Intelligent lead-free reflow soldering machine

Abstract

The utility model relates to the field of reflow soldering, and discloses an intelligent lead-free reflow soldering machine which comprises a machine frame, a transmission assembly arranged in the middle of the upper portion of the machine frame, a plurality of ceramic substrates placed on the transmission assembly, a soldering area arranged on the left portion of the upper portion of the machine frame, a cooling area arranged on the right portion of the upper portion of the machine frame, and a flexible partition curtain arranged on the left side of the soldering area. An air channel is arranged between the welding area and the cooling area, a processing assembly is arranged above the air channel, a set of grooved wheels are arranged on the front portion and the rear portion of each shaft rod, transmission chains are arranged in the grooved wheels corresponding in the front-back direction, and a plurality of connecting rods are evenly arranged between the two transmission chains. The rear portion of the left side of the rack is provided with a driving motor, and the output end of the driving motor is connected with the shaft rod on the left side. According to the utility model, cold air and hot air in a welding area and a cooling area can be prevented from mutually diffusing to a square temperature area to influence the cooling of a PCB, solder paste steam is processed through the processing box, and heat in the air is recycled.

Description

Technical Field

[0001] The utility model relates to the technical field of reflow soldering, in particular to an intelligent lead-free reflow soldering machine. Background Art

[0002] A reflow soldering machine is also called a reflow soldering machine or a reflow oven. It provides a heating environment to melt the solder paste so that the surface mount components and PCB pads can be reliably combined together through the solder paste. The intelligent lead-free reflow soldering includes a rack, a high temperature zone, a cooling zone and a transmission mechanism. The transmission mechanism sends the PCB board into the rack from one end, and passes through the soldering zone and the cooling zone in turn, and finally sends it out from the other end of the rack. In the soldering zone, the solder paste is melted by high temperature to combine the components with the PCB board, and then the solder paste is cooled and solidified in the cooling zone.

[0003] Generally, the physical distance between the welding area and the cooling area is relatively close, which is 100mm to 200mm. The hot and cold air diffuse to each other's temperature zone, affecting the cooling of the PCB. In addition, in a high temperature environment, the solder paste will volatilize or evaporate the solder paste vapor after heating. The solder paste vapor mixes with the air and is directly discharged, so that part of the solder paste is lost, which increases the material loss and causes environmental pollution. Therefore, we propose an intelligent lead-free reflow soldering machine. Utility Model Content

[0004] In view of the deficiencies in the prior art, the utility model provides an intelligent lead-free reflow soldering machine, which solves the problems mentioned in the above background.

[0005] The utility model provides the following technical solution: The utility model discloses an intelligent lead-free reflow soldering machine, including a frame, a transmission component is arranged in the upper middle part of the frame, a plurality of ceramic substrates are placed on the transmission component, a welding area is arranged in the upper left part of the frame, a cooling area is arranged in the upper right part of the frame, a flexible partition curtain is arranged on the left side of the welding area, an air duct is arranged between the welding area and the cooling area, a processing component is arranged above the air duct, and a control panel is arranged on the frame.

[0006] As a preferred solution, the transmission component includes shafts respectively arranged on the left and right sides above the frame, a group of groove wheels are arranged on the front and rear of the shaft, a transmission chain is arranged in the front and rear corresponding groove wheels, a plurality of connecting rods are evenly arranged between the two transmission chains, a driving motor is arranged at the rear left side of the frame, and the output end of the driving motor is connected to the shaft on the left side.

[0007] As a preferred solution, the processing assembly includes a processing box detachably arranged above the air duct, a connecting pipe detachably arranged above the processing box, a pump is arranged at the end of the connecting pipe, a conduit is arranged at the outlet of the pump, an air heater is arranged on the welding area, the other end of the conduit is connected to the air heater, and the outlet end of the air heater is extended into the welding area through a pipe.

[0008] As a preferred solution, a cavity is opened on the side of the processing box, and multiple solder paste recovery plates are arranged in parallel at the upper and lower parts of the processing box. The longitudinal cross-section of the solder paste recovery plate is a continuous zigzag structure, and multiple through holes are evenly opened on the solder paste recovery plate.

[0009] As a preferred solution, an active adsorption block is provided in the connecting pipe, the active adsorption block is columnar, and a plurality of channels are evenly opened in the active adsorption block.

[0010] As a preferred solution, a water inlet is provided on the left side of the processing box, a water outlet is provided on the right side of the processing box, and the water inlet and the water outlet are connected to the cavity.

[0011] Compared with the prior art, the utility model has the following beneficial effects:

[0012] The utility model prevents the cold and hot air in the welding area and the cooling area from diffusing to each other's temperature zone and affecting the cooling of the PCB through the structural setting of the processing component, and processes the solder paste vapor through the processing box, and recycles the heat in the air. The user connects the water inlet to the cold water pipe and the water outlet to the outlet pipe, and then passes cold water into the cavity, and then reduces the temperature of the solder paste recovery board. Through the operation of the pump, the wind at the air duct is guided away, and then the air is introduced into the processing box, and the gas contacts the solder paste recovery board. The solder paste recovery board is made of copper, and the longitudinal cross-section is a continuous zigzag structure and has been cooled. The solder paste vapor passes through the through holes on the solder paste recovery board, and then the solder paste vapor is cooled and attached to the solder paste recovery board, which is convenient for the later recovery of the solder paste. Then the gas is guided through the connecting pipe, and the active adsorption block further processes the gas in the connecting pipe, and then guides it into the air heater, heats the air to a preset temperature, and guides it to the inside of the welding area, so as to utilize the residual heat in the air. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a three-dimensional structural diagram of the utility model;

[0014] Figure 2 for Figure 1 The enlarged view of point A in the middle;

[0015] Figure 3is a partial cross-sectional view of a processing box;

[0016] Figure 4 This is a three-dimensional structural diagram of the solder paste recovery board;

[0017] Figure 5 This is a three-dimensional structural diagram of the active adsorption block.

[0018] In the figure: 1. frame; 2. ceramic substrate; 3. welding area; 4. cooling area; 5. flexible partition curtain; 6. air duct; 7. shaft; 8. groove wheel; 9. transmission chain; 10. connecting rod; 11. driving motor; 12. processing box; 13. connecting pipe; 14. pump; 15. air heater; 16. cavity; 17. solder paste recovery board; 18. through hole; 19. active adsorption block. DETAILED DESCRIPTION

[0019] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0020] See also Figure 1-5An intelligent lead-free reflow soldering machine of the present embodiment includes a frame 1, which is made of fine steel. A transmission component is arranged at the upper middle part of the frame 1, and the transmission component is used to transport the PCB board to be reflow soldered. A plurality of ceramic substrates 2 are placed on the transmission component, and the PCB board is placed on the ceramic substrate 2. A welding area 3 is arranged at the upper left part of the frame 1, and the welding area 3 is divided into a preheating area, a constant temperature area, and a reflow area from left to right. A cooling area 4 is arranged at the upper right part of the frame 1, and the PCB board after reflow soldering is cooled. A flexible partition curtain 5 is arranged on the left side of the welding area 3, and the flexible partition curtain 5 reduces the heat loss in the welding area 3 and prevents the solder paste vapor from escaping. An air duct 6 is arranged between the welding area 3 and the cooling area 4, and a processing component is arranged above the air duct 6 to process the solder paste vapor. A control The panel is provided with a single-chip microcomputer, and the control panel is electrically connected to the electrical components in the device. The heating method in the welding area 3 is infrared heating, that is, heating by radiation through an infrared heat source, and the temperature in the furnace is uniform. The user operates the control panel to preset the temperature of the welding area 3, so that the heating slope of the preheating zone should be less than 3°C / sec, the set temperature should be at room temperature 130°C, the set temperature of the constant temperature zone is 130°C-160°C, and the constant temperature time is 60-120s, so that the temperature of the components on the PCB circuit board tends to be stable and the temperature difference is minimized as much as possible. The heating rate of the reflow zone is controlled at 2.5-3°C / s, and the peak temperature should generally be reached within 25s-30s. The cooling rate of the cooling section is generally 3-4°C / s to cool to 75°C, and the cooling slope is less than 4°C / s.

[0021] like Figure 1 , 2 As shown, the transmission component includes a shaft rod 7 respectively arranged on the left and right sides above the frame 1, a group of groove wheels 8 are arranged on the front and rear of the shaft rod 7, a transmission chain 9 is arranged in the front and rear corresponding groove wheels 8, and a plurality of connecting rods 10 are evenly arranged between the two transmission chains 9. A driving motor 11 is arranged at the rear left side of the frame 1, and the output end of the driving motor 11 is connected to the left shaft rod 7. The driving motor 11 is a servo motor, which is used to transport the PCB board to be reflowed through the transmission component.

[0022] like Figure 1 , 3As shown in Figures 4 and 5, the processing component includes a processing box 12 detachably arranged above the air duct 6, a connecting pipe 13 detachably arranged above the processing box 12, a pump 14 is arranged at the end of the connecting pipe 13, a conduit is arranged at the outlet of the pump 14, an air heater 15 is arranged on the welding area 3, the other end of the conduit is connected to the air heater 15, and the outlet end of the air heater 15 is extended to the inside of the welding area 3 through a pipe fitting. Through the structural setting of the processing component and the operation of the pump 14, the wind at the air duct 6 is diverted to avoid the cold and hot air in the welding area 3 and the cooling area 4 from diffusing to each other's temperature zones to affect the cooling of the PCB, and the solder paste vapor is processed by the processing box 12, and the heat in the air is recycled.

[0023] like Figure 3 As shown, a cavity 16 is provided on the side of the processing box 12, and a plurality of solder paste recovery plates 17 are arranged in parallel at the upper and lower parts of the processing box 12. The longitudinal section of the solder paste recovery plate 17 is a continuous zigzag structure, and a plurality of through holes 18 are evenly provided on the solder paste recovery plate 17. The solder paste recovery plate 17 and the processing box 12 are detachably arranged, so that the user can take the solder paste recovery plate 17 out of the processing box 12. The solder paste recovery plate 17 is made of copper, so that the solder paste recovery plate 17 has good thermal conductivity. The solder paste vapor passes through the solder paste recovery plate 17 to cool the solder paste vapor, and then adheres to the solder paste recovery plate 17 to recover the solder paste.

[0024] like Figure 5 As shown, an active adsorption block 19 is disposed in the connecting pipe 13 . The active adsorption block 19 is columnar and has a plurality of channels evenly formed therein to further process the gas passing through the connecting pipe 13 .

[0025] like Figure 1 , 3 As shown, a water inlet is provided on the left side of the processing box 12, and a water outlet is provided on the right side of the processing box 12. The water inlet and the water outlet are connected to the cavity 16, and the water inlet is externally connected to a cold water pipe, and the water outlet is externally connected to a water outlet pipe, so that cold water is passed into the cavity 16, and the temperature on the solder paste recovery plate 17 is reduced, so that the solder paste vapor passes through the solder paste recovery plate 17 and then cools the solder paste vapor, attaches to the solder paste recovery plate 17, and recovers the solder paste.

[0026] During the specific implementation of this embodiment, the user operates the control panel to preset the temperature of the welding area 3, so that the temperature of the area on the welding area 3 is adjusted. By controlling the operation of the transmission component, the driving motor 11 drives the shaft 7 to rotate, so that the transmission chain 9 rotates, and the PCB board to be reflowed is placed on the ceramic substrate 2, and then the ceramic substrate 2 is placed on the connecting rod 10 of the transmission chain 9, and the PCB board is transported to the welding area 3. Through the structural setting of the processing component, the cold and hot air in the welding area 3 and the cooling area 4 are prevented from diffusing to each other's temperature zones, affecting the cooling of the PCB, and the solder paste vapor is processed by the processing box 12, and the heat in the air is recycled. The user connects the water inlet to the cold water pipe and the water outlet to the outlet. Water pipe, and then cold water is passed into the cavity 16, thereby reducing the temperature on the solder paste recovery board 17. Through the operation of the pump 14, the wind at the air duct 6 is diverted, and then the air is introduced into the processing box 12. The gas contacts the solder paste recovery board 17, and the longitudinal section is a continuous zigzag structure and has been cooled. The solder paste vapor passes through the through hole 18 on the solder paste recovery board 17, and then the solder paste vapor is cooled and attached to the solder paste recovery board 17, which is convenient for the later recovery of the solder paste. The gas is then guided through the connecting pipe 13, and the active adsorption block 19 further processes the gas in the connecting pipe 13, and then introduced into the air heater 15, the air is heated to a preset temperature, and guided to the inside of the welding area 3, thereby utilizing the waste heat in the air.

[0027] Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. An intelligent lead-free reflow soldering machine, comprising a frame (1), characterized in that: A transmission component is arranged in the middle of the upper part of the frame (1), a plurality of ceramic substrates (2) are placed on the transmission component, a welding area (3) is arranged in the upper left part of the frame (1), a cooling area (4) is arranged in the upper right part of the frame (1), a flexible partition curtain (5) is arranged on the left side of the welding area (3), an air duct (6) is arranged between the welding area (3) and the cooling area (4), a processing component is arranged above the air duct (6), and a control panel is arranged on the frame (1).

2. The intelligent lead-free reflow soldering machine according to claim 1, characterized in that: The transmission assembly comprises a shaft (7) respectively arranged on the left and right sides above the frame (1); a group of groove wheels (8) are arranged on the front and rear of the shaft (7); a transmission chain (9) is arranged in the front and rear corresponding groove wheels (8); a plurality of connecting rods (10) are evenly arranged between the two transmission chains (9); a driving motor (11) is arranged at the rear left side of the frame (1); and an output end of the driving motor (11) is connected to the shaft (7) on the left side.

3. The intelligent lead-free reflow soldering machine according to claim 1, characterized in that: The processing assembly comprises a processing box (12) detachably arranged above the air duct (6); a connecting pipe (13) detachably arranged above the processing box (12); a pump (14) is arranged at the end of the connecting pipe (13); a conduit is arranged at the outlet of the pump (14); an air heater (15) is arranged on the welding area (3); the other end of the conduit is connected to the air heater (15); and the outlet of the air heater (15) is extended into the welding area (3) through a pipe fitting.

4. The intelligent lead-free reflow soldering machine according to claim 3, characterized in that: A cavity (16) is provided on the side of the processing box (12), and a plurality of solder paste recovery plates (17) are arranged in parallel at the top and bottom of the processing box (12). The longitudinal cross-section of the solder paste recovery plates (17) is a continuous zigzag structure, and a plurality of through holes (18) are evenly provided on the solder paste recovery plates (17).

5. The intelligent lead-free reflow soldering machine according to claim 4, characterized in that: An active adsorption block (19) is arranged in the connecting pipe (13); the active adsorption block (19) is columnar and has a plurality of holes evenly arranged in the active adsorption block (19).

6. The intelligent lead-free reflow soldering machine according to claim 5, characterized in that: A water inlet is provided on the left side of the processing box (12), and a water outlet is provided on the right side of the processing box (12), and the water inlet and the water outlet are connected to the cavity (16).

Images