Wind scooper and server

Abstract

The utility model relates to a wind scooper and a server. The wind scooper is used for a server, and the server comprises a first memory module and a first processing module. The wind scooper comprises a first wind guide channel, a second wind guide channel and a first wind guide structure, and the first wind guide channel is used for accommodating the first memory module; the second air guide channel and the first air guide channel are arranged in parallel, and the second air guide channel is used for containing the first processing module; the first air guide structure is arranged in the second air guide channel; the first air guide structure is obliquely arranged relative to the first air guide channel, and the first air guide structure extends in the direction close to the downstream side of the first air guide channel in the airflow flowing direction of the second air guide channel. Therefore, heat dissipation of the electronic components behind the first memory module can be optimized while heat dissipation of the first processing module and the first memory module is taken into consideration, so that the operation reliability of the server can be improved.

Description

Technical Field

[0001] The present application relates to the technical field of server heat dissipation, and in particular to an air guide cover and a server. Background Art

[0002] Currently, industries such as the Internet, cloud computing, and artificial intelligence have entered a stage of rapid development. Their development requires servers to have higher performance and more reliable operating conditions. However, the heat generated by the electronic components inside server products has greatly increased due to the increase in data processing speed and computing speed, which poses a severe challenge to the heat dissipation capacity of the cooling system.

[0003] The server includes memory, central processing unit (CPU), smart network card and air duct, etc. The smart network card is usually arranged behind the memory, and the cool air from the gap between the memory is used to dissipate the heat of the smart network card. However, due to the defects of the air duct design, the air volume and wind speed from the gap between the memory are small, which cannot meet the heat dissipation requirements of the smart network card located behind the memory. Utility Model Content

[0004] Based on this, it is necessary to provide an air guide cover and a server to optimize the heat dissipation of electronic components behind the first memory module while taking into account the heat dissipation of the first processing module and the first memory module, thereby improving the operating reliability of the server.

[0005] An air guide cover is used for a server, wherein the server includes a first memory module and a first processing module; the air guide cover includes:

[0006] a first air guiding channel, wherein the first air guiding channel is used to accommodate the first memory module;

[0007] a second air guiding channel, arranged in parallel with the first air guiding channel, the second air guiding channel being used to accommodate the first processing module;

[0008] The first wind guide structure is arranged in the second wind guide channel; the first wind guide structure is inclined relative to the first wind guide channel, and in the airflow direction of the second wind guide channel, the first wind guide structure extends toward the downstream side of the first wind guide channel.

[0009] The above-mentioned air guide cover is provided with a first air guide structure in the second air guide channel, the first air guide structure is inclined relative to the first air guide structure, and in the air flow direction of the second air guide channel, the first air guide structure extends in the direction close to the downstream side of the first air guide channel; therefore, when cold air enters the first air guide channel and the second air guide channel; the first air guide structure diverts part of the cold air in the second air guide channel to the first air guide channel, that is, diverts part of the cold air used to dissipate the heat of the first processing module to the first memory module, in this way, the air volume passing through the first memory module can be increased, thereby increasing the air volume reaching the rear of the first memory module, so that while taking into account the heat dissipation of the first processing module and the first memory module, the heat dissipation of the electronic components behind the first memory module can be optimized, thereby improving the operation reliability of the server.

[0010] In some embodiments, the second air guide channel includes a first air guide cavity and a second air guide cavity; the first air guide cavity is connected to the first air guide channel; the second air guide cavity is located on the downstream side of the first air guide cavity, and the top of the second air guide cavity is lower than the top of the first air guide cavity; the second air guide cavity is used to accommodate the first processing module; the first air guide structure is arranged between the first air guide cavity and the second air guide cavity; the first air guide structure is inclined relative to the first air guide cavity, and in the airflow direction of the second air guide channel, the first air guide structure extends in a direction close to the second air guide cavity.

[0011] Therefore, the first air guide structure can divert part of the cold air in the first air guide cavity to the first air guide channel, and the first air guide structure has basically no effect on the air volume in the second air guide cavity, thereby ensuring the air volume and wind speed reaching the first processing module, and further ensuring effective heat dissipation of the first processing module.

[0012] In some embodiments, the first air guide channel includes a third air guide cavity and a fourth air guide cavity; the third air guide cavity is connected to the first air guide cavity; the fourth air guide cavity is located on the downstream side of the third air guide cavity, and the top of the fourth air guide cavity is lower than the top of the third air guide cavity; the fourth air guide cavity is used to accommodate the first memory module; the air guide cover includes a second air guide structure, and the second air guide structure is arranged between the third air guide cavity and the fourth air guide cavity; the second air guide structure is inclined relative to the third air guide cavity; and in the airflow direction of the second air guide channel, the second air guide structure extends in a direction close to the fourth air guide cavity; the second air guide structure is connected to the first air guide structure.

[0013] Therefore, under the action of the second air guide structure, the cold air entering the third air guide cavity can be forced into the fourth air guide cavity. At the same time, the air volume diverted from the first air guide structure can be pressed into the fourth air guide cavity, thereby increasing the air volume and wind speed reaching the fourth air guide cavity, and further increasing the air volume and wind speed reaching the electronic components behind the first memory module, so as to optimize the heat dissipation of the electronic components behind the first memory module while ensuring the heat dissipation of the first memory module.

[0014] In some embodiments, the first wind guide structure includes at least one first wind guide plate; the second wind guide structure includes at least two second wind guide plates connected to each other; and one second wind guide plate is connected to one first wind guide plate.

[0015] Therefore, the cold air entering the first air guide channel can reach the first memory module through two paths: path one: the third air guide cavity-the second air guide plate-the fourth air guide cavity; path two: the first air guide plate-the second air guide plate-the fourth air guide cavity, thereby effectively increasing the air volume and wind speed reaching the fourth air guide cavity, thereby increasing the air volume and wind speed reaching the electronic components behind the first memory module, and optimizing the heat dissipation of the electronic components.

[0016] In some embodiments, the wind guide cover includes a third wind guide plate and a fourth wind guide plate; the third wind guide plate is connected to the fourth wind guide plate to define a first wind guide cavity and a third wind guide cavity that are interconnected; the first wind guide plate is connected to the third wind guide plate; and one of the second wind guide plates is connected to the fourth wind guide plate.

[0017] Therefore, the third air guide plate can guide the cold air to the first air guide plate, and the fourth air guide plate can guide the cold air to the second air guide plate. Under the action of the first air guide plate, a part of the cold air is guided to the second air guide plate and enters the fourth air guide cavity, and the other part of the cold air is guided to the second air guide cavity. In this way, not only can sufficient airflow be provided to the first processing module, the wind speed reaching the first processing module can be accelerated to achieve effective heat dissipation of the first processing module; but also the air volume and wind speed reaching the first memory module and the rear of the first memory module can be increased, thereby ensuring the heat dissipation of the first memory module while optimizing the heat dissipation of the electronic components behind the first memory module.

[0018] In some embodiments, the second air guiding cavity includes a first sub-air guiding cavity and a second sub-air guiding cavity; the top of the first sub-air guiding cavity is lower than the top of the first air guiding cavity, and the first air guiding structure is arranged between the first air guiding cavity and the first sub-air guiding cavity; the top of the second sub-air guiding cavity is lower than the top of the first sub-air guiding cavity; the top of the second sub-air guiding cavity is flush with the top of the fourth air guiding cavity, and the second sub-air guiding cavity is connected to the fourth air guiding cavity.

[0019] Thus, the second air guiding cavity and the fourth air guiding cavity can be adapted to the heights of the first processing module and the first memory module respectively, so as to dissipate heat for the first processing module and the first memory module.

[0020] In some embodiments, it also includes a third air guiding channel, a fourth air guiding channel and a fifth air guiding channel; the third air guiding channel, the fourth air guiding channel and the fifth air guiding channel are all arranged in parallel with the first air guiding channel; the third air guiding channel is located on the side of the second air guiding channel away from the first air guiding channel; the third air guiding channel is used to accommodate the second memory module of the server; the fourth air guiding channel is located on the side of the third air guiding channel away from the first air guiding channel; the fourth air guiding channel is used to accommodate the second processing module of the server; the fifth air guiding channel is located on the side of the fourth air guiding channel away from the first air guiding channel, and the fifth air guiding channel is used to accommodate the third processing module of the server.

[0021] Therefore, the second memory module, the second processing module and the third memory module in the server can be easily cooled to improve the operation reliability of the server.

[0022] In some embodiments, the third air guide channel includes a fifth air guide cavity and a sixth air guide cavity; the sixth air guide cavity is located on the downstream side of the fifth air guide cavity, and the top of the sixth air guide cavity is lower than the top of the fifth air guide cavity; the sixth air guide cavity is used to accommodate the second memory module; the air guide cover also includes a fifth air guide plate; the fifth air guide plate is detachably arranged on the downstream side of the fifth air guide cavity; the fifth air guide plate is inclined relative to the fifth air guide cavity, and in the airflow direction of the third air guide channel, the fifth air guide plate extends in the direction close to the sixth air guide cavity; a plurality of openings are arranged on the fifth air guide plate.

[0023] Therefore, on the one hand, the fifth air guide plate can press the cold air in the fifth air guide cavity to the sixth air guide cavity to dissipate the heat of the second memory module; on the other hand, the arrangement and plugging of the lines in the server can be facilitated by disassembling and assembling the fifth air guide plate and the openings on the fifth air guide plate.

[0024] A server comprises a fan assembly and the air guide cover described in any of the above embodiments; the air guide cover is arranged on the air outlet path of the fan assembly.

[0025] The above-mentioned server, by applying the above-mentioned air guide cover, sets the air guide cover on the air outlet path of the fan assembly, so that the cold air provided by the fan assembly can be used to dissipate the heat of the first memory module and the first processing module of the server. At the same time, the heat dissipation of the electronic components behind the first memory module is optimized, thereby improving the operating reliability of the server.

[0026] In some embodiments, it also includes a first memory module, a first processing module and a network card module; the first memory module is located in the first air guide channel; the first processing module is located in the second air guide channel; the network card module is located on the downstream side of the first air guide channel.

[0027] Therefore, the cold air guided out from the first air guiding channel can be used to dissipate the heat of the network card module, so as to meet the heat dissipation demand of the network card module and prevent it from overheating. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] FIG. 1 is a schematic diagram of an air guide cover in an embodiment of the present application.

[0029] FIG. 2 is a schematic diagram of the air guide cover in another perspective in one embodiment of the present application.

[0030] FIG. 3 is a schematic diagram of an air guide cover in another embodiment of the present application.

[0031] Description of reference numerals:

[0032] 10. air guide cover; 21. first memory module; 22. second memory module; 23. third memory module; 201. memory bar; 31. first processing module; 311. first central processing unit; 312. first heat sink; 32. second processing module; 321. second central processing unit; 322. second heat sink; 40. network card module; 50. main board;

[0033] 110, first wind guiding channel; 111, third wind guiding cavity; 112, fourth wind guiding cavity; 120, second wind guiding channel; 121, first wind guiding cavity; 122, second wind guiding cavity; 1221, first sub-wind guiding cavity; 1222, second sub-wind guiding cavity; 130, third wind guiding channel; 131, fifth wind guiding cavity; 132, sixth wind guiding cavity; 140, fourth wind guiding channel; 150, fifth wind guiding channel;

[0034] 101. First wind guide structure; 1011. First wind guide plate; 102. Second wind guide structure; 1021. Second wind guide plate; 103. Third wind guide plate; 104. Fourth wind guide plate; 105. Fifth wind guide plate; 1051. Opening. DETAILED DESCRIPTION

[0035] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0036] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0037] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0038] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0039] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0040] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0041] Referring to Figures 1 to 3, an air guide cover 10 provided in an embodiment of the present application is used for a server, and the server includes a first memory module 21 and a first processing module 31; the air guide cover 10 includes a first air guide channel 110, a second air guide structure 102 and a first air guide structure 101; the first air guide channel 110 is used to accommodate the first memory module 21; the second air guide channel 120 is arranged in parallel with the first air guide channel 110, and the second air guide channel 120 is used to accommodate the first processing module 31; the first air guide structure 101 is arranged in the second air guide channel 120; the first air guide structure 101 is inclined relative to the first air guide channel 110, and in the airflow direction of the second air guide channel 120, the first air guide structure 101 extends in a direction close to the downstream side of the first air guide channel 110.

[0042] It is understandable that, referring to FIG. 1 , the server further includes a motherboard 50, and the air guide cover 10 can be disposed on the motherboard 50. The first processing module 31 includes a first central processing unit 311 disposed on the motherboard 50 and a first heat sink 312 disposed above the first central processing unit 311, and the first heat sink 312 can be a standard heat sink or an EVAC heat sink. The first air guide channel 110 and the second air guide channel 120 can be connected. The first memory module 21 includes a plurality of memory bars 201 arranged at intervals on the motherboard 50; the wind flow can reach the rear of the first memory module 21 through the gaps between the memory bars 201, so that by increasing the air volume of the first air guide channel 110, the air volume passing through the first memory module 21 can be increased, thereby increasing the air volume reaching the rear of the first memory module 21, and further optimizing the heat dissipation of the electronic components behind the first memory module 21.

[0043] The above-mentioned air guide cover 10 is provided with a first air guide structure 101 in the second air guide channel 120, and the first air guide structure 101 is inclined relative to the first air guide structure 101, and in the air flow direction of the second air guide channel 120, the first air guide structure 101 extends in the direction close to the downstream side of the first air guide channel 110; therefore, when cold air enters the first air guide channel 110 and the second air guide channel 120; the first air guide structure 101 diverts part of the cold air in the second air guide channel 120 to the first air guide channel 110, that is, diverts part of the cold air used to dissipate the heat of the first processing module 31 to the first memory module 21, so that the air volume passing through the first memory module 21 can be increased, thereby increasing the air volume reaching the rear of the first memory module 21, so that while taking into account the heat dissipation of the first processing module 31 and the first memory module 21, the heat dissipation of the electronic components behind the first memory module 21 can be optimized, thereby improving the operation reliability of the server.

[0044] Referring to Figure 2, in some embodiments, the second air guide channel 120 includes a first air guide cavity 121 and a second air guide cavity 122; the first air guide cavity 121 is connected to the first air guide channel 110; the second air guide cavity 122 is located on the downstream side of the first air guide cavity 121, and the top of the second air guide cavity 122 is lower than the top of the first air guide cavity 121; the second air guide cavity 122 is used to accommodate the first processing module 31; the first air guide structure 101 is arranged between the first air guide cavity 121 and the second air guide cavity 122; the first air guide structure 101 is inclined relative to the first air guide cavity 121, and in the airflow direction of the second air guide channel 120, the first air guide structure 101 extends in a direction close to the second air guide cavity 122.

[0045] It should be noted that the height of the air guide cover 10 can be 3U, the height of the memory bar 201 is usually 1U; the height of the heat sink above the central processing unit is usually 2U, and the second air guide channel 120 includes a first air guide cavity 121 and a second air guide cavity 122, the second air guide cavity 122 is located at the downstream side of the first air guide cavity 121, and the top of the second air guide cavity 122 is lower than the top of the first air guide cavity 121; the second air guide cavity 122 is used to accommodate the first processing module 31; the first air guide structure 101 is arranged on the first Between the air guide cavity 121 and the second air guide cavity 122, that is, the height from the top of the first air guide cavity 121 to the main board 50 can be 3U, and the height from the top of the second air guide cavity 122 to the main board 50 can be 2U. The first air guide structure 101 is located between 2U-3U. In this way, the first air guide structure 101 can divert the wind flow in the 2U-3U space to the first air guide channel 110. The first air guide structure 101 has basically no effect on the wind flow in the space below 2U, thereby ensuring the heat dissipation of the first processing module 31.

[0046] Therefore, the first air guiding structure 101 can divert part of the cold air in the first air guiding cavity 121 to the first air guiding channel 110, and the first air guiding structure 101 has basically no effect on the air volume in the second air guiding cavity 122, thereby ensuring the air volume and wind speed reaching the first processing module 31, and further ensuring effective heat dissipation of the first processing module 31.

[0047] Referring to Figure 2, in some embodiments, the first air guiding channel 110 includes a third air guiding cavity 111 and a fourth air guiding cavity 112; the third air guiding cavity 111 is connected to the first air guiding cavity 121; the fourth air guiding cavity 112 is located on the downstream side of the third air guiding cavity 111, and the top of the fourth air guiding cavity 112 is lower than the top of the third air guiding cavity 111; the fourth air guiding cavity 112 is used to accommodate the first memory module 21; the air guiding cover 10 includes a second air guiding structure 102, and the second air guiding structure 102 is arranged between the third air guiding cavity 111 and the fourth air guiding cavity 112; the second air guiding structure 102 is inclined relative to the third air guiding cavity 111; and in the airflow direction of the second air guiding channel 120, the second air guiding structure 102 extends in a direction close to the fourth air guiding cavity 112; the second air guiding structure 102 is connected to the first air guiding structure 101.

[0048] Therefore, under the action of the second air guide structure 102, the cold air entering the third air guide cavity 111 can be forced into the fourth air guide cavity 112. At the same time, the air volume diverted from the first air guide structure 101 can be pressed into the fourth air guide cavity 112, thereby increasing the air volume and wind speed reaching the fourth air guide cavity 112, and further increasing the air volume and wind speed reaching the electronic components behind the first memory module 21, so as to optimize the heat dissipation of the electronic components behind the first memory module 21 while ensuring the heat dissipation of the first memory module 21.

[0049] 2 and 3 , in some embodiments, the first wind guide structure 101 includes at least one first wind guide plate 1011 ; the second wind guide structure 102 includes at least two second wind guide plates 1021 connected to each other; and one second wind guide plate 1021 is connected to one first wind guide plate 1011 .

[0050] Referring to FIG. 2 , in a specific example, the first wind guide structure 101 may include a first wind guide plate 1011; the second wind guide structure 102 includes two second wind guide plates 1021 connected to each other, one of the second wind guide plates 1021 is connected to the first wind guide plate 1011; the two second wind guide plates 1021 and the first wind guide plate 1011 share a vertex. Referring to FIG. 3 , in another specific example, the first wind guide structure 101 may include two first wind guide plates 1011 connected to each other, the second wind guide structure 102 includes at least two second wind guide plates 1021 connected to each other, one of the second wind guide plates 1021 is connected to a first wind guide plate 1011; the two first wind guide plates 1011 and the two second wind guide plates 1021 share a vertex.

[0051] Therefore, the cold air entering the first air guide channel 110 can reach the first memory module 21 through two paths, path one: the third air guide cavity 111-the second air guide plate 1021-the fourth air guide cavity 112; path two: the first air guide plate 1011-the second air guide plate 1021-the fourth air guide cavity 112, thereby effectively increasing the air volume and wind speed reaching the fourth air guide cavity 112, thereby increasing the air volume and wind speed reaching the electronic components behind the first memory module 21, and optimizing the heat dissipation of the electronic components.

[0052] Referring to 3, in some embodiments, the wind guide cover 10 includes a third wind guide plate 103 and a fourth wind guide plate 104; the third wind guide plate 103 is connected to the fourth wind guide plate 104 to define a first wind guide cavity 121 and a third wind guide cavity 111 that are interconnected; the first wind guide plate 1011 is connected to the third wind guide plate 103; and a second wind guide plate 1021 is connected to the fourth wind guide plate 104.

[0053] Therefore, the third air guide plate 103 can guide the cold air to the first air guide plate 1011, and the fourth air guide plate 104 can guide the cold air to the second air guide plate 1021. Under the action of the first air guide plate 1011, a part of the cold air is guided to the second air guide plate 1021 and enters the fourth air guide cavity 112, and the other part of the cold air is guided to the second air guide cavity 122. In this way, not only can sufficient airflow be provided to the first processing module 31, but also the wind speed reaching the first processing module 31 can be accelerated to achieve effective heat dissipation of the first processing module 31; moreover, the air volume and wind speed reaching the first memory module 21 and the rear of the first memory module 21 can be increased, thereby ensuring the heat dissipation of the first memory module 21 while optimizing the heat dissipation of the electronic components behind the first memory module 21.

[0054] Referring to Figures 2 and 3, in some embodiments, the second air guiding cavity 122 includes a first sub-air guiding cavity 1221 and a second sub-air guiding cavity 1222; the top of the first sub-air guiding cavity 1221 is lower than the top of the first air guiding cavity 121, and the first air guiding structure 101 is disposed between the first air guiding cavity 121 and the first sub-air guiding cavity 1221; the top of the second sub-air guiding cavity 1222 is lower than the top of the first sub-air guiding cavity 1221; the top of the second sub-air guiding cavity 1222 is flush with the top of the fourth air guiding cavity 112, and the second sub-air guiding cavity 1222 is connected to the fourth air guiding cavity 112.

[0055] Therefore, the second air guiding cavity 122 and the fourth air guiding cavity 112 can be adapted to the heights of the first processing module 31 and the first memory module 21 respectively, so as to dissipate heat for the first processing module 31 and the first memory module 21 .

[0056] Referring to Figures 2 and 3, in some embodiments, a third air guiding channel 130, a fourth air guiding channel 140 and a fifth air guiding channel 150 are also included; the third air guiding channel 130, the fourth air guiding channel 140 and the fifth air guiding channel 150 are all arranged in parallel with the first air guiding channel 110; the third air guiding channel 130 is located on the side of the second air guiding channel 120 away from the first air guiding channel 110; the third air guiding channel 130 is used to accommodate the second memory module 22 of the server; the fourth air guiding channel 140 is located on the side of the third air guiding channel 130 away from the first air guiding channel 110; the fourth air guiding channel 140 is used to accommodate the second processing module 32 of the server; the fifth air guiding channel 150 is located on the side of the fourth air guiding channel 140 away from the first air guiding channel 110, and the fifth air guiding channel 150 is used to accommodate the third processing module of the server.

[0057] Therefore, the second memory module 22, the second processing module 32 and the third memory module 23 in the server can be easily cooled to improve the operation reliability of the server.

[0058] It is understandable that, referring to Fig. 1, the second memory module 22 and the third memory module 23 both include a plurality of memory bars 201 spaced apart and arranged on the motherboard 50. The second processing module 32 includes a second central processing unit 321 disposed on the motherboard 50 and a second heat sink 322 located above the second central processing unit 321; the second heat sink 322 may be a standard heat sink or an EVAC heat sink.

[0059] Referring to Figures 2 and 3, in some embodiments, the third air guide channel 130 includes a fifth air guide cavity 131 and a sixth air guide cavity 132; the sixth air guide cavity 132 is located on the downstream side of the fifth air guide cavity 131, and the top of the sixth air guide cavity 132 is lower than the top of the fifth air guide cavity 131; the sixth air guide cavity 132 is used to accommodate the second memory module 22; the air guide cover 10 also includes a fifth air guide plate 105; the fifth air guide plate 105 is detachably arranged on the downstream side of the fifth air guide cavity 131; the fifth air guide plate 105 is inclined relative to the fifth air guide cavity 131, and in the airflow direction of the third air guide channel 130, the fifth air guide plate 105 extends in a direction close to the sixth air guide cavity 132; a plurality of openings 1051 are arranged on the fifth air guide plate 105.

[0060] Therefore, on the one hand, the fifth air guide plate 105 can press the cold air in the fifth air guide cavity 131 to the sixth air guide cavity 132 to dissipate the heat of the second memory module 22; on the other hand, the fifth air guide plate 105 and the opening 1051 on the fifth air guide plate 105 can be disassembled and assembled to facilitate the arrangement and plugging of lines in the server.

[0061] 1 to 3 , an embodiment of the present application provides a server, including a fan assembly (not shown) and an air guide cover 10 in any of the above embodiments; the air guide cover 10 is disposed on an air outlet path of the fan assembly.

[0062] The above-mentioned server, by applying the above-mentioned air guide cover 10, sets the air guide cover 10 on the air outlet path of the fan assembly, so that the cold air provided by the fan assembly can be used to dissipate the heat of the first memory module 21 and the first processing module 31 of the server, and at the same time, optimizes the heat dissipation of the electronic components behind the first memory module 21, thereby improving the operating reliability of the server.

[0063] Referring to Figure 1, in some embodiments, it also includes a first memory module 21, a first processing module 31 and a network card module 40; the first memory module 21 is located in the first air guide channel 110; the first processing module 31 is located in the second air guide channel 120; the network card module 40 is located on the downstream side of the first air guide channel 110.

[0064] Therefore, the cold air guided out from the first air guiding channel 110 can be used to dissipate the heat of the network card module 40 to meet the heat dissipation demand of the network card module 40 and prevent it from overheating.

[0065] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0066] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An air guide cover for a server, wherein the server comprises a first memory module and a first processing module; characterized in that: The air guide cover comprises: a first air guiding channel, wherein the first air guiding channel is used to accommodate the first memory module; a second air guiding channel, arranged in parallel with the first air guiding channel, the second air guiding channel being used to accommodate the first processing module; The first wind guide structure is arranged in the second wind guide channel; the first wind guide structure is inclined relative to the first wind guide channel, and in the airflow direction of the second wind guide channel, the first wind guide structure extends toward the downstream side of the first wind guide channel.

2. The air guide cover according to claim 1, characterized in that: The second wind guiding channel includes a first wind guiding cavity and a second wind guiding cavity; the first wind guiding cavity is connected to the first wind guiding channel; the second wind guiding cavity is located at the downstream side of the first wind guiding cavity, and the top of the second wind guiding cavity is lower than the top of the first wind guiding cavity; The second air guiding cavity is used to accommodate the first processing module; The first wind guide structure is arranged between the first wind guide cavity and the second wind guide cavity; the first wind guide structure is inclined relative to the first wind guide cavity, and in the airflow direction of the second wind guide channel, the first wind guide structure extends toward the direction close to the second wind guide cavity.

3. The air guide cover according to claim 2, characterized in that: The first air guiding channel includes a third air guiding cavity and a fourth air guiding cavity; the third air guiding cavity is connected to the first air guiding cavity; the fourth air guiding cavity is located at the downstream side of the third air guiding cavity, and the top of the fourth air guiding cavity is lower than the top of the third air guiding cavity; The fourth air guide cavity is used to accommodate the first memory module; The wind guide cover includes a second wind guide structure, which is arranged between the third wind guide cavity and the fourth wind guide cavity; the second wind guide structure is inclined relative to the third wind guide cavity; and in the airflow flow direction of the second wind guide channel, the second wind guide structure extends toward the direction close to the fourth air guide cavity; the second wind guide structure is connected to the first wind guide structure.

4. The air guide cover according to claim 3, characterized in that: The first wind guide structure includes at least one first wind guide plate; the second wind guide structure includes at least two second wind guide plates connected to each other; one second wind guide plate is connected to one first wind guide plate.

5. The air guide cover according to claim 4, characterized in that: The wind guide cover includes a third wind guide plate and a fourth wind guide plate; the third wind guide plate is connected to the fourth wind guide plate to define a first wind guide cavity and a third wind guide cavity that are interconnected; the first wind guide plate is connected to the third wind guide plate; and the second wind guide plate is connected to the fourth wind guide plate.

6. The air guide cover according to claim 3, characterized in that: The second wind guiding cavity includes a first sub-wind guiding cavity and a second sub-wind guiding cavity; the top of the first sub-wind guiding cavity is lower than the top of the first wind guiding cavity, and the first wind guiding structure is arranged between the first wind guiding cavity and the first sub-wind guiding cavity; the top of the second sub-wind guiding cavity is lower than the top of the first sub-wind guiding cavity; The top of the second sub-air guiding cavity is flush with the top of the fourth air guiding cavity, and the second sub-air guiding cavity is communicated with the fourth air guiding cavity.

7. The air guide cover according to claim 1, characterized in that: It also includes a third air guiding channel, a fourth air guiding channel and a fifth air guiding channel; the third air guiding channel, the fourth air guiding channel and the fifth air guiding channel are all arranged in parallel with the first air guiding channel; the third air guiding channel is located on a side of the second air guiding channel away from the first air guiding channel; the third air guiding channel is used to accommodate a second memory module of the server; the fourth air guiding channel is located on a side of the third air guiding channel away from the first air guiding channel; the fourth air guiding channel is used to accommodate a second processing module of the server; The fifth air guiding channel is located at a side of the fourth air guiding channel away from the first air guiding channel, and the fifth air guiding channel is used to accommodate the third processing module of the server.

8. The air guide cover according to claim 7, characterized in that: The third air guiding channel includes a fifth air guiding cavity and a sixth air guiding cavity; the sixth air guiding cavity is located at the downstream side of the fifth air guiding cavity, and the top of the sixth air guiding cavity is lower than the top of the fifth air guiding cavity; the sixth air guiding cavity is used to accommodate the second memory module; The wind guide cover also includes a fifth wind guide plate; the fifth wind guide plate is detachably arranged on the downstream side of the fifth wind guide cavity; the fifth wind guide plate is inclined relative to the fifth wind guide cavity, and in the airflow direction of the third air guide channel, the fifth wind guide plate extends toward the direction close to the sixth air guide cavity; a plurality of openings are arranged on the fifth wind guide plate.

9. A server, characterized in that: It comprises a fan assembly and the air guide cover according to any one of claims 1 to 8; the air guide cover is arranged on the air outlet path of the fan assembly.

10. The server according to claim 9, characterized in that It also includes a first memory module, a first processing module and a network card module; the first memory module is located in the first air guide channel; the first processing module is located in the second air guide channel; the network card module is located on the downstream side of the first air guide channel.

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