Supporting boss and supporting device
By designing support bosses with empty grooves during the flip-chip welding process, the friction between the substrate and the bosses is reduced, the problems of substrate chipping, chip damage and boss wear are solved, and higher welding reliability is achieved. and equipment life.
Patent Information
- Application Number
- CN202421144236.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-23
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-23
AI Technical Summary
During flip chip welding, the friction between the ceramic substrate and the base boss leads to problems such as substrate fragmentation, chip damage, and base wear.
Design a support boss, which has a support surface for supporting the substrate, and has an empty groove on the support surface. The empty groove is located in the orthographic projection of the substrate to reduce the contact area and friction between the substrate and the boss. .
By reducing the friction between the substrate and the boss, the generation of substrate debris and boss metal objects is effectively reduced, and the problems of substrate fragmentation, chip damage and dirt, and boss wear are alleviated.
Smart Images
Figure CN222380570U_ABST
Abstract
Description
Technical Field
[0001] The present application relates to the technical field of chip welding, and in particular to a supporting boss and a supporting device. Background Art
[0002] Flip chip welding technology is widely used in camera packaging, LED packaging, BGA packaging and other fields. It has the advantages of smaller volume, thinner size and higher reliability after welding. The mobile phone camera module of the flip chip process is mainly composed of optical lens, voice coil motor, infrared filter, image sensor and ceramic substrate. Among them, the ceramic substrate is a raw material unique to the FC process. It plays a role in protecting the chip, forming interconnections between chips, and carrying the infrared filter and lens base in the entire production process. It can be said that the entire assembly process is carried out with the ceramic substrate as the base. During the production process, the substrate is placed in the actual installation platform in the welding equipment. During the long-term welding operation, the substrate and the base boss will rub against each other, thereby generating substrate debris or base metal objects, which will cause problems such as substrate breakage, chip damage and dirt, and severe base wear. Utility Model Content
[0003] The purpose of the present application is to provide a supporting boss and a supporting device, which can effectively reduce the friction between the substrate and the boss, thereby reducing substrate debris and boss metal objects, and effectively alleviate the problems of substrate fragmentation, chip damage and dirt, and boss wear.
[0004] To this end, in a first aspect, an embodiment of the present application provides a supporting boss having a supporting surface for supporting a substrate, an empty groove being arranged on the supporting surface, and the empty groove being located within the orthographic projection of the substrate toward the supporting boss.
[0005] In a possible implementation, a mounting hole for mounting the chip is provided in the middle of the substrate, and an orthographic projection of the mounting hole toward the supporting boss is located in the empty groove.
[0006] In a possible implementation, the depth L of the empty groove satisfies the following relationship: 0.04 mm≤L≤0.06 mm.
[0007] In a possible implementation, the supporting boss includes a base portion and a supporting portion connected to the base portion, the supporting portion is arranged around the empty groove, and the supporting surface is arranged on the supporting portion.
[0008] In a possible implementation manner, a slope reinforcement portion is formed at a connection between the support portion and the hollow groove.
[0009] In a possible implementation, a clearance position is provided on a side of the supporting boss facing the supporting surface, and the clearance position is used to avoid a marking point on the substrate.
[0010] In a possible implementation, the clearance points are arranged at the four end corners of the supporting boss.
[0011] In a possible implementation, the avoidance positions are arranged around the supporting surface.
[0012] In a possible implementation, the supporting boss is made of tungsten steel.
[0013] In a second aspect, an embodiment of the present application provides a supporting device, comprising: a base; and the above-mentioned supporting boss, wherein the supporting boss is arranged on the base.
[0014] According to the supporting boss and supporting device provided in the embodiment of the present application, the supporting boss supports the substrate through the supporting surface of the supporting boss, and an empty groove is arranged on the supporting surface to reduce the contact area between the supporting surface and the supporting boss, which can effectively reduce the friction between the substrate and the boss, thereby reducing substrate debris and boss metal objects, and effectively alleviating the problems of substrate fragmentation, chip damage and dirt, and boss wear. BRIEF DESCRIPTION OF THE DRAWINGS
[0015] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.
[0016] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.
[0017] One or more embodiments are exemplarily described by pictures in the corresponding drawings, and these exemplified descriptions do not constitute limitations on the embodiments. Elements with the same reference numerals in the drawings represent similar elements, and unless otherwise stated, the figures in the drawings do not constitute proportional limitations.
[0018] Figure 1 A schematic diagram of a planar structure of a supporting boss and a substrate provided in an embodiment of the present application is shown;
[0019] Figure 2 Show Figure 1 A local enlarged structural schematic diagram;
[0020] Figure 3 Show Figure 1 A schematic diagram of the local enlarged structure at B;
[0021] Figure 4 A schematic diagram of the structure of a support boss provided in an embodiment of the present application is shown in a top view;
[0022] Figure 5 A schematic diagram showing a top view of another supporting boss provided in an embodiment of the present application is shown;
[0023] Figure 6 A schematic diagram showing the planar structure of a boss and a substrate in the prior art is shown;
[0024] Figure 7 A schematic diagram of a top view of a supporting device provided in an embodiment of the present application is shown;
[0025] Figure 8 A schematic diagram of the planar structure of the support device provided in an embodiment of the present application is shown.
[0026] Description of reference numerals:
[0027] 1. Support boss; 11. Support surface; 12. Empty groove; 13. Base portion; 14. Support portion; 15. Inclined surface reinforcement portion; 16. Avoidance position;
[0028] 2. Substrate; 21. Mounting hole; 22. Marking point; 23. Burr;
[0029] 3. Base;
[0030] 4. Boss. DETAILED DESCRIPTION
[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present application clearer, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without making creative work are within the scope of protection of this application.
[0032] The disclosure below provides many different embodiments or examples to realize the different structures of the embodiments of the present application. In order to simplify the disclosure of the embodiments of the present application, the parts and settings of specific examples are described below. Of course, they are only examples, and the purpose is not to limit the embodiments of the present application. In addition, the embodiments of the present application can repeat reference numbers and / or letters in different examples. This repetition is for the purpose of simplification and clarity, and does not itself indicate the relationship between the various embodiments and / or settings discussed.
[0033] For ease of description, spatial relative terms may be used herein to describe the relative positional relationship or movement of one element or feature relative to another element or feature as shown in the figure, such as "inside", "outside", "inner side", "outer side", "below", "below", "above", "above", "front", "back", etc. Such spatial relative terms are intended to include different orientations of the device in use or operation in addition to the orientation depicted in the figure. For example, if the device in the figure undergoes a position flip or a posture change or a motion state change, then these directional indications also change accordingly, for example: an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented as "above other elements or features" or "above other elements or features". Therefore, the example term "below..." may include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions) and the spatial relative descriptors used herein are interpreted accordingly.
[0034] In order to solve the problems in the prior art, the present application provides a supporting boss and a supporting device, which can effectively reduce the friction between the substrate and the boss, thereby reducing substrate debris and boss metal objects, and effectively alleviate the problems of substrate fragmentation, chip damage and dirt, and boss wear.
[0035] like Figure 1-5 As shown, an embodiment of the present application provides a supporting boss, wherein the supporting boss 1 has a supporting surface 11 for supporting a substrate 2 , and an empty groove 12 is provided on the supporting surface 11 , and the empty groove 12 is located within the orthographic projection of the substrate 2 toward the supporting boss 1 .
[0036] In the present application, the substrate 2 is supported by the supporting surface 11 of the supporting boss 1, and an empty groove 12 is provided on the supporting surface 11 to reduce the contact area between the supporting surface 11 and the supporting boss 1, which can effectively reduce the friction between the substrate 2 and the supporting boss, thereby reducing the debris of the substrate 2 and the metal objects of the supporting boss 1, and effectively alleviating the problems of substrate 2 breakage, chip damage and dirt, and support boss 1 wear.
[0037] In the related technology, the mobile phone camera module is mainly composed of an optical lens, a voice coil motor, an infrared filter, an image sensor, and a ceramic substrate 2. Among them, the ceramic substrate 2 is a raw material unique to the FC process. It plays a role in protecting the chip, forming interconnections with the chip, and carrying the infrared filter and the lens in the entire production process. It can be said that the entire assembly process is carried out with the ceramic substrate 2 as the base. During the production process, the substrate 2 is placed on the actual installation platform in the welding equipment. During long-term welding operations, friction will occur between the substrate 2 and the boss of the base 3, thereby generating substrate 2 debris or base 3 metal objects, which will cause the substrate 2 to crack, the chip to be damaged and dirty, and the base 3 to be severely worn. In the flip-chip welding process, the warping control of the substrate 2 is particularly important, but the ceramic substrate 2 needs to undergo baking, sintering and other steps during the production process, which will inevitably cause warping. Such as Figure 6 As shown, currently, the mounting base 3 used in the flip chip welding station is a planar design scheme using three bosses 4, and the material is SUS 304 (stainless steel), which is to ensure that the bosses 4 are in full contact with the substrate 2, increase the contact area, and improve welding reliability. However, the friction between the substrate 2 and the boss 4 in this scheme is also the greatest. When the substrate 2 is warped, there is a risk that the welding area cannot contact the boss 4, and the increase in the contact surface indicates that it is easier to generate particles, and the wear on the boss 4 will also be greater.
[0038] In the embodiment of the present application, a supporting boss 1 is used to replace the existing three bosses 4, and the substrate 2 is supported by the supporting surface 11 of the supporting boss 1. In addition, an empty groove 12 is provided on the supporting surface 11, which can further reduce the contact area with the substrate 2, thereby reducing the friction between the substrate 2 and the supporting boss 1. In addition, the empty groove 12 can also play a certain avoidance role, thereby reducing the risk that the welding area cannot contact the supporting boss 1 when the substrate 2 is warped.
[0039] like Figure 1 As shown, in some embodiments, a mounting hole 21 for mounting a chip is provided in the middle of the substrate 2 , and the orthographic projection of the mounting hole 21 toward the supporting boss 1 is located in the empty groove 12 .
[0040] In the present application, the mounting hole 21 in the middle of the substrate 2 is used to mount the chip. The mounting hole 21 of the substrate 2 is prone to warping or burrs 23 during processing. If these warping or burrs 23 come into contact with the support surface 11 of the support boss 1, they will cause relatively serious wear on the support surface 11. However, by locating the orthographic projection of the mounting hole 21 in the empty groove 12, even if there are warping or burrs 23 at the mounting hole 21 of the substrate 2, these warping or burrs 23 will not come into contact with the support boss 1, thereby minimizing the friction between the substrate 2 and the support boss 1.
[0041] like Figure 3 As shown, further, the depth L of the empty groove 12 satisfies the following relationship: 0.04 mm≤L≤0.06 mm.
[0042] In the present application, by controlling the depth of the empty groove 12 to be between 0.04 mm and 0.06 mm, it is possible to ensure effective avoidance of the warped portion and burrs 23 on the substrate 2 while ensuring the support strength of the support surface 11 .
[0043] Specifically, the depth of the hollow groove 12 is 0.05 mm.
[0044] like Figure 2 As shown, in some embodiments, the supporting boss 1 includes a base portion 13 and a supporting portion 14 connected to the base portion 13 , the supporting portion 14 is arranged around the empty groove 12 , and the supporting surface 11 is arranged on the supporting portion 14 .
[0045] In the present application, the base portion 13 is used as the main support of the bottom and is used to connect the base 3 at the bottom. The support portion 14 is arranged above the base portion 13, and the support portion 14 is arranged around the empty groove 12. As a part of the support substrate 2, the top surface of the support portion 14 is the support surface 11. By arranging the support boss 1 into the base portion 13 and the support portion 14, and the support portion 14 is arranged around the empty groove 12, the support portion 14 is a frame-shaped integral structure, thereby ensuring the stability of the support portion 14 structure.
[0046] like Figure 5 As shown, optionally, the support portion 14 can also be arranged around the empty groove 12, and the support portion 14 includes a plurality of separated parts, such as four parts, which are respectively arranged at the four end corners of the empty groove 12, and the top of the support portion 14 is a support surface 11 for supporting the substrate 2.
[0047] In some embodiments, a chamfer reinforcement portion 15 is formed at a connection between the support portion 14 and the hollow groove 12 .
[0048] In the present application, by setting the connection between the support portion 14 and the hollow groove 12 as a bevel reinforcement portion 15, the connection area between the support portion 14 and the base portion 13 can be increased, thereby further increasing the stability of the support portion 14 structure, making the support surface 11 more stable, extending the service life of the support boss 1, and preventing deformation caused by long-term use.
[0049] like Figure 1 As shown, in some embodiments, a clearance position 16 is provided on the side of the supporting boss 1 facing the supporting surface 11 , and the clearance position 16 is used to avoid the marking point 22 on the substrate 2 .
[0050] In the present application, there are usually marking points 22 at the four corners of the substrate 2. The marking points 22 on the substrate 2 can be avoided by the avoidance positions 16 to prevent the corners of the substrate 2 from being lifted up, thereby ensuring the reliability of welding. Moreover, by providing the avoidance positions 16, the contact area between the support boss 1 and the substrate 2 can be further reduced, thereby reducing the friction between the support boss 1 and the substrate 2.
[0051] In one embodiment, the avoidance positions 16 are disposed at four end corners of the supporting boss 1 .
[0052] In the present application, since the marking points 22 on the substrate 2 are generally arranged at the four corners of the substrate 2 , the avoidance positions 16 are arranged at the four end corners of the supporting boss 1 , which can ensure that the supporting surface 11 is a whole, thereby ensuring the structural strength and stability of the supporting surface 11 .
[0053] In another embodiment, the avoidance spaces 16 are disposed around the supporting surface 11 .
[0054] In the present application, the avoidance positions 16 can also be set around the support surface 11, that is, the avoidance positions 16 are set around the support surface 11 of the frame structure to avoid the marking points 22 on the substrate 2. The support surface 11 can still be ensured to be an integral structure, and the structural strength and stability of the support surface 11 can be ensured.
[0055] In some embodiments, the supporting boss 1 is made of tungsten steel.
[0056] In this application, during the welding process, the chip needs to transfer heat to the substrate 2 through the support boss 1. By setting the support boss 1 to be made of tungsten steel, it has a better thermal conductivity coefficient, thereby reducing the contact area while still meeting the heat transfer effect to the substrate 2. In addition, the tungsten steel material is more wear-resistant and has a longer service life.
[0057] The supporting boss supports the substrate 2 via the supporting surface 11 of the supporting boss 1, and an empty groove 12 is provided on the supporting surface 11 to reduce the contact area between the supporting surface 11 and the supporting boss 1, which can effectively reduce the friction between the substrate 2 and the boss, thereby reducing the debris of the substrate 2 and the metal objects of the boss, and effectively alleviating the problems of substrate 2 fragmentation, chip damage and dirt, and boss wear.
[0058] like Figure 7-8 As shown, an embodiment of the present application provides a supporting device, including: a base 3; and the above-mentioned supporting boss, which is arranged on the base 3.
[0059] Specifically, the support boss 1 is fixed on the base 3 by copper coin welding. The support boss 1 supports the substrate 2 through the support surface 11. The empty groove 12 on the support surface 11 can reduce the contact area between the support boss 1 and the substrate 2, thereby reducing the friction between the substrate 2 and the support boss 1, reducing the debris of the substrate 2 and the metal debris of the support boss 1, and effectively alleviating the problem of the substrate 2 being worn by the debris, the chip being damaged and dirty, and the support boss 1 being worn. The support boss 1 is made of tungsten steel, which can meet the temperature requirements of the substrate 2 while reducing the contact area with the substrate 2, so as to ensure the welding effect, reduce the risk of foreign matter generated by the friction between the substrate 2 and the support boss 1, improve the production yield, and extend the service life of the support device.
[0060] When performing flip chip welding, after the substrate 2 is plasma cleaned, the substrate 2 is transported along the track to the base 3 for flip chip welding, and is ready for the flip chip welding operation.
[0061] It should be understood that the terms used herein are only for the purpose of describing specific example embodiments and are not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms "one", "an" and "said" as used herein may also be meant to include plural forms. The terms "include", "comprise", "contain", and "have" are inclusive, and therefore specify the existence of stated features, steps, operations, elements and / or parts, but do not exclude the existence or addition of one or more other features, steps, operations, elements, parts, and / or combinations thereof. The method steps, processes, and operations described herein are not interpreted as necessarily requiring them to be performed in the specific order described or illustrated, unless the execution order is clearly indicated. It should also be understood that additional or alternative steps may be used.
[0062] Although the terms first, second, third, etc. can be used in the text to describe multiple elements, components, regions, layers and / or sections, these elements, components, regions, layers and / or sections should not be limited by these terms. These terms can only be used to distinguish an element, component, region, layer or section from another region, layer or section. Unless the context clearly indicates, terms such as "first", "second" and other numerical terms do not imply order or sequence when used in the text. Therefore, the first element, component, region, layer or section discussed below can be referred to as the second element, component, region, layer or section without departing from the teaching of the example embodiments.
[0063] The above description is only a specific implementation of the present application, so that those skilled in the art can understand or implement the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest range consistent with the principles and novel features applied for herein.
Claims
1. A supporting boss, characterized in that: The supporting boss (1) has a supporting surface (11) for supporting a substrate (2); a hollow groove (12) is provided on the supporting surface (11); the hollow groove (12) is located within the orthographic projection of the substrate (2) toward the supporting boss (1).
2. The support boss according to claim 1, characterized in that: The middle part of the base plate (2) has a mounting hole (21) for mounting a chip, and the orthographic projection of the mounting hole (21) toward the supporting boss (1) is located in the empty groove (12).
3. The support boss according to claim 2, characterized in that: The depth L of the hollow groove (12) satisfies the following relationship: 0.04 mm≤L≤0.06 mm.
4. The supporting boss according to claim 1, characterized in that: The supporting boss (1) comprises a base portion (13) and a supporting portion (14) connected to the base portion (13); the supporting portion (14) is arranged around the hollow groove (12); and the supporting surface (11) is arranged on the supporting portion (14).
5. The supporting boss according to claim 4, characterized in that: A slope reinforcement portion (15) is formed at the connection between the support portion (14) and the hollow groove (12).
6. The supporting boss according to claim 1, characterized in that: A clearance position (16) is provided on one side of the supporting boss (1) facing the supporting surface (11), and the clearance position (16) is used to avoid a marking point (22) on the substrate (2).
7. The supporting boss according to claim 6, characterized in that: The avoidance positions (16) are arranged at the four end corners of the supporting boss (1).
8. The supporting boss according to claim 6, characterized in that: The avoidance position (16) is arranged around the supporting surface (11).
9. The supporting boss according to claim 1, characterized in that: The supporting boss (1) is made of tungsten steel.
10. A supporting device, characterized in that: include: Base (3); as well as According to the supporting boss according to any one of claims 1 to 9, the supporting boss (1) is arranged on the base (3).