Polishing device for polishing head die for semiconductor production

Abstract

The utility model discloses a polishing head mold polishing device for semiconductor production, which relates to the technical field of semiconductor mold processing, and comprises a polishing mechanism, the polishing mechanism comprises a base, the base is fixedly connected with a supporting plate, the supporting plate is rotatably connected with a circular connecting plate, and the circular connecting plate is connected with a polishing head. At least two polishing beads are arranged on the circular connecting plate; the clamping mechanism comprises a connecting cylinder, the connecting cylinder is connected to the base in a sliding mode, the connecting cylinder is matched with the circular connecting plate, clamping plates which are symmetrically arranged are elastically connected to the inner side wall of the connecting cylinder, and the clamping plates are matched with one another. And meanwhile, the situation that grinding stays on the semiconductor, and consequently the grinding effect of the semiconductor is affected can be effectively avoided.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor mold processing, and more specifically, to a semiconductor production polishing head mold grinding device. Background Art

[0002] Semiconductors refer to materials with electrical conductivity between conductors and insulators at room temperature. Semiconductors are used in integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion and other fields. For example, diodes are devices made of semiconductors. Whether from the perspective of science and technology or economic development, the importance of semiconductors is enormous. In the process of semiconductor production and processing, polishing heads are usually required to polish them.

[0003] The utility model patent with patent announcement number: CN216097894U discloses a semiconductor production polishing head mold grinding device, which includes a base plate, a support shaft is rotatably installed on the top of the base plate, a placement seat is fixedly installed on the top of the support shaft, a placement groove is provided on the top of the placement seat, a cylinder is fixedly installed on the top of the base plate, a slide plate is fixedly welded on the piston shaft of the cylinder, a slide groove is provided on the top of the base plate, the slide plate is slidably connected in the slide groove, a motor is fixedly installed on one side of the slide plate, a grinding head is fixedly connected to the output shaft of the motor, and a horizontal axis is rotatably installed on one side of the slide plate.

[0004] Although the semiconductor production polishing head mold grinding device has a reasonable structural design, the polishing head can be polished by rotating the opposite grinding head and the polishing head, and the polishing effect of the polishing head is good and the efficiency is high.

[0005] However, during the grinding process of the polishing head by this type of semiconductor production polishing head mold grinding device, the grinding generated will remain on the polishing head, and in the process of the grinding head grinding the polishing head, there will be partial grinding between the grinding head and the polishing head, thereby increasing the friction between the grinding head and the polishing head, thereby ensuring the grinding effect of the polishing head, improving the smoothness of the polishing head surface after grinding, and resulting in the smoothness of the polishing head surface grinding. Utility Model Content

[0006] In view of the deficiencies in the prior art, the utility model aims to provide a semiconductor production polishing head mold grinding device.

[0007] In order to achieve the above purpose, the utility model provides the following technical solutions:

[0008] A semiconductor production polishing head mold grinding device, comprising:

[0009] The grinding mechanism comprises a base, a support plate is fixedly connected to the base, a circular connecting plate is rotatably connected to the support plate, and at least two grinding beads are arranged on the circular connecting plate.

[0010] The clamping mechanism includes a connecting tube, the connecting tube is slidably connected to the base, the connecting tube cooperates with a circular connecting plate, and the inner side wall of the connecting tube is elastically connected with symmetrically arranged clamping plates, and the clamping plates cooperate with each other.

[0011] Preferably, a circular fixed box is fixedly connected to the side wall of the support plate, an end of the circular fixed box away from the support plate is rotatably connected to a circular rotating box, and a fan is fixedly connected to the inner side wall of the circular fixed box, and the fan cooperates with the circular rotating box.

[0012] At least two ventilation holes are provided on the side wall of the circular rotating box and the side wall of the circular connecting plate.

[0013] Preferably, one end of the circular rotating box away from the circular fixed box is open, and the circular connecting plate is fixedly connected to the end of the circular rotating box.

[0014] Preferably, a connecting ring is sleeved on the polishing bead, a first spring is fixedly connected to the connecting ring, and one end of the first spring is fixedly connected to the side wall of the circular rotating box.

[0015] Preferably, at least two circular through holes are formed on the side wall of the circular connecting plate, and the connecting ring is slidably connected to the side walls of the circular through holes.

[0016] Preferably, a second spring arranged vertically is fixedly connected to the clamping plate, and one end of the second spring is fixedly connected to the inner side wall of the connecting tube.

[0017] Preferably, a collecting box is fixedly connected to the side wall of the base, a telescopic pipe is fixedly connected to the top of the collecting box, and the upper end of the telescopic pipe is fixedly connected to the bottom of the connecting tube and communicates with the connecting tube.

[0018] Compared with the prior art, the utility model has the following beneficial effects:

[0019] 1. In the utility model, the circular rotating box, the circular connecting plate and the grinding beads are driven to rotate by the output shaft of the driving motor. In the process of grinding the burrs on the semiconductor, the grinding beads roll on the semiconductor, which can effectively prevent the burrs from being too hard and causing damage to the semiconductor. At the same time, through the rolling of the grinding beads, burrs of different protruding lengths can be effectively ground, avoiding excessive grinding of the semiconductor's plane and causing damage to the semiconductor. After the grinding beads are worn, when the grinding beads are worn after grinding the semiconductor, the first spring pushes the connecting ring and the grinding beads toward the connecting tube through the elastic force of the first spring, so that the grinding beads fit on the semiconductor clamped and fixed by the clamping plate. At the same time, because the grinding beads are spherical, it is convenient for the grinding beads to grind the semiconductor on different sides, thereby avoiding affecting the grinding effect of the grinding beads on the semiconductor after the grinding beads are worn.

[0020] 2. In the utility model, the fan blows the wind through the ventilation holes onto the semiconductor clamped on the clamping plate, which can not only improve the heat dissipation efficiency of the heat generated by the semiconductor during grinding, but also blow the grinding chips from the semiconductor into the connecting tube, and the grinding chips in the connecting tube slide into the collection box through the telescopic pipe, which can not only effectively prevent the grinding chips from flying in the air and avoid air pollution, but also effectively prevent the grinding chips from staying on the semiconductor, thereby affecting the grinding effect of the semiconductor. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] Figure 1 The utility model provides a schematic diagram of the overall structure of a semiconductor production polishing head mold grinding device;

[0022] Figure 2 The utility model provides a schematic diagram of the partial connection structure of a grinding mechanism in a semiconductor production polishing head mold grinding device;

[0023] Figure 3 for Figure 2 A schematic diagram of the local enlarged structure at point A in the middle;

[0024] Figure 4 The utility model provides a structural schematic diagram of a clamping mechanism in a semiconductor production polishing head mold grinding device.

[0025] 1. Grinding mechanism; 2. Base; 3. Support plate; 4. Circular connecting plate; 5. Grinding beads; 6. Clamping mechanism; 7. Connecting tube; 8. Clamping plate; 9. Circular fixing box; 10. Circular rotating box; 11. Fan; 12. Connecting ring; 13. First spring; 14. Circular through hole; 15. Ventilation hole; 16. Second spring; 17. Collecting box; 18. Telescopic pipe. DETAILED DESCRIPTION

[0026] Reference Figures 1 to 4 .

[0027] The semiconductor production polishing head mold grinding device proposed by the utility model is further explained.

[0028] A semiconductor production polishing head mold grinding device, comprising:

[0029] The grinding mechanism 1 comprises a base 2, a support plate 3 is fixedly connected to the base 2, a circular connecting plate 4 is rotatably connected to the support plate 3, and at least two grinding beads 5 are arranged on the circular connecting plate 4.

[0030] The clamping mechanism 6 includes a connecting tube 7, which is slidably connected to the base 2, and the connecting tube 7 cooperates with the circular connecting plate 4. A symmetrically arranged clamping plate 8 is elastically connected to the inner side wall of the connecting tube 7, and the clamping plates 8 cooperate with each other. The end of the connecting tube 7 away from the circular connecting plate 4 is in a closed state, and a sliding plate is fixedly connected to the connecting tube 7. A sliding groove is provided on the base 2, and the sliding plate is slidably connected in the sliding groove, and a spring is fixedly connected to the sliding plate, and one end of the spring is fixedly connected to the side wall of the sliding groove. The elastic force of the spring pushes the sliding plate and the connecting tube 7 toward the direction close to the circular connecting plate 4, so that the polishing head clamped on the clamping plate 8 is pushed toward the direction of the circular connecting plate 4, thereby facilitating the polishing of the polishing head by the polishing beads 5 on the circular connecting plate 4.

[0031] A circular fixed box 9 is fixedly connected to the side wall of the support plate 3 , and a circular rotating box 10 is rotatably connected to one end of the circular fixed box 9 away from the support plate 3 , and a fan 11 is fixedly connected to the inner wall of the circular fixed box 9 , and the fan 11 cooperates with the circular rotating box 10 .

[0032] At least two ventilation holes 15 are provided on the side walls of the circular rotating box 10 and the side walls of the circular connecting plate 4. A driving motor is fixedly connected to the support plate 3. The output shaft of the driving motor passes through the support plate 3 and the circular fixed box 9 and is fixedly connected to the circular rotating box 10, so as to drive the circular connecting plate 4 to drive the grinding beads 5 to rotate, thereby grinding the polishing head. The wires on the fan 11 and the driving motor are electrically connected to a battery or other power storage device, so as to drive the fan 11 and the driving motor to work.

[0033] One end of the circular rotating box 10 away from the circular fixed box 9 is open, and the circular connecting plate 4 is fixedly connected to the end of the circular rotating box 10 .

[0034] A connecting ring 12 is sleeved on the grinding bead 5 , and a first spring 13 is fixedly connected to the connecting ring 12 . One end of the first spring 13 is fixedly connected to the side wall of the circular rotating box 10 .

[0035] At least two circular through holes 14 are formed on the side wall of the circular connecting plate 4 , and the connecting ring 12 is slidably connected to the side wall of the circular through hole 14 .

[0036] A vertically arranged second spring 16 is fixedly connected to the clamping plate 8, one end of the second spring 16 is fixedly connected to the inner wall of the connecting tube 7, and a vertically arranged limit rod is fixedly connected to the clamping plate 8, one end of the limit rod away from the clamping plate 8 passes through the side wall of the connecting tube 7 and extends to the outside of the connecting tube 7.

[0037] A collecting box 17 is fixedly connected to the side wall of the base 2 , a telescopic pipe 18 is fixedly connected to the top of the collecting box 17 , and the upper end of the telescopic pipe 18 is fixedly connected to the bottom of the connecting tube 7 and communicates with the connecting tube 7 .

[0038] Working principle: Pull the connecting tube 7 away from the circular connecting plate 4, then pull the two clamping plates 8 in opposite directions, and place the polishing head to be polished between the two clamping plates 8. Through the elastic force of the second spring 16, the two clamping plates 8 are pushed toward each other, so that the two clamping plates 8 clamp the polishing head to be polished, thereby fixing the position of the polishing head. Release the connecting tube 7. Under the elastic force of the spring on the base 2, the spring pushes the connecting tube 7 toward the circular connecting plate 4, so that the polishing head to be polished contacts with the polishing beads 5. Start the driving motor and the fan 11 on the supporting plate 3. The output shaft of the driving motor drives the circular rotating box 10, the circular connecting plate 4 and the polishing beads 5 to rotate. In the process of polishing the burrs on the polishing head, the polishing beads 5 The burrs are blocked so that the grinding beads 5 can roll on the polishing head, which can effectively prevent the burrs from being too hard and causing damage to the polishing head. At the same time, through the rolling of the grinding beads 5, burrs of different protruding lengths can be effectively polished to avoid excessive grinding of the flat surface of the polishing head and causing damage to the polishing head. After the grinding beads 5 are worn, when the grinding beads 5 are worn after grinding the polishing head, the first spring 13 pushes the connecting ring 12 and the grinding beads 5 in the direction of the connecting tube 7 through the elastic force of the first spring 13, so that the grinding beads 5 fit on the polishing head clamped and fixed by the clamping plate 8. At the same time, since the grinding beads 5 are spherical, it is convenient for the grinding beads 5 to grind the polishing head on different sides, thereby avoiding affecting the grinding effect of the grinding beads 5 on the polishing head after being worn.

[0039] When the fan 11 is working, the fan 11 blows wind through the ventilation hole 15 to the polishing head clamped on the clamping plate 8, which can not only improve the heat dissipation efficiency of the heat generated by the polishing head during grinding, but also blow the grinding off the polishing head into the connecting tube 7, and the grinding in the connecting tube 7 slides into the collection box 17 through the telescopic pipe 18, which can not only effectively prevent the grinding from flying in the air and avoid air pollution, but also effectively prevent the grinding from staying on the polishing head, thereby ensuring the grinding effect of the polishing head and improving the smoothness of the polishing head after grinding.

[0040] The above is only a preferred embodiment of the present invention. The protection scope of the present invention is not limited to the above embodiments. All technical solutions under the concept of the present invention belong to the protection scope of the present invention. It should be pointed out that for ordinary technicians in this technical field, some improvements and modifications without departing from the principle of the present invention should also be regarded as the protection scope of the present invention.

Claims

1. A semiconductor production polishing head mold grinding device, characterized in that: include: A grinding mechanism (1), the grinding mechanism (1) comprising a base (2), a support plate (3) fixedly connected to the base (2), a circular connecting plate (4) rotatably connected to the support plate (3), and at least two grinding beads (5) arranged on the circular connecting plate (4); A clamping mechanism (6), the clamping mechanism (6) comprising a connecting tube (7), the connecting tube (7) being slidably connected to the base (2), the connecting tube (7) being matched with a circular connecting plate (4), the inner side wall of the connecting tube (7) being elastically connected with symmetrically arranged clamping plates (8), the clamping plates (8) being matched with each other.

2. A semiconductor production polishing head mold grinding device according to claim 1, characterized in that: A circular fixed box (9) is fixedly connected to the side wall of the support plate (3); an end of the circular fixed box (9) away from the support plate (3) is rotatably connected to a circular rotating box (10); and a fan (11) is fixedly connected to the inner side wall of the circular fixed box (9); the fan (11) cooperates with the circular rotating box (10); At least two ventilation holes (15) are provided on the side wall of the circular rotating box (10) and the side wall of the circular connecting plate (4).

3. A semiconductor production polishing head mold grinding device according to claim 2, characterized in that: One end of the circular rotating box (10) away from the circular fixed box (9) is open, and the circular connecting plate (4) is fixedly connected to the end of the circular rotating box (10).

4. A semiconductor production polishing head mold grinding device according to claim 3, characterized in that: The polishing beads (5) are sleeved with a connecting ring (12), the connecting ring (12) is fixedly connected with a first spring (13), and one end of the first spring (13) is fixedly connected to the side wall of the circular rotating box (10).

5. A semiconductor production polishing head mold grinding device according to claim 4, characterized in that: At least two circular through holes (14) are provided on the side wall of the circular connecting plate (4), and the connecting ring (12) is slidably connected to the side wall of the circular through hole (14).

6. A semiconductor production polishing head mold grinding device according to claim 5, characterized in that: A second spring (16) arranged vertically is fixedly connected to the clamping plate (8), and one end of the second spring (16) is fixedly connected to the inner wall of the connecting tube (7).

7. A semiconductor production polishing head mold grinding device according to claim 6, characterized in that: A collecting box (17) is fixedly connected to the side wall of the base (2), a telescopic pipe (18) is fixedly connected to the top of the collecting box (17), and the upper end of the telescopic pipe (18) is fixedly connected to the bottom of the connecting tube (7) and communicates with the connecting tube (7).

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