Sensor module and impedance matcher
By setting a double-sided PCBA board in the RF matcher and adjusting the position and shape of the signal sensing line, the problem of insufficient safe distance between the signal sensing line and the RF channel line is solved, and the stable signal transmission and isolation effect is achieved under low and high power .
Patent Information
- Application Number
- CN202420998605.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-09
- Publication Date
- 2025-01-07
- Estimated Expiration
- 2034-05-09
AI Technical Summary
The safe distance between the signal induction line and the RF channel line in existing RF matchers is insufficient, resulting in insufficient signal strength at low power, and the sampling value at high power may exceed the maximum value processed by the subsequent circuit.
Design a sensor module, including RF channel line and signal sensing line, ensures that there is sufficient safe distance between RF channel line and signal sensing line by setting the signal sensing line on the other side of the double-sided PCBA board, and optionally Single or multi-stage ladder line, adjusting its spatial distance to optimize isolation and matching parameters.
Ensure that the signal strength is sufficient at low power, and the sampling value at high power will not exceed the maximum value processed by the subsequent circuit, which improves the stability of the sensor module and the isolation of signal transmission.
Smart Images
Figure CN222318064U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the field of radio frequency technology, in particular to a sensor module and an impedance matcher. Background Art
[0002] Radio Frequency (RF) power matcher, also known as RF load matcher or RF matching network, is a device used to match the impedance between RF power and load. Based on the concept of impedance matching, the parameters of the matching network can be adjusted according to the impedance characteristics of the power supply and load, so that it can achieve the improvement of power transmission and reflection loss.
[0003] When the RF power source sends power through the coupling line directional coupler, there will be a coupling capacitor between the RF channel line and the signal sensing line. At the same time, according to the law of electromagnetic induction, there will be an induced current in the signal sensing line. Due to the limitations of process specifications, the safety distance between the signal sensing line and the RF channel line in the matching device in the prior art is not enough. In order to ensure that the signal strength of the matching device is sufficient at low power, and the sampling value does not exceed the maximum value that the digital-to-analog conversion module of the subsequent circuit can handle at high power, it is necessary to ensure that the signal line safety distance is sufficient and find the optimal sensing distance to ensure that the isolation and matching parameters are within the appropriate range.
[0004] The above contents are only used to assist in understanding the technical solution of the present utility model and do not constitute an admission that the above contents are prior art. Utility Model Content
[0005] The main purpose of the utility model is to provide a sensor module and an impedance matcher, aiming to solve the technical problem of insufficient safety distance between the signal sensing line and the radio frequency channel line of the matching sensor module in the prior art.
[0006] To achieve the above object, the utility model provides a sensor module, the sensor module comprising: a radio frequency channel line, a signal sensing line and a double-sided PCBA board;
[0007] The radio frequency channel line is arranged on one side of the PCBA board, and the signal sensing line is arranged on the other side of the PCBA board.
[0008] Optionally, the signal sensing line is a single line, and the signal sensing line is arranged in parallel with the radio frequency channel line.
[0009] Optionally, the signal sensing line is a multi-segment ladder line, and the multi-segment ladder line includes: a first coupling segment, a second coupling segment and a third coupling segment;
[0010] The first coupling section and the third coupling section have the same distance from the signal sensing line, and are both greater than the distance between the second coupling section and the signal sensing line;
[0011] The first coupling section, the second coupling section and the third coupling section are parallel to each other. The two ends of the second coupling section are respectively provided with two connecting sections perpendicular to the second coupling section, for connecting the first coupling section with the second coupling section, and connecting the second coupling section with the third coupling section.
[0012] Optionally, the surface shape of the double-sided PCBA board on which the radio frequency channel line and the signal sensing line are arranged is a rectangle.
[0013] Optionally, the RF channel line is arranged perpendicular to the first side of the double-sided PCBA board, extending to the second side of the double-sided PCBA board parallel to the first side, and the RF channel line has the same spacing with the third side and the fourth side of the double-sided PCBA board perpendicular to the first side.
[0014] Optionally, the first coupling segment, the second coupling segment and the third coupling segment have the same line width.
[0015] Optionally, a line connecting a midpoint of the second coupling segment and a midpoint of the radio frequency channel line is perpendicular to the second coupling segment and the radio frequency channel line.
[0016] Optionally, a first lead is provided at one end of the first coupling section close to the short side of the double-sided PCBA board, and the other end of the first lead extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to be connected to an external device; a second lead is provided at one end of the third coupling section close to the short side of the double-sided PCBA board, and the other end of the second lead extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to be connected to an external device;
[0017] The line widths of the first lead line and the second lead line are the same as the line width of the first coupling section.
[0018] Optionally, a plurality of positioning holes are further provided on the double-sided PCBA board for fixing the double-sided PCBA board at a preset position of the sensor module.
[0019] In addition, to achieve the above-mentioned purpose, the utility model also provides an impedance matcher, which includes a vacuum capacitor, an FPGA board and the sensor module as described above; the input end of the sensor module is connected to an external RF power supply, the output end of the sensor module is connected to the vacuum capacitor, and the sampling signal output end of the sensor module is connected to the FPGA board.
[0020] The technical solution of the utility model proposes a sensor module and an impedance matcher. The sensor module includes: a radio frequency channel line, a signal sensing line and a double-sided PCBA board; the radio frequency channel line is arranged on one side of the PCBA board, the signal sensing line is arranged on the other side of the PCBA board, and the radio frequency channel line is arranged in parallel with the signal sensing line. By arranging the signal sensing line on the back of the PCBA board, there is a sufficient safety distance between the radio frequency channel line and the signal sensing line, ensuring that the signal strength of the sensor is sufficient when the power is low, and the sampling value of the sensor will not exceed the maximum value that the post-processing circuit can handle when the power is high. BRIEF DESCRIPTION OF THE DRAWINGS
[0021] In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the utility model. For ordinary technicians in this field, other drawings can be obtained based on the structures shown in these drawings without paying creative work.
[0022] Figure 1 This is a schematic diagram of the structure of the PCBA board in the first embodiment of the sensor module of the utility model;
[0023] Figure 2 This is a schematic diagram of the internal structure of the first embodiment of the sensor module of the utility model;
[0024] Figure 3 This is a schematic diagram of the external structure of the first embodiment of the sensor module of the utility model;
[0025] Figure 4 This is a schematic diagram of the structure of the PCBA board in the second embodiment of the sensor module of the utility model;
[0026] Figure 5 This is a schematic diagram of the internal structure of the second embodiment of the sensor module of the utility model;
[0027] Figure 6 This is a schematic diagram of the dimensions of the PCBA board in the second embodiment of the sensor module of the utility model;
[0028] Figure 7 This is a schematic diagram of the structure of an impedance matcher in an embodiment of the utility model;
[0029] Figure 8 It is a schematic diagram of a top view of the structure of an embodiment of an impedance matcher of the utility model.
[0030] The realization of the purpose, functional features and advantages of the utility model will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION
[0031] It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.
[0032] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0033] It should be noted that all directional indications in the embodiments of the present invention (such as up, down, left, right, front, back...) are only used to explain the relative position relationship, movement status, etc. between the components under a certain specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indication will also change accordingly.
[0034] In addition, the descriptions of "first", "second", etc. in the present utility model are only used for descriptive purposes and cannot be understood as indicating or implying their relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include at least one of the features. In addition, the technical solutions between the various embodiments can be combined with each other, but they must be based on the ability of ordinary technicians in this field to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be deemed that such a combination of technical solutions does not exist and is not within the scope of protection required by the present utility model.
[0035] Reference Figure 1 , Figure 1 The schematic diagram of the structure of the PCBA board in the first embodiment of the sensor module of the utility model. The utility model proposes the first embodiment of the sensor module.
[0036] In this embodiment, the sensor module includes: a radio frequency channel line, a signal sensing line and a double-sided PCBA board; the radio frequency channel line is arranged on one side of the PCBA board, and the signal sensing line is arranged on the other side of the PCBA board. By arranging the signal sensing line and the radio frequency channel line on both sides of the PCBA board, the relative distance is increased to improve the safety distance.
[0037] It should be noted that the double-sided PCBA board can be a printed circuit board with copper on both the top and bottom layers, and circuit wiring can be connected on both sides. Wherein, the shapes of both sides of the PCBA board on which the radio frequency channel line and the signal sensing line are set are rectangular.
[0038] Preferably, the length of the long side of the rectangle is 8.2982 cm, and the length of the short side of the rectangle is 2.3978 cm.
[0039] In a possible implementation, the signal sensing lines arranged on the double-sided PCBA board are all single lines, and the directions of the signal sensing lines are arranged in parallel with the directions of the RF channel lines, and are all arranged in parallel with the long sides of the rectangular PCBA board and perpendicular to the short sides of the PCBA board.
[0040] It should be understood that the RF channel line is arranged perpendicular to the first side (short side) of the double-sided PCBA board, extending to the second side (the other short side) of the double-sided PCBA board parallel to the first side, and the RF channel line has the same spacing with the third side (long side) and the fourth side (the other long side) of the double-sided PCBA board perpendicular to the first side.
[0041] Preferably, the length of the RF channel line is 8.2982 cm, and the width is 0.7620 cm. The length of the signal sensing line is 6.5958 cm, and the width is 0.1524 cm. Both ends of the signal sensing line have leads extending outward perpendicular to the long side of the double-sided PCBA board, and are electrically connected to external devices through the leads.
[0042] It should be understood that the isolation of the sensor module can be modified by changing the spatial distance between the RF channel line and the signal sensing line. Since the thickness of the double-sided PCBA board is fixed, the modification of the spatial distance can be adjusted by modifying the vertical distance between the signal sensing line and the short side of the rectangle of the double-sided PCBA board. When the signal sensing line is a single line, the corresponding relationship between the spatial distance and the isolation is shown in Table 1 below.
[0043] Mil 120 110 100 90 80 70 dB -33.1 -33.5 -34.7 -35.1 -35.8 -36.8 Mil 60 50 40 30 20 10 dB -37.5 -38.8 -40.5 -41.1 -41.3 -41.6
[0044] Table 1
[0045] Among them, Mil can be the unit of the spatial distance between the signal sensing line and the RF channel line, and dB can be the unit of the isolation of the sensor module.
[0046] Reference Figure 2 and Figure 3 , Figure 2 This is a schematic diagram of the internal structure of the first embodiment of the sensor module of the utility model; Figure 3The schematic diagram of the external structure of the first embodiment of the sensor module of the utility model. The double-sided PCBA board is also provided with a plurality of positioning holes for fixing the double-sided PCBA board at a preset position of the sensor module. Preferably, six positioning holes are provided to be encapsulated inside the housing of the sensor module. The two ends of the RF channel line are connected to the outside through the input and output ends of the sensor respectively. Two openings are provided on the housing close to the signal sensing line so that the signal sensing line can extend to the outside of the sensor module for connection.
[0047] This embodiment proposes a sensor module and an impedance matcher. The sensor module includes: a radio frequency channel line, a signal sensing line and a double-sided PCBA board; the radio frequency channel line is arranged on one side of the PCBA board, the signal sensing line is arranged on the other side of the PCBA board, and the radio frequency channel line is arranged in parallel with the signal sensing line. By arranging the signal sensing line on the back of the PCBA board, there is a sufficient safety distance between the radio frequency channel line and the signal sensing line, ensuring that the signal strength of the sensor is sufficient when the power is low, and the sampling value of the sensor does not exceed the maximum value that the post-processing circuit can handle when the power is high.
[0048] Reference Figure 4 and Figure 5 , Figure 4 This is a schematic diagram of the structure of the PCBA board in the second embodiment of the sensor module of the utility model; Figure 5 The second embodiment of the sensor module of the present invention is a schematic diagram of the internal structure of the second embodiment of the sensor module of the present invention. The second embodiment of the sensor module of the present invention is proposed based on the first embodiment of the sensor module.
[0049] In this embodiment, the signal sensing line is a multi-segment ladder line, and the multi-segment ladder line includes: a first coupling segment 1 , a second coupling segment 2 , and a third coupling segment 3 .
[0050] It should be noted that the spatial distances between the first coupling section 1 and the third coupling section 3 and the signal sensing line are the same, and are both greater than the spatial distance between the second coupling section 2 and the signal sensing line. The first coupling section 1, the second coupling section 2, and the third coupling section 3 are parallel to each other. The extension line of the first coupling section 1 coincides with the extension line of the third coupling end 3.
[0051] Preferably, refer to Figure 6 , Figure 6 The following is a schematic diagram of the dimensions of the PCBA board in the second embodiment of the sensor module of the utility model. For the convenience of annotation, the units of the dimension values in the figure are centimeters. The vertical distance between the second coupling section and the closer side of the two long sides of the double-sided PCBA board is 0.6020 cm, and the vertical distance between the first coupling section and the closer side of the two long sides of the double-sided PCBA board is 0.2261 cm.
[0052] It should be understood that when the RF power is low, the signal amplitude obtained by the first coupling section 1 and the third coupling section 3, which are relatively far in space, is small, and there are more clutter signals. After the signal obtained by the second coupling section 2, which is relatively close in space, is superimposed, the signal obtained by the first coupling section 1 and the third coupling section 3 will be superimposed on the clutter signal of the second coupling section 2. After the superimposed coupling signal passes through the filter circuit of the subsequent circuit, the clutter signal will be filtered out, and the final coupling signal mainly comes from the second coupling section 2, which is close in distance. When the RF power is high, the signal superimposed by the first coupling section 1, the second coupling section 2 and the third coupling section 3 is smaller in amplitude than when only the second coupling section 2, which is relatively close in distance, is used. After the signal is filtered and AD converted by the subsequent circuit, the risk of AD value overflow is small.
[0053] Furthermore, two connecting sections 4 perpendicular to the second coupling section 2 are respectively provided at both ends of the second coupling section 2 , for connecting the first coupling section 1 with the second coupling section 2 , and connecting the second coupling section 2 with the third coupling section 3 .
[0054] Preferably, the first coupling section 1, the second coupling section 2, the third coupling section 3 and the connecting section 4 have the same line width, which is 0.1524 cm. The line lengths of the first coupling section 1 and the third coupling section 3 are both 1.4026 cm, and the line length of the second coupling section is 3.7312 cm.
[0055] Furthermore, the line connecting the midpoint of the second coupling section 2 and the midpoint of the RF channel line is perpendicular to the second coupling section 2 and the RF channel line, that is, the distances between the two ends of the second coupling section 2 and the first side and the second side of the double-sided PCBA board are the same.
[0056] It should be understood that, similar to the case where the signal sensing line is a single line, the isolation of the sensor module can be modified by changing the spatial distance between the RF channel line and the signal sensing line. In the case of a single line, the relative spatial distance of 50 mil is modified to a multi-stage step line, and the corresponding relationship between the spatial distance and the isolation of the 8 sets of relative spatial distances are designed as shown in Table 2 below.
[0057] Mil 1828 1729 1629 1529 1330 1130 930 730 dB -40.9 -41.3 -41.5 -41.8 -42.7 -42.6 -43.5 -44.3
[0058] Table 2
[0059] Among them, the front and back coupling mode of the multi-segment step line with a relative spatial distance of 1529 is a position setting with appropriate isolation and matching parameters.
[0060] Furthermore, a first lead 5 is provided at one end of the first coupling section 1 close to the short side of the double-sided PCBA board, and the other end of the first lead 5 extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to connect to an external device. A second lead 6 is provided at one end of the third coupling section 3 close to the short side of the double-sided PCBA board, and the other end of the second lead 6 extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to connect to an external device. The line widths of the first lead 5 and the second lead 6 are the same as the line widths of the first coupling section 1, both of which are 0.1524 cm.
[0061] In this embodiment, the signal sensing line is set as a multi-segment ladder line, and the multi-segment ladder line includes: a first coupling segment, a second coupling segment, and a third coupling segment; the first coupling segment and the third coupling segment are at the same distance from the signal sensing line, and are both greater than the distance between the second coupling segment and the signal sensing line; the first coupling segment, the second coupling segment, and the third coupling segment are parallel to each other, and the two ends of the second coupling segment also have two connecting segments perpendicular to the second coupling segment, which are used to connect the first coupling segment with the second coupling segment, and the second coupling segment with the third coupling segment. It is ensured that the sensor module is not interfered by clutter signals at low power and cannot obtain effective transmission signals. The signal strength at high power is within the test range of the AD converter of the subsequent circuit, and the amplitude overflow does not occur. The signal strength of the low-power end and the high-power end during the signal transmission process is balanced, so that the device operation is more stable.
[0062] In addition, the embodiment of the utility model further provides an impedance matcher, wherein the impedance matcher includes the above-mentioned sensor module. Figure 7 and Figure 8 , Figure 7 It is a front view structural diagram of an embodiment of an impedance matcher of the utility model; Figure 8 The top view of the structure of an embodiment of the impedance matcher of the utility model is shown in FIG. The impedance matcher includes a vacuum capacitor, an FPGA board, and the sensor module as described above; the input end of the sensor module is connected to an external RF power supply, the output end of the sensor module is connected to the vacuum capacitor, and the sampling signal output end of the sensor module is connected to the FPGA board.
[0063] It should be noted that the input end of the sensor module may be an input terminal of the RF power supply signal (i.e., an input port of the RF channel line), referring to the above Figure 2 and Figure 3 The shorter side of the cylindrical housing end of the sensor module ( Figure 2 and Figure 3The output end of the sensor module may be an output terminal of the RF power supply signal (i.e., an output port of the RF channel line), referring to Figure 2 and Figure 3 The longer side of the cylindrical housing end of the sensor module ( Figure 2 and Figure 3 The sampling signal output terminal of the sensor module may be an output terminal matching the sensing signal (i.e., an output port of the signal sensing line), referring to Figure 2 and Figure 3 The two output terminals on the side of the cylindrical housing of the sensor module ( Figure 2 The bottom and Figure 3 The induced signal generated on the signal sensing line can be transmitted to the FPGA board for processing.
[0064] Since the impedance matcher adopts all the technical solutions of all the above embodiments, it has at least all the beneficial effects brought by the technical solutions of the above embodiments, which will not be described one by one here.
[0065] The above description is only a preferred embodiment of the utility model, and does not limit the patent scope of the utility model. All equivalent structural changes made by using the contents of the utility model specification and drawings under the utility model concept, or directly / indirectly used in other related technical fields are included in the patent protection scope of the utility model.
Claims
1. A sensor module, characterized in that: The sensor module includes: a radio frequency channel line, a signal sensing line and a double-sided PCBA board; The radio frequency channel line is arranged on one side of the PCBA board, and the signal sensing line is arranged on the other side of the PCBA board.
2. The sensor module according to claim 1, characterized in that The signal sensing line is a single line, and the signal sensing line is arranged in parallel with the radio frequency channel line.
3. The sensor module according to claim 1, characterized in that: The signal sensing line is a multi-segment ladder line, and the multi-segment ladder line includes: a first coupling segment, a second coupling segment and a third coupling segment; The first coupling section and the third coupling section have the same distance from the signal sensing line, and are both greater than the distance between the second coupling section and the signal sensing line; The first coupling section, the second coupling section and the third coupling section are parallel to each other. The two ends of the second coupling section are respectively provided with two connecting sections perpendicular to the second coupling section, for connecting the first coupling section with the second coupling section, and connecting the second coupling section with the third coupling section.
4. The sensor module according to claim 3, characterized in that: The surface shape of the double-sided PCBA board on which the radio frequency channel line and the signal sensing line are arranged is a rectangle.
5. The sensor module according to claim 4, characterized in that: The RF channel line is arranged perpendicularly to the first side of the double-sided PCBA board and extends to the second side of the double-sided PCBA board parallel to the first side. The RF channel line has the same spacing with the third side and the fourth side of the double-sided PCBA board perpendicular to the first side.
6. The sensor module according to claim 5, characterized in that: The first coupling segment, the second coupling segment and the third coupling segment have the same line width.
7. The sensor module according to claim 6, characterized in that: A line connecting a midpoint of the second coupling segment and a midpoint of the radio frequency channel line is perpendicular to the second coupling segment and the radio frequency channel line.
8. The sensor module according to claim 7, characterized in that: A first lead is provided at one end of the first coupling section close to the short side of the double-sided PCBA board, and the other end of the first lead extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to be connected to an external device; a second lead is provided at one end of the third coupling section close to the short side of the double-sided PCBA board, and the other end of the second lead extends outward perpendicularly to the closer of the two long sides of the double-sided PCBA board to be connected to an external device; The line widths of the first lead line and the second lead line are the same as the line width of the first coupling section.
9. The sensor module according to claim 1, characterized in that: The double-sided PCBA board is also provided with a plurality of positioning holes for fixing the double-sided PCBA board at a preset position of the sensor module.
10. An impedance matching device, characterized in that: The impedance matcher comprises a vacuum capacitor, an FPGA board and a sensor module according to any one of claims 1 to 9; The input end of the sensor module is connected to an external radio frequency power supply, the output end of the sensor module is connected to the vacuum capacitor, and the sampling signal output end of the sensor module is connected to the FPGA board.