition equipment to solve the problems raised in the above-mentioned background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a water cooling structure of an MPCVD chemical vapor deposition equipment, comprising a base plate, a shell is fixed on the top of the base plate, a water inlet is arranged on the lower side of the shell, a water outlet is arranged on the upper side of the shell, a chemical vapor deposition furnace is installed on the inner side of the shell, a cooling pipe is wrapped around the outer side of the chemical vapor deposition furnace, an end cover is installed on the top of the shell, a first bolt passes through the top of the end cover, a first hose is installed on one side of the water inlet, a water pump is installed on one side of the first hose, a cooling box is installed on one side of the water pump, a second hose is installed on one side of the water outlet, a cooling plate is installed on one side of the second hose, sealing sleeves are fixed on both sides of the cooling plate, a fan is installed on one side of the cooling plate, second bolts pass through both sides of the fan, and heat dissipation fins are fixed on one side of the cooling plate.

[0006] Preferably, the end cover is threadedly connected to the housing via first bolts, and the first bolts are distributed in a circumference above the end cover.

[0007] Preferably, the sealing sleeve is symmetrically arranged with respect to the central axis of the cooling plate, and the inner diameter of the sealing sleeve matches the outer diameter of the second hose.

[0008] Preferably, the fan is threadedly connected to the cooling plate via a second bolt, and the second bolt is symmetrically arranged with respect to the central axis of the cooling plate.

[0009] Preferably, the heat dissipation fins are arranged at equal intervals on one side of the cooling plate, and the heat dissipation fins are used in conjunction with a fan.

[0010] Preferably, a return pipe is installed on one side of the cooling plate, and one side of the return pipe penetrates to the inner side of the cooling box.

[0011] Preferably, a water trough is provided on the inner side of the cooling plate, and screw holes are provided on both sides of the cooling plate.

[0012] Compared with the prior art, the beneficial effects of the utility model are:

[0013] 1. The water cooling structure of the MPCVD chemical vapor deposition equipment is used in coordination with the cooling plate, the fan, the second bolt, the heat sink, the return pipe and the water tank. During the use of the device, water is introduced into the water tank in the cooling plate, and the fan switch is turned on, so that the fan and the heat sink cooperate to cool the water in the cooling plate, and then the cooled water enters the cooling box through the return pipe. Through the recycling of water resources, efficient use of water resources can be achieved, water resource consumption is reduced, and water resources are saved, thereby improving the environmental protection and energy-saving effect of water resources;

[0014] 2. The water cooling structure of the MPCVD chemical vapor deposition equipment, through the arrangement of the cooling plate and the sealing sleeve, prevents the water of the second hose and the return pipe from leaking out from the connection points on both sides of the cooling plate by fixing the sealing sleeve on both sides of the cooling plate during the use of the device, thereby avoiding the failure of the water cooling structure caused by leakage, so that the water cooling structure can normally dissipate heat for the chemical vapor deposition furnace, and prolongs the service life of the water cooling structure;

[0015] 3. The water-cooling structure of the MPCVD chemical vapor deposition equipment is provided with heat dissipating fins and a fan. When the device is used, the fan switch is turned on so that the heat dissipating fins and the fan cooperate to dissipate the water in the cooling plate. The simultaneous heat dissipation of the heat dissipating fins and the fan accelerates the cooling of the water in the cooling plate and improves the heat dissipation efficiency. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0017] Figure 2 This is a schematic diagram of the cooling pipe structure of the utility model;

[0018] Figure 3 This is a schematic diagram of the sealing sleeve structure of the utility model;

[0019] Figure 4 This is a schematic diagram of the heat dissipation fin structure of the utility model;

[0020] Figure 5 This is a schematic diagram of the cross-sectional structure of the cooling plate of the utility model.

[0021] In the figure: 1. bottom plate; 2. outer shell; 3. water inlet; 4. water outlet; 5. chemical vapor deposition furnace; 6. cooling pipe; 7. end cover; 8. first bolt; 9. first hose; 10. water pump; 11. cooling box; 12. second hose; 13. cooling plate; 14. sealing sleeve; 15. fan; 16. second bolt; 17. cooling fins; 18. return pipe; 19. water sink; 20. screw hole. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0023] See also Figure 1-2 The utility model provides a technical solution: a water cooling structure of an MPCVD chemical vapor deposition device, comprising a bottom plate 1, a shell 2 is fixed above the bottom plate 1, a water inlet 3 is arranged on the lower side of the shell 2, a water outlet 4 is arranged on the upper side of the shell 2, a chemical vapor deposition furnace 5 is installed on the inner side of the shell 2, a cooling pipe 6 is wound around the outer side of the chemical vapor deposition furnace 5, an end cover 7 is installed above the shell 2, the end cover 7 is threadedly connected to the shell 2 through a first bolt 8, the first bolt 8 is distributed in a circle above the end cover 7, the end cover 7 and the shell 2 are fixed, the first bolt 8 is penetrated above the end cover 7, a first hose 9 is installed on one side of the water inlet 3, a water pump 10 is installed on one side of the first hose 9, and a cooling box 11 is installed on one side of the water pump 10;

[0024] See also Figure 3-4A second hose 12 is installed on one side of the water outlet 4, a cooling plate 13 is installed on one side of the second hose 12, sealing sleeves 14 are fixed on both sides of the cooling plate 13, the sealing sleeves 14 are symmetrically arranged with the central axis of the cooling plate 13, the inner diameter of the sealing sleeve 14 coincides with the outer diameter of the second hose 12, and prevents the water of the second hose 12 from leaking out from the connection of the cooling plate 13, and a fan 15 is installed on one side of the cooling plate 13, and the fan 15 is threadedly connected to the cooling plate 13 through a second bolt 16, and the second bolt 16 is symmetrically arranged with the central axis of the cooling plate 13 to fix the fan 15 On the cooling plate 13, second bolts 16 are passed through both sides of the fan 15, and heat sink fins 17 are fixed on one side of the cooling plate 13. The heat sink fins 17 are arranged at equal intervals on one side of the cooling plate 13. The heat sink 17 is used in conjunction with the fan 15. The heat sink 17 and the fan 15 work together to dissipate the heat of the water in the cooling plate 13. A return pipe 18 is installed on one side of the cooling plate 13, and one side of the return pipe 18 passes through the inner side of the cooling box 11, thereby achieving the effect of water circulation. A water tank 19 is provided on the inner side of the cooling plate 13, and screw holes 20 are provided on both sides of the cooling plate 13.

[0025] Working principle: When using the water-cooling structure of the MPCVD chemical vapor deposition equipment, first connect the external power supply, turn on the switch of the water pump 10, so that the water in the cooling box 11 enters the cooling pipe 6, and the water in the cooling pipe 6 cools the chemical vapor deposition furnace 5. Then the water takes away the heat of the chemical vapor deposition furnace 5 and enters the cooling plate 13. The sealing sleeves 14 fixed on both sides of the cooling plate 13 prevent the water of the second hose 12 and the return pipe 18 from leaking out from the connection parts on both sides of the cooling plate 13. Then turn on the switch of the fan 15 so that the fan 15 and the heat dissipation fins 17 cooperate to dissipate the water in the cooling plate 13. The cooled water re-enters the cooling box 11 through the return pipe 18. Through the water-cooling structure of the chemical vapor deposition furnace 5, the recycling and utilization of water resources are realized. When the device is not used, the external power supply of the device is cut off. The model of the water pump 10 is ISW25, and the model of the fan 15 is RB-21D. In this way, the use process of the water-cooling structure of the MPCVD chemical vapor deposition equipment is completed.

[0026] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A water cooling structure for MPCVD chemical vapor deposition equipment, comprising a bottom plate (1), characterized in that: A shell (2) is fixed above the bottom plate (1), a water inlet (3) is provided on the lower side of the shell (2), a water outlet (4) is provided on the upper side of the shell (2), a chemical vapor deposition furnace (5) is installed on the inner side of the shell (2), a cooling pipe (6) is wound around the outer side of the chemical vapor deposition furnace (5), an end cover (7) is installed above the shell (2), a first bolt (8) passes through the upper side of the end cover (7), a first hose (9) is installed on one side of the water inlet (3), and the first hose (9) is connected to the inner side of the shell (2). A water pump (10) is installed on one side of the pipe (9), a cooling box (11) is installed on one side of the water pump (10), a second hose (12) is installed on one side of the water outlet (4), a cooling plate (13) is installed on one side of the second hose (12), sealing sleeves (14) are fixed on both sides of the cooling plate (13), a fan (15) is installed on one side of the cooling plate (13), second bolts (16) are passed through both sides of the fan (15), and a heat dissipation fin (17) is fixed on one side of the cooling plate (13).

2. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: The end cover (7) is threadedly connected to the housing (2) via first bolts (8), and the first bolts (8) are distributed in a circumferential manner above the end cover (7).

3. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: The sealing sleeve (14) is symmetrically arranged with respect to the central axis of the cooling plate (13), and the inner diameter of the sealing sleeve (14) matches the outer diameter of the second hose (12).

4. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: The fan (15) is threadedly connected to the cooling plate (13) via a second bolt (16), and the second bolt (16) is symmetrically arranged with respect to the central axis of the cooling plate (13).

5. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: The heat dissipation fins (17) are arranged at equal intervals on one side of the cooling plate (13), and the heat dissipation fins (17) are used in conjunction with the fan (15).

6. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: A return pipe (18) is installed on one side of the cooling plate (13), and one side of the return pipe (18) penetrates into the inner side of the cooling box (11).

7. The water cooling structure of the MPCVD chemical vapor deposition equipment according to claim 1, characterized in that: A water tank (19) is provided on the inner side of the cooling plate (13), and screw holes (20) are provided on both sides of the cooling plate (13).

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