Novel cooling process cabin

Abstract

The utility model provides a novel cooling process cabin, which comprises a first shell with a first space, a first bottom plate is arranged in the first space, a bearing table is also arranged in the first space, and the bearing table comprises a plurality of bearing parts which are axially arranged and are used for placing wafers; a cooling assembly is further arranged in the first space, the cooling assembly is fixed to the first bottom plate, and a cooling station corresponding to the bearing part is arranged on the cooling assembly; the novel cooling process cabin further comprises a lifting assembly. The lifting assembly is arranged on the side, close to the first bottom plate, of the bearing table. According to the scheme, the lifting assembly is adopted to drive the bearing table and the wafer to move to the cooling station to cool the wafer, and due to the fact that the mass of the wafer and the bearing table is small, inertia generated in the lifting process is small, and displacement caused by inertia is avoided.

Description

Technical Field

[0001] The present application relates to the field of semiconductor welding technology, and in particular to a novel cooling process chamber. Background Art

[0002] With the development of semiconductor technology, the manufacturing processes related to it have also developed rapidly. The vacuum reflow process has greatly improved the welding quality with its superior welding performance, and is more widely used in advanced semiconductors, new energy, consumer electronics, military and aerospace fields.

[0003] However, the workpiece is usually hot after welding, and in order to carry out subsequent operations, the high-temperature workpiece needs to be cooled. In the prior art, the workpiece is usually transported to a cooling cabin, and the position of the cooling component is adjusted to change the distance from the cooling component to the workpiece to achieve cooling of the workpiece. However, the mass of the cooling component is large, and during the movement, the moving target position of the cooling component is easily offset from the actual position due to inertia problems, thereby affecting the cooling effect of the workpiece. Summary of the invention

[0004] In view of the above-mentioned defects or deficiencies in the prior art, the present application aims to provide a new cooling process chamber, comprising:

[0005] A first shell, wherein the first shell has a first space therein, and a first bottom plate is disposed in the first space;

[0006] A carrying platform, the carrying platform is arranged in the first space, the carrying platform comprises a plurality of circumferentially arranged carrying parts, the carrying parts are used to place wafers, and the carrying platform can move along a first direction;

[0007] A cooling assembly, the cooling assembly is fixed to the first bottom plate, and the cooling assembly is circumferentially provided with a plurality of cooling stations corresponding to the bearing portion, for cooling the wafer;

[0008] A lifting component is disposed on the side of the carrying platform close to the first bottom plate, and drives the carrying platform to drive the carrying part and the wafer to move along the first direction to the cooling station.

[0009] According to the technical solution provided in the embodiment of the present application, the lifting assembly includes a lifting part, one end of which is fixedly connected to the supporting platform, and a driving part is provided at the end of the lifting part away from the supporting platform. The driving part drives the lifting part to extend and retract along the first direction, thereby driving the supporting platform to move along the first direction.

[0010] According to the technical solution provided in the embodiment of the present application, it also includes a connecting component, which includes a first connecting plate, the extension direction of the first connecting plate is a second direction, the second direction is perpendicular to the first direction, a second connecting plate is provided at one end of the first connecting plate, and a third connecting plate is provided at the end of the second connecting plate away from the first connecting plate, the driving part is fixed to the third connecting plate, and the connecting component is used to fix the driving part and the first shell.

[0011] According to the technical solution provided in the embodiment of the present application, a guide assembly is further provided on the side of the second connecting plate close to the lifting assembly, and the guide assembly includes a fixed part and a movable part, the fixed part is fixed to the second connecting plate, and the movable part is fixedly connected to the lifting part and the movable part can move along the fixed part.

[0012] According to the technical solution provided in the embodiment of the present application, the fixed part includes two guide rails distributed on the second connecting plate along a third direction, the extension direction of the guide rails is the second direction, and the third direction is perpendicular to the first direction and the second direction; the movable part includes two sliders that can move along the guide rails, and a fourth connecting plate is provided on the side of the slider away from the second connecting plate, and the fourth connecting plate is fixedly connected to the lifting part.

[0013] According to the technical solution provided in the embodiment of the present application, it also includes a limit assembly, which includes a first limit member, which is arranged on the side of the first bottom plate away from the first space, and a second limit member is correspondingly arranged on the fourth connecting plate. When the second limit member abuts against the first limit member, the driving part stops driving.

[0014] According to the technical solution provided in the embodiment of the present application, a first opening is provided on the first shell side away from the first bottom plate for taking out the cooled wafer, and a hatch is provided covering the first opening for closing the first space, and the hatch is hinged to the first shell.

[0015] According to the technical solution provided in the embodiment of the present application, a first through hole is provided on the first base plate, and a hole groove is provided on the cooling component close to the first base plate side; it also includes a temperature measuring component, which passes through the first through hole and is inserted into the hole groove to measure the temperature of the wafer.

[0016] According to the technical solution provided in the embodiment of the present application, the cooling assembly includes a first cooling plate fixed to the first base plate, a second cooling plate is provided on the side of the first cooling plate away from the first base plate, and a groove is provided on the side of the first cooling plate close to the second cooling plate for passing cooling water.

[0017] In summary, the present application proposes a new cooling process chamber, comprising a first shell having a first space, a first bottom plate being arranged in the first space, a carrying platform being further arranged in the first space, the carrying platform comprising a plurality of axially arranged carrying parts for placing wafers; a cooling component is further arranged in the first space, the cooling component is fixed to the first bottom plate, and a cooling station corresponding to the carrying part is arranged on the cooling component; the new cooling process chamber also comprises a lifting component, and the lifting component is arranged on the side of the carrying platform close to the first bottom plate; when in use, the lifting component drives the carrying platform, the carrying part and the wafer to move along the first direction, so that the carrying part is placed in the cooling station, and the cooling component cools the wafer; in this scheme, a lifting component is used to drive the carrying platform and the wafer to move to the cooling station to cool the wafer. Since the mass of the wafer and the carrying platform is small, the inertia generated during the lifting process is small, thereby avoiding displacement caused by inertia. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 A schematic diagram of the structure of a new cooling process chamber provided in an embodiment of the present application;

[0019] Figure 2 A cross-sectional view of a novel cooling process chamber provided in an embodiment of the present application;

[0020] Figure 3 A schematic diagram of the structure of the lifting assembly and the carrying platform provided in the embodiment of the present application;

[0021] Figure 4 A schematic diagram of the structure of a cooling assembly provided in an embodiment of the present application.

[0022] The text annotations in the figure represent:

[0023] 1. First shell; 11. First bottom plate; 12. Second opening; 2. Carrying platform; 21. Carrying part; 211. First part; 212. Second part; 3. Cooling assembly; 31. Cooling station; 32. First cooling plate; 33. Second cooling plate; 4. Lifting assembly; 41. Lifting part; 411. Flange shaft; 412. Bellows; 42. Driving part; 5. Connecting assembly; 51. First connecting plate; 52. Second connecting plate; 53. Third connecting assembly; 6. Guide assembly; 61. Fixed part; 62. Moving part; 621. Slider; 622. Fourth connecting plate; 7. Limiting assembly; 71. First limiting member; 72. Second limiting member; 8. Hatch cover; 81. Handle; 9. Temperature measuring assembly. DETAILED DESCRIPTION

[0024] The present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It is to be understood that the specific embodiments described herein are only used to explain the relevant invention, rather than to limit the invention. It is also necessary to explain that, for ease of description, only the parts related to the invention are shown in the accompanying drawings.

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present application can be combined with each other. The present application will be described in detail below with reference to the accompanying drawings and in combination with the embodiments.

[0026] As mentioned in the background technology, in view of the problems in the prior art, the present application proposes a new cooling process chamber, comprising:

[0027] A first shell 1, wherein the first shell 1 has a first space therein, and a first bottom plate 11 is disposed in the first space;

[0028] A carrying platform 2, wherein the carrying platform 2 is disposed in the first space, the carrying platform 2 comprises a plurality of circumferentially arranged carrying portions 21, the carrying portions 21 are used to place wafers, and the carrying platform 2 can move along a first direction;

[0029] A cooling assembly 3, wherein the cooling assembly 3 is fixed to the first bottom plate 11, and the cooling assembly 3 is circumferentially provided with a plurality of cooling stations 31 corresponding to the bearing portion 21, for cooling the wafer;

[0030] A lifting assembly 4, wherein the lifting assembly 4 is disposed on the side of the carrying platform 2 close to the first bottom plate 11, and drives the carrying platform 2 to drive the carrying portion 21 and the wafer to move along the first direction to the cooling station 31;

[0031] In some specific scenarios, please refer to Figure 1 The first shell 1 shown in the figure has a second opening 12 on one side of the first shell 1. The wafer enters the first space through the second opening 12 under the transmission of the robot. A valve baffle is provided near the first opening. The valve baffle can move in the vertical direction. When the wafer is ready to enter the first space, the valve baffle rises. After the wafer enters the first space and is placed on the bearing portion 21, the valve baffle falls to seal the first space.

[0032] like Figure 3 and Figure 4As shown, the carrier 2 includes a semi-annular platform, and three carrier parts 21 are axially arranged on the platform. The carrier part 21 includes a first part 211 and a second part 212. The first part 211 is fixed to the semi-annular platform, and the second part 212 is located at the arc surface of the annular platform. The second part 212 is rectangular, so the cooling station 31 on the cooling component 3 is also a rectangular station. The cooling component 3 is cylindrical. When the lifting component 4 drives the carrier 2 to move along the vertical direction, the annular platform circumferentially surrounds the outer wall of the cooling component 3, and the second part 212 can be just embedded in the cooling station 31, so that the wafer can be surrounded by the cooling component 3 and fully cooled;

[0033] In summary, after the wafer welding is completed, the lifting component 4 drives the carrier 2 and the carrier part 21 to move along the vertical direction, so that the second part 212 is embedded in the cooling station 31, so that the wafer is in contact with the cooling component 3 to the greatest extent, and the wafer is cooled after welding; in this solution, the lifting component 4 is used to drive the carrier 2 and the wafer to move to the cooling station 31 to cool the wafer. Since the mass of the wafer and the carrier 2 is small, the inertia generated during the lifting process is small, thereby avoiding displacement caused by inertia; wherein, the first direction is the vertical direction.

[0034] In a preferred embodiment, the lifting assembly 4 includes a lifting part 41, one end of the lifting part 41 is fixedly connected to the carrying platform 2, and the end of the lifting part 41 away from the carrying platform 2 is provided with a driving part 42, and the driving part 42 drives the lifting part 41 to move along the first direction, thereby driving the carrying platform 2 to move along the first direction;

[0035] In some specific scenarios, please refer to Figure 3 The lifting assembly 4 shown in the figure, the driving part 42 is a cylinder, the lifting part 41 includes a lifting bellows 412 and a flange shaft 411 connected to the output end of the cylinder, the outer wall of the flange shaft 411 exposed to the first space is sleeved with a bellows 412, and the bellows 412 is provided with a flange close to the first bottom plate 11 for connecting the bellows 412 and the first bottom plate 11, and the cylinder drives the flange shaft 411 to move along the vertical direction under the restriction of the bellows 412.

[0036] In a preferred embodiment, a connecting assembly 5 is further included, the connecting assembly 5 includes a first connecting plate 51, the extending direction of the first connecting plate 51 is a second direction, the second direction is perpendicular to the first direction, a second connecting plate 52 is provided at one end of the first connecting plate 51, a third connecting plate 53 is provided at the end of the second connecting plate 52 away from the first connecting plate 51, the driving part 42 is fixed to the third connecting plate 53, and the connecting assembly 5 is used to fix the driving part 42 and the first housing 1;

[0037] In some specific scenarios, please refer to Figure 3 The connecting assembly 5 shown in the figure, the first connecting plate 51, the second connecting plate 52, and the third connecting plate 53 together form a "Z"-shaped connecting member of the connecting assembly 5, and the second connecting plate 52 is provided with a reinforcing rib on the side away from the lifting assembly 4 to enhance the supporting and connecting function of the connecting assembly 5; wherein, the second direction is a horizontal direction and is parallel to the extension direction of the long side of the third connecting plate 53, and the third direction is a horizontal direction and is parallel to the extension direction of the short side of the third connecting plate 53.

[0038] In a preferred embodiment, a guide assembly 6 is further provided on the side of the second connecting plate 52 close to the lifting assembly 4, and the guide assembly 6 includes a fixed portion 61 and a movable portion 62, wherein the fixed portion 61 is fixed to the second connecting plate 52, and the movable portion 62 is fixedly connected to the lifting portion 41 and can move along the fixed portion 61;

[0039] In some specific scenarios, please refer to Figure 3 The guide assembly 6 shown prevents the moving part 62 from being deviated during the movement.

[0040] In a preferred embodiment, the fixed portion 61 includes two guide rails distributed on the second connecting plate 52 along a third direction, the extending direction of the guide rails is the second direction, and the third direction is perpendicular to the first direction and the second direction; the movable portion 62 includes two sliders 621 movable along the guide rails, and a fourth connecting plate 622 is provided on the side of the slider 621 away from the second connecting plate 52, and the fourth connecting plate 622 is fixedly connected to the lifting portion 41;

[0041] In some specific scenarios, please refer to Figure 3The guide assembly 6 shown in the figure, the bottom of the flange shaft 411 is fixedly connected to the fourth connecting plate 622, when the cylinder drives the flange shaft 411 to move along the vertical direction, the flange shaft 411 drives the fourth connecting plate 622 to move synchronously along the vertical direction, and one end of the fourth connecting plate 622 is fixed to the slider 621, and the slider 621 can only move along the vertical direction under the restriction of the guide rail, thereby guiding the movement of the moving part 62.

[0042] In a preferred embodiment, a limiting assembly is further included, the limiting assembly includes a first limiting member 71, the first limiting member 71 is arranged on the side of the first bottom plate 11 away from the first space, and a second limiting member 72 is correspondingly arranged on the fourth connecting plate 622, and when the second limiting member 72 abuts against the first limiting member 71, the driving part 42 stops driving;

[0043] In some specific scenarios, please refer to Figure 2 As shown in the limiting assembly, after the cooling of the wafer is completed, the supporting part 21 and the wafer are moved out of the cooling station 31 to facilitate the removal of the wafer. When the flange shaft 411 moves, the fourth connecting plate 622 moves synchronously along the vertical direction, and the second limiting member 72 arranged on the fourth connecting plate 622 moves synchronously along the vertical direction. When one end of the second limiting member 72 abuts against the first limiting member 71, the moving part 62 cannot continue to drive the supporting platform 2 to move away from the cooling assembly 3 along the first direction due to the resistance, the cylinder stops driving, and the wafer stops moving.

[0044] In a preferred embodiment, the first housing 1 is provided with a first opening away from the first bottom plate for taking out the cooled wafer, and a hatch 8 is provided to cover the first opening for closing the first space, and the hatch 8 is hinged to the first housing 1;

[0045] In some specific scenarios, please refer to Figure 1 and Figure 2 The hatch cover 8 is hinged to the side wall of one side of the first shell 1, and two handles 81 are also provided on the hatch cover 8. By holding the handles 81, the hatch cover 8 can be opened to use a robot to take out the cooled wafer.

[0046] In a preferred embodiment, a first through hole is provided on the first bottom plate 11, and a hole groove is provided on the side of the cooling component 3 close to the first bottom plate 11; a temperature measuring component 9 is also included, and the temperature measuring component 9 passes through the first through hole and is inserted into the hole groove to measure the temperature of the wafer;

[0047] In some specific scenarios, please refer to Figure 2The temperature measuring component 9 shown in the figure may be a thermocouple, which is used to measure whether the wafer meets the predetermined temperature reduction requirement.

[0048] In a preferred embodiment, the cooling assembly 3 includes a first cooling plate 32 fixed to the first bottom plate 11, a second cooling plate 33 is provided on the side of the first cooling plate 32 away from the first bottom plate 11, and a groove is provided on the side of the first cooling plate 32 close to the second cooling plate 33 for passing cooling water;

[0049] In some specific scenarios, please refer to Figure 4 The cooling assembly 3 shown in the figure, the second cooling plate 33 is also provided with a water inlet and a water outlet for introducing water, and a water inlet pipe and a water outlet pipe are inserted into the water inlet and the water outlet for introducing cooling water into the groove, and the cooling water is circulated to maintain a cooling environment.

[0050] This article uses specific examples to illustrate the principles and implementation methods of this application. The description of the above embodiments is only used to help understand the method and its core ideas of this application. The above is only the preferred implementation method of this application. It should be pointed out that due to the limitations of textual expression and the objective existence of infinite specific structures, ordinary technicians in this technical field can make several improvements, modifications or changes without departing from the principles of the present invention, and can also combine the above technical features in an appropriate manner; these improvements, modifications, changes or combinations, or the direct application of the inventive concept and technical solution to other occasions without improvement, should be regarded as the scope of protection of this application.

Claims

1. A new type of cooling process chamber, characterized in that: include: A first shell (1), wherein the first shell (1) has a first space therein, and a first bottom plate (11) is provided in the first space; A carrier platform (2), the carrier platform (2) being arranged in the first space, the carrier platform (2) comprising a plurality of circumferentially arranged carrier parts (21), the carrier parts (21) being used for placing wafers, and the carrier platform (2) being movable along a first direction; A cooling component (3), the cooling component (3) being fixed to the first bottom plate (11), the cooling component (3) being provided with a plurality of cooling stations (31) corresponding to the bearing portion (21) in a circumferential direction and being used for cooling the wafer; A lifting component (4), the lifting component (4) being arranged on a side of the carrying platform (2) close to the first bottom plate (11), driving the carrying platform (2) and the carrying portion (21) and the wafer to move along the first direction to the cooling station (31).

2. The novel cooling process chamber according to claim 1 is characterized in that: The lifting assembly (4) comprises a lifting part (41), one end of the lifting part (41) being fixedly connected to the bearing platform (2), and an end of the lifting part (41) away from the bearing platform (2) being provided with a driving part (42), the driving part (42) driving the lifting part (41) to extend and retract along the first direction, thereby driving the bearing platform (2) to move along the first direction.

3. The novel cooling process chamber according to claim 2 is characterized in that: The invention also comprises a connecting assembly (5), wherein the connecting assembly (5) comprises a first connecting plate (51), wherein the extending direction of the first connecting plate (51) is a second direction, wherein the second direction is perpendicular to the first direction, a second connecting plate (52) is provided at one end of the first connecting plate (51), and a third connecting plate (53) is provided at an end of the second connecting plate (52) away from the first connecting plate (51), wherein the driving portion (42) is fixed to the third connecting plate (53), and the connecting assembly (5) is used for fixing the driving portion (42) and the first housing (1).

4. The novel cooling process chamber according to claim 3 is characterized in that: A guide assembly (6) is further provided on the side of the second connecting plate (52) close to the lifting assembly (4), and the guide assembly (6) comprises a fixed portion (61) and a movable portion (62), wherein the fixed portion (61) is fixed to the second connecting plate (52), and the movable portion (62) is fixedly connected to the lifting portion (41), and the movable portion (62) can move along the fixed portion (61).

5. The novel cooling process chamber according to claim 4 is characterized in that: The fixed portion (61) comprises two guide rails distributed on the second connecting plate (52) along a third direction, the guide rails extending in the second direction, and the third direction being perpendicular to the first direction and the second direction; the movable portion (62) comprises two sliders (621) movable along the guide rails, a fourth connecting plate (622) being provided on a side of the slider (621) away from the second connecting plate (52), and the fourth connecting plate (622) being fixedly connected to the lifting portion (41).

6. The novel cooling process chamber according to claim 5 is characterized in that: The device further comprises a limit assembly, wherein the limit assembly comprises a first limit member (71), the first limit member (71) being arranged on the side of the first bottom plate (11) away from the first space, and a second limit member (72) being correspondingly arranged on the fourth connecting plate (622), and when the second limit member (72) abuts against the first limit member (71), the driving part (42) stops driving.

7. The novel cooling process chamber according to claim 1 is characterized in that: The first shell (1) is provided with a first opening on a side away from the first bottom plate (11) for taking out the wafer after cooling, and a hatch (8) is provided covering the first opening for closing the first space, the hatch (8) being hinged to the first shell (1).

8. The novel cooling process chamber according to claim 1 is characterized in that: The first base plate (11) is provided with a first through hole, and the cooling component (3) is provided with a hole groove on the side close to the first base plate (11); and further comprises a temperature measuring component (9), the temperature measuring component (9) passes through the first through hole and is inserted into the hole groove, and is used to measure the temperature of the wafer.

9. The novel cooling process chamber according to claim 1 is characterized in that: The cooling assembly (3) comprises a first cooling plate (32) fixed to the first bottom plate (11), a second cooling plate (33) is provided on the side of the first cooling plate (32) away from the first bottom plate (11), and a groove is provided on the side of the first cooling plate (32) close to the second cooling plate (33) for passing cooling water.

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