Heat dissipation packaging structure
By adopting a heat dissipation packaging structure that combines an upper heat dissipation cover and a lower heat dissipation cover in a large-size chiplet package, the tight packaging layout space and reliability problems are solved, and the packaging layout space and product reliability are improved without increasing the size of the substrate. effect.
Patent Information
- Application Number
- CN202421108371.7
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-05-21
- Publication Date
- 2025-01-21
- Estimated Expiration
- 2034-05-21
AI Technical Summary
In large-size Chiplet packages, increasing substrate size will lead to a decrease in substrate yield and an increase in cost, while existing processes will lead to tight packaging layout space, affecting reliability.
The upper heat dissipation cover and the lower heat dissipation cover are combined to form the heat dissipation packaging structure of the substrate. Through the fastening of the lower buckle and the upper buckle, the upper heat dissipation cover and the lower heat dissipation cover are closely combined, reducing the occupation of the substrate space, and Effectively resists substrate warping.
Without increasing the size of the substrate, the packaging layout space is increased, product reliability is improved, and substrate warping is avoided.
Smart Images
Figure CN222380582U_ABST
Abstract
Description
Technical Field
[0001] The utility model relates to the technical field of semiconductor packaging, in particular to a heat dissipation packaging structure. Background Art
[0002] Chiplet is a group of small chip units with separate functions, namely die, which are disassembled into a complex chip. The module chip and the underlying basic chip package are combined together through die-to-die. With the development of chiplet technology, more dies are integrated into a single chip package, resulting in larger and larger package sizes. At present, in large-size chiplet packages, the front side of the substrate must accommodate the heat dissipation cover, dies, and passive devices (such as resistors, capacitors, and inductors) at the same time; and Figure 1 As shown, considering the substrate size tolerance, heat sink cover mounting accuracy and heat sink cover size tolerance, the existing process requirements stipulate the minimum sizes of A, B and C, which leads to very tight packaging layout space.
[0003] In addition, large-size chiplet packaging will bring packaging reliability issues. For example, under certain reliability test conditions, the warping of a large-size substrate may cause delamination and cracking between the heat dissipation cover and the substrate, affecting the reliability of the product.
[0004] In order to improve the packaging layout space, the substrate size can be increased, but the increase in substrate size will cause a significant decrease in substrate yield, which in turn will lead to an increase in substrate cost. Utility Model Content
[0005] The heat dissipation packaging structure provided by the utility model can increase the packaging layout space without increasing the size of the substrate.
[0006] In the first aspect, the utility model provides a heat dissipation packaging structure, which includes an upper heat dissipation cover and a lower heat dissipation cover; the main body of the lower heat dissipation cover is a square ring structure, the inner cavity of the square ring structure forms a supporting platform for placing a substrate, and the four corners of the square ring structure have upwardly protruding lower buckles; the four corners of the upper heat dissipation cover have upper buckles used in conjunction with the lower buckles; the four corners of the substrate have notches to form an appearance consistent with the edge shape of the supporting platform, the substrate is placed on the supporting platform in the inner cavity of the lower heat dissipation cover, the lower buckles of the lower heat dissipation cover pass through the notches at the four corners of the substrate and are buckled with the upper buckles of the upper heat dissipation cover, so that the upper heat dissipation cover and the lower heat dissipation cover are completely combined.
[0007] Optionally, the edge shape of the supporting platform is octagonal, and the four corners of the base plate have triangular notches.
[0008] Optionally, initial contact positions of the upper buckle and the lower buckle are both beveled.
[0009] Optionally, the lower heat dissipation cover is made of a material having rigidity and toughness.
[0010] Optionally, the bottom end of the upper buckle of the upper heat dissipation cover is coated with glue.
[0011] Optionally, all positions where the upper heat dissipation cover contacts the substrate are coated with glue.
[0012] Optionally, glue is coated at a position where the lower heat dissipation cover contacts the substrate.
[0013] Optionally, the support platform of the lower heat dissipation cover is coated with glue; or, the position where the lower heat dissipation cover contacts the side of the substrate is coated with glue; or, both the support platform of the lower heat dissipation cover and the position where the lower heat dissipation cover contacts the side of the substrate are coated with glue.
[0014] Optionally, after the upper heat dissipation cover is combined with the lower heat dissipation cover, the bottom end of the upper heat dissipation cover is in contact with both the lower heat dissipation cover and the substrate.
[0015] Optionally, a crystal grain is arranged on the substrate, a heat-conducting material is laid on the crystal grain, and the heat-conducting material is in contact with the lower surface of the upper heat dissipation cover.
[0016] The heat dissipation packaging structure provided by the embodiment of the utility model adopts the method of combining an upper heat dissipation cover and a lower heat dissipation cover to form a heat dissipation packaging structure of a substrate. The supporting points of the upper heat dissipation cover are the substrate and the lower heat dissipation cover. Compared with the upper heat dissipation cover supported by the substrate only, the bottom end position of the upper heat dissipation cover moves toward the outside of the substrate, reducing the occupation of the substrate space, thereby increasing the packaging layout space of the substrate without increasing the size of the substrate; in addition, by buckling the upper buckle with the lower buckle, after the upper heat dissipation cover and the lower heat dissipation cover are combined, the upper heat dissipation cover and the lower heat dissipation cover can tightly flatten the four sides of the substrate, thereby effectively resisting the warping of the substrate and improving the reliability of the product. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] Figure 1 is a schematic diagram of an existing heat dissipation packaging structure;
[0018] Figure 2 A schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;
[0019] Figure 3 A schematic cross-sectional view of a diagonal structure of a heat dissipation packaging structure provided by an embodiment of the utility model;
[0020] Figure 4 A 3D schematic diagram of a lower heat dissipation cover of a heat dissipation packaging structure provided by an embodiment of the utility model;
[0021] Figure 5 A 3D schematic diagram of an upper heat dissipation cover of a heat dissipation packaging structure provided by an embodiment of the utility model;
[0022] Figure 6 A cross-sectional schematic diagram of a heat dissipation packaging structure provided by an embodiment of the utility model;
[0023] Figure 7 This is a schematic diagram of an exploded view of a heat dissipation packaging structure provided in an embodiment of the utility model. DETAILED DESCRIPTION
[0024] In order to make the purpose, technical solution and advantages of the embodiment of the utility model clearer, the technical solution in the embodiment of the utility model will be clearly and completely described below in conjunction with the drawings in the embodiment of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, not all of the embodiments. Based on the embodiment of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.
[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as those commonly understood by those skilled in the art to which this application belongs. The terms used herein in the specification of this application are only for the purpose of describing specific embodiments and are not intended to limit this application.
[0026] Spatially relative terms such as "under," "beneath," "below," "under," "above," "above," and the like may be used herein to describe the relationship of an element or feature shown in the figures to other elements or features. It should be understood that, in addition to the orientations shown in the figures, spatially relative terms also include different orientations of the device in use and operation. For example, if the device in the accompanying drawings is flipped, an element or feature described as "under other elements" or "under it" or "under it" will be oriented as being "above" the other elements or features. Thus, the exemplary terms "under" and "under" may include both upper and lower orientations. In addition, the device may also include additional orientations (e.g., rotated 90 degrees or other orientations), and the spatial descriptors used herein are interpreted accordingly.
[0027] It should be noted that when an element is referred to as being "fixedly connected" to another element, it may be directly on the other element or there may also be a central element. When an element is considered to be "connected" to another element, it may be directly connected to the other element or there may be a central element at the same time. In contrast, when an element is referred to as being "directly on" another element, there is no intermediate element. The terms "vertical", "horizontal", "left", "right" and similar expressions used herein are for illustrative purposes only.
[0028] When used herein, the singular forms "a", "an", and "said / the" may also include plural forms, unless the context clearly indicates otherwise. It should also be understood that the terms "include / comprise" or "have" etc. specify the presence of stated features, wholes, steps, operations, components, parts or combinations thereof, but do not exclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts or combinations thereof.
[0029] The utility model provides a heat dissipation packaging structure, such as Figures 2 to 7 As shown, the heat dissipation packaging structure includes an upper heat dissipation cover 10 and a lower heat dissipation cover 20; the main body of the lower heat dissipation cover 20 is a square ring structure, the inner cavity of the square ring structure is formed with a supporting platform 21 for placing a substrate 30, and the four corners of the square ring structure have upwardly protruding lower buckles 22; the four corners of the upper heat dissipation cover 10 have upper buckles 11 used in conjunction with the lower buckles 22; the four corners of the substrate 30 have notches to form an appearance consistent with the edge shape of the supporting platform 21, the substrate 30 is placed on the supporting platform 21 in the inner cavity of the lower heat dissipation cover 20, the lower buckles 22 of the lower heat dissipation cover 20 pass through the notches at the four corners of the substrate 30 and are buckled with the upper buckles 11 of the upper heat dissipation cover 10, so that the upper heat dissipation cover 10 and the lower heat dissipation cover 20 are completely combined.
[0030] Furthermore, a crystal grain 40 is disposed on the substrate 30 , a heat-conducting material 50 is laid on the crystal grain 40 , and the heat-conducting material 50 is in contact with the lower surface of the upper heat dissipation cover 10 .
[0031] In this embodiment, the edge shape of the supporting platform 21 can be octagonal, and accordingly, the four corners of the substrate 30 have triangular notches to form an octagonal shape, so that the substrate 30 can avoid the buckle structure formed after the upper heat dissipation cover 10 and the lower heat dissipation cover 20 are combined, and the lower buckle 22 of the lower heat dissipation cover 20 passes through the notch positions at the four corners of the substrate 30 and is buckled with the upper buckle 11 of the upper heat dissipation cover 10, thereby completing the close combination of the upper heat dissipation cover 10 and the lower heat dissipation cover 20.
[0032] Optionally, the initial contact positions of the upper buckle 11 and the lower buckle 22 are both beveled to ensure smooth combination of the upper buckle 11 and the lower buckle 22 .
[0033] Optionally, the lower heat dissipation cover 20 is made of a material with rigidity and toughness, so that when the upper buckle 11 is buckled with the lower buckle 22, the combination is completed by the elasticity of the lower buckle 22 itself, and the lower buckle 22 will not undergo permanent deformation.
[0034] In the present embodiment, after the upper heat dissipation cover 10 is combined with the lower heat dissipation cover 20, the bottom end of the upper heat dissipation cover 10 is in contact with both the lower heat dissipation cover 20 and the substrate 30. On the one hand, the upper heat dissipation cover 10 and the lower heat dissipation cover 20 can tightly flatten the four sides of the substrate 30, thereby effectively resisting the substrate from warping and improving the product reliability. On the other hand, the supporting points of the upper heat dissipation cover 10 include both the substrate 30 and the lower heat dissipation cover 20. Compared with the existing design in which the heat dissipation cover is completely supported by the substrate, the bottom end position of the upper heat dissipation cover 10 moves toward the outside of the substrate 30, reducing the occupation of the substrate space, thereby increasing the packaging layout space of the substrate without increasing the size of the substrate.
[0035] Optionally, considering the dimensional tolerances of the upper heat dissipation cover 10, the lower heat dissipation cover 20 and the substrate 30, in order to ensure that the upper heat dissipation cover 10 and the lower heat dissipation cover 20 can be tightly combined after being buckled, glue 60 can be applied to the bottom end of the upper buckle 11 of the upper heat dissipation cover 10 in advance and cured; or, glue can be applied to all positions where the upper heat dissipation cover 10 contacts the substrate 30 in advance and cured. The elastic glue acts as a sealing ring and a buffer, thereby compensating for the dimensional tolerances of the upper heat dissipation cover 10, the lower heat dissipation cover 20 and the substrate 30, and ensuring the stability of the entire heat dissipation packaging structure in the vertical direction.
[0036] In addition, glue may be applied in advance at the position where the lower heat dissipation cover 20 contacts the substrate 30. Specifically, glue may be applied and cured at the support platform 21 of the lower heat dissipation cover 20; or, glue may be applied and cured at the position where the lower heat dissipation cover 20 contacts the side of the substrate 30; or, glue may be applied and cured at both the support platform 21 of the lower heat dissipation cover 20 and the position where the lower heat dissipation cover 20 contacts the side of the substrate 30. The elastic glue acts as a sealing ring and a buffer, thereby ensuring the stability of the entire heat dissipation packaging structure in the horizontal direction.
[0037] The heat dissipation packaging structure provided by the embodiment of the utility model adopts the method of combining an upper heat dissipation cover and a lower heat dissipation cover to form a heat dissipation packaging structure of a substrate. The supporting points of the upper heat dissipation cover are the substrate and the lower heat dissipation cover. Compared with the upper heat dissipation cover supported by the substrate only, the bottom end position of the upper heat dissipation cover moves toward the outside of the substrate, reducing the occupation of the substrate space, thereby increasing the packaging layout space of the substrate without increasing the size of the substrate; in addition, by buckling the upper buckle with the lower buckle, after the upper heat dissipation cover and the lower heat dissipation cover are combined, the upper heat dissipation cover and the lower heat dissipation cover can tightly flatten the four sides of the substrate, thereby effectively resisting the warping of the substrate and improving the reliability of the product.
[0038] The above is only a specific implementation of the utility model, but the protection scope of the utility model is not limited thereto. Any changes or substitutions that can be easily thought of by a person skilled in the art within the technical scope disclosed by the utility model should be included in the protection scope of the utility model. Therefore, the protection scope of the utility model should be based on the protection scope of the claims.
Claims
1. A heat dissipation packaging structure, characterized in that: The heat dissipation packaging structure includes an upper heat dissipation cover and a lower heat dissipation cover; the main body of the lower heat dissipation cover is a square ring structure, the inner cavity of the square ring structure forms a supporting platform for placing a substrate, and the four corners of the square ring structure have lower buckles protruding upward; the four corners of the upper heat dissipation cover have upper buckles used in conjunction with the lower buckles; the four corners of the substrate have notches to form an appearance consistent with the edge shape of the supporting platform, the substrate is placed on the supporting platform in the inner cavity of the lower heat dissipation cover, the lower buckles of the lower heat dissipation cover pass through the notches at the four corners of the substrate and are buckled with the upper buckles of the upper heat dissipation cover, so that the upper heat dissipation cover and the lower heat dissipation cover are completely combined.
2. The heat dissipation packaging structure according to claim 1, characterized in that: The edge shape of the supporting platform is octagonal, and the four corners of the base plate have triangular notches.
3. The heat dissipation packaging structure according to claim 1, characterized in that: The initial contact positions of the upper buckle and the lower buckle are both beveled.
4. The heat dissipation packaging structure according to claim 1, characterized in that: The lower heat dissipation cover is made of a material with rigidity and toughness.
5. The heat dissipation packaging structure according to claim 1, characterized in that: The bottom end of the upper buckle of the upper heat dissipation cover is coated with glue.
6. The heat dissipation packaging structure according to claim 5, characterized in that: All positions where the upper heat dissipation cover contacts the substrate are coated with glue.
7. The heat dissipation packaging structure according to claim 1, characterized in that: The position where the lower heat dissipation cover contacts the substrate is coated with glue.
8. The heat dissipation packaging structure according to claim 7, characterized in that: The support platform of the lower heat dissipation cover is coated with glue; or the position where the lower heat dissipation cover contacts the side of the substrate is coated with glue; or both the support platform of the lower heat dissipation cover and the position where the lower heat dissipation cover contacts the side of the substrate are coated with glue.
9. The heat dissipation packaging structure according to claim 1, characterized in that: After the upper heat dissipation cover is combined with the lower heat dissipation cover, the bottom end of the upper heat dissipation cover is in contact with the lower heat dissipation cover and the substrate.
10. The heat dissipation packaging structure according to claim 1, characterized in that: The substrate is provided with crystal grains, the crystal grains are covered with heat-conducting materials, and the heat-conducting materials are in contact with the lower surface of the upper heat dissipation cover.