Multi-end controlled semiconductor water system operation and maintenance platform heat dissipation device

By installing a cleaning brush and a vacuum bucket heat dissipation device on the server of the semiconductor water system operation and maintenance platform, the problem of dust accumulation in the server's cooling vents was solved, achieving more efficient heat dissipation and extending the life of the hardware.

CN222369727UActive Publication Date: 2025-01-21TG HILYTE ENVIRONMENTAL TECHNOLOGY (BEIJING) CO LTD
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
CN202421131531.X
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-05-22
Publication Date
2025-01-21
Estimated Expiration
2034-05-22

AI Technical Summary

Technical Problem

The servers of the semiconductor water system operation and maintenance platform will generate heat when working at high power, causing dust to accumulate in the heat dissipation vents, affecting the heat dissipation effect and reducing the server's working efficiency.

Method used

Design a multi-terminal control semiconductor water system operation and maintenance platform cooling device, use a cleaning brush to clean the vents of the server, and use a pull-out dust bucket to clean and collect dust to prevent dust from entering the inside of the server.

Benefits of technology

Keeping your server's vents clear of obstructions prevents dust clogs, reduces the risk of hardware overheating, extends the life of your hardware, and increases the usefulness of your unit.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure CN222369727U_ABST
    Figure CN222369727U_ABST
Patent Text Reader

Abstract

The utility model belongs to the technical field of heat dissipation devices, and particularly relates to a multi-end controlled semiconductor water system operation and maintenance platform heat dissipation device which comprises a server body and a heat dissipation cleaning assembly arranged on the outer side of the end portion of the server body. The heat dissipation cleaning assembly comprises a connecting plate, a rotating plate, a first gear and a connecting rotating rod, the connecting plate is fixedly connected to the outer side of one end of the server body, and the rotating plate is fixedly connected to the outer side of the end of the connecting plate; the air outlet of the server body is cleaned by the cleaning brush, the ventilation opening of the server body can be ensured to be unobstructed, the heat dissipation problem caused by dust blockage is prevented, and the risk of overheating of hardware can be reduced by keeping the heat dissipation ventilation opening of the server body clean, so that the service life of the hardware is prolonged.
Need to check novelty before this filing date? Find Prior Art

Description

Technical Field

[0001] The utility model belongs to the technical field of heat dissipation devices, and specifically relates to a heat dissipation device for a semiconductor water system operation and maintenance platform controlled by multiple terminals. Background Art

[0002] The semiconductor water system operation and maintenance platform is a comprehensive platform designed for the operation and maintenance of semiconductor water systems. It can realize the collaborative management and control of multiple terminals (such as PCs, mobile terminals, etc.). Usually, in order to save space, the above systems are integrated on a server. When the server works at high power, it will generate heat, which will be dissipated through the radiator. Then dust will often accumulate at the vents of the radiator. If it is not solved in time, the heat dissipation effect of the server will be reduced, affecting the server's work efficiency.

[0003] Therefore, a multi-terminal controlled semiconductor water system operation and maintenance platform heat dissipation device is designed to solve the above problems. Utility Model Content

[0004] To solve the problems raised in the above background technology. The utility model provides a multi-terminal controlled semiconductor water system operation and maintenance platform heat dissipation device, which can ensure that the vents of the server body are unobstructed by cleaning the air outlet of the server body with a cleaning brush, and prevent heat dissipation problems caused by dust blockage. By keeping the heat dissipation vents of the server body clean, the risk of hardware overheating can be reduced, thereby extending the service life of the hardware. By pulling out the dust bucket, the dust can be cleaned and collected at the same time, preventing dust from entering the interior of the server body and causing damage to the hardware inside the server body, thereby increasing the practicality of the device.

[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a multi-terminal controlled semiconductor water system operation and maintenance platform heat dissipation device, comprising a server body, and also comprising a heat dissipation cleaning component arranged on the outer side of the end of the server body;

[0006] The heat dissipation cleaning assembly includes a connecting plate, a rotating plate, a first gear and a connecting and rotating rod, a connecting plate is fixedly connected to the outer side of one end of the server body, a rotating plate is fixedly connected to the outer side of the end of the connecting plate, a first gear is rotatably connected to the outer side of one end of the rotating plate, a toggle piece is rotatably connected to the outer side of the other end of the rotating plate, a motor is installed on the outer side of the end of the connecting plate, a second gear is fixedly connected to the outer side of the main shaft of the motor, the first gear is meshed with the second gear, the outer sides of both ends of the connecting and rotating rod are respectively rotatably connected to the outer side of one end of the first gear and the outer side of the end of the toggle piece, the outer side of the end of the toggle piece is fixedly connected to the toggle rod, the outer surface of the end of the toggle rod is fixedly connected to a cleaning plate, a cleaning brush is fixedly connected to the outer side of one end of the cleaning plate, and the cleaning brush contacts the outer side of the end of the server body.

[0007] As a preferred heat dissipation device of a multi-terminal controlled semiconductor water system operation and maintenance platform of the utility model, the radius size of the first gear is larger than the radius size of the second gear.

[0008] As a preferred heat dissipation device of a semiconductor water system operation and maintenance platform with multi-end control of the utility model, the heat dissipation cleaning component also includes a connecting pipe and a filter collector, a pull-out dust bucket is installed on the outer side of the end of the cleaning plate, a one-way exhaust valve is installed on the outer side of the end of the pull-out dust bucket, the two ends of the connecting pipe are respectively connected to the inner side of one end of the pull-out dust bucket and the inner side of one end of the filter collector, and the outer side of the end of the pull-out dust bucket is rotatably connected to the rotating plate.

[0009] As a preferred heat dissipation device of a multi-terminal controlled semiconductor water system operation and maintenance platform of the utility model, the two pull-out dust buckets are symmetrically arranged on the outer sides of the two ends of the cleaning plate.

[0010] As a preferred heat dissipation device of a multi-terminal controlled semiconductor water system operation and maintenance platform of the utility model, a collection bucket is fixedly connected to the outer side of the end of the server body.

[0011] Compared with the prior art, the beneficial effects of the utility model are: a heat dissipation cleaning component is added to the present application, and the air outlet of the server body is cleaned by a cleaning brush, so as to ensure that the vents of the server body are unobstructed, and prevent heat dissipation problems caused by dust blockage; by keeping the heat dissipation vents of the server body clean, the risk of hardware overheating can be reduced, thereby extending the service life of the hardware; by pulling out the dust bucket, the dust can be cleaned and collected at the same time, preventing dust from entering the interior of the server body and causing damage to the hardware inside the server body, thereby increasing the practicality of the device. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings:

[0013] Figure 1 It is a schematic diagram of the overall structure of the utility model;

[0014] Figure 2 It is a structural schematic diagram of the connecting plate and the first gear in the utility model;

[0015] Figure 3 This is a schematic diagram of the structure of the first gear and the second gear in the utility model;

[0016] Figure 4 It is a structural schematic diagram of the motor and filter collector in the utility model;

[0017] In the figure:

[0018] 1. Server body;

[0019] 2. Heat dissipation and cleaning assembly; 21. Connecting plate; 22. Rotating plate; 23. First gear; 24. Motor; 25. Second gear; 26. Connecting rotating rod; 27. Toggle member; 28. Toggle rod; 29. ​​Cleaning plate; 210. Cleaning brush; 211. Pull-out dust bucket; 212. One-way exhaust valve; 213. Connecting pipe; 214. Filter collector; 215. Collection bucket. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

[0021] like Figure 1 As shown;

[0022] A multi-terminal controlled semiconductor water system operation and maintenance platform heat dissipation device comprises a server body 1.

[0023] In this implementation scheme: The semiconductor water system operation and maintenance platform is a comprehensive platform designed for the operation and maintenance of semiconductor water systems. It can realize the collaborative management and control of multiple terminals (such as PCs, mobile terminals, etc.). Usually, in order to save space, the above systems are integrated on a server. When the server works at high power, it will generate heat, which will be dissipated through the radiator. Then dust will often accumulate at the vents of the radiator. If it is not solved in time, the heat dissipation effect of the server will be reduced, affecting the work efficiency of the server. In order to solve this technical problem, a heat dissipation cleaning component 2 is added on this basis.

[0024] More specifically:

[0025] like Figures 1 to 4 As shown:

[0026] In combination with the above content: the heat dissipation cleaning component 2 includes a connecting plate 21, a rotating plate 22, a first gear 23 and a connecting rotating rod 26. The connecting plate 21 is fixedly connected to the outer side of one end of the server body 1, and the rotating plate 22 is fixedly connected to the outer side of the end of the connecting plate 21. The first gear 23 is rotatably connected to the outer side of one end of the rotating plate 22, and the toggle member 27 is rotatably connected to the outer side of the other end of the rotating plate 22. A motor 24 is installed on the outer side of the end of the connecting plate 21, and the second gear 25 is fixedly connected to the outer side of the main shaft of the motor 24. The first gear 23 is meshed and connected with the second gear 25. The outer sides of both ends of the connecting rotating rod 26 are respectively rotatably connected to the outer side of one end of the first gear 23 and the outer side of the end of the toggle member 27. The toggle rod 28 is fixedly connected to the outer side of the end of the toggle member 27. The cleaning plate 29 is fixedly connected to the outer side of the end of the toggle rod 28. A cleaning brush 210 is fixedly connected to the outer side of one end of the cleaning plate 29. The cleaning brush 210 contacts the outer side of the end of the server body 1. The radius of the first gear 23 is larger than the radius of the second gear 25.

[0027] In this embodiment: In the heat dissipation device, a heat dissipation through hole is provided on the outer side of one end of the server body 1. When the server body 1 works at high power for a long time, dust will accumulate in the heat dissipation through hole at the end of the server body 1, thereby causing the heat dissipation through hole to be blocked. A connecting plate 21 is fixedly connected to the outer side of one end of the server body 1, which can be used to fix the rotating plate 22 and the motor 24. At the same time, since the radius of the first gear 23 is larger than the radius of the second gear 25, when the second gear 25 can drive the first gear 23 to rotate with a smaller torque, the first gear 23 can be driven to rotate more efficiently, thereby increasing the working efficiency of the device. The connecting rotating rod 26 connects the first gear 23 and the toggle member 27. When the staff needs to use the device, the motor 24 is started, and the motor 24 drives the second gear 25 to rotate, thereby driving the end of the connecting rotating rod 26 The toggle member 27 performs circular motion. When the connecting rotating rod 26 rotates to the lowest position, the toggle rod 28 at the end of the toggle member 27 is located at the extreme position of the swing. When the connecting rotating rod 26 moves upward, a pulling force is applied to the toggle member 27, thereby causing the toggle member 27 to swing in the opposite direction. When the connecting rotating rod 26 is located at the highest point of the first gear 23, the toggle rod 28 is located at the extreme position of the other end of the swing, and swings back and forth in this way. The vents of the server body 1 can be cleaned by the cleaning plate 29 and the cleaning brush 210 inside the cleaning plate 29. The way of cleaning the air outlet of the server body 1 by the cleaning brush 210 can ensure that the vents of the server body 1 are unobstructed, and heat dissipation problems caused by dust blockage can be prevented. By keeping the heat dissipation vents of the server body 1 clean, the risk of hardware overheating can be reduced, thereby extending the service life of the hardware.

[0028] Going further:

[0029] In an optional embodiment, the heat dissipation cleaning component 2 also includes a connecting pipe 213 and a filter collector 214, a pull-out dust bucket 211 is installed on the outer side of the end of the cleaning plate 29, a one-way exhaust valve 212 is installed on the outer side of the end of the pull-out dust bucket 211, the two ends of the connecting pipe 213 are respectively connected to the inner side of one end of the pull-out dust bucket 211 and the inner side of one end of the filter collector 214, and the outer side of the end of the pull-out dust bucket 211 is rotatably connected to the rotating plate 22.

[0030] In this embodiment: a pull-out dust bucket 211 is installed on the outer side of the end of the cleaning plate 29. The working principle of the pull-out dust bucket 211 is similar to that of a syringe. The outer side of the end of the pull-out dust bucket 211 is rotatably connected to the outer side of one end of the rotating plate 22. When the toggle member 27 drives the cleaning plate 29 to rotate to the extreme position on one side, one end of the pull-out dust bucket 211 will be compressed. When the toggle member 27 drives the cleaning plate 29 to continue to rotate, one end of the pull-out dust bucket 211 will be stretched. The one-way air extraction valve 212 is a one-way air permeable valve that can absorb dust. The valve 212 can only absorb the dust, and then transport the dust to the inside of the filter collector 214 through the connecting pipe 213. The filter collector 214 has the function of collecting and filtering, and is also equipped with a one-way air valve to ensure that when the dust bucket 211 is compressed, it will not blow air outward, but the gas will be discharged through the filter collector 214. By pulling the dust bucket 211, the dust can be cleaned and collected at the same time, preventing dust from entering the inside of the server body 1 and causing damage to the hardware inside the server body 1, thereby increasing the practicality of the device.

[0031] Going further:

[0032] In an optional embodiment, two pull-out dust buckets 211 are symmetrically arranged on the outer sides of both ends of the cleaning plate 29.

[0033] In the present embodiment: two pull-out dust buckets 211 are symmetrically arranged at both ends of the cleaning plate 29, so that when the cleaning plate 29 swings left and right, one of the two pull-out dust buckets 211 is always in the suction state, which can achieve the dust suction effect, increase the dust suction efficiency of the device, and at the same time increase the practicality of the device.

[0034] Going further:

[0035] In an optional embodiment, a collection bucket 215 is fixedly connected to the outer side of the end of the server body 1 .

[0036] In this embodiment: a collecting bucket 215 is fixedly connected to the outer side of one end of the server body 1. The collecting bucket 215 is a fan-shaped structure. The collecting bucket 215 can prevent the dust cleaned by the cleaning brush 210 from falling to the ground. The collecting bucket 215 can collect the dust to a certain extent, which is convenient for the subsequent cleaning work of the staff.

[0037] Working principle: In the heat dissipation device, a heat dissipation hole is arranged on the outer side of one end of the server body 1. When the server body 1 works at high power for a long time, dust will accumulate in the heat dissipation hole at the end of the server body 1, which will cause the heat dissipation hole to be blocked. A connecting plate 21 is fixedly connected to the outer side of one end of the server body 1, which can be used to fix the rotating plate 22 and the motor 24. At the same time, since the radius of the first gear 23 is larger than the radius of the second gear 25, when the second gear 25 can drive the first gear 23 to rotate with a smaller torque, it can drive the first gear 23 to rotate more efficiently, thereby increasing the working efficiency of the device. The connecting rotating rod 26 connects the first gear 23 and the toggle member 27. When the staff needs to use the device, the electric start The motor 24 drives the second gear 25 to rotate, thereby driving the end of the connecting rotating rod 26 to perform a circular motion. When the connecting rotating rod 26 rotates to the lowest position, the toggle rod 28 at the end of the toggle member 27 is located at the extreme position of the swing. When the connecting rotating rod 26 moves upward, a pulling force is applied to the toggle member 27, thereby causing the toggle member 27 to swing in the opposite direction. When the connecting rotating rod 26 is at the highest point of the first gear 23, the toggle rod 28 is located at the extreme position of the other end of the swing, and thus the reciprocating swing can be used to clean the vents of the server body 1 through the cleaning plate 29 and the cleaning brush 210 inside the cleaning plate 29. By cleaning the air outlet of the server body 1 with the cleaning brush 210, the air quality of the server body 1 can be ensured. The vents are unobstructed to prevent heat dissipation problems caused by dust blockage. By keeping the heat dissipation vents of the server body 1 clean, the risk of hardware overheating can be reduced, thereby extending the service life of the hardware. A pull-out dust bucket 211 is installed on the outer side of the end of the cleaning plate 29. The working principle of the pull-out dust bucket 211 is similar to that of a syringe. The outer side of the end of the pull-out dust bucket 211 is rotatably connected to the outer side of one end of the rotating plate 22. When the toggle member 27 drives the cleaning plate 29 to rotate to the extreme position on one side, one end of the pull-out dust bucket 211 will be compressed. When the toggle member 27 drives the cleaning plate 29 to continue to rotate, one end of the pull-out dust bucket 211 will be stretched. The one-way exhaust valve 212 is a one-way air-permeable valve that can absorb dust. Through the one-way exhaust valve 212, can only absorb the dust, and then transport the dust to the inside of the filter collector 214 through the connecting pipe 213. The filter collector 214 has the function of collecting and filtering, and is also equipped with a one-way air-permeable valve to ensure that when the pull-out dust bucket 211 is compressed, it will not blow air outward, but the gas will be discharged through the filter collector 214. The pull-out dust bucket 211 can achieve the effect of cleaning and collecting dust at the same time, preventing dust from entering the inside of the server body 1 and causing damage to the hardware inside the server body 1, thereby increasing the practicality of the device. The two pull-out dust buckets 211 are symmetrically arranged at both ends of the cleaning plate 29, so that when the cleaning plate 29 swings left and right, one of the two pull-out dust buckets 211 is always in the suction state.The dust absorption effect can be achieved, the dust absorption efficiency of the device is increased, and the practicability of the device is increased. A collection bucket 215 is fixedly connected to the outside of one end of the server body 1. The collection bucket 215 is a fan-shaped structure. The collection bucket 215 can prevent the dust cleaned by the cleaning brush 210 from falling to the ground. The collection bucket 215 can collect dust to a certain extent, which is convenient for the cleaning work of the staff in the later stage.

[0038] Finally, it should be noted that the above description is only a preferred embodiment of the utility model and is not intended to limit the utility model. Although the utility model is described in detail with reference to the above embodiments, those skilled in the art can still modify the technical solutions recorded in the above embodiments or replace some of the technical features therein by equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the utility model shall be included in the protection scope of the utility model.

Claims

1. A multi-terminal controlled semiconductor water system operation and maintenance platform heat dissipation device, comprising a server body (1), characterized in that: It also includes a heat dissipation cleaning component (2) arranged on the outside of the end of the server body (1); The heat dissipation cleaning component (2) comprises a connecting plate (21), a rotating plate (22), a first gear (23) and a connecting rotating rod (26); the connecting plate (21) is fixedly connected to the outer side of one end of the server body (1); the rotating plate (22) is fixedly connected to the outer side of the end of the connecting plate (21); the first gear (23) is rotatably connected to the outer side of one end of the rotating plate (22); the first gear (23) is rotatably connected to the outer side of the other end of the rotating plate (22); a motor (24) is installed on the outer side of the end of the connecting plate (21); the first gear (23) is fixedly connected to the outer side of the main shaft of the motor (24); Two gears (25), the first gear (23) is meshedly connected with the second gear (25), the outer sides of both ends of the connecting rotating rod (26) are respectively rotatably connected with the outer side of one end of the first gear (23) and the outer side of the end of the toggle member (27), the outer side of the end of the toggle member (27) is fixedly connected with a toggle rod (28), the outer surface of the end of the toggle rod (28) is fixedly connected with a cleaning plate (29), the outer side of one end of the cleaning plate (29) is fixedly connected with a cleaning brush (210), and the cleaning brush (210) contacts the outer side of the end of the server body (1).

2. The heat dissipation device of the semiconductor water system operation and maintenance platform with multi-terminal control according to claim 1 is characterized by: The radius of the first gear (23) is greater than the radius of the second gear (25).

3. The heat dissipation device of the semiconductor water system operation and maintenance platform controlled by multiple terminals according to claim 1 is characterized in that: The heat dissipation cleaning component (2) also includes a connecting pipe (213) and a filter collector (214); a pull-out dust bucket (211) is installed on the outer side of the end of the cleaning plate (29); a one-way exhaust valve (212) is installed on the outer side of the end of the pull-out dust bucket (211); the two ends of the connecting pipe (213) are respectively connected to the inner side of one end of the pull-out dust bucket (211) and the inner side of one end of the filter collector (214); the outer side of the end of the pull-out dust bucket (211) is rotatably connected to the rotating plate (22).

4. The heat dissipation device of the semiconductor water system operation and maintenance platform controlled by multiple terminals according to claim 3 is characterized by: The two pull-out dust suction buckets (211) are symmetrically arranged outside the two ends of the cleaning plate (29).

5. The heat dissipation device of the semiconductor water system operation and maintenance platform controlled by multiple terminals according to claim 1 is characterized by: A collection bucket (215) is fixedly connected to the outer side of the end of the server body (1).