Test probe and test equipment
By integrating heating parts and probes into the test probes, the heating and testing functions of the probes are achieved, which solves the problem of cumbersome flying wires and prone to short circuits in circuit board testing, and improves the safety and efficiency of the test.
Patent Information
- Application Number
- CN202420336519.6
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-02-23
- Publication Date
- 2025-01-17
- Estimated Expiration
- 2034-02-23
Smart Images
Figure CN222365032U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of testing equipment, and specifically provides a testing probe and testing equipment. Background Art
[0002] During the development, use or maintenance of electronic equipment, testing of circuit boards is a key step in ensuring the normal operation of the equipment. In order to accurately measure the electrical signal of a device in a circuit board, testers usually use flying wires at the device location and use an oscilloscope or multimeter to measure. However, although this method is relatively convenient and fast, it still has some defects. For example, the flying wire connection process is quite cumbersome and requires the use of tools such as soldering guns. In addition, flying wires are prone to short circuit risks, causing potential damage to the circuit board and may even pose a safety threat to testers.
[0003] Therefore, this field needs a new technical solution to solve the above problems. Utility Model Content
[0004] The utility model aims to solve the above technical problems, that is, to solve the problem that the process of measuring electrical signals by flying wires in the existing circuit board test is cumbersome and easy to cause short circuit risks. The application provides a test probe, which includes:
[0005] A probe body, wherein a first accommodating cavity is formed inside the probe body;
[0006] A heating element, wherein the heating element is disposed in the first accommodating cavity;
[0007] The probe is arranged on the probe body and is configured to be connected to the heating element and the test input terminal respectively so that the probe can have the functions of heating and testing at the same time.
[0008] In the preferred technical solution of the above test probe, a second accommodating cavity independent of the first accommodating cavity is further formed inside the probe body;
[0009] At least a portion of a wire for connecting the test input terminal and the probe is disposed in the second accommodating cavity.
[0010] In a preferred technical solution of the above test probe, the test probe further includes a partition, and the partition divides the internal space of the probe body into the first accommodating chamber and the second accommodating chamber.
[0011] In the preferred technical solution of the above test probe, the test probe further includes a heat insulation tube, and the heat insulation tube is sleeved on the heating element.
[0012] In a preferred technical solution of the above-mentioned test probe, the test probe further includes a heating circuit board connected to the heating element, and the heating circuit board is arranged in a region formed by an outer wall of the insulation tube and an inner wall of the first accommodating cavity.
[0013] In a preferred technical solution of the above test probe, the test probe further comprises a temperature adjustment component connected to the heating element, and the temperature adjustment component is arranged on the outer wall of the probe body or outside the probe body.
[0014] In the preferred technical solution of the above-mentioned test probe, the temperature adjustment component is a temperature adjustment knob or a temperature adjustment button.
[0015] In the preferred technical solution of the above test probe, the heating element is a heating wire or a heating tube.
[0016] In a preferred technical solution of the above test probe, the test probe further includes an insulating member, on which the heating wire or the heating tube is coiled.
[0017] In a preferred technical solution of the above test probe, the test probe further includes a heating input end which is arranged on the probe body or outside the probe body and connected to the heating element.
[0018] In the preferred technical solution of the above test probe, the heating input end is a plug or an interface.
[0019] In the preferred technical solution of the above test probe, the test input end is a plug or an interface.
[0020] The present application also provides a testing device, which includes the testing probe described in the above preferred technical solution.
[0021] Solution 1. A test probe, characterized in that the test probe comprises:
[0022] A probe body, wherein a first accommodating cavity is formed inside the probe body;
[0023] A heating element, wherein the heating element is disposed in the first accommodating cavity;
[0024] The probe is arranged on the probe body and is connected to the heating element and the test input terminal respectively, so that the probe can have the functions of heating and testing at the same time.
[0025] Solution 2. The test probe according to Solution 1 is characterized in that a second accommodating cavity independent of the first accommodating cavity is formed inside the probe body;
[0026] At least a portion of a wire for connecting the test input terminal and the probe is disposed in the second accommodating cavity.
[0027] Solution 3. The test probe according to Solution 2 is characterized in that the test probe also includes a partition, which divides the internal space of the probe body into the first accommodating cavity and the second accommodating cavity.
[0028] Solution 4. The test probe according to Solution 1 is characterized in that the test probe also includes an insulation tube, and the insulation tube is sleeved on the heating element.
[0029] Solution 5. The test probe according to Solution 4 is characterized in that the test probe also includes a heating circuit board connected to the heating element, and the heating circuit board is arranged in the area formed by the outer wall of the insulation tube and the inner wall of the first accommodating cavity.
[0030] Solution 6. The test probe according to Solution 1 is characterized in that the test probe also includes a temperature adjustment component connected to the heating element, and the temperature adjustment component is arranged on the outer wall of the probe body or outside the probe body.
[0031] Solution 7. The test probe according to Solution 6 is characterized in that the temperature adjustment component is a temperature adjustment knob or a temperature adjustment button.
[0032] Solution 8. The test probe according to Solution 1 is characterized in that the heating element is a heating wire or a heating tube.
[0033] Solution 9. The test probe according to Solution 8 is characterized in that the test probe also includes an insulating member arranged in the first accommodating cavity, and the heating wire or the heating tube is coiled on the insulating member.
[0034] Solution 10. The test probe according to Solution 1 is characterized in that the test probe also includes a heating input end arranged on the outer wall of the probe body or outside the probe body and connected to the heating element.
[0035] Solution 11. The test probe according to Solution 10 is characterized in that the heating input end is a plug or an interface.
[0036] Solution 12. The test probe according to Solution 1 is characterized in that the test input end is a plug or an interface.
[0037] Solution 13. A testing device, characterized in that the testing device comprises the test probe described in any one of Solutions 1-12.
[0038] It can be understood by those skilled in the art that the test probe of the present invention integrates a heating element inside the probe body, and the heating element and the test input terminal can be connected to the probe at the same time, so that the probe has both heating and testing functions. Before testing the device on the circuit board, the probe is heated and fixed to the device with welding wire, and the device on the circuit board can be tested after the probe cools down. After the test is completed, the probe is separated from the device by heating the probe. Compared with the flying wire method for testing devices on the circuit board in the prior art, the present application is not only easy to use, simple to operate, and has high testing efficiency, but also can effectively avoid the problem that the flying wire method is cumbersome and easy to cause short circuit risks in the process of measuring electrical signals.
[0039] Furthermore, by passing the wire of the test input end through the second accommodating cavity and connecting with the probe, conflicts between the wire and other components or structures are avoided, thereby improving space utilization.
[0040] Furthermore, the space inside the probe body is reasonably divided into two independent accommodating chambers by the partition, so that the heating element and the wires of the test input end can be arranged in an orderly manner, avoiding mutual interference.
[0041] Furthermore, by arranging a heat-insulating tube on the heating element, other components in the first accommodating chamber can be protected from being affected by the heat generated by the heating element.
[0042] Furthermore, by arranging the heating circuit board in the area formed by the outer wall of the heat insulation tube and the inner wall of the first accommodating cavity, it is possible to avoid protecting the heating circuit board from being affected by the heat generated by the heating element.
[0043] Furthermore, by winding the heating wire or the heating tube on the insulating member, on the one hand, the stability of the heating wire or the heating tube can be increased, and on the other hand, the problem of leakage of the heating wire or the heating tube during operation can be avoided. BRIEF DESCRIPTION OF THE DRAWINGS
[0044] The preferred embodiments of the present invention are described below in conjunction with the accompanying drawings, in which:
[0045] Figure 1 It is a cross-sectional view of the test probe of the utility model;
[0046] Figure 2 It is a schematic diagram of an oscilloscope of the utility model.
[0047] List of reference numerals:
[0048] 1. Test probe; 11. Probe body; 111. First accommodating cavity; 112. Second accommodating cavity; 12. Heating wire; 13. Probe; 14. Partition; 15. Heating circuit board; 16. First plug; 17. First wire; 18. Second plug; 19. Second wire; 2. Test equipment body; 3. Test circuit board. DETAILED DESCRIPTION
[0049] The preferred embodiments of the present application are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only used to explain the technical principles of the present application and are not intended to limit the scope of protection of the present application. For example, although the present embodiment is introduced in conjunction with an oscilloscope, this is not intended to limit the scope of protection of the present application. Without departing from the principles of the present application, those skilled in the art may apply the present application to other types of electrical equipment. For example, a multimeter, etc.
[0050] It should be noted that, in the description of the present application, terms such as "upper", "lower", "inner", "bottom" and the like indicating directions or positional relationships are based on the directions or positional relationships shown in the drawings. This is merely for the convenience of description and does not indicate or imply that the device or element must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be understood as a limitation on the present application.
[0051] In addition, it should be noted that in the description of this application, unless otherwise clearly specified and limited, the terms "disposed" and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, a direct connection, or an indirect connection through an intermediate medium, or it can be the internal communication of two elements. For those skilled in the art, the specific meanings of the above terms in this application can be understood according to the specific circumstances.
[0052] See first Figure 1 The test probe of the present application is introduced.
[0053] like Figure 1 As shown, in order to solve the problem that the process of measuring electrical signals by flying wires in the prior art during the test of the existing circuit board is cumbersome and easy to cause the risk of short circuit, the test probe 1 of the present application includes a probe body 11, a heating element and a probe 13. Among them, a first accommodating cavity 111 is formed inside the probe body 11, the heating element is arranged in the first accommodating cavity 111, the probe 13 is arranged on the probe body 11, and the probe 13 is respectively connected to the heating element and the test input end so that the probe 13 can have the functions of heating and testing at the same time.
[0054] The present application integrates a heating element inside the probe body 11, and the heating element and the test input terminal can be connected to the probe 13 at the same time, so that the probe 13 has both heating and testing functions. Before testing the device on the circuit board 3, the probe 13 is heated and fixed to the device on the circuit board with welding wire. After the probe 13 cools down, the device on the test circuit board 3 can be tested. After the test is completed, the probe 13 is separated from the device by heating the probe 13. Compared with the flying line method for testing devices on the circuit board in the prior art, the present application is not only easy to use, simple to operate, and has high testing efficiency, but also can effectively avoid the problem that the flying line method is cumbersome and easy to cause short circuit risks in the process of measuring electrical signals.
[0055] See below for further reference Figure 1 , a preferred embodiment of the test probe 1 of the present application is introduced. Those skilled in the art will understand that the embodiments described below are only used to illustrate the principles of the present application and are not intended to limit the scope of protection of the present application. On the premise that the test probe 1 at least includes a probe body 11, a heating element and a probe 13, those skilled in the art can adjust the following settings so that the present application can be applied to more specific application scenarios.
[0056] Reference Figure 1 The probe body 11 is a columnar structure, and a partition 14 is provided in its internal space. The partition 14 divides the internal space into a first accommodating chamber 111 and a second accommodating chamber 112. The partition 14 and the probe body 11 are integrally formed, and the material is a heat-insulating material, which can prevent the heating element and the probe 13 from deforming under high temperature conditions.
[0057] Of course, the configuration of the probe body 11 is not fixed in the present application, and those skilled in the art can adjust it according to the specific application scenario. For example, the shape of the probe body 11 can also be a cuboid or other polyhedron. Alternatively, the shape of the probe body 11 can also be other irregular shapes. In addition, in other preferred embodiments, the configuration of the second accommodating cavity 112 is not necessary, and those skilled in the art can adjust it according to the configuration needs.
[0058] In addition, the present application does not have a fixed connection method between the partition 14 and the probe body 11, and those skilled in the art can choose it as needed. For example, the partition 14 and the probe body 11 can be connected by bonding or the like. In addition, the present application has no restrictions on the material of the partition 14 and the probe body 11, as long as they can be insulated. For example, the insulation material can be asbestos, etc.
[0059] See next Figure 1The probe 13 is arranged at one end of the probe body 11 in the axial direction, and partially extends into the first accommodation cavity 111 and the second accommodation cavity 112. The heating wire 12 is arranged in the first accommodation cavity 111, and one end of the heating wire 12 is connected to the probe 13 extending into the first accommodation cavity 111. The probe 13 is cone-shaped and made of metal. When the heating wire 12 is heated, the heat can be transferred to the probe 13, so that the temperature of the probe 13 increases, so that the probe 13 can be fixed on the device of the test circuit board 3 under the action of the tin wire.
[0060] Of course, the setting position of the probe 13 in the present application is not fixed, and those skilled in the art can adjust it according to the setting needs. For example, the probe 13 can be set on the side wall of the probe body 11. In addition, the present application has no restrictions on the material of the probe 13, as long as it is conducive to heat conduction. For example, the material of the probe can be low carbon steel, etc. In addition, the setting form of the heating element in the present application is not fixed, and those skilled in the art can adjust it according to the setting needs. For example, the heating element can also be a heating tube.
[0061] In addition, the arrangement of the probe 13 in the present application is not fixed, and those skilled in the art can adjust it according to the specific application scenario. For example, the probe 13 only needs to be arranged at one end of the axial direction of the probe body 11, and part of it does not need to extend into the first accommodating cavity 111 and / or the second accommodating cavity 112. Taking the case where part of the probe body 11 does not extend into the first accommodating cavity 111 as an example, a hole can be set on the end surface of the probe body 11 that contacts the probe 13, and one end of the heating wire 12 can pass through the hole to connect with the probe 13.
[0062] See next Figure 1 The heating wire 12 is coiled on the hollow porcelain tube (not shown in the figure) in the first accommodating cavity, and mica sheets are filled in the hollow porcelain tube, which can increase the stability of the heating wire 12 and avoid leakage problems when the heating wire 12 is working. The heating wire 12 is covered with a heat insulation tube (not shown in the figure), and the heating circuit board 15 is arranged in the area formed by the outer wall of the heat insulation tube and the inner wall of the first accommodating cavity 111. The heat insulation tube can protect the heating circuit board 15 in the first accommodating cavity 111 from the heat generated by the heating element.
[0063] Of course, the setting form of the insulating member in this application is not fixed, and those skilled in the art can adjust it according to the setting needs. For example, the insulating member can also be a solid ceramic column. In addition, the material of the insulating member in this application is not fixed. In other preferred embodiments of the present invention, the insulating tube can also be a quartz tube, and the glass tube is filled with quartz sand. In addition, in other preferred embodiments, the setting of the mica sheet is not necessary, and those skilled in the art can choose it according to the setting needs.
[0064] It should be noted that when the heating element is a heating tube, the heating tube can also be coiled on a hollow porcelain tube, and the hollow porcelain tube can also be filled with mica sheets.
[0065] See next Figure 1 A second plug 18 is provided outside the probe body 11. The part of the second wire 19 connected to the second plug 18 passes through the probe body 11 and extends into the first accommodating cavity 111, and is connected to the heating circuit board 15 arranged in the first accommodating cavity 111. The heating circuit board 15 and the heating wire 12, when testing the device on the test circuit board 3, the second plug 18 can be connected to the power supply, the heating circuit board 15 receives the electric energy, and transmits the electric energy to the heating wire 12, so that the heating wire 12 generates heat and transmits it to the probe 13. The tin wire is melted by the probe 13 so that the probe 13 can be fixed on the test circuit board 3 after cooling, so that the probe can measure the electrical signal of the device, thereby eliminating the need to use the flying line method to measure the electrical signal of the device on the test circuit board 3, avoiding the problem that the flying line method is cumbersome and easy to cause short circuit risk.
[0066] Of course, the present application does not have a fixed setting position and setting form for the heating input terminal, and those skilled in the art can adjust it according to the setting needs. For example, the heating input terminal can also be set on the outer wall of the probe body 11, and the second wire 19 is set in the first accommodating cavity 111, and connected to the heating input terminal through an external power line, so as to achieve the purpose of heating the probe 13. And / or, the heating input terminal can also be an interface.
[0067] See next Figure 1 A temperature adjustment knob (not shown in the figure) can be provided on the outer wall of the probe body 11, and the temperature adjustment knob is connected to the heating wire 12 through the heating circuit board 15. The temperature of the heating wire 12 can be controlled by rotating the temperature adjustment knob.
[0068] Of course, the specific setting form and setting position of the temperature adjustment component are not fixed in this application, and those skilled in the art can adjust it according to the setting needs. For example, the temperature adjustment component can also be a temperature adjustment button, which can be a touch button or a mechanical button, and the temperature of the heating wire 12 can also be controlled by the button. And / or, the temperature adjustment component can also be set outside the probe body 11, and the temperature adjustment component is connected to the heating circuit board 15 through a wire.
[0069] See next Figure 1 A first plug 16 that can be connected to the oscilloscope body 2 is also provided outside the probe body 11, and a first wire 17 is connected between the first plug 16 and the probe 13. Part of the wire can pass through the probe body 11 and extend into the second accommodating cavity 112 to connect with the probe 13, so that the probe 13 can test the devices on the test circuit board 3.
[0070] Of course, the setting position and setting form of the test input terminal are not fixed in this application, and those skilled in the art can adjust them according to the setting needs. For example, the test input terminal can also be set on the outer wall of the probe body 11, and the first wire 17 is completely set in the second accommodating cavity 112, and connected to the test input terminal through an external test line, so as to achieve the purpose of testing the probe 13. And / or, the test input terminal can also be an interface.
[0071] In addition, the utility model also provides a testing device, which includes the testing probe 1 in any one of the above embodiments.
[0072] The test equipment may be an oscilloscope or a multimeter.
[0073] Taking the oscilloscope as an example, combined with Figure 1 and Figure 2 The following is an explanation of how to use the oscilloscope in this application:
[0074] When the oscilloscope tests the device on the test circuit board 3, the second plug 18 is connected to the power supply, the temperature knob is rotated to the set high temperature (higher than the melting point of the tin wire), the heating wire 12 is heated and the heat is transferred to the probe 13, and after the temperature of the probe 13 reaches the set high temperature, the temperature knob is rotated to 0, and after the probe 13 is placed on the device, the tin wire contacts the probe 13. Since the set high temperature is higher than the melting point of the tin wire, the tin wire contacts the probe 13 and melts. After the probe 13 cools down to room temperature, the probe 13 can be fixed on the device under the action of the tin wire. After the probe 13 cools down and is fixed on the device, the first plug 16 is connected to the oscilloscope body 2, and the oscilloscope body measures the electrical signal of the device on the test circuit board 3. After the test is completed, the temperature knob is rotated to the set high temperature (higher than the melting point of the tin wire), and the solidified tin melts again at high temperature. At this time, the test probe 1 can be separated from the device, and the test of a device in the test circuit board 3 is completed.
[0075] Those skilled in the art will appreciate that, although some embodiments herein include certain features included in other embodiments but not other features, the combination of features of different embodiments is meant to be within the scope of the present application and form different embodiments. For example, in the claims of the present application, any one of the claimed embodiments may be used in any combination.
[0076] So far, the technical solutions of the present application have been described in conjunction with the preferred embodiments shown in the accompanying drawings. However, it is easy for those skilled in the art to understand that the protection scope of the present application is obviously not limited to these specific embodiments. Without departing from the principles of the present application, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after these changes or substitutions will fall within the protection scope of the present application.
Claims
1. A test probe, characterized in that: The test probe comprises: A probe body, wherein a first accommodating cavity is formed inside the probe body; A heating element, wherein the heating element is disposed in the first accommodating cavity; The probe is arranged on the probe body and is connected to the heating element and the test input terminal respectively, so that the probe can have the functions of heating and testing at the same time.
2. The test probe according to claim 1, characterized in that: A second accommodating cavity independent of the first accommodating cavity is also formed inside the probe body; At least a portion of a wire for connecting the test input terminal and the probe is disposed in the second accommodating cavity.
3. The test probe according to claim 2, characterized in that: The test probe further includes a partition plate, which divides the inner space of the probe body into the first accommodating cavity and the second accommodating cavity.
4. The test probe according to claim 1, characterized in that: The test probe further comprises a heat-insulating tube, and the heat-insulating tube is sleeved on the heating element.
5. The test probe according to claim 4, characterized in that: The test probe further includes a heating circuit board connected to the heating element, and the heating circuit board is arranged in a region formed by an outer wall of the thermal insulation tube and an inner wall of the first accommodating cavity.
6. The test probe according to claim 1, characterized in that: The test probe further comprises a temperature adjustment component connected to the heating element, and the temperature adjustment component is arranged on the outer wall of the probe body or outside the probe body.
7. The test probe according to claim 6, characterized in that: The temperature adjustment component is a temperature adjustment knob or a temperature adjustment button.
8. The test probe according to claim 1, characterized in that: The heating element is a heating wire or a heating tube.
9. The test probe according to claim 8, characterized in that: The test probe further includes an insulating member disposed in the first accommodating cavity, and the heating wire or the heating tube is coiled on the insulating member.
10. The test probe according to claim 1, characterized in that: The test probe further includes a heating input end which is arranged on the outer wall of the probe body or outside the probe body and connected to the heating element.
11. The test probe according to claim 10, characterized in that: The heating input end is a plug or an interface.
12. The test probe according to claim 1, characterized in that: The test input end is a plug or an interface.
13. A testing device, characterized in that: The testing device comprises the testing probe according to any one of claims 1-12.