Cutting machine with multiple driving shafts

Abstract

The cutting machine comprises a machine body, the machine body is of a hollow structure, a feeding assembly is arranged on the inner wall of the top of the machine body, an external connector is formed in one side of the machine body, two mounting frames are fixedly connected to the inner wall of the bottom of the machine body, driving rollers are rotationally connected into the two mounting frames, and the driving rollers are arranged on the inner wall of the machine body. And power components for driving the driving rollers to rotate are arranged on one sides of the two mounting frames, cutting lines are wound around the outer sides of the two driving rollers, two guide rails are fixedly connected to the inner wall of the bottom of the machine body, and a moving plate is slidably connected to the outer sides of the two guide rails. According to the utility model, the condition that the silicon wafer at the far end is not completely cut, the silicon wafer cut at the near end touches the wire net at the near end and is cut again can be avoided, the cutting effect of the cutting machine is improved, the position of the auxiliary roller after moving is more stable, and the use stability of the cutting machine is improved.

Description

Technical Field

[0001] The utility model relates to the technical field of silicon rod cutting, in particular to a cutting machine with multiple active axes. Background Art

[0002] Silicon rod cutting is mostly done by wire cutting, where wire cutting is mostly divided into dual-axis cutting, that is, cutting equipment with two active axes.

[0003] After searching, the announcement number CN202016131U discloses a three-roller multi-wire cutting machine, which can cut two polysilicon rods at the same time. The cutting quality is stable, and the equipment is small in size, low in price, and high in efficiency, which can reduce the cutting production cost. However, during cutting, the length of the silicon wafer in the vertical direction cannot be larger than the diameter of the axis. If it is larger, the silicon wafer at the far end has not been cut yet, and the silicon wafer cut at the near end will touch the wire net at the near end and be cut again, causing the product to be scrapped. Utility Model Content

[0004] The utility model aims to solve the shortcomings in the prior art and proposes a cutting machine with multiple driving axes.

[0005] In order to achieve the above purpose, the utility model adopts the following technical solutions:

[0006] A multi-active-axis cutting machine comprises a machine body, the machine body is a hollow structure, a feeding assembly is provided on the top inner wall of the machine body, an external interface is opened on one side of the machine body, two mounting frames are fixedly connected to the bottom inner wall of the machine body, active rollers are rotatably connected in the two mounting frames, a power component for driving the active rollers to rotate is provided on one side of the two mounting frames, a cutting line is wound around the outer sides of the two active rollers, two guide rails are fixedly connected to the bottom inner wall of the machine body, a moving plate is slidably connected to the outer sides of the two guide rails, an electric push rod is fixedly connected to the upper surface of the moving plate, one end of the telescopic part of the electric push rod is fixedly connected to an L-shaped frame, one side of the L-shaped frame is rotatably connected to an auxiliary roller for pressing the cutting line to deform, the other side of the L-shaped frame is fixedly connected to motor 1, and one end of the output shaft of motor 1 passes through the L-shaped frame and is fixed to the auxiliary roller.

[0007] As a further solution of the utility model, the feeding assembly includes two cylinders, both of which are fixedly connected to the top inner wall of the machine body, one end of the pneumatic rods of the two cylinders is fixed with a connecting plate by bolts, and the bottom of the connecting plate is fixedly connected with a crystal tray for placing silicon wafers.

[0008] As a further solution of the utility model, the power component is two motors 2, the two motors 2 are respectively fixedly connected to one side of two mounting frames, and one end of the output shaft of the two motors 2 passes through the mounting frames and is fixed to the active roller.

[0009] As a further solution of the present invention, the power of the motor 1 and the motor 2 are the same.

[0010] As a further solution of the utility model, an elastic plate is fixedly connected to the upper surface of the movable plate, a plurality of slots are provided on one side of the elastic plate, a card block is fixedly connected to one side of the L-shaped frame near the bottom, and the card block is engaged with the slot.

[0011] As a further solution of the utility model, the bottom inner wall of the body is provided with a baffle for limiting the movable plate, the upper surface of the movable plate is provided with a threaded hole, and the threaded hole is threadedly connected with a fixing screw for locking the movable plate.

[0012] As a further solution of the utility model, the auxiliary roller is located between the two active rollers and above the bottom cutting line.

[0013] As a further solution of the utility model, a plurality of auxiliary rods are fixedly connected in the body, and the plurality of auxiliary rods all pass through the connecting plate. A plurality of supporting frames are fixedly connected to the bottom outer wall of the body, and the bottom ends of the plurality of supporting frames are fixedly connected to connecting seats.

[0014] The beneficial effects of the utility model are:

[0015] 1. Through the coordinated use of the electric push rod and the auxiliary roller, when the length of the silicon wafer is greater than the diameter of the active roller, the electric push rod is started to retract, the electric push rod will drive the L-shaped frame to move downward, the L-shaped frame will drive the auxiliary roller to move downward, and the auxiliary roller will pull the cutting line below to deform, thereby changing the distance between the cutting line below and the cutting line above, thereby avoiding the situation where the silicon wafer at the far end has not been cut yet, and the silicon wafer cut at the near end will touch the wire mesh at the near end and be cut again, thereby improving the cutting effect of the cutting machine.

[0016] 2. Through the coordinated use of the card block and the elastic plate, after the L-shaped frame moves downward to a suitable position, the card block on the L-shaped frame engages with the card slot on the elastic plate, thereby assisting in fixing the position of the L-shaped frame, making the position of the auxiliary roller more stable after movement, thereby improving the stability of the cutting machine. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 This is a schematic diagram of the front three-dimensional structure of a multi-active-axis cutting machine proposed by the utility model;

[0018] Figure 2 This is a schematic diagram of the rear three-dimensional structure of a multi-active-axis cutting machine proposed by the utility model;

[0019] Figure 3This is a partially enlarged structural schematic diagram of a multi-active-axis cutting machine proposed by the utility model.

[0020] In the figure: 1. body; 2. cylinder; 3. connecting plate; 4. crystal support; 5. guide rail; 6. support frame; 7. connecting seat; 8. external interface; 9. auxiliary rod; 10. mounting frame; 11. active roller; 12. cutting line; 13. electric push rod; 14. auxiliary roller; 15. L-shaped frame; 16. baffle; 17. moving plate; 18. elastic plate; 19. slot; 20. block. DETAILED DESCRIPTION

[0021] The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. The described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the utility model.

[0022] Reference Figure 1-Figure 3 A multi-active-axis cutting machine comprises a machine body 1, which is a hollow structure. A feeding assembly is arranged on the top inner wall of the machine body 1. An external interface 8 is opened on one side of the machine body 1. Two mounting frames 10 are fixed to the bottom inner wall of the machine body 1 by bolts. Active rollers 11 are rotatably connected in the two mounting frames 10. Power components for driving the active rollers 11 to rotate are arranged on one side of the two mounting frames 10. Cutting lines 12 are wound around the outer sides of the two active rollers 11. Two guide rails 5 are fixed to the bottom inner wall of the machine body 1 by bolts. Moving plates 17 are slidably connected to the outer sides of the two guide rails 5. An electric push rod 13 is fixed to the upper surface of the moving plate 17 by bolts. An L-shaped frame 15 is fixed to one end of the telescopic part of the electric push rod 13 by bolts. One side of the L-shaped frame 15 is rotatably connected to press the cutting line 12 to deform. The other side of the L-shaped frame 15 is fixed to the motor 1 by bolts, and one end of the output shaft of the motor 1 passes through the L-shaped frame 15 and is fixed to the auxiliary roller 14. When the length of the silicon wafer is greater than the diameter of the active roller 11, the electric push rod 13 is started to contract, and the electric push rod 13 will drive the L-shaped frame 15 to move downward, and the L-shaped frame 15 will drive the auxiliary roller 14 to move downward. The auxiliary roller 14 will cause the cutting line 12 below to deform during the downward movement, thereby increasing the distance between the cutting line 12 below and the cutting line 12 above, and then the silicon wafer is fed through the feeding assembly, so that the cutting line 12 cuts the silicon wafer, avoiding the situation where the silicon wafer at the far end has not been cut yet, and the silicon wafer cut at the near end will touch the wire mesh at the near end and be cut again, thereby improving the cutting effect of the cutting machine.

[0023] In the utility model, the feeding assembly includes two cylinders 2, and the two cylinders 2 are fixed to the top inner wall of the machine body 1 by bolts. One end of the pneumatic rod of the two cylinders 2 is fixed with a connecting plate 3 by bolts, and the bottom of the connecting plate 3 is fixed with a crystal support 4 for placing silicon wafers by bolts. When the cylinder 2 is started to extend, the cylinder 2 will push the connecting plate 3 to move downward, and the connecting plate 3 will drive the crystal support 4 to move downward, so that the cutting line 12 cuts the silicon wafer. The power component is two motors 2, and the two motors 2 are respectively fixed to one side of the two mounting frames 10 by bolts. One end of the output shaft of the two motors 2 passes through the mounting frame 10 and is fixed to the active roller 11. The motors The power of the motor 1 and the motor 2 is the same. Since the power of the motor 1 and the motor 2 is the same, the rotation speeds of the active roller 11 and the auxiliary roller 14 are the same, so that the normal operation of the cutting line 12 will not be affected. An elastic plate 18 is welded on the upper surface of the movable plate 17, and a plurality of card slots 19 are opened on one side of the elastic plate 18. A card block 20 is fixed by bolts near the bottom of one side of the L-shaped frame 15, and the card block 20 is carded with the card slot 19. In the process of the L-shaped frame 15 moving downward, the L-shaped frame 15 will drive the card block 20 to move downward. In the process of moving downward, the card block 20 will cause the elastic plate 18 to deform, so that the card block 20 and the card on the elastic plate 18 are connected. The slot 19 is disengaged. When the block 20 moves to align with the next slot 19, the elastic plate 18 will recover by its own elastic force, so that the block 20 is engaged with the next slot 19, and this cycle is repeated until the L-shaped frame 15 stops moving. The position of the L-shaped frame 15 is auxiliary fixed by the engagement of the block 20 with the slot 19. The bottom inner wall of the body 1 is provided with a baffle 16 for limiting the movable plate 17. The upper surface of the movable plate 17 is provided with a threaded hole. The threaded hole is connected with a fixing screw for locking the movable plate 17. The auxiliary roller 14 is located between the two active rollers 11 and above the bottom cutting line 12. When When the length of the silicon wafer is less than the length of the active roller 11, the fixing screws are no longer locked on the movable plate 17, and then the movable plate 17 is pulled to move along the guide rail 5. The movable plate 17 will drive the L-shaped frame 15 to move through the electric push rod 13, and the L-shaped frame 15 will drive the auxiliary roller 14 to move out from between the two active rollers 11 and move the auxiliary roller 14 between the upper and lower cutting lines 12, and then the silicon wafer can be cut normally. A plurality of auxiliary rods 9 are fixed in the body 1 by bolts, and the plurality of auxiliary rods 9 all pass through the connecting plate 3. A plurality of support frames 6 are fixed to the bottom outer wall of the body 1 by bolts, and a connecting seat 7 is welded to the bottom end of the plurality of support frames 6.

[0024] Working principle: When in use, when the length of the silicon wafer is greater than the diameter of the active roller 11, the electric push rod 13 is started to retract, and the electric push rod 13 will drive the L-shaped frame 15 to move downward, and the L-shaped frame 15 will drive the auxiliary roller 14 to move downward. In the process of the auxiliary roller 14 moving downward, the lower cutting line 12 will be deformed, thereby increasing the distance between the lower cutting line 12 and the upper cutting line 12, and then the cylinder 2 is started to extend, and the cylinder 2 will push the connecting plate 3 to move downward, and the connecting plate 3 will drive the crystal support 4 to move downward, so that the cutting line 12 cuts the silicon wafer to avoid In order to avoid the situation where the silicon wafer at the far end has not been cut yet, the silicon wafer cut at the near end will touch the wire mesh at the near end and be cut again, thereby improving the cutting effect of the cutting machine, when the length of the silicon wafer is less than the length of the active roller 11, the fixing screws will no longer lock the movable plate 17, and then the movable plate 17 will be pulled to move along the guide rail 5, and the movable plate 17 will drive the L-shaped frame 15 to move through the electric push rod 13, and the L-shaped frame 15 will drive the auxiliary roller 14 to move out from between the two active rollers 11 and move the auxiliary roller 14 between the upper and lower cutting lines 12, and then the silicon wafer can be cut normally.

[0025] Finally, it should be noted that: for those skilled in the art, they can still modify the technical solutions recorded in the above embodiments, or replace some of the technical features therein with equivalents. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of this utility model shall be included in the protection scope of this utility model.

Claims

1. A multi-active-axis cutting machine, comprising a machine body (1), wherein the machine body (1) is a hollow structure, and a feeding assembly is provided on the top inner wall of the machine body (1), characterized in that: An external interface (8) is provided on one side of the machine body (1); two mounting frames (10) are fixedly connected to the inner wall of the bottom of the machine body (1); active rollers (11) are rotatably connected to the two mounting frames (10); a power component for driving the active rollers (11) to rotate is provided on one side of the two mounting frames (10); cutting lines (12) are wound around the outer sides of the two active rollers (11); two guide rails (5) are fixedly connected to the inner wall of the bottom of the machine body (1); and the two guide rails (5) are fixedly connected to the inner wall of the bottom of the machine body (1). The outer side of the guide rail (5) is slidably connected to a moving plate (17), the upper surface of the moving plate (17) is fixedly connected to an electric push rod (13), one end of the telescopic portion of the electric push rod (13) is fixedly connected to an L-shaped frame (15), one side of the L-shaped frame (15) is rotatably connected to an auxiliary roller (14) for pressing the cutting line (12) to deform, the other side of the L-shaped frame (15) is fixedly connected to a motor 1, and one end of the output shaft of the motor 1 passes through the L-shaped frame (15) and is fixed to the auxiliary roller (14).

2. A multi-active-axis cutting machine according to claim 1, characterized in that: The feeding assembly comprises two cylinders (2), the two cylinders (2) are fixedly connected to the top inner wall of the machine body (1), one end of the pneumatic rods of the two cylinders (2) is fixed with a connecting plate (3) by bolts, and the bottom of the connecting plate (3) is fixedly connected with a crystal tray (4) for placing silicon wafers.

3. The multi-active-axis cutting machine according to claim 1, characterized in that: The power components are two motors 2, the two motors 2 are respectively fixedly connected to one side of two mounting frames (10), and one end of the output shafts of the two motors 2 passes through the mounting frames (10) and is fixed to the active roller (11).

4. A multi-active-axis cutting machine according to claim 3, characterized in that: The power of the motor 1 is the same as that of the motor 2.

5. The multi-active-axis cutting machine according to claim 1, characterized in that: An elastic plate (18) is fixedly connected to the upper surface of the movable plate (17), a plurality of slots (19) are provided on one side of the elastic plate (18), and a clamping block (20) is fixedly connected to a position near the bottom of one side of the L-shaped frame (15), and the clamping block (20) is clamped with the slot (19).

6. A multi-active-axis cutting machine according to claim 5, characterized in that: The bottom inner wall of the machine body (1) is provided with a baffle (16) for limiting the position of the movable plate (17); the upper surface of the movable plate (17) is provided with a threaded hole, and a fixing screw for locking the movable plate (17) is threadedly connected in the threaded hole.

7. The multi-active-axis cutting machine according to claim 1, characterized in that: The auxiliary roller (14) is located between the two active rollers (11) and above the bottom cutting line (12).

8. The multi-active-axis cutting machine according to claim 6, characterized in that: A plurality of auxiliary rods (9) are fixedly connected inside the machine body (1), and the plurality of auxiliary rods (9) all pass through the connecting plate (3). A plurality of support frames (6) are fixedly connected to the bottom outer wall of the machine body (1), and the bottom ends of the plurality of support frames (6) are fixedly connected to connecting seats (7).

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