Device for improving through-current capability of PCB (Printed Circuit Board)

Abstract

The utility model discloses a device for increasing the through-current capability of a PCB (Printed Circuit Board), which comprises a PCB upper layer, a PCB inner layer and a PCB bottom layer, and the PCB is provided with a metalized sinking groove; the metalized sinking groove penetrates through the upper layer of the PCB and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB, or the metalized sinking groove penetrates through the upper layer of the PCB and the inner layer of the PCB and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the inner layer of the PCB; or the metalized sinking groove penetrates through the PCB upper layer and the PCB inner layer and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the PCB upper layer and the PCB inner layer; according to the device, the area of a PCB layer occupied by large-current backflow copper laying is reduced, the surface layer element laying space and the inner layer circuit wiring space are increased, and the current bearing capacity of a PCB loop can be improved.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB, in particular to a device for increasing the flow capacity of a PCB board. Background Art

[0002] At present, when a large current is encountered during PCB design, the current capacity of the circuit is generally increased by increasing the copper area, increasing the PCB copper thickness, using the PCB copper embedding process or using jumpers. These methods will increase the area of ​​the PCB board and also increase the product volume, which will bring design difficulties when the product space is insufficient. Using too many jumpers and increasing the copper thickness on the PCB board will not only increase the cost, but also increase the insecurity of the PCB board; the area of ​​the PCB board will also reduce the area that can be used by components due to the increase in the surface copper; when a relatively large current flow path needs to be set, the surface copper area is very large and cannot meet the arrangement of other components at all. Utility Model Content

[0003] The technical problem to be solved by the utility model is to propose a device for increasing the current carrying capacity of a PCB board. The device for increasing the current carrying capacity of a PCB board reduces the area of ​​the PCB layer occupied by the large current return copper plating, increases the surface component placement space and the inner layer line wiring space, and can increase the current carrying capacity of the PCB board loop.

[0004] In order to solve the above technical problems, the utility model provides a device for increasing the flow capacity of a PCB board, comprising an upper layer of a PCB board, an inner layer of a PCB board and a bottom layer of a PCB board, wherein the upper layer of the PCB board, the inner layer of the PCB board and the bottom layer of the PCB board are respectively provided with an A-end connecting copper sheet and a B-end connecting copper sheet, and a metallized sink groove is provided on the PCB board; the metallized sink groove penetrates the upper layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board, or the metallized sink groove penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the inner layer of the PCB board, or the metallized sink groove penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board and the inner layer of the PCB board.

[0005] Preferably, the metallized sink is connected to the bottleneck where the A end is connected to the copper sheet and the B end is connected to the copper sheet, and the length and width of the metallized sink hole are determined according to the size of the current that needs to flow.

[0006] Preferably, the shape of the connection between the metallized sink and the copper sheet connected to the A end and the copper sheet connected to the B end is square or semicircular.

[0007] Preferably, the metal filler in the metallization sink is solder paste or tin sheet.

[0008] Preferably, the metal filler filled in the metallized sink groove is solidified by reflow soldering to form a whole with the sink groove.

[0009] Preferably, after the metallization filling of the metallization sink is completed, an insulating material for increasing the safety distance from surrounding components is sprayed on the surface of the metallization sink.

[0010] Preferably, when the metallized sink penetrates the upper layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the upper layer of the PCB board, an outer layer electronic component is arranged around the metallized sink on the upper layer of the PCB board; when the metallized sink penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the inner layer of the PCB board, an inner layer circuit is arranged around the metallized sink on the inner layer of the PCB board; when the metallized sink penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the upper layer of the PCB board and the inner layer of the PCB board, an outer layer electronic component is arranged around the metallized sink on the upper layer of the PCB board, and an inner layer circuit is arranged around the metallized sink on the inner layer of the PCB board.

[0011] After adopting the above device, the device for increasing the current carrying capacity of the PCB board comprises an upper layer of the PCB board, an inner layer of the PCB board and a bottom layer of the PCB board, wherein the upper layer of the PCB board, the inner layer of the PCB board and the bottom layer of the PCB board are respectively provided with an A-end connecting copper sheet and a B-end connecting copper sheet, and a metallized sink groove is provided on the PCB board; the metallized sink groove penetrates the upper layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board, or the metallized sink groove penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the inner layer of the PCB board, or the metallized sink groove penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board and the inner layer of the PCB board; the device for increasing the current carrying capacity of the PCB board reduces the area of ​​the PCB layer occupied by the large current reflux copper plating, increases the surface component placement space and the inner layer line wiring space, and can increase the current carrying capacity of the PCB board loop. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] Figure 1 A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 1 ;

[0013] Figure 2 A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 2 ;

[0014] Figure 3A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 3 ;

[0015] Figure 4 This is a top view of the upper layer of a PCB board of a device for increasing the flow capacity of a PCB board according to the utility model;

[0016] Figure 5 This is a top view of the inner layer of a PCB board of a device for increasing the flow capacity of a PCB board according to the utility model;

[0017] Figure 6 This is a structural diagram of a device for increasing the flow capacity of a PCB board after the surface of the metallized sink is sprayed with insulating material.

[0018] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with embodiments and with reference to the accompanying drawings. DETAILED DESCRIPTION

[0019] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present application clearer and more understandable, the present application is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present application and are not used to limit the present application.

[0020] In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "center", "upper", "lower", "front", "back", "left", "right", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the present application. In addition, the terms "first" and "second" are used for descriptive purposes only and cannot be understood as indicating or implying relative importance.

[0021] Embodiment 1

[0022] See also Figures 1 to 5 , Figure 1 A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 1 , Figure 2 A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 2 , Figure 3 A cross section of a device for increasing the flow capacity of a PCB board according to the utility model Figure 3 , Figure 4 This is a top view of the upper layer of a PCB board of a device for increasing the flow capacity of a PCB board according to the utility model. Figure 5 This is a top view of the inner layer of a PCB board of a device for increasing the flow capacity of a PCB board according to the utility model;

[0023] The present embodiment discloses a device for increasing the flow capacity of a PCB board 10, comprising an upper layer 1 of a PCB board, an inner layer 2 of a PCB board and a bottom layer 11 of a PCB board, wherein the upper layer 1 of the PCB board, the inner layer 2 of the PCB board and the bottom layer 11 of the PCB board are respectively provided with an A-end connecting copper sheet and a B-end connecting copper sheet, and a metallized sink 9 is provided on the PCB board 10; Figure 1 As shown, the metallized sink 9 penetrates the upper layer 1 of the PCB board and connects the A-end connecting copper sheet 3 and the B-end connecting copper sheet 4 of the upper layer 1 of the PCB board, or as shown in FIG. Figure 2 As shown, the metallized sink 9 penetrates the upper layer 1 of the PCB board and the inner layer 2 of the PCB board and connects the A-end connecting copper sheet 7 and the B-end connecting copper sheet 8 of the inner layer 2 of the PCB board, or as shown in FIG. Figure 3 As shown, the metallized sink 9 penetrates the upper layer 1 of the PCB board and the inner layer 2 of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer 1 of the PCB board and the inner layer 2 of the PCB board.

[0024] Embodiment 2

[0025] This embodiment is based on the first embodiment. In this embodiment, the metallized sink 9 is connected to the bottleneck where the A end is connected to the copper sheet and the B end is connected to the copper sheet. The length and width of the metallized sink hole 9 are determined according to the size of the current that needs to flow.

[0026] Embodiment 3

[0027] See also Figure 6 , Figure 6 This is a structural diagram of a device for increasing the flow capacity of a PCB board according to the utility model after the surface of the metallized sink is sprayed with insulating material;

[0028] This embodiment is based on the first embodiment. In this embodiment, the shape of the connection between the metallized sink 9 and the copper sheet connected to the A end and the copper sheet connected to the B end is square or semicircular.

[0029] Embodiment 4

[0030] This embodiment is based on the first embodiment. In this embodiment, the metal filling in the metallization sink 9 is solder paste or solder flakes.

[0031] The metal filler filled in the metallized sink groove 9 is solidified by reflow soldering to form a whole with the sink groove.

[0032] After the metallization filling of the metallization sink is completed, an insulating material is sprayed on the surface of the metallization sink to increase the safety distance from surrounding components.

[0033] Embodiment 5

[0034] This embodiment is based on the first embodiment. In this embodiment,

[0035] When the metallized sink groove 9 penetrates the upper layer 1 of the PCB board and connects the A-end connection copper sheet 3 and the B-end connection copper sheet 4 of the upper layer 1 of the PCB board, the outer layer electronic components 5 are arranged around the metallized sink groove 9 of the upper layer 1 of the PCB board;

[0036] When the metallized sink groove 9 penetrates the upper layer 1 of the PCB board and the inner layer 2 of the PCB board and connects the A-end connecting copper sheet 7 and the B-end connecting copper sheet 8 of the inner layer 2 of the PCB board, the inner layer circuit 6 is arranged around the metallized sink groove 9 of the inner layer 2 of the PCB board;

[0037] When the metallized sink groove 9 penetrates the upper layer 1 of the PCB board and the inner layer 2 of the PCB board and connects the A-end connecting copper foil and the B-end connecting copper foil of the upper layer 1 of the PCB board and the inner layer 2 of the PCB board, the outer layer electronic components 5 are arranged around the metallized sink groove 9 of the upper layer 1 of the PCB board, and the inner layer circuits 6 are arranged around the metallized sink groove 9 of the inner layer 2 of the PCB board.

[0038] The device for increasing the current carrying capacity of a PCB board reduces the area of ​​the PCB layer occupied by the large current return copper plating, increases the surface component placement space and the inner layer line wiring space, and can increase the current carrying capacity of the PCB board loop.

[0039] The preferred embodiments of the present application are described above with reference to the accompanying drawings, but the scope of the present application is not limited thereby. Any modification, equivalent substitution and improvement made by a person skilled in the art without departing from the scope and essence of the present application shall be within the scope of the present application.

Claims

1. A device for increasing the flow capacity of a PCB board, characterized in that: The invention comprises an upper layer of a PCB board, an inner layer of a PCB board and a bottom layer of a PCB board, wherein the upper layer of the PCB board, the inner layer of the PCB board and the bottom layer of the PCB board are respectively provided with an A-end connecting copper sheet and a B-end connecting copper sheet, and a metallized sink groove is provided on the PCB board; the metallized sink groove runs through the upper layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board, or the metallized sink groove runs through the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the inner layer of the PCB board, or the metallized sink groove runs through the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connecting copper sheet and the B-end connecting copper sheet of the upper layer of the PCB board and the inner layer of the PCB board.

2. The device for increasing the flow capacity of a PCB board according to claim 1, characterized in that: The metallized sink is connected to the bottleneck where the A end is connected to the copper sheet and the B end is connected to the copper sheet. The length and width of the metallized sink hole are determined according to the size of the current that needs to flow.

3. The device for increasing the flow capacity of a PCB board according to claim 1, characterized in that: The shape of the connection between the metallized sink and the copper sheet connected to the A end and the copper sheet connected to the B end is square or semicircular.

4. The device for increasing the flow capacity of a PCB board according to claim 1, characterized in that: The metal filler in the metallization sink is solder paste or tin sheet.

5. The device for increasing the flow capacity of a PCB board according to claim 4, characterized in that: The metal filler filled in the metallized sink groove is solidified by reflow soldering to form a whole with the sink groove.

6. The device for increasing the flow capacity of a PCB board according to claim 5, characterized in that: After the metallization filling of the metallization sink is completed, an insulating material is sprayed on the surface of the metallization sink to increase the safety distance from surrounding components.

7. The device for increasing the flow capacity of a PCB board according to claim 1, characterized in that: When the metallized sink penetrates the upper layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the upper layer of the PCB board, an outer layer electronic component is arranged around the metallized sink on the upper layer of the PCB board; when the metallized sink penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the inner layer of the PCB board, an inner layer circuit is arranged around the metallized sink on the inner layer of the PCB board; when the metallized sink penetrates the upper layer of the PCB board and the inner layer of the PCB board and connects the A-end connected copper sheet and the B-end connected copper sheet of the upper layer of the PCB board and the inner layer of the PCB board, an outer layer electronic component is arranged around the metallized sink on the upper layer of the PCB board, and an inner layer circuit is arranged around the metallized sink on the inner layer of the PCB board.

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