PCB (Printed Circuit Board) dispensing device

Abstract

The utility model relates to a PCB (printed circuit board) dispensing device which comprises a mounting base, a dispensing gun, a heating wire and a gun head, the dispensing gun is provided with a heating cavity and a glue storage cavity, the heating cavity and the glue storage cavity share one side wall, and the heating wire is arranged in the heating cavity and is connected with the side wall of the heating cavity. A heat conduction cavity is formed in the end, close to the mounting base, of the dispensing gun, a glue outlet channel is formed in the gun head, a mounting part is arranged on the gun head, a heat conduction piece is arranged on the mounting part, when the gun head is connected with the dispensing gun, the glue storage cavity is communicated with the glue outlet channel, the heat conduction cavity is communicated with the heating cavity, and the heat conduction piece penetrates through the heat conduction cavity to abut against the heating wire. Through the arrangement, the heating wire can transfer heat generated by the heating wire to the side wall of the heating cavity and the heat conduction piece, so that the heating wire can heat glue in the glue storage cavity and the glue outlet channel at the same time. And the heated liquid glue is good in flowability and can better flow out of the glue outlet channel, so that the glue can be uniformly dispensed on the PCB.

Description

Technical Field

[0001] The utility model relates to the technical field of PCB board processing equipment, in particular to a PCB board glue dispensing device. Background Art

[0002] At present, when PCB boards are produced on the market, glue is usually dispensed on the electronic components on the PCB boards. Glue dispensing can fix and protect the electronic components, thereby improving the reliability and durability of the PCB boards.

[0003] However, when the PCB board dispensing device on the market is dispensing glue on the PCB board, the gun head does not have a heating function. Therefore, when the liquid glue flows from the glue storage chamber into the gun head, the temperature drops sharply, causing the liquid glue to be slightly solidified in the gun head. That is, the fluidity of the liquid glue in the gun head is poor, resulting in inconsistent glue output from the gun head, resulting in uneven dispensing, thereby affecting the dispensing efficiency and dispensing effect of the PCB board dispensing device. Utility Model Content

[0004] Based on this, it is necessary to provide a PCB board dispensing device.

[0005] The technical solution of the utility model to solve the above technical problems is as follows:

[0006] A PCB board dispensing device, comprising:

[0007] Install the base;

[0008] A glue dispensing gun, the glue dispensing gun is arranged on the mounting base, and a glue storage cavity is provided on the glue dispensing gun;

[0009] A heating wire, a heating chamber is provided on the dispensing gun, the heating wire is arranged in the heating chamber, the heating wire is connected to the side wall of the heating chamber, a heat conduction chamber is provided at one end of the dispensing gun close to the mounting base, the heat conduction chamber is communicated with the heating chamber, and the heat conduction chamber runs through the side wall of the heating chamber;

[0010] A gun head, wherein a mounting portion is provided at one end of the gun head close to the glue dispensing gun, a heat conductive member is convexly provided on a surface of the mounting portion facing the glue dispensing gun, a glue outlet channel is provided on the gun head, the mounting portion of the gun head is detachably connected to the glue dispensing gun, when the gun head is connected to the glue dispensing gun, the glue outlet channel is connected to the glue storage cavity, the heat conductive member is located in the heating cavity, and the heat conductive member passes through the heating cavity and abuts against the heating wire, and the heat conductive member is used to conduct the heat generated by the heating wire to the gun head.

[0011] In one embodiment, a stop portion is provided on the side wall of the glue storage cavity near one end of the gun head, and the stop portion is at least partially located outside the glue storage cavity. When the gun head is connected to the glue dispensing gun, the stop portion is located in the glue outlet channel.

[0012] In one embodiment, the heating wire is spirally arranged in the heating chamber.

[0013] In one embodiment, a first thermal insulation layer is provided on the outer surface of the dispensing gun.

[0014] In one embodiment, a second heat-insulating layer is provided on the outer surface of the gun head.

[0015] In one embodiment, the PCB board dispensing device also includes: bolts, a plurality of connecting blocks are arranged on one end of the dispensing gun close to the mounting base, a plurality of connecting grooves are opened on the mounting portion of the gun head, a through hole is opened on the outer surface of the gun head, and a threaded hole is opened on the connecting block. When the dispensing gun is connected to the gun head, each of the connecting blocks is arranged in one of the connecting grooves, the through hole and the threaded hole are aligned and connected, and one end of the bolt passes through the through hole and is screwed to the side wall of the threaded hole.

[0016] In one embodiment, the PCB board dispensing device further includes a gun cover, which is disposed on an end of the dispensing gun away from the mounting base, and the gun cover movably closes the glue storage cavity of the dispensing gun.

[0017] In one embodiment, the heat conducting member is integrally formed with the gun head.

[0018] The beneficial effects of the utility model are as follows: the utility model provides a PCB board dispensing device, a heating chamber and a glue storage chamber are provided on the dispensing gun, the heating chamber and the glue storage chamber share a side wall, the heating wire is arranged in the heating chamber and connected to the side wall of the heating chamber, a heat conduction chamber is provided on one end of the dispensing gun close to the mounting base, a glue outlet channel is provided on the gun head, a mounting portion is provided on the gun head, a heat conduction member is provided on the mounting portion, when the gun head is connected to the dispensing gun, the glue storage chamber is connected to the glue outlet channel, the heat conduction chamber is connected to the heating chamber, and the heat conduction member passes through the heat conduction chamber and abuts against the heating wire. Through the above arrangement, the heating wire can transfer the heat generated by it to the side wall of the heating chamber and the heat conduction member, so that the heating wire can heat the glue in the glue storage chamber and the glue outlet channel at the same time. The heated liquid glue has good fluidity and can flow out from the glue outlet channel better, so that the PCB board can be evenly dispensed, the dispensing efficiency of the PCB board dispensing device is improved, and a better dispensing effect is achieved. BRIEF DESCRIPTION OF THE DRAWINGS

[0019] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0020] Figure 1 This is a schematic structural diagram of a PCB board dispensing device in one direction according to an embodiment;

[0021] Figure 2 A schematic diagram of the cross-sectional structure of a dispensing gun and a gun head according to an embodiment;

[0022] Figure 3 for Figure 2 A schematic diagram of the enlarged structure at A in the middle;

[0023] Figure 4 The figure is a schematic diagram of the cross-sectional exploded structure of a dispensing gun and a gun head according to an embodiment.

[0024] In the accompanying drawings, 100, mounting base; 200, glue dispensing gun; 201, glue storage chamber; 202, heating chamber; 203, heat conduction chamber; 204, connecting block; 210, gun head; 211, glue outlet channel; 213, connecting groove; 214, mounting part; 215, stopper; 216, through hole; 300, heating wire; 301, heat conduction part; 320, first insulation layer; 330, second insulation layer; 340, threaded hole; 400, gun cover; 500, bolt. DETAILED DESCRIPTION

[0025] It should be noted that, in the absence of conflict, the embodiments and features in the embodiments of the present invention can be combined with each other. The technical solution of the present invention will be further described below in conjunction with the drawings of the embodiments of the present invention, and the present invention is not limited to the following specific implementation methods.

[0026] It should be understood that the same or similar numbers in the drawings of the embodiments correspond to the same or similar parts. In the description of the present utility model, it should be understood that if there are terms such as "upper", "lower", "front", "back", "left", "right", "top", "bottom" and the like indicating the orientation or positional relationship, they are based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present utility model and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, the terms describing the positional relationship in the drawings are only used for illustrative purposes and cannot be understood as a limitation on this patent. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0027] In one embodiment, Figure 1 , Figure 2 and Figure 4 As shown, a PCB board dispensing device includes: a mounting base 100, a dispensing gun 200, a heating wire 300 and a gun head 210, wherein the dispensing gun 200 is arranged on the mounting base 100, a glue storage cavity 201 is provided on the dispensing gun 200, a heating cavity 202 is provided on the dispensing gun 200, the heating wire 300 is arranged in the heating cavity 202, the heating wire 300 is connected to the side wall of the heating cavity 202, a heat conduction cavity 203 is provided at one end of the dispensing gun 200 close to the mounting base 100, the heat conduction cavity 203 is communicated with the heating cavity 202, and the heat conduction cavity 203 passes through the side wall of the heating cavity 202, and the gun head 210 is close to the mounting base 100. A mounting portion 214 is provided at one end of the glue gun 200, and a heat conductive member 301 is protruded on a surface of the mounting portion 214 facing the glue gun 200. A glue outlet channel 211 is provided on the gun head 210, and the mounting portion 214 of the gun head 210 is detachably connected to the glue gun 200. When the gun head 210 is connected to the glue gun 200, the glue outlet channel 211 is connected to the glue storage chamber 201, and the heat conductive member 301 is located in the heating chamber 202, and the heat conductive member 301 passes through the heating chamber 202 and abuts against the heating wire 300, and the heat conductive member 301 is used to conduct the heat generated by the heating wire 300 to the gun head 210.

[0028] In order to improve the fluidity of liquid glue in the glue storage chamber 201 and the glue storage channel 211. In this embodiment, the heating chamber 202 is spaced apart from the glue storage chamber 201, and the heating chamber 202 and the glue storage chamber 201 share a side wall, and the heat generated by the heating wire 300 in the heating chamber 202 can be transferred to the side wall of the glue storage chamber 201. The outer surface of the heating wire 300 is wrapped with an insulating layer, and the insulating layer is made of a heat-conducting material; the insulating layer can prevent the heating wire 300 from being electrically connected to the shell of the glue gun 200 and the gun head 210 during heating. When the gun head 210 is connected to the glue dispensing gun 200, the glue storage chamber 201 is connected to the glue outlet channel 211, the heat conduction chamber 203 is connected to the heating chamber 202, and the heat conduction member 301 on the connector passes through the heat conduction chamber 203 and abuts against the heating wire 300, so that the liquid glue in the glue storage channel can flow into the glue outlet channel 211, and the heat generated by the heating wire 300 is transferred to the side wall of the heating chamber 202 and the heat conduction member 301, which can heat the glue in the glue storage chamber 201 and the glue outlet channel 211 at the same time. The glue dispensing gun 200 and the gun head 210 are both made of copper, which has good thermal conductivity. The glue dispensing gun 200 and the gun head 210 made of copper can transfer heat to the glue storage chamber 201 and the glue outlet channel 211 faster, shortening the time of heating the glue. The heated liquid glue has good fluidity and can flow out of the glue outlet channel 211 better, so that the PCB board dispensing device can evenly dispense glue on the PCB board.

[0029] In order to improve the sealing performance when the glue storage chamber 201 is connected to the glue outlet channel 211. In one embodiment, Figure 2 and Figure 3 As shown, a stopper 215 is provided on the side wall of the glue storage cavity 201 near one end of the gun head 210, and the stopper 215 is at least partially located outside the glue storage cavity 201. When the gun head 210 is connected to the glue dispensing gun 200, the stopper 215 is located in the glue outlet channel 211. Specifically, the opening width of the glue storage cavity 201 near the glue outlet channel 211 is smaller than the opening width of the glue outlet channel 211 near the glue storage cavity 201. The stopper 215 is integrally formed with the glue dispensing gun 200. When the gun head 210 is connected to the glue dispensing gun 200, the stopper 215 is located in the glue outlet channel 211 and abuts against the side wall of the glue outlet channel 211. Through the above arrangement, the stopper 215 can close the gap between the glue storage chamber 201 and the glue outlet channel 211, and can prevent liquid glue from flowing out of the gap between the glue storage chamber 201 and the glue outlet channel 211, thereby avoiding glue leakage and improving the sealing of the PCB board dispensing device.

[0030] In order to further improve the sealing performance when the glue storage chamber 201 is connected to the glue outlet channel 211. In one embodiment, the shape of the glue dispensing gun 200 is a cylinder, the cross-sectional shape of the stopper 215 is annular, and the shape of the gun head 210 is a cylinder. When the stopper 215 is inserted into the glue outlet channel 211, the stopper 215 abuts against the side wall of the glue outlet channel 211. Specifically, when the crotch stopper 215 with an annular cross-sectional shape is inserted into the glue outlet channel, the crotch stopper can form a continuous and uniform sealing surface at the connection between the glue dispensing gun 200 and the gun head 210, and can fully close the gap between the glue storage chamber 201 and the glue outlet channel 211, effectively preventing the leakage of liquid glue.

[0031] In order to improve the heating effect of the heating wire 300. In one embodiment, Figure 2 and Figure 3 As shown, the heating wire 300 is spirally arranged in the heating chamber 202. Specifically, the shape of the heating wire 300 is spring-shaped, and the heating wire 300 is spirally arranged on the side wall of the heating chamber 202. The spring-shaped heating wire 300 can save materials and can be in more uniform contact with the side wall of the heating chamber 202, so that the heat generated by the heating wire 300 can be more evenly transferred to the side walls of the glue storage chamber 201 and the glue outlet channel 211, and the spring-shaped heating wire 300 can absorb the stress of thermal expansion, reduce the risk of the heating wire 300 breaking, and thus extend the service life of the heating wire 300. Through the above arrangement, the heating effect of the glue in the glue storage chamber 201 and the glue outlet channel 211 can be improved.

[0032] In order to reduce the heat loss on the surface of the glue gun 200. In one embodiment, Figure 2 and Figure 3 As shown, a first insulation layer 320 is provided on the outer surface of the glue gun 200. Specifically, the first insulation layer 320 is made of aluminum silicate. Aluminum silicate has low thermal conductivity and good heat insulation effect, and can effectively reduce the heat transfer between the first insulation layer 320 and the surface of the glue gun 200. Thus, heat can be prevented from being lost from the outer surface of the glue gun 200.

[0033] In order to reduce the heat loss on the outer surface of the gun head 210. In one embodiment, Figure 2 and Figure 3 As shown, a second thermal insulation layer 330 is provided on the outer surface of the gun head 210. Specifically, the second thermal insulation layer 330 is made of aluminum silicate. Aluminum silicate has low thermal conductivity and good heat insulation effect, which can effectively reduce the heat transfer between the second thermal insulation layer 320 and the surface of the gun head 210. Thus, heat loss from the outer surface of the gun head 210 can be avoided.

[0034] In order to improve the stability of the connection between the dispensing gun 200 and the gun head 210. In one embodiment, Figure 3 and Figure 4 As shown, the PCB board dispensing device also includes: a bolt 500, a plurality of connecting blocks 204 are arranged on one end of the dispensing gun close to the mounting base 100, a plurality of connecting grooves 213 are provided on the mounting portion 214 of the gun head 210, a through hole 216 is provided on the outer surface of the gun head 210, and a threaded hole 340 is provided on the connecting block 204. When the dispensing gun 200 is connected to the gun head 210, each of the connecting blocks 204 is arranged in one of the connecting grooves 213, the through hole 216 and the threaded hole 340 are aligned and connected, and one end of the bolt 500 passes through the through hole 216 and is screwed to the side wall of the threaded hole 340. Specifically, when the dispensing gun 200 is connected to the gun head 210, each of the connecting blocks 204 is arranged in one of the connecting grooves 213, the through hole 216 and the threaded hole 340 are aligned and connected. One end of the bolt 500 passes through the through hole 216 and is screwed to the side wall of the threaded hole 340. This allows a stable connection to be formed between the gun head 210 and the glue gun 200. The glue gun 200 and the gun head 210 can be disassembled by unscrewing the bolt 500. Through the above arrangement, the gun head 210 and the glue gun 200 can be assembled and disassembled.

[0035] In order to reduce the heat loss on the glue gun 200. In one embodiment, Figure 1 and Figure 2 As shown, the PCB board dispensing device further includes a gun cover 400, which is disposed on one end of the dispensing gun 200 away from the mounting base 100, and the gun cover 400 movably closes the glue storage chamber 201 of the dispensing gun 200. Specifically, a third thermal insulation layer is disposed on the side of the gun cover 400 facing the dispensing gun 200, and the third thermal insulation layer can effectively reduce the heat loss in the glue storage chamber 201 and the heating chamber 202. By covering the gun cover 400 on the end of the dispensing gun 200 away from the mounting base 100, the heat generated by the heating wire 300 can be reduced from being lost from the end of the dispensing gun 200 away from the mounting base 100.

[0036] In order to improve the heat conduction effect of the heat conducting member 301. In one embodiment, Figure 3 and Figure 4As shown, the heat conductor 301 and the gun head 210 are integrally structured. Specifically, the heat conductor 301 and the gun head 210 are integrally formed, and the materials of the heat conductor 301 and the gun head 210 are both copper. Through the above arrangement, since the heat conductor 301 and the gun head 210 in this embodiment are integrally structured, compared with the separate arrangement of the heat conductor and the gun head, the connection part between the gun head 210 and the heat conductor 301 in this embodiment has a more stable structural strength, and the heat conductor 301 can transfer the heat generated by the heating wire 300 to the gun head 210 more quickly, thereby reducing the heat loss during the transfer process and improving the effect of heating the glue of the gun head 210.

[0037] Compared with the prior art, the utility model has at least the following advantages:

[0038] The beneficial effects of the utility model are as follows: the utility model provides a PCB board dispensing device, a heating chamber and a glue storage chamber are provided on the dispensing gun, the heating chamber and the glue storage chamber share a side wall, the heating wire is arranged in the heating chamber and connected to the side wall of the heating chamber, a heat conduction chamber is provided on one end of the dispensing gun close to the mounting base, a glue outlet channel is provided on the gun head, a mounting portion is provided on the gun head, a heat conduction part is provided on the mounting portion, when the gun head is connected to the dispensing gun, the glue storage chamber is connected to the glue outlet channel, the heat conduction chamber is connected to the heating chamber, and the heat conduction part passes through the heat conduction chamber and abuts against the heating wire. Through the above arrangement, the heating wire can transfer the heat generated by it to the side wall of the heating chamber and the heat conduction part, so that the heating wire can heat the glue in the glue storage chamber and the glue outlet channel at the same time. The heated liquid glue has good fluidity and can flow out from the glue outlet channel better, so that the PCB board can be evenly dispensed, which improves the dispensing efficiency of the PCB board dispensing device and has better dispensing effect.

[0039] Obviously, the above embodiments of the utility model are only examples for clearly explaining the utility model, and are not intended to limit the implementation methods of the utility model. For ordinary technicians in the relevant field, other different forms of changes or modifications can be made on the basis of the above description. It is not necessary and impossible to list all the implementation methods here. Any modifications, equivalent substitutions and improvements made within the spirit and principles of the utility model should be included in the protection scope of the claims of the utility model.

Claims

1. A PCB board dispensing device, characterized in that: include: Install the base; A glue dispensing gun, the glue dispensing gun is arranged on the mounting base, and a glue storage cavity is provided on the glue dispensing gun; A heating wire, a heating chamber is provided on the dispensing gun, the heating wire is arranged in the heating chamber, the heating wire is connected to the side wall of the heating chamber, a heat conduction chamber is provided at one end of the dispensing gun close to the mounting base, the heat conduction chamber is communicated with the heating chamber, and the heat conduction chamber runs through the side wall of the heating chamber; A gun head, wherein a mounting portion is provided at one end of the gun head close to the glue dispensing gun, a heat conductive member is convexly provided on a surface of the mounting portion facing the glue dispensing gun, a glue outlet channel is provided on the gun head, the mounting portion of the gun head is detachably connected to the glue dispensing gun, when the gun head is connected to the glue dispensing gun, the glue outlet channel is connected to the glue storage cavity, the heat conductive member is located in the heating cavity, and the heat conductive member passes through the heating cavity and abuts against the heating wire, and the heat conductive member is used to conduct the heat generated by the heating wire to the gun head.

2. The PCB dispensing device according to claim 1, characterized in that: A stopper is provided on the side wall of the glue storage cavity near one end of the gun head. The stopper is at least partially located outside the glue storage cavity. When the gun head is connected to the glue dispensing gun, the stopper is located in the glue outlet channel.

3. The PCB board dispensing device according to claim 1, characterized in that: The heating wire is spirally arranged in the heating chamber.

4. The PCB board dispensing device according to claim 1, characterized in that: A first heat-insulating layer is arranged on the outer surface of the glue dispensing gun.

5. The PCB board dispensing device according to claim 1, characterized in that: A second heat-insulating layer is arranged on the outer surface of the gun head.

6. The PCB board dispensing device according to claim 1, characterized in that: Also includes: Bolts, a plurality of connecting blocks are arranged on one end of the glue gun close to the mounting base, a plurality of connecting grooves are opened on the mounting portion of the gun head, a through hole is opened on the outer surface of the gun head, and a threaded hole is opened on the connecting block. When the glue gun is connected to the gun head, each of the connecting blocks is arranged in one of the connecting grooves, the through hole and the threaded hole are aligned and connected, and one end of the bolt passes through the through hole and is screwed to the side wall of the threaded hole.

7. The PCB board dispensing device according to claim 1, characterized in that: It also includes a gun cover, which is arranged on one end of the glue dispensing gun away from the mounting base, and the gun cover movably closes the glue storage cavity of the glue dispensing gun.

8. The PCB dispensing device according to any one of claims 1 to 7, characterized in that: The heat conducting member is integrally arranged with the gun head.

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