Electronic device

Abstract

The utility model provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a first middle frame, a second middle frame, a rotating shaft, a first heat conduction layer and a second heat conduction layer. The first middle frame is rotationally connected with the second middle frame through a rotating shaft; a rotating shaft floating plate is arranged between the first middle frame and the second middle frame, and the rotating shaft and the rotating shaft floating plate are arranged at intervals; the first heat conduction layer first part is arranged between the rotating shaft and the rotating shaft floating plate, the first heat conduction layer second part covers the first middle frame and the second middle frame, the second heat conduction layer first part is arranged on the side, away from the rotating shaft, of the rotating shaft floating plate, and the second heat conduction layer second part covers the first middle frame and the second middle frame.

Description

Technical Field

[0001] The present application relates to the technical field of electronic equipment, and in particular to an electronic equipment. Background Art

[0002] With the rapid development of electronic devices, the degree of integration of electronic devices is getting higher and higher. Not only do they need to realize functions in a small space, but they also need to dissipate the heat generated to ensure the smooth operation of electronic devices and extend their service life.

[0003] For an electronic device with a folding function, a rotating shaft and a rotating shaft floating plate are usually arranged between the foldable first middle frame and the second middle frame. By arranging a single layer of graphite between the rotating shaft and the rotating shaft floating plate or on the side of the rotating shaft floating plate away from the rotating shaft, the thermal conductivity of graphite is utilized to achieve heat conduction between the first middle frame and the second middle frame.

[0004] At present, due to the increase in the degree of integration in electronic devices, the heat generated has increased, and there is an urgent need to improve the heat dissipation efficiency to meet the heat dissipation needs. Utility Model Content

[0005] The present application provides an electronic device, which improves heat dissipation efficiency and meets the heat dissipation demand after the increase in heat generated due to the increase in the degree of integration in the electronic device.

[0006] The present application provides an electronic device, including:

[0007] A first middle frame, a second middle frame, and a rotating shaft;

[0008] The first middle frame is rotatably connected with the second middle frame via a rotating shaft;

[0009] A rotating shaft floating plate is arranged between the first middle frame and the second middle frame, and the rotating shaft and the rotating shaft floating plate are arranged at intervals;

[0010] The first heat-conducting layer and the second heat-conducting layer, the first part of the first heat-conducting layer is arranged between the rotating shaft and the rotating shaft floating plate, the second part of the first heat-conducting layer covers the first middle frame and the second middle frame respectively, the first part of the second heat-conducting layer is arranged on the side of the rotating shaft floating plate away from the rotating shaft, and the second part of the second heat-conducting layer covers the first middle frame and the second middle frame respectively.

[0011] In some embodiments, the aforementioned electronic device, wherein the first middle frame and the second middle frame can be in a first form and a second form through a rotating shaft; the first thermal conductive layer has a first deformation amount when in the first form, and has a second deformation amount when in the second form; the second thermal conductive layer has a third deformation amount when in the first form, and has a fourth deformation amount when in the second form; there is a first deformation amount difference between the first deformation amount and the second deformation amount, there is a second deformation amount difference between the third deformation amount and the fourth deformation amount, and the first deformation amount difference is different from the second deformation amount difference.

[0012] In some embodiments, the aforementioned electronic device further includes a scratch-resistant layer disposed on a side of the rotating shaft floating plate away from the rotating shaft, and the first portion of the second heat-conducting layer is disposed between the scratch-resistant layer and the rotating shaft floating plate.

[0013] In some embodiments, in the aforementioned electronic device, the length of the first heat-conducting layer in the axial direction of the rotating shaft is the same as or different from the length of the second heat-conducting layer in the axial direction of the rotating shaft.

[0014] In some embodiments, in the aforementioned electronic device, the first portion of the second heat-conducting layer also covers two side walls of the rotating shaft floating plate facing the first middle frame and the second middle frame.

[0015] In some embodiments, the aforementioned electronic device, wherein a groove is provided on the side of the shaft facing the shaft floating plate, and the shaft floating plate is accommodated in the groove; the first part of the first thermal conductive layer is arranged between the groove and the shaft floating plate; the first part of the second thermal conductive layer is arranged on the side of the shaft floating plate away from the groove.

[0016] In some embodiments, in the aforementioned electronic device, there are multiple shaft floating plates, the multiple shaft floating plates are arranged at intervals along the axial direction of the shaft, and there are multiple first portions of the first thermal conductive layer and the first portions of the second thermal conductive layer and are arranged corresponding to the multiple shaft floating plates.

[0017] In some embodiments, in the aforementioned electronic device, a plurality of first heat-conducting layer second portions and a plurality of second heat-conducting layer second portions are connected as a whole to cover the first middle frame and the second middle frame.

[0018] In some embodiments, in the aforementioned electronic device, the first portion of the first heat-conducting layer is provided with a plurality of diamond-shaped stretching holes, and the plurality of diamond-shaped stretching holes are arranged in an array.

[0019] In some embodiments, in the aforementioned electronic device, the first heat-conducting layer and the second heat-conducting layer are both single-layer graphene.

[0020] The above description is only an overview of the technical solution of the present application. In order to more clearly understand the technical means of the present application and implement it according to the contents of the specification, the following is a detailed description of the preferred embodiments of the present application in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present disclosure or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present disclosure. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0022] Figure 1A schematic diagram of the side structure of a first electronic device according to an embodiment of the present application is shown;

[0023] Figure 2 A schematic diagram of the side structure of a second electronic device according to an embodiment of the present application is shown;

[0024] Figure 3 A schematic diagram of the side structure of a third electronic device according to an embodiment of the present application is shown;

[0025] Figure 4 The schematic diagram of the top view of the fourth electronic device according to the embodiment of the present application is shown;

[0026] Figure 5 The top view of the fifth electronic device according to the embodiment of the present application is schematically shown;

[0027] Figure 6 The structural diagram of the first heat-conducting layer of the electronic device in the embodiment of the present application is schematically shown.

[0028] Description of Figure Numbers

[0029] 1. The first middle frame;

[0030] 2. Second middle frame;

[0031] 3. rotating shaft; 31. groove;

[0032] 4. Rotating shaft floating plate;

[0033] 5. first heat conducting layer; 51. diamond-shaped stretching hole;

[0034] 6. The second heat conducting layer;

[0035] 7. Anti-scratch layer;

[0036] A. Axial direction. DETAILED DESCRIPTION

[0037] The following is a further detailed description of the embodiments of the present disclosure in conjunction with the accompanying drawings and examples. The detailed description of the following embodiments and the accompanying drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure. The present disclosure can be implemented in many different forms and is not limited to the specific embodiments disclosed herein, but includes all technical solutions that fall within the scope of the claims.

[0038] The present disclosure provides these embodiments to make the present disclosure thorough and complete, and to fully express the scope of the present disclosure to those skilled in the art. It should be noted that unless otherwise specifically stated, the relative arrangement of the parts and steps, the composition of the materials, the numerical expressions and the numerical values ​​set forth in these embodiments should be interpreted as being merely exemplary, and not as limiting.

[0039] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "multiple" is greater than or equal to two; the terms "upper", "lower", "left", "right", "inner", "outer", etc., indicating the orientation or positional relationship, are only for the convenience of describing the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation of the present disclosure. When the absolute position of the object being described changes, the relative positional relationship may also change accordingly.

[0040] In addition, the words "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different parts. "Vertical" does not mean vertical in the strict sense, but is within the tolerance range. "Parallel" does not mean parallel in the strict sense, but is within the tolerance range. "Include" or "comprising" and similar words mean that the elements before the word include the elements listed after the word, and do not exclude the possibility of including other elements.

[0041] It should also be noted that in the description of the present disclosure, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be directly connected or indirectly connected through an intermediate medium. For ordinary technicians in this field, the specific meanings of the above terms in the present disclosure can be understood according to the specific circumstances. When a specific device is described as being located between a first device and a second device, there may or may not be an intermediate device between the specific device and the first device or the second device.

[0042] All terms used in the present disclosure have the same meanings as those understood by those of ordinary skill in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries, for example, should be interpreted as having meanings consistent with their meanings in the context of the relevant technology, and should not be interpreted in an idealized or extremely formal sense, unless explicitly defined as such herein.

[0043] Technologies, methods, and equipment known to ordinary technicians in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and equipment should be considered part of the specification.

[0044] like Figure 1As shown, the present application provides an electronic device, including a first middle frame 1, a second middle frame 2, a rotating shaft 3, a first heat-conducting layer 5, and a second heat-conducting layer 6. The first middle frame 1 is rotatably connected with the second middle frame 2 through the rotating shaft 3; a rotating shaft floating plate 4 is arranged between the first middle frame 1 and the second middle frame 2, and the rotating shaft 3 and the rotating shaft floating plate 4 are arranged at intervals; the first part of the first heat-conducting layer 5 is arranged between the rotating shaft 3 and the rotating shaft floating plate 4, and the second part of the first heat-conducting layer 5 covers the first middle frame 1 and the second middle frame 2 respectively, the first part of the second heat-conducting layer 6 is arranged on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second part of the second heat-conducting layer 6 covers the first middle frame 1 and the second middle frame 2 respectively.

[0045] Specifically, for an electronic device with a folding function, it corresponds to two foldable screen modules, and has a corresponding foldable first middle frame 1 and second middle frame 2, and there are many electronic components in the electronic device. The first middle frame 1 and the second middle frame 2 can play a bearing and supporting role for the electronic components in the electronic device. For an electronic device with a folding function, the first middle frame 1 and the second middle frame 2 can not only maintain its structural strength, but also meet the dynamic scene of the screen module folding. During the use of the electronic device, the electronic components inside it will generate heat during operation, and the generated heat needs to be conducted and dissipated to ensure the safe operation of the electronic components and to ensure the service life. The present application covers the first middle frame 1 and the second middle frame 2 by setting the second part of the first heat conductive layer 5 and the second part of the second heat conductive layer 6 to achieve heat conduction and improve the heat dissipation performance of the electronic device.

[0046] During the arrangement of the internal components of the electronic device, the electronic components in the first middle frame 1 and the second middle frame 2 are not symmetrical, and they correspond to different functional modules. When the electronic device is in different working states, different functional modules generate heat, which will cause the heat generated by the electronic components in the spaces inside the electronic device corresponding to the first middle frame 1 and the second middle frame 2 to be different. For example, the first middle frame 1 corresponds to the core functional modules such as the processor, storage unit, camera module, and battery of the electronic device, and the second middle frame 2 corresponds to the wireless communication module, speaker module, and microphone module of the electronic device. In this embodiment, when the electronic device is in the process of shooting or charging, the heat generated by the first middle frame 1 is greater than the heat generated by the second middle frame 2, and when the electronic device is in working scenarios such as communication, audio and video, the heat generated by the second middle frame 2 may be less than that of the second middle frame 2. Frame 2, and based on the above embodiment, if the battery function module is set in the second middle frame 2, the difference in heat generated by the first middle frame 1 and the second middle frame 2 will change in different scenarios, so the present application does not limit the arrangement position of the functional modules corresponding to the electronic components in the specific electronic device in the first middle frame 1 and the second middle frame 2. Considering that excessive heat generated by the electronic components may cause damage to the corresponding electronic components, or cause damage to other electronic components in the middle frame where the electronic components are located, or even damage the electronic device, it is necessary to conduct and dissipate the heat efficiently. The present application conducts the heat generated by the electronic components in the space inside the electronic device corresponding to the first middle frame 1 and the second middle frame 2 at the same time through the first heat-conducting layer 5 and the second heat-conducting layer 6, thereby reducing the heat dissipation pressure of the corresponding middle frame that generates more heat, and ensuring the stable and safe operation of the electronic device.

[0047] In order to switch between the folding and unfolding states of the first middle frame 1 and the second middle frame 2, the first middle frame 1 and the second middle frame 2 are rotatably connected via a rotating shaft 3. In order to provide support and protection for the flexible screen during the folding and unfolding of the electronic device, a rotating shaft floating plate 4 spaced from the rotating shaft 3 is provided between the first middle frame 1 and the second middle frame 2. The rotating shaft floating plate 4 provides support for the flexible screen during the folding and unfolding process, reduces creases, and reduces the bending stress of the flexible screen at the rotating shaft 3. The electronic device of the present application is not limited to its bending type, and can be an inward folding form, an outward folding form, a flip form, etc. For different bending types, the setting positions and connection relationships of the first middle frame 1, the second middle frame 2, the shaft 3 and the shaft floating plate 4 are adaptively adjusted, as long as the first part of the first heat-conducting layer 5 is arranged between the shaft 3 and the shaft floating plate 4, the first part of the second heat-conducting layer 6 is arranged on the side of the shaft floating plate 4 away from the shaft 3, and the second parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 respectively cover the first middle frame 1 and the second middle frame 2, so as to provide two heat-conducting paths to simultaneously conduct the heat generated in the space inside the electronic device corresponding to the first middle frame 1 and the second middle frame 2.

[0048] The first heat-conducting layer 5 is arranged between the rotating shaft 3 and the rotating shaft floating plate 4, and the second part of the first heat-conducting layer 5 covers the first middle frame 1 and the second middle frame 2 respectively, forming a through-axis heat-conducting path between the rotating shaft 3 and the rotating shaft floating plate 4; the first part of the second heat-conducting layer 6 is arranged on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second part of the second heat-conducting layer 6 covers the first middle frame 1 and the second middle frame 2 respectively, forming a through-axis heat-conducting path on the side of the rotating shaft floating plate 4 away from the rotating shaft 3. The present application provides a through-axis heat-conducting path and a through-axis heat-conducting path through the first heat-conducting layer 5 and the second heat-conducting layer 6, conducts the heat generated by the first middle frame 1 and the second middle frame 2, and the two heat-conducting paths improve the heat conduction efficiency per unit time, thereby improving the heat dissipation performance of the electronic device of the present application.

[0049] For the arrangement of the first heat-conducting layer 5, the first heat-conducting layer 5 can be arranged by reserving a space between the rotating shaft 3 and the rotating shaft floating plate 4, or the first heat-conducting layer 5 can be arranged by using the space reserved for FPC (Flexible Printed Circuit) in the electronic device. For the arrangement of the second heat-conducting layer 6, a protective film layer structure with insulation, wear resistance and other properties can be coated on the side of the second heat-conducting layer 6 away from the rotating shaft floating plate 4 to ensure that the second heat-conducting layer 6 provides a stable heat-conducting function. In order to improve the heat dissipation efficiency, graphite materials are used in both the first heat-conducting layer 5 and the second heat-conducting layer 6 in this application to utilize the excellent thermal conductivity of graphite to ensure the heat dissipation efficiency in the electronic device. In this application, the first heat-conducting layer 5 and the second heat-conducting layer 6 can both use the same thickness of graphite, or different thicknesses, or graphite sheets can be used to stick to the preset position in the electronic device, or they can be in the form of graphite films, which are not limited to specific ones, as long as they can achieve heat conduction between the first middle frame 1 and the second middle frame 2.

[0050] In the present application, in order to realize that the first part of the first heat-conducting layer 5 and the first part of the second heat-conducting layer 6 are respectively arranged between the rotating shaft 3 and the rotating shaft floating plate 4 and on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, a high thermal conductivity adhesive, a flexible thermal conductive material or a thermal conductive gel can be used to realize the connection of the first heat-conducting layer 5 and the first part of the second heat-conducting layer 6 at the corresponding setting position, or the corresponding position can be arranged and connected by integrating at least part of the internal structural parts of the area where the rotating shaft 3 of the electronic device is set or components such as the above-mentioned FPC flexible printed circuit board. As for the stacking of the second part of the first heat-conducting layer 5 and the second part of the second heat-conducting layer 6 at the first middle frame 1 and the second middle frame 2, the same is true as above, and the connection between the second part of the first heat-conducting layer 5 and the second heat-conducting layer 6 can also be realized by means of a high thermal conductivity adhesive, a flexible thermal conductive material or a thermal conductive gel. And when the second part of the first heat-conducting layer 5 and the second heat-conducting layer 6 covers the first middle frame 1 and the second middle frame 2, it is still based on the positional relationship between the first parts of the two, that is, the second part of the second heat-conducting layer 6 is located on the side away from the first middle frame 1 and the second middle frame 2 relative to the second part of the first heat-conducting layer 5.

[0051] It should be noted that if Figure 1 As shown, the present application shows a side view structural diagram of an electronic device, only to clearly express the setting positions of the first heat-conducting layer 5 and the second heat-conducting layer 6 in the electronic device of the present application, and their positional relationship with the first middle frame 1, the second middle, the shaft 3, and the shaft floating plate 4. In the actual electronic device, the shaft 3 is a complex hinge structure, and the first middle frame 1 and the second middle frame 2 are both tightly matched with the above-mentioned hinge structure for rotational connection.

[0052] The present application provides an electronic device, including a first middle frame 1, a second middle frame 2, a rotating shaft 3, a first heat-conducting layer 5, and a second heat-conducting layer 6. The first middle frame 1 is rotatably connected to the second middle frame 2 via the rotating shaft 3; a rotating shaft floating plate 4 is arranged between the first middle frame 1 and the second middle frame 2, and the rotating shaft 3 and the rotating shaft floating plate 4 are arranged at intervals; the first part of the first heat-conducting layer 5 is arranged between the rotating shaft 3 and the rotating shaft floating plate 4, the second part of the first heat-conducting layer 5 covers the first middle frame 1 and the second middle frame 2 respectively, the first part of the second heat-conducting layer 6 is arranged on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second part of the second heat-conducting layer 6 covers the first middle frame 1 and the second middle frame 2 respectively. The electronic device of the present application is provided with a first heat-conducting layer 5 and a second heat-conducting layer 6 respectively between the rotating shaft 3 and the rotating shaft floating plate 4 and on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 are provided to cover the first middle frame 1 and the second middle frame 2 of the electronic device, so that two heat-conducting paths can be formed through the two heat-conducting layers, and the heat generated in the space of the electronic device corresponding to the first middle frame 1 and the second middle frame 2 is conducted at the same time, so as to improve the heat dissipation efficiency and reduce the heat dissipation pressure of the corresponding middle frame that generates more heat. Through the application of the present application, the heat dissipation efficiency is improved, and the heat dissipation demand after the increase in heat generated due to the increase in the degree of integration in the electronic device is met.

[0053] In some embodiments, the first middle frame 1 and the second middle frame 2 can be in a first form and a second form through the rotating shaft 3; the first thermal conductive layer 5 has a first deformation amount when in the first form, and has a second deformation amount when in the second form; the second thermal conductive layer 6 has a third deformation amount when in the first form, and has a fourth deformation amount when in the second form; there is a first deformation amount difference between the first deformation amount and the second deformation amount, there is a second deformation amount difference between the third deformation amount and the fourth deformation amount, and the first deformation amount difference is different from the second deformation amount difference.

[0054] Specifically, in the electronic device provided in the present application, the first middle frame 1 and the second middle frame 2 can be in a first form and a second form through the rotating shaft 3. For an electronic device that can complete a folding action, the first form referred to in the present application is a fully unfolded state of the electronic device, and the second form is a fully folded state of the electronic device. During the process of the electronic device changing from the first form of the fully unfolded state to the second form of the fully folded state, the first heat-conducting layer 5 is stretched along with the rotating shaft 3 during the above process, and will change from the first deformation amount to the second deformation amount. Similarly, the second heat-conducting layer 6 will change from the fourth deformation amount to the third deformation amount.

[0055] In one embodiment of the present application, the first part of the first thermal conductive layer 5 and the first part of the second thermal conductive layer 6 both include a single-layer graphene, a double-sided adhesive and a PI film. In order to adapt to the change in the above-mentioned deformation amount, the present application sets a certain range of elongation at break for the single-layer graphene, the double-sided adhesive and the PI film in the first part of the first thermal conductive layer 5 and the first part of the second thermal conductive layer 6, wherein the elongation at break of the single-layer graphene is in the range of 3% to 6%, the elongation at break of the double-sided adhesive is in the range of 5% to 10%, and the elongation at break of the PI film is in the range of 3% to 6%. The specific elongation at break values ​​of the single-layer graphene, the double-sided adhesive and the PI film are adaptively adjusted according to the size of the screen module in the electronic device, the rotation radius, and the corresponding set lengths of the first part of the first thermal conductive layer 5 and the first part of the second thermal conductive layer 6.

[0056] Since the first part of the first heat-conducting layer 5 and the first part of the second heat-conducting layer 6 are set at different positions and the distances between the two relative to the rotation center are also different, the first deformation amount difference between the first deformation amount and the second deformation amount corresponding to the first heat-conducting layer 5 and the second deformation amount difference between the third deformation amount and the fourth deformation amount corresponding to the second heat-conducting layer 6 are different.

[0057] like Figure 2 As shown, in some embodiments, an anti-scratch layer 7 is further included, which is arranged on the side of the rotating shaft floating plate 4 facing away from the rotating shaft 3 , and the first part of the second heat conductive layer 6 is arranged between the anti-scratch layer 7 and the rotating shaft floating plate 4 .

[0058] Specifically, in order to enable the rotating shaft 3 and the rotating shaft floating plate 4 of the electronic device to withstand repeated folding movements and prevent the second heat-conducting layer 6 from being damaged by friction during the folding and unfolding process of the electronic device, the present application provides an anti-scratch layer 7 on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, so as to place the first part of the second heat-conducting layer 6 between the anti-scratch layer 7 and the rotating shaft floating plate 4, so that the anti-scratch layer 7 replaces the first part of the second heat-conducting layer 6 in contact with the outside world, and the anti-scratch layer 7 can use PI film, CPI (Coloress Polymide, colorless transparent polyimide) film or other friction-resistant coating materials, and the connection with the second heat-conducting layer 6 can be achieved by gluing, hot pressing bonding, chemical deposition and other methods, which are not limited to specific methods. And the first heat-conducting layer 5 and the second heat-conducting layer 6 cover the second part of the first middle frame 1 and the second middle frame 2 in a stacked state, and the side of the second part of the second heat-conducting layer 6 away from the first middle frame 1 or the second middle frame 2 after stacking can also be provided with an anti-scratch layer 7 to protect the second heat-conducting layer 6.

[0059] In some embodiments, the length of the first heat-conducting layer 5 in the axial direction A of the rotating shaft 3 is the same as or different from the length of the second heat-conducting layer 6 in the axial direction A of the rotating shaft 3 .

[0060] Specifically, the first part of the first heat-conducting layer 5 is arranged between the rotating shaft 3 and the rotating shaft floating plate 4, the first part of the second heat-conducting layer 6 is arranged on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 both cover the first middle frame 1 and the second middle frame 2. The first heat-conducting layer 5 provides a through-axis heat-conducting path in the electronic device provided in the present application, and the second heat-conducting layer 6 provides a cross-axis heat-conducting path. The present application provides two heat-conducting paths to conduct the heat generated by the first middle frame 1 and the second middle frame 2. However, it should be noted that in the electronic device, the outside of the area where the rotating shaft 3 and the rotating shaft floating plate 4 are arranged is the electronic device. In order to enable the screen module to be folded and unfolded smoothly and without creases during use, there will be structural parts supporting the screen module in the area of ​​the shaft 3 and the shaft floating plate 4 in the electronic device. The first thermal conductive layer 5 and the second thermal conductive layer 6 of the present application need to avoid the above-mentioned structural parts during the setting process to avoid collision. There will be different structural setting positions and structural shapes of the above-mentioned structural parts between the shaft 3 and the shaft floating plate 4 and on the side of the shaft floating plate 4 away from the shaft 3, resulting in different lengths of the first thermal conductive layer 5 and the second thermal conductive layer 6 in the axial direction A of the shaft 3 during the setting process.

[0061] Moreover, under the different external shapes, structures and assembly relationships between the rotating shaft 3 and the rotating shaft floating plate 4, since the rotating shaft floating plate 4 can extend along the axial direction A according to the length of the rotating shaft 3, or can only occupy a part of the length of the rotating shaft 3 in the axial direction A, in the present application, the length of the first heat-conducting layer 5 in the axial direction A of the rotating shaft 3 and the length of the second heat-conducting layer 6 in the axial direction A of the rotating shaft 3 may be the same or different, and the specific length needs to be adjusted accordingly according to the structural arrangement of the rotating shaft 3 and the rotating shaft floating plate 4 area. In the present application, the first heat-conducting layer 5 and the second heat-conducting layer 6 are respectively arranged between the rotating shaft 3 and the rotating shaft floating plate 4 and on the side of the rotating shaft floating plate 4 away from the rotating shaft 3, and the second parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 can cover the first middle frame 1 and the second middle frame 2 of the electronic device, so that the heat generated in the space inside the electronic device corresponding to the first middle frame 1 and the second middle frame 2 can be simultaneously conducted through the two heat-conducting layers, thereby improving the heat dissipation efficiency and reducing the heat dissipation pressure of the corresponding middle frame that generates more heat.

[0062] like Figure 1 As shown, in some embodiments, the first portion of the second heat conducting layer 6 also covers the two side walls of the rotating shaft floating plate 4 facing the first middle frame 1 and the second middle frame 2 .

[0063] Specifically, when the electronic device is in the unfolded state, when the side surface of the hinge floating plate 4 facing away from the hinge 3 at least partially protrudes out of the plane where the surfaces of the first middle frame 1 and the second middle frame 2 are located, the hinge floating plate 4 has two side walls facing the first middle frame 1 and the second middle frame 2 above the above plane, and the correspondingly arranged second heat-conducting layer 6 first part covers the side of the hinge floating plate 4 facing away from the hinge 3 while also covering the above two side walls, thereby reducing the space required for the arrangement of the second heat-conducting layer 6 and maintaining the tightness between the second heat-conducting layer 6 and the hinge floating plate 4 so that the second heat-conducting layer 6 is clamped during the process of the electronic device being unfolded to folded.

[0064] like Figure 3 As shown, in some embodiments, a groove 31 is provided on the side of the rotating shaft 3 facing the rotating shaft floating plate 4, and the rotating shaft floating plate 4 is accommodated in the groove 31; the first part of the first heat-conducting layer 5 is arranged between the groove 31 and the rotating shaft floating plate 4; the first part of the second heat-conducting layer 6 is arranged on the side of the rotating shaft floating plate 4 away from the groove 31.

[0065] Specifically, when the electronic device is in the unfolded state, the surface of the side of the hinge floating plate 4 facing away from the hinge 3 and the surfaces of the first middle frame 1 and the second middle frame 2 are in the same plane, a groove 31 is opened on the side of the hinge 3 facing the hinge floating plate 4, and the hinge floating plate 4 is accommodated in the groove 31. At this time, in order to satisfy the first thermal conductive layer 5 to form a through-axis heat conductive path, the first part of the first thermal conductive layer 5 is arranged between the groove 31 and the hinge floating plate 4, and the first part of the second thermal conductive layer 6 is arranged on the side of the hinge floating plate 4 facing away from the groove 31 to form a through-axis heat conductive path.

[0066] like Figure 4 As shown, in some embodiments, there are multiple shaft floating plates 4, and the multiple shaft floating plates 4 are arranged at intervals along the axial direction A of the shaft 3, and there are multiple first portions of the first heat conducting layer 5 and the first portions of the second heat conducting layer 6 and are arranged corresponding to the multiple shaft floating plates 4.

[0067] Specifically, in order to achieve a more uniform pressure distribution during the folding and unfolding of the electronic device, enhance the stability of the folding, improve the flatness of the screen after folding, reduce the bending stress and reduce the crease, the present application is provided with a plurality of rotating shaft floating plates 4, and the plurality of rotating shaft floating plates 4 are arranged at intervals along the axial direction A of the rotating shaft 3. Correspondingly, the first portion of the first heat conducting layer 5 and the first portion of the second heat conducting layer 6 are arranged in a plurality and correspond to the plurality of rotating shaft floating plates 4, so as to conduct heat between each rotating shaft floating plate 4 and the rotating shaft 3 and on the side of each rotating shaft floating plate 4 away from the rotating shaft 3.

[0068] like Figure 5 As shown, in some embodiments, the second portions of the plurality of first heat conducting layers 5 and the second portions of the plurality of second heat conducting layers 6 are connected as a whole to cover the first middle frame 1 and the second middle frame 2 .

[0069] Specifically, when there are multiple rotating shaft floating plates 4, the first parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 are multiple and correspond to the multiple rotating shaft floating plates 4, and for the second parts of the first heat-conducting layer 5 and the second heat-conducting layer 6 covering the first middle frame 1 and the second middle frame 2, in order to improve the integrity of the first heat-conducting layer 5 and the second heat-conducting layer 6 in the present application, so that they are respectively laid in the electronic device in the form of an integrated arrangement, the present application arranges multiple first heat-conducting layer 5 second parts and multiple second heat-conducting layer 6 second parts connected as a whole. Such an arrangement facilitates the arrangement of the first heat-conducting layer 5 and the second heat-conducting layer 6 whose first part and the second part are an integral whole in the electronic device having multiple rotating shaft floating plates 4, and since the gaps between the multiple first heat-conducting layers 5 and the multiple second heat-conducting layers 6 are eliminated, the heat-conducting area covering the first middle frame 1 and the second middle frame 2 is increased, and the heat dissipation efficiency is improved.

[0070] like Figure 6 As shown, in some embodiments, a first portion of the first heat conducting layer 5 is provided with a plurality of diamond-shaped stretching holes 51 , and the plurality of diamond-shaped stretching holes 51 are arranged in an array.

[0071] Specifically, in the present application, a plurality of array-arranged diamond-shaped stretching holes 51 are provided in the first portion of the first heat-conducting layer 5, so that the stretching performance of the first portion of the first heat-conducting layer 5 can be uniformly enhanced through the array-arranged diamond-shaped drawstring holes, so that during the folding and unfolding of the electronic device, the first portion of the first heat-conducting layer 5 can be expanded and contracted accordingly with the rotation of the shaft 3. By making the first portion of the first heat-conducting layer 5 deform along with the shaft 3, the risk of the first portion of the first heat-conducting layer 5 being clamped or broken by the shaft 3 can be reduced, thereby ensuring the service life of the first heat-conducting layer 5.

[0072] In some embodiments, the first heat conducting layer 5 and the second heat conducting layer 6 are both single-layer graphene.

[0073] Specifically, in order to make the first heat-conducting layer 5 and the second heat-conducting layer 6 provide better thermal conductivity, improve heat dissipation efficiency, and meet the heat dissipation demand after the increase in heat generated due to the increased degree of integration in electronic equipment, the present application sets the first heat-conducting layer 5 and the second heat-conducting layer 6 to be single-layer graphene. Single-layer graphene is a material with a two-dimensional honeycomb lattice structure composed of a single layer of carbon atoms tightly arranged, which has excellent thermal conductivity. If the number of graphene layers is increased, such as double-layer graphene or multi-layer graphene. Due to the influence of factors such as interlayer coupling strength, interface quality or interlayer phonon scattering, thermal conductivity will be reduced. Therefore, the present application sets the first heat-conducting layer 5 and the second heat-conducting layer 6 to be single-layer graphene to improve better thermal conductivity.

[0074] So far, various embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Based on the above description, those skilled in the art can fully understand how to implement the technical solution disclosed here.

[0075] Although some specific embodiments of the present disclosure have been described in detail by way of examples, it should be understood by those skilled in the art that the above examples are for illustration only and are not intended to limit the scope of the present disclosure. It should be understood by those skilled in the art that the above embodiments may be modified or some technical features may be replaced by equivalents without departing from the scope and spirit of the present disclosure. In particular, the various technical features mentioned in the various embodiments may be combined in any manner as long as there is no structural conflict.

Claims

1. An electronic device, characterized in that: include: A first middle frame, a second middle frame, and a rotating shaft; The first middle frame and the second middle frame are rotatably connected via the rotating shaft; A rotating shaft floating plate is arranged between the first middle frame and the second middle frame, and the rotating shaft and the rotating shaft floating plate are arranged at intervals; A first heat-conducting layer and a second heat-conducting layer, wherein the first portion of the first heat-conducting layer is disposed between the rotating shaft and the rotating shaft floating plate, the second portion of the first heat-conducting layer respectively covers the first middle frame and the second middle frame, the first portion of the second heat-conducting layer is disposed on a side of the rotating shaft floating plate away from the rotating shaft, and the second portion of the second heat-conducting layer respectively covers the first middle frame and the second middle frame.

2. The electronic device according to claim 1, characterized in that: The first middle frame and the second middle frame can be in a first state or a second state through the rotating shaft; The first heat-conducting layer has a first deformation amount when in the first state, and has a second deformation amount when in the second state; The second heat-conducting layer has a third deformation amount when in the first state, and has a fourth deformation amount when in the second state; There is a first deformation amount difference between the first deformation amount and the second deformation amount, there is a second deformation amount difference between the third deformation amount and the fourth deformation amount, and the first deformation amount difference is different from the second deformation amount difference.

3. The electronic device according to claim 1, characterized in that: Also includes: The anti-scratch layer is arranged on a side of the rotating shaft floating plate away from the rotating shaft, and the first part of the second heat-conducting layer is arranged between the anti-scratch layer and the rotating shaft floating plate.

4. The electronic device according to claim 1, characterized in that: The length of the first heat-conducting layer in the axial direction of the rotating shaft is the same as or different from the length of the second heat-conducting layer in the axial direction of the rotating shaft.

5. The electronic device according to claim 1, characterized in that: The first portion of the second heat-conducting layer also covers two side walls of the rotating shaft floating plate facing the first middle frame and the second middle frame.

6. The electronic device according to claim 1, characterized in that: A groove is formed on one side of the rotating shaft facing the rotating shaft floating plate, and the rotating shaft floating plate is accommodated in the groove; The first portion of the first heat-conducting layer is disposed between the groove and the rotating shaft floating plate; The first portion of the second heat-conducting layer is arranged on a side of the rotating shaft floating plate away from the groove.

7. The electronic device according to claim 1, characterized in that: There are a plurality of rotating shaft floating plates, which are spaced apart along the axial direction of the rotating shaft. There are a plurality of first heat conducting layer first portions and a plurality of second heat conducting layer first portions, which are arranged corresponding to the plurality of rotating shaft floating plates.

8. The electronic device according to claim 7, characterized in that: A plurality of the first heat-conducting layer second portions and a plurality of the second heat-conducting layer second portions are connected as a whole to cover the first middle frame and the second middle frame.

9. The electronic device according to claim 1, characterized in that: The first portion of the first heat-conducting layer is provided with a plurality of diamond-shaped stretching holes, and the plurality of diamond-shaped stretching holes are arranged in an array.

10. The electronic device according to any one of claims 1 to 9, characterized in that: The first heat-conducting layer and the second heat-conducting layer are both single-layer graphene.

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