Structure of semiconductor heating component
By designing heat pipes, reinforcement plates and multi-layer thermal insulation structures in semiconductor heating components, the problems of large heat loss and slow heating speed in the existing technology are solved, achieving more efficient heating effects and higher safety.
Patent Information
- Application Number
- CN202420975681.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-08
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-08
AI Technical Summary
The existing semiconductor heating components have problems such as large heat loss and slow heating speed during the heating process, resulting in no energy saving.
A structure of a semiconductor heating element is designed, including a metal tube, a heat pipe, a slot, a PTC semiconductor, a reinforcing plate, a reinforcing rib, a clamping piece, a thermal insulation layer, a thermal insulation layer and an insulating layer. The heat is transferred to the metal tube through the heat pipe, the reinforcement plate and through-hole design promote the circulation of hot air, and the insulation and insulation layers reduce heat loss.
It effectively avoids heat loss, improves heating effect and safety, reduces the risk of excessive temperature outside the equipment, and prevents safety hazards caused by PTC semiconductor short circuits.
Smart Images
Figure CN222378444U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor heating components, in particular to a structure of a semiconductor heating component. Background Art
[0002] In recent years, with the development of semiconductor technology, semiconductors have been widely used in various industries, such as integrated circuits, consumer electronics, communication systems, photovoltaic power generation, lighting, high-power power conversion, etc. The demand for semiconductors has increased significantly. In order to ensure product operation, higher requirements have been put forward for the quality of semiconductor production.
[0003] Currently, in the field of semiconductor pipeline liquid electric heating, most products heat the pipe by attaching the PTC heating sheet to the outer wall of the pipe. This heating method has many disadvantages. Because the PTC semiconductor is in sheet form, the heating element releases heat on both sides when the power is turned on for heating. This will cause the PTC heating element on the surface of the pipe to be exposed to the air, resulting in large heat energy loss in the heating tube and slow heating speed, which leads to energy saving. Utility Model Content
[0004] The utility model aims to provide a structure of a semiconductor heating element, which has the characteristics of avoiding heat loss, having a good heating effect and being highly safe.
[0005] To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a structure of a semiconductor heating element, comprising a metal tube, the outer wall of the metal tube is provided with a heat conducting tube, the outer wall of the heat conducting tube is fixedly connected with a plurality of evenly distributed card slots, the inner sides of the plurality of card slots are all clamped with PTC semiconductors, the left and right sides of the outer wall of the card slot are fixedly connected with reinforcement plates through connecting columns, the opposite sides of the two reinforcement plates are provided with a plurality of reinforcement ribs, the other sides of the plurality of reinforcement ribs are fixedly provided with clamping pieces, and the outer walls of the plurality of clamping pieces are all in contact with the PTC semiconductor;
[0006] A heat preservation layer is arranged on the outer side of the heat conducting pipe, a heat insulating layer is arranged on the outer wall of the heat preservation layer, and an insulating layer is arranged on the outer wall of the heat insulating layer.
[0007] In order to fix and support the thermal insulation layer, as a preferred structure of a semiconductor heating element of the utility model, a plurality of evenly distributed connecting ribs are fixedly connected between the thermal insulation layer and the heat conducting pipe.
[0008] In order to allow the connecting ribs to be retractable, as a preferred structure of a semiconductor heating element of the utility model, the outer wall of the reinforcement plate is provided with a plurality of grooves, the interiors of the plurality of grooves are fixedly connected with springs, and the other ends of the plurality of springs are respectively fixedly connected to a plurality of reinforcing ribs.
[0009] In order to facilitate the circulation of hot air, as a preferred structure of a semiconductor heating element of the utility model, the outer wall of the reinforcement plate is provided with a plurality of evenly distributed through holes.
[0010] In order to facilitate the formation of a closed heating cavity, as a preferred structure of a semiconductor heating component of the utility model, both ends of the thermal insulation layer, the heat insulating layer and the insulating layer are detachably connected with end covers, and the outer wall of the end cover is provided with holes matching the metal tube.
[0011] In order to facilitate the connection of an external power source, as a preferred structure of a semiconductor heating element of the utility model, the outer walls of the plurality of PTC semiconductors are provided with connecting wires, and the plurality of connecting wires extend to the outside of one of the end covers.
[0012] Compared with the prior art, the beneficial effects of the utility model are as follows:
[0013] The metal tube is used for circulating liquid, and the PTC semiconductor is plugged into multiple card slots for easy fixation. The outer wall of the PTC semiconductor is clamped by multiple reinforcing ribs and clamping pieces, which improves the installation stability of the PTC semiconductor and makes it less prone to damage. The cross-sections of multiple clamping pieces are circular, making the PTC semiconductor easier and more convenient to plug in and quicker to install.
[0014] Multiple PTC semiconductors start to generate heat, and the heat is conducted to the metal tube through the heat pipe, thereby heating the liquid inside the metal tube. The outer wall of the reinforcement plate on both sides of the PTC semiconductor is provided with multiple evenly distributed through holes to facilitate the circulation of hot air. The thermal insulation layer and the heat insulating layer improve the thermal insulation and heat insulation effects of the equipment, on the one hand to avoid heat loss and improve the heating effect, on the other hand to avoid burns caused by excessive temperature on the outside of the equipment and improve safety. By setting an insulating layer, even if the PTC semiconductor short-circuits and damages the surface of the equipment, it will not cause a safety hazard of live electricity. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] Figure 1 This is the overall cross-sectional structural diagram of the utility model;
[0016] Figure 2 This is an enlarged structural diagram of part a of the utility model;
[0017] Figure 3 This is a side structural diagram of the reinforcement plate of the utility model;
[0018] Figure 4 This is the overall external structure diagram of the utility model.
[0019] In the figure: 1. metal tube; 2. heat conducting tube; 3. slot; 4. PTC semiconductor; 5. connecting column; 6. reinforcing plate; 7. reinforcing rib; 8. clamping piece; 9. thermal insulation layer; 10. thermal insulation layer; 11. insulating layer; 12. connecting rib; 13. groove; 14. spring; 15. through hole; 16. end cover; 17. connecting wire. DETAILED DESCRIPTION
[0020] See also Figures 1 to 4 A structure of a semiconductor heating element, comprising a metal tube 1, a heat conducting tube 2 is arranged on the outer wall of the metal tube 1, a plurality of evenly distributed card slots 3 are fixedly connected to the outer wall of the heat conducting tube 2, a PTC semiconductor 4 is clamped on the inner sides of the plurality of card slots 3, a reinforcing plate 6 is fixedly connected to the left and right sides of the outer wall of the card slot 3 through a connecting column 5, a plurality of reinforcing ribs 7 are arranged on the opposite sides of the two reinforcing plates 6, a clamping piece 8 is fixedly arranged on the other side of the plurality of reinforcing ribs 7, and the outer walls of the plurality of clamping pieces 8 are in contact with the PTC semiconductor 4;
[0021] A heat preservation layer 9 is arranged on the outer side of the heat conducting pipe 2 , a heat insulating layer 10 is arranged on the outer wall of the heat preservation layer 9 , and an insulating layer 11 is arranged on the outer wall of the heat insulating layer 10 .
[0022] In this embodiment: the metal tube 1 is used to circulate liquid, the PTC semiconductor 4 is inserted into the multiple card slots 3 for easy fixation, and the outer wall of the PTC semiconductor 4 is clamped by multiple reinforcing ribs 7 and clamping members 8, which improves the installation stability of the PTC semiconductor 4 and makes it less prone to damage. The cross-section of the multiple clamping members 8 is circular, making it easier and more convenient for the PTC semiconductor 4 to be inserted and installed quickly. The thermal insulation layer 9, the heat insulating layer 10 and the insulating layer 11 are detachably connected at both ends with end covers 16, so that the heat pipe 2, the thermal insulation layer 9 and the two end covers 16 form a closed heating cavity. During operation, multiple PTC semiconductors 4 start to generate heat, and the heat is transferred to the metal pipe 1 through the heat pipe 2, thereby heating the liquid inside the metal pipe 1. The outer wall of the reinforcement plate 6 on both sides of the PTC semiconductor 4 is provided with multiple evenly distributed through holes 15 to facilitate the circulation of hot air. The thermal insulation layer 9 and the heat insulating layer 10 improve the thermal insulation and heat insulation effects of the equipment, on the one hand, avoiding heat loss and improving the heating effect, on the other hand, avoiding excessive temperature on the outside of the equipment to cause burns, thereby improving safety. By setting the insulating layer 11, even if the PTC semiconductor 4 short-circuits and damages the surface of the equipment, it will not cause a safety hazard of live electricity.
[0023] As a technical optimization solution of the utility model, a plurality of evenly distributed connecting ribs 12 are fixedly connected between the thermal insulation layer 9 and the heat conducting pipe 2 .
[0024] In this embodiment, a plurality of evenly distributed connecting ribs 12 are fixedly connected between the thermal insulation layer 9 and the heat conducting pipe 2 , so as to facilitate the support and fixation of the thermal insulation layer 9 .
[0025] As a technical optimization solution of the utility model, the outer wall of the reinforcing plate 6 is provided with a plurality of grooves 13 , the interiors of the plurality of grooves 13 are fixedly connected with springs 14 , and the other ends of the plurality of springs 14 are respectively fixedly connected with a plurality of reinforcing ribs 7 .
[0026] In this embodiment, a spring 14 is provided at the end of the reinforcing rib 7 so that the reinforcing rib 7 can adapt to contraction, thereby facilitating the insertion of the PTC semiconductor 4 , and utilizing the elastic force of the spring 14 to improve the clamping effect of the PTC semiconductor 4 .
[0027] As a technical optimization solution of the present invention, the outer wall of the reinforcement plate 6 is provided with a plurality of evenly distributed through holes 15 .
[0028] In this embodiment: the outer wall of the reinforcement plate 6 is provided with a plurality of evenly distributed through holes 15 to facilitate the circulation of hot air.
[0029] As a technical optimization solution of the utility model, both ends of the thermal insulation layer 9 , the heat insulating layer 10 and the insulating layer 11 are detachably connected with end covers 16 , and the outer wall of the end cover 16 is provided with holes matching the metal tube 1 .
[0030] In this embodiment, both ends of the thermal insulation layer 9 , the heat insulating layer 10 and the insulating layer 11 are detachably connected with end covers 16 , so that the heat conducting pipe 2 , the thermal insulation layer 9 and the two end covers 16 form a closed heating cavity.
[0031] As a technical optimization solution of the present invention, the outer walls of the plurality of PTC semiconductors 4 are all provided with connecting wires 17 , and the plurality of connecting wires 17 are all extended to the outer side of one of the end caps 16 .
[0032] In this embodiment, a plurality of connecting wires 17 are extended to the outside of one of the end caps 16 to facilitate connection with an external power source so that the PTC semiconductor 4 can work normally.
[0033] Working principle: The metal tube 1 is used to circulate liquid, and the PTC semiconductor 4 is inserted into a plurality of slots 3 for easy fixation. The outer wall of the PTC semiconductor 4 is clamped by a plurality of reinforcing ribs 7 and clamping members 8, which improves the installation stability of the PTC semiconductor 4 and makes it less prone to damage. The cross-section of the plurality of clamping members 8 is circular, which makes the PTC semiconductor 4 easier and more convenient to insert and quick to install. The thermal insulation layer 9, the heat insulating layer 10 and the insulating layer 11 are detachably connected at both ends with end covers 16, so that the heat pipe 2, the thermal insulation layer 9 and the two end covers 16 form a closed heating cavity. During operation, multiple PTC semiconductors 4 start to generate heat, and the heat is transferred to the metal pipe 1 through the heat pipe 2, thereby heating the liquid inside the metal pipe 1. The outer wall of the reinforcement plate 6 on both sides of the PTC semiconductor 4 is provided with multiple evenly distributed through holes 15 to facilitate the circulation of hot air. The thermal insulation layer 9 and the heat insulating layer 10 improve the thermal insulation and heat insulation effects of the equipment, on the one hand, avoiding heat loss and improving the heating effect, on the other hand, avoiding excessive temperature on the outside of the equipment to cause burns, thereby improving safety. By setting the insulating layer 11, even if the PTC semiconductor 4 short-circuits and damages the surface of the equipment, it will not cause a safety hazard of live electricity.
[0034] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the present invention should be included in the protection scope of the present invention.
Claims
1. A structure of a semiconductor heating element, comprising a metal tube (1), characterized in that: The outer wall of the metal tube (1) is provided with a heat conducting tube (2), the outer wall of the heat conducting tube (2) is fixedly connected with a plurality of evenly distributed slots (3), the inner sides of the plurality of slots (3) are all clamped with PTC semiconductors (4), the left and right sides of the outer wall of the slots (3) are fixedly connected with reinforcement plates (6) via connecting columns (5), the opposite sides of the two reinforcement plates (6) are provided with a plurality of reinforcement ribs (7), the other sides of the plurality of reinforcement ribs (7) are fixedly connected with clamping pieces (8), and the outer walls of the plurality of clamping pieces (8) are all in contact with the PTC semiconductor (4); The outer side of the heat-conducting pipe (2) is provided with a heat-insulating layer (9), the outer wall of the heat-insulating layer (9) is provided with a heat-insulating layer (10), and the outer wall of the heat-insulating layer (10) is provided with an insulating layer (11).
2. The structure of a semiconductor heating element according to claim 1, characterized in that: A plurality of evenly distributed connecting ribs (12) are fixedly connected between the thermal insulation layer (9) and the heat conducting pipe (2).
3. The structure of a semiconductor heating element according to claim 1, characterized in that: The outer wall of the reinforcing plate (6) is provided with a plurality of grooves (13), the interiors of the plurality of grooves (13) are all fixedly connected with springs (14), and the other ends of the plurality of springs (14) are respectively fixedly connected to a plurality of reinforcing ribs (7).
4. The structure of a semiconductor heating element according to claim 1, characterized in that: The outer wall of the reinforcement plate (6) is provided with a plurality of evenly distributed through holes (15).
5. The structure of a semiconductor heating element according to claim 1, characterized in that: Both ends of the thermal insulation layer (9), the heat insulating layer (10) and the insulating layer (11) are detachably connected with end covers (16), and the outer wall of the end cover (16) is provided with holes matching the metal tube (1).
6. The structure of a semiconductor heating element according to claim 5, characterized in that: The outer walls of the plurality of PTC semiconductors (4) are each provided with a connecting wire (17), and the plurality of connecting wires (17) each extend to the outside of one of the end caps (16).