Half-hole-plugging device for gold plating in holes of rigid-flex board

Abstract

The utility model discloses a semi-hole-plugging device for gold plating in holes of a rigid-flex board, and the device comprises a pretreatment device which is used for printing ink production and tool preparation; tool preparation comprises base plate manufacturing and nail bed manufacturing; the screen printing device is connected with the pretreatment device and is used for carrying out semi-plug hole treatment and resistance welding on via holes on the board surface through a base plate and a nail bed; the pre-curing device is connected with the screen printing device and is used for pre-drying the plate surface; the exposure device is connected with the pre-curing device and is used for setting snowflake gear points for the semi-plug holes in the board surface and exposing the board surface provided with the snowflake gear points; the developing device is connected with the exposure device and is used for developing the plate surface; and the post-curing device is connected with the developing device and is used for curing the board surface to obtain the rigid-flex board. According to the utility model, partial printing ink curing at the semi-plugging hole position can be realized, printing ink semi-plugging is realized, and the in-hole gilding effect is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of gold plating in holes, in particular to a semi-plugging hole device used for gold plating in holes of a soft-hard combination board. Background Art

[0002] Rigid-flex PCB is a combination of flexible PCB and rigid PCB. It is an important electronic component, a support for electronic components, and a carrier for electrical connection of electronic components. It is made by electronic printing. During the production process of rigid-flex PCB, a layer of ink needs to be printed on the board surface. Through image transfer, the pads that need to be welded are washed and developed with developer, and a layer of ink is retained on the copper surface that does not need to be welded to prevent functional problems caused by the connection between the copper surface and the electronic components.

[0003] The semi-plugged hole type of solder mask on the rigid-flexible board is not fully plugged, and the fullness is below 45%. In the surface treatment nickel-palladium-gold process, due to the poor fullness of the plugged hole, the semi-plugged hole is easy to hide the solution and is not easy to clean. In the activation tank, palladium ions will remain in the semi-plugged hole, resulting in an oxidation-reduction reaction in the nickel-palladium-gold tank, and a nickel-palladium-gold coating will be plated in the semi-plugged hole, affecting the electrical performance. Utility Model Content

[0004] The utility model aims to solve at least one of the technical problems existing in the prior art. To this end, the utility model proposes a semi-plugging device for gold plating in the holes of a rigid-flexible board, which adds a snowflake stop point at the semi-plugging position, and partially solidifies the ink at the semi-plugging position to achieve semi-plugging of the ink, thereby improving the gold plating effect in the hole.

[0005] According to a first aspect of the present invention, a semi-plugging device for gold plating in a hole of a rigid-flexible board is provided. The semi-plugging device comprises:

[0006] A pre-processing device for ink preparation and tool preparation; the tool preparation includes pad preparation and nail bed preparation;

[0007] A screen printing device, connected to the pre-processing device, for performing semi-plugging and solder resist processing of the via holes on the board surface through the pad and the nail bed;

[0008] A pre-curing device, connected to the screen printing device, for pre-baking the board surface;

[0009] An exposure device, connected to the pre-curing device, used to set snowflake points on the half-plugged holes of the board surface and expose the board surface with the snowflake points set;

[0010] A developing device, connected to the exposure device, for developing the plate surface;

[0011] A post-curing device is connected to the developing device and is used to cure the board surface to obtain a rigid-flexible board.

[0012] The semi-plugging device for gold plating in a hole of a rigid-flexible board according to the embodiment of the utility model has at least the following beneficial effects:

[0013] First, the ink, pad and nail bed are made through the pre-treatment device. The ink can be modulated according to the scene requirements to obtain more suitable ink. The pad is made to prevent the ink from contaminating the table surface. The nail bed is made to make the force uniform during the semi-plugging treatment. Secondly, the semi-plugging treatment and solder mask of the via hole are carried out by the silk screen printing device to achieve semi-plugging of ink and improve the gold-plating effect in the hole. Then, the board surface is pre-baked by the pre-curing device to better control the volatilization of ink solvent and the shrinkage of resin during subsequent curing or tin spraying. Then, the exposure device sets the snowflake point at the semi-plugged hole to further solidify the ink at the semi-plugged hole position to achieve the effect of semi-plugging of ink. Then, the board surface is developed to rinse off the part where no chemical reaction occurs. Finally, the post-curing device is used for the final curing to evaporate the ink solvent, reduce the gap between molecules and shrink the resin to obtain a better soft-hard combination board.

[0014] According to some embodiments of the present invention, the semi-plugged hole adopts a full-open window process.

[0015] According to some embodiments of the present invention, the first diameter of the snowflake stop point is two-fifths of the second diameter of the half-plug hole.

[0016] According to some embodiments of the utility model, the ink production includes setting the ink ratio and oil-opening conditions; the ratio includes a hardener ratio higher than 30% and a solid component ratio of 78%, and the oil-opening conditions include a viscosity higher than 220PS and an oil-opening water ratio of 15CC / KG.

[0017] According to some embodiments of the utility model, the pad production includes producing a pad having a hole identical to that of the via hole by a CNC drilling machine; the pad uses a copper clad laminate.

[0018] According to some embodiments of the utility model, the nail bed manufacturing includes drilling holes through the CNC drilling machine to obtain the nail bed, and supporting the board surface through the nail bed and the nail bed nails.

[0019] According to some embodiments of the present invention, in the semi-plugging process, the copper thickness of the hole wall surface reaches 15um.

[0020] According to some embodiments of the utility model, the silk-screen printing device is also connected to a plate grinding machine, and the plate grinding machine is used to grind the plate surface that has been semi-plugged.

[0021] According to some embodiments of the present invention, the post-curing device is also connected to a UV machine, and before the board surface is cured, the board surface is first processed by the UV machine.

[0022] According to some embodiments of the present invention, the post-curing device adopts segmented curing, and the segmented curing is achieved by setting multiple segments of curing time.

[0023] Additional aspects and advantages of the present invention will be given in part in the following description, and in part will become apparent from the following description, or will be learned through the practice of the present invention. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The present invention is further described below with reference to the accompanying drawings and embodiments, wherein:

[0025] Figure 1 It is a schematic diagram of the framework of a semi-hole plugging device for gold plating in holes of a rigid-flexible board according to an embodiment of the utility model;

[0026] Figure 2 This is a gold-plating effect diagram of a semi-plugging device for gold-plating in a hole of a rigid-flexible board without adding a snowflake stop point according to an embodiment of the utility model;

[0027] Figure 3 This is a gold-plating effect diagram of a semi-plugging device for gold-plating in a hole of a rigid-flexible board with an increased snowflake stop point according to an embodiment of the utility model;

[0028] Figure 4 A schematic diagram of the framework of a semi-hole plugging device for gold plating in a hole of a rigid-flexible board with a plate grinding machine added to an embodiment of the utility model;

[0029] Figure 5 The present invention is a schematic diagram of a framework of a semi-hole plugging device for gold plating in holes of a rigid-flexible board with an additional UV machine according to an embodiment of the present invention.

[0030] Figure Number:

[0031] Pre-processing device 1001;

[0032] Screen printing device 1002;

[0033] Pre-curing device 1003;

[0034] Exposure device 1004;

[0035] Development device 1005;

[0036] Post-curing device 1006;

[0037] Plate grinding machine 101;

[0038] UV machine 102. DETAILED DESCRIPTION

[0039] The embodiments of the present invention are described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0040] In the description of the present invention, it should be understood that the descriptions involving orientation, such as the orientation or positional relationship indicated as up, down, etc., are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present invention.

[0041] In the description of the present utility model, "a plurality" means more than two. If there is a description of "first" or "second", it is only for the purpose of distinguishing the technical features, and cannot be understood as indicating or implying the relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the order of the indicated technical features.

[0042] In the description of the present invention, unless otherwise clearly defined, terms such as setting, installing, connecting, etc. should be understood in a broad sense, and technicians in the relevant technical field can reasonably determine the specific meanings of the above terms in the present invention based on the specific content of the technical solution.

[0043] The following will be combined Figure 1 A clear and complete description is given of the semi-plugging device for gold plating in holes of rigid-flex boards according to the embodiment of the utility model. Obviously, the embodiment described below is only a part of the embodiment of the utility model, not all of the embodiments.

[0044] According to the embodiment of the utility model, a semi-plugging device for gold plating in a hole of a rigid-flexible board is provided, and the semi-plugging device comprises:

[0045] The pre-processing device 1001 is used for ink production and tool preparation; tool preparation includes pad production and nail bed production.

[0046] The screen printing device 1002 is connected to the pre-processing device 1001 and is used to perform semi-plugging and solder masking of the via holes on the board surface through a pad and a nail bed.

[0047] The pre-curing device 1003 is connected to the screen printing device 1002 and is used for pre-baking the board surface.

[0048] The exposure device 1004 is connected to the pre-curing device 1003, and is used to set snowflake points on the semi-plugged holes of the board surface and expose the board surface with the snowflake points set.

[0049] The developing device 1005 is connected to the exposure device 1004 and is used for developing the board surface.

[0050] The post-curing device 1006 is connected to the developing device 1005 and is used to cure the board surface to obtain a rigid-flex board.

[0051] First, the ink, pad and nail bed are made by the pre-processing device 1001. The ink can be modulated according to the scene requirements to obtain more suitable ink. The pad is made to prevent the ink from contaminating the table surface. The nail bed is made to make the force uniform during the semi-plugging treatment. Secondly, the semi-plugging treatment and solder mask of the via hole are carried out by the silk screen device 1002 to achieve semi-plugging of ink and improve the gold effect in the hole. Then, the board surface is pre-baked by the pre-curing device 1003 to better control the volatilization of ink solvent and the shrinkage of resin during subsequent curing or tin spraying. Then, the exposure device 1004 sets a snowflake point at the semi-plugged hole to further solidify the ink at the semi-plugged hole position to achieve the effect of semi-plugging of ink. Then, the board surface is developed by the developing device 1005 to rinse off the part where no chemical reaction occurs. Finally, the post-curing device 1006 is used for final curing to volatilize the ink solvent, reduce the gap between molecules and shrink the resin to obtain a better soft-hard combination board.

[0052] In some embodiments of the present invention, the half-plugged hole adopts a full-open window process.

[0053] It should be noted that the full-window design enables better surface treatment, such as tinning, welding, etc.

[0054] The semi-plug hole adopts the full window process to better treat the surface of the board and save a certain amount of production cost.

[0055] In some embodiments of the present invention, the first diameter of the snowflake stop point is two-fifths of the second diameter of the half-plug hole.

[0056] It should be noted that when the semi-plug hole adopts the full window process design, it will have a certain impact on the solder mask process. Therefore, by setting the snowflake point, refer to Figure 2 and Figure 3 , Figure 2 This is the gold effect picture without snowflake points. Figure 3 For the gold-plating effect diagram with snowflake stops, setting the diameter of the snowflake stops to two-fifths of the diameter of the half-plug hole can achieve a better gold-plating effect.

[0057] Preferably, the aperture of the semi-plugged hole is 250um, and a snowflake point of 100um is added to the semi-plugged hole position in the exposure data.

[0058] In some embodiments of the present invention, ink preparation includes setting the ink ratio and oil-opening conditions; the ratio includes a hardener ratio higher than 30% and a solid component ratio of 78%, and the oil-opening conditions include a viscosity higher than 220PS and an oil-opening water ratio of 15CC / KG.

[0059] Limiting the ink ratio and oil opening conditions can strictly control the ink quality, thereby solving certain via voids and unevenness problems.

[0060] In some embodiments of the present invention, the pad manufacturing includes manufacturing the pad with the same drilling holes as the via holes by a CNC drilling machine; the pad uses a copper clad laminate.

[0061] Using a CNC drilling machine to make a pad with the same drilling hole as the via hole is beneficial to remove the air in the via hole, and using a copper clad laminate with a thickness of 1.0 mm to 1.4 mm is preferred to reduce certain production costs.

[0062] In some embodiments of the present invention, the production of the nail bed includes drilling holes through a CNC drilling machine to obtain the nail bed, and supporting the board surface through the nail bed and the nail bed nails.

[0063] Preferably, the diameter of the drilled holes is 3.20MM, the distance between the holes is 5CM, and the nail bed is surrounded by 1MM to 1.6MM copper bars and nail bed nails to support the board surface together, so that the board surface is evenly stressed.

[0064] In some embodiments of the present invention, the copper thickness on the hole wall surface in the semi-plugging process reaches 15 um.

[0065] It should be noted that when the copper thickness on the hole surface is greater than 15um, the problem of resin and copper delamination can be solved. The maximum thickness of the copper is limited according to the product and cost, and no specific numerical limit is given here.

[0066] Reference Figure 4 In some embodiments of the present invention, the screen printing device 1002 is also connected to the plate grinding machine 101, and the plate grinding machine 101 is used to grind the plate surface that has been semi-plugged.

[0067] The grinding machine 101 can effectively remove the resin on the board surface, and can also greatly ensure that the copper surface will not be scratched or scratched, thereby improving the semi-plugging effect and the subsequent gold plating effect.

[0068] Reference Figure 5In some embodiments of the present invention, the post-curing device 1006 is also connected to the UV machine 102, and the board surface is first processed by the UV machine 102 before curing the board surface.

[0069] The preliminary treatment by the UV machine 102 can effectively prevent the oil from bouncing off and make the surface photopolymerization reaction of the board more thorough.

[0070] In some embodiments of the present invention, the post-curing device 1006 adopts segmented curing, and the segmented curing is achieved by setting multiple segments of curing time.

[0071] By achieving segmented curing through multiple curing times, the volatilization of ink solvents, the reduction of intermolecular gaps and the shrinkage of resins can be strictly controlled. At the same time, the curing time can be adjusted to meet the requirements of ink solvent volatilization, intermolecular gaps and resin shrinkage in different task scenarios, thereby improving the flexibility of curing.

[0072] The embodiments of the present invention are described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge scope of ordinary technicians in the relevant technical field without departing from the purpose of the present invention.

[0073] Those skilled in the art will appreciate that the technical solutions shown in the figures do not limit the embodiments of the present disclosure and may include more or fewer steps than shown in the figures, or a combination of certain steps, or different steps.

[0074] The device embodiments described above are merely illustrative, and the units described as separate components may or may not be physically separated, that is, they may be located in one place or distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0075] Those skilled in the art will appreciate that all or some of the steps in the methods disclosed above, and the functional modules / units in the systems and devices may be implemented as software, firmware, hardware, or a suitable combination thereof.

[0076] The terms "first", "second", "third", "fourth", etc. (if any) in the specification of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0077] It should be understood that in the present application, "at least one (item)" means one or more, and "plurality" means two or more. "And / or" is used to describe the association relationship of associated objects, indicating that three relationships may exist. For example, "A and / or B" can mean: only A exists, only B exists, and A and B exist at the same time, where A and B can be singular or plural. The character " / " generally indicates that the objects associated before and after are in an "or" relationship. "At least one of the following" or similar expressions refers to any combination of these items, including any combination of single or plural items. For example, at least one of a, b or c can mean: a, b, c, "a and b", "a and c", "b and c", or "a and b and c", where a, b, c can be single or multiple.

[0078] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0079] The above is a specific description of the preferred implementation of the embodiments of the present application, but the embodiments of the present application are not limited to the above-mentioned implementation methods. Technical personnel familiar with the field can also make various equivalent modifications or substitutions without violating the spirit of the embodiments of the present application. These equivalent modifications or substitutions are all included in the scope defined by the claims of the embodiments of the present application.

Claims

1. A semi-plugging device for gold plating in holes of rigid-flex boards, characterized in that: The semi-plugging device comprises: A pre-processing device for ink preparation and tool preparation; the tool preparation includes pad preparation and nail bed preparation; A screen printing device, connected to the pre-processing device, for performing semi-plugging and solder resist processing of the via holes on the board surface through the pad and the nail bed; A pre-curing device, connected to the screen printing device, for pre-baking the board surface; An exposure device, connected to the pre-curing device, used to set snowflake points on the half-plugged holes of the board surface and expose the board surface with the snowflake points set; A developing device, connected to the exposure device, for developing the plate surface; A post-curing device is connected to the developing device and is used to cure the board surface to obtain a rigid-flexible board.

2. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 1, characterized in that: The semi-plugged hole adopts a full-open window process.

3. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 1, characterized in that: The first diameter of the snowflake stop point is two-fifths of the second diameter of the half-plug hole.

4. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 1, characterized in that: The pad production includes producing a pad with a hole identical to the through hole by a numerically controlled drilling machine; the pad is made of a copper-clad laminate.

5. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 4, characterized in that: The nail bed manufacturing includes drilling holes through the CNC drilling machine to obtain the nail bed, and supporting the board surface through the nail bed and the nail bed nails.

6. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 5, characterized in that: In the semi-plugging process, the copper thickness on the hole wall surface reaches 15um.

7. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 6, characterized in that: The screen printing device is also connected to a plate grinding machine, which is used to grind the plate surface that has been semi-plugged.

8. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 6, characterized in that: The post-curing device is also connected to a UV machine, and before the board surface is cured, the board surface is first processed by the UV machine.

9. The semi-plugging device for gold plating in holes of rigid-flex boards according to claim 7, characterized in that: The post-curing device adopts segmented curing, and the segmented curing is achieved by setting multiple segments of curing time.

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