High-power radio frequency connection assembly

Abstract

The utility model provides a high-power radio frequency connection assembly. The high-power radio frequency connection assembly comprises a first radio frequency connection piece, a second radio frequency connection piece and a third radio frequency connection piece which are connected in sequence. The first radio frequency connecting piece is provided with an upper end and a lower end, the upper end is provided with a lengthened clamp spring structure and is connected with a substrate radio frequency connecting rod, and the lower end is provided with an external thread structure and is connected with the second radio frequency connecting piece; the upper end of the second radio frequency connecting piece is of an internal thread structure and is connected with the first radio frequency connecting piece, and the lower end of the second radio frequency connecting piece is of an external thread structure and is connected with the third radio frequency connecting piece; the third radio frequency connecting piece is bent, the upper end of the third radio frequency connecting piece is of an internal thread structure and is connected with the second radio frequency connecting piece, and the lower end of the third radio frequency connecting piece is provided with a socket hole and is connected with a radio frequency generating device.

Description

Technical Field

[0001] The utility model relates to a connector, in particular to a radio frequency connection component. Background Art

[0002] A spray plate and a heating plate are provided in the reaction chamber of the plasma enhanced thin film deposition equipment. The substrate to be processed can be placed between the spray plate and the heating plate which are arranged opposite to each other. The spray plate is used to provide reaction gas to the substrate to be processed. At the same time, the spray plate can also serve as an RF electrode plate. The RF power supply can provide RF power to the spray plate via an RF matcher, thereby forming an electric field between the spray plate and the heating plate for process treatment. The heating plate may include an RF grounding electrode. The RF grounding electrode can be connected to a heating plate RF electrode perpendicular to the heating plate. The heating plate RF electrode can be connected to a tuner via an RF connection structure.

[0003] During deposition, the radio frequency needs to increase its power. After the power is increased, the existing radio frequency connection structure generates heat due to the high-power current passing through, and the heat exceeds the heat resistance of the existing connection components.

[0004] Therefore, there is an urgent need for a new type of RF connection component to solve the problem of excessive temperature of high-power RF connections. Utility Model Content

[0005] In order to solve the problem of excessively high temperature of high-power radio frequency connections, the utility model provides a high-power radio frequency connection component.

[0006] The high-power radio frequency connection component comprises a first radio frequency connection piece, a second radio frequency connection piece and a third radio frequency connection piece which are connected in sequence.

[0007] The first RF connector has an upper end and a lower end, the upper end has an extended spring structure, connected to the base RF connecting rod, and the lower end has an external thread structure, connected to the second RF connector; the upper end of the second RF connector is an internal thread structure, connected to the first RF connector, the lower end of the second RF connector is an external thread structure, connected to the third RF connector; the third RF connector is bent, the upper end of the third RF connector is an internal thread structure, connected to the second RF connector, and the lower end of the third RF connector has a socket hole, connected to the RF generating device.

[0008] In one embodiment, a surface of the first RF connector has a conductive gold plating layer.

[0009] In one embodiment, a wrench bayonet structure is provided at the middle portion of the first RF connector.

[0010] In one embodiment, the second RF connector is made of high thermal resistance material.

[0011] In one embodiment, the high thermal resistance material includes chrome alloy or stainless steel.

[0012] In one embodiment, a surface of the second RF connector has a conductive gold plating layer.

[0013] In one embodiment, a wrench bayonet structure is provided on the upper and lower parts of the second RF connector.

[0014] In one embodiment, a wrench bayonet structure is provided on the upper portion of the third RF connector.

[0015] In one embodiment, a surface of the third RF connector has a conductive gold plating layer. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] The above utility model content and the following specific embodiments of the utility model will be better understood when read in conjunction with the accompanying drawings. It should be noted that the accompanying drawings are only examples of the utility model claimed for protection. In the accompanying drawings, the same reference numerals represent the same or similar elements.

[0017] Figure 1 A radio frequency connection assembly according to an embodiment of the utility model is shown;

[0018] Figure 2 A cross-sectional view showing a radio frequency connection assembly according to an embodiment of the present utility model;

[0019] Figure 3A A schematic diagram showing a first radio frequency connection assembly according to an embodiment of the utility model;

[0020] Figure 3B A cross-sectional view showing a first radio frequency connection assembly according to an embodiment of the present utility model;

[0021] Figure 4A A schematic diagram showing a second radio frequency connection assembly according to an embodiment of the present utility model;

[0022] Figure 4B A cross-sectional view showing a second radio frequency connection assembly according to an embodiment of the present utility model;

[0023] Figure 5A A schematic diagram showing a third radio frequency connection assembly according to an embodiment of the present utility model;

[0024] Figure 5B A cross-sectional view of a third radio frequency connection assembly according to an embodiment of the present invention is shown. DETAILED DESCRIPTION

[0025] The detailed features and advantages of the utility model are described in detail in the specific implementation mode below, and the content is sufficient for any technical personnel in the field to understand the technical content of the utility model and implement it accordingly, and according to the specification, claims and drawings disclosed in this specification, the technical personnel in the field can easily understand the relevant purposes and advantages of the utility model. Although the description of the utility model will be introduced in conjunction with the preferred embodiment, this does not mean that the features of this utility model are limited to this implementation mode. On the contrary, the purpose of introducing the utility model in conjunction with the implementation mode is to cover other options or modifications that may be extended based on the claims of the utility model. In order to provide an in-depth understanding of the utility model, the following description will include many specific details. The utility model can also be implemented without using these details. In addition, in order to avoid confusion or blurring the focus of the utility model, some specific details will be omitted in the description.

[0026] In the description of the present invention, it should be noted that, unless otherwise clearly specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0027] In addition, the terms "upper", "lower", "left", "right", "top", "bottom", "horizontal" and "vertical" used in the following description should be understood as the directions shown in the paragraph and the related drawings. Such relative terms are only used for the convenience of description and do not mean that the device described therein must be manufactured or operated in a specific direction, and therefore should not be understood as limiting the present invention.

[0028] It is understood that although the terms "first", "second", "third", etc. may be used herein to describe various components, channels, components, regions, layers and / or parts, these components, channels, components, regions, layers and / or parts should not be limited by these terms, and these terms are only used to distinguish different components, channels, components, regions, layers and / or parts. In addition, the terms "first", "second", "third" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0029] As shown in this application and claims, unless the context clearly indicates an exception, the words "a", "an", "an" and / or "the" do not refer to the singular and may also include the plural. Generally speaking, the terms "include" and "comprise" only indicate the inclusion of the steps and elements that have been clearly identified, and these steps and elements do not constitute an exclusive list. The method or device may also include other steps or elements.

[0030] In some embodiments, numbers describing the number of components and attributes are used. It should be understood that such numbers used in the description of the embodiments are modified by the modifiers "about", "approximately" or "substantially" in some examples. Unless otherwise specified, "about", "approximately" or "substantially" indicate that the numbers are allowed to vary by ±20%. Accordingly, in some embodiments, the numerical parameters used in the specification and claims are approximate values, which may change according to the required features of individual embodiments. In some embodiments, the numerical parameters should take into account the specified significant digits and adopt the general method of retaining digits. Although the numerical domains and parameters used to confirm the breadth of their range in some embodiments of the present application are approximate values, in specific embodiments, the setting of such numerical values ​​is as accurate as possible within the feasible range.

[0031] At the same time, the present application uses specific words to describe the embodiments of the present application. For example, "one embodiment", "an embodiment", and / or "some embodiments" refer to a certain feature, structure or characteristic related to at least one embodiment of the present application. Therefore, it should be emphasized and noted that "one embodiment" or "an embodiment" or "an alternative embodiment" mentioned twice or more in different positions in this specification does not necessarily refer to the same embodiment. In addition, some features, structures or characteristics in one or more embodiments of the present application can be appropriately combined.

[0032] A spray plate and a heating plate are provided in the reaction chamber of the plasma enhanced thin film deposition equipment. The substrate to be processed can be placed between the spray plate and the heating plate which are arranged opposite to each other. The spray plate is used to provide reaction gas to the substrate to be processed. At the same time, the spray plate can also serve as an RF electrode plate. The RF power supply can provide RF power to the spray plate via an RF matcher, thereby forming an electric field between the spray plate and the heating plate for process treatment. The heating plate may include an RF grounding electrode. The RF grounding electrode can be connected to a heating plate RF electrode perpendicular to the heating plate. The heating plate RF electrode can be connected to a tuner via an RF connection structure.

[0033] During deposition, the radio frequency needs to increase its power. After the power is increased, the existing radio frequency connection structure generates heat due to the high-power current passing through, and the heat exceeds the heat resistance of the existing connection components.

[0034] Therefore, in order to solve the problem of high temperature of high-power RF connection, the utility model provides a high-power RF connection component. The high-power RF connection component includes a first RF connector, a second RF connector and a third RF connector which are connected in sequence.

[0035] The first RF connector has an upper end and a lower end, the upper end has an extended spring structure, connected to the base RF connecting rod, and the lower end has an external thread structure, connected to the second RF connector; the upper end of the second RF connector is an internal thread structure, connected to the first RF connector, the lower end of the second RF connector is an external thread structure, connected to the third RF connector; the third RF connector is bent, the upper end of the third RF connector is an internal thread structure, connected to the second RF connector, and the lower end of the third RF connector has a socket hole, connected to the RF generating device.

[0036] In one embodiment, a surface of the first RF connector has a conductive gold plating layer.

[0037] In one embodiment, a wrench bayonet structure is provided at the middle portion of the first RF connector.

[0038] In one embodiment, the second RF connector is made of high thermal resistance material.

[0039] In one embodiment, the high thermal resistance material includes chrome alloy or stainless steel.

[0040] In one embodiment, a surface of the second RF connector has a conductive gold plating layer.

[0041] In one embodiment, a wrench bayonet structure is provided on the upper and lower parts of the second RF connector.

[0042] In one embodiment, a wrench bayonet structure is provided on the upper portion of the third RF connector.

[0043] In one embodiment, a surface of the third RF connector has a conductive gold plating layer.

[0044] Figure 1 A radio frequency connection assembly according to an embodiment of the present invention is shown. Figure 2 A cross-sectional view of a radio frequency connection assembly according to an embodiment of the present invention is shown. Figure 1 and Figure 2 As shown, the RF connection assembly includes a first RF connector 101, a second RF connector 102 and a third RF connector 103. The first RF connector 101 is connected to the base RF connection rod, and the third RF connector 103 is connected to the RF generating device. The first RF connector 101, the second RF connector 102 and the third RF connector 103 are connected end to end.

[0045] Figure 3A A schematic diagram of a first radio frequency connection assembly according to an embodiment of the present invention is shown. Figure 3B FIG. 2 is a cross-sectional view of a first radio frequency connection assembly according to an embodiment of the present invention. Figure 1 , Figure 2 as well as Figure 3A , Figure 3B The first RF connector is connected to the base RF connector rod via an extended spring structure. The first RF connector 101 is connected to the second RF connector via a thread.

[0046] In one embodiment, a conductive gold layer is plated on the surface of the first RF connector 101 .

[0047] In one embodiment, one end of the first RF connector 101 is an extended spring structure that can be connected to the base RF connecting rod, and the other end is an external thread structure that is connected to the second RF connector 102 .

[0048] In one embodiment, a wrench bayonet structure 301 is disposed in the middle of the first RF connector 101 .

[0049] Figure 4A A schematic diagram showing a second radio frequency connection assembly according to an embodiment of the present invention is shown. Figure 4B FIG. 2 is a cross-sectional view of a second radio frequency connection assembly according to an embodiment of the present invention. Figure 1 , Figure 2 as well as Figure 4A , Figure 4B The second RF connector 102 is connected to the third RF connector 103 via threads.

[0050] In one embodiment, the second RF connector 102 is made of high thermal resistance material.

[0051] In one embodiment, the second RF connector 102 uses chrome alloy or stainless steel as a high thermal resistance material.

[0052] In one embodiment, the second RF connector 102 is plated with a conductive gold layer on its surface.

[0053] In one embodiment, one end of the second RF connector 102 is an internal thread structure connected to the first RF connector 101 , and the other end is an external thread structure connected to the third RF connector 103 .

[0054] In one embodiment, a wrench bayonet structure 401 is disposed on the upper and lower parts of the second RF connector 102 .

[0055] Figure 5A A schematic diagram showing a third radio frequency connection assembly according to an embodiment of the present utility model is shown. Figure 5B FIG. 2 is a cross-sectional view of a third radio frequency connection assembly according to an embodiment of the present invention. Figure 1 , Figure 2 as well as Figure 5A , Figure 5BOne end of the third RF connector 103 is an internal thread structure that can be connected to the second RF connector 102, and the other end is a socket hole connected to the RF generating device.

[0056] In one embodiment, a wrench bayonet structure 501 is disposed on the upper portion of the third RF connector 103 .

[0057] In one embodiment, the third RF connector 103 is plated with a conductive gold layer on its surface.

[0058] In one embodiment, the third RF connector 103 is bent.

[0059] The terms and expressions used above are for description only, and the present invention should not be limited to these terms and expressions. The use of these terms and expressions does not mean to exclude any equivalent features of the illustrations and descriptions (or parts thereof), and it should be recognized that various modifications that may exist should also be included in the scope of the claims. Other modifications, changes and substitutions may also exist. Accordingly, the claims should be deemed to cover all such equivalents.

[0060] Similarly, it should be noted that in order to simplify the description of the disclosure of this application and thus facilitate the understanding of one or more utility model embodiments, in the above description of the embodiments of this application, multiple features are sometimes combined into one embodiment, drawing or description thereof. However, this disclosure method does not mean that the features required by the object of this application are more than the features mentioned in the claims.

[0061] Similarly, it should be pointed out that although the present invention has been described with reference to the current specific embodiments, ordinary technicians in this technical field should realize that the above embodiments are only used to illustrate the present invention, and various equivalent changes or substitutions can be made without departing from the spirit of the present invention. Therefore, as long as the changes and modifications to the above embodiments are within the scope of the essential spirit of the present invention, they will fall within the scope of the claims of this application.

Claims

1. A high-power radio frequency connection component, characterized in that: The high-power radio frequency connection component comprises: A first radio frequency connector, a second radio frequency connector, and a third radio frequency connector connected in sequence; The first RF connector has an upper end and a lower end, the upper end has an extended clip structure connected to the base RF connecting rod, and the lower end has an external thread structure connected to the second RF connector; The upper end of the second RF connector is an internal thread structure, connected to the first RF connector, and the lower end of the second RF connector is an external thread structure, connected to the third RF connector; The third RF connector is bent, the upper end of the third RF connector is an internal thread structure, connected to the second RF connector, and the lower end of the third RF connector has a socket hole, connected to the RF generating device.

2. The high-power radio frequency connection assembly according to claim 1, characterized in that: The surface of the first radio frequency connector has a conductive gold plating layer.

3. The high-power radio frequency connection assembly according to claim 1, characterized in that: A wrench bayonet structure is provided in the middle of the first radio frequency connector.

4. The high-power radio frequency connection assembly according to claim 1, characterized in that: The second radio frequency connector is made of high thermal resistance material.

5. The high-power radio frequency connection assembly according to claim 1, characterized in that: A conductive gold plating layer is provided on the surface of the second radio frequency connector.

6. The high-power radio frequency connection assembly according to claim 1, characterized in that: The upper and lower parts of the second radio frequency connector are provided with a wrench bayonet structure.

7. The high-power radio frequency connection assembly according to claim 1, characterized in that: A wrench bayonet structure is provided on the upper portion of the third radio frequency connector.

8. The high-power radio frequency connection assembly according to claim 1, characterized in that: The surface of the third radio frequency connector has a conductive gold plating layer.

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